EPF10K50VBC356-3 - FLEX 10K FPGA, 50K Gates, 356-BGA | Altera
MPN: EPF10K50VBC356-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.75 | $387.50 |
| 100 | $31.2 | $3,120.00 |
| 500 | $25.8 | $12,900.00 |
| 1,000 | $22.15 | $22,150.00 |
EPF10K50VBC356-3 Overview
An FPGA (Field Programmable Gate Array) is a class of programmable logic device that combines the high integration of a gate array with the design flexibility of in-system programmability. Within the programmable logic hierarchy, FPGAs sit above CPLDs and below fixed-function ASICs: a CPLD is suited to glue-logic and small state machines, while an FPGA targets high-density datapath, DSP, and bus-interface functions. The FLEX 10K family specifically pioneered the embedded array block architecture that merged look-up-table logic with dedicated memory, allowing the designer to implement RAM, ROM, and FIFO functions without consuming general-purpose logic.
Key differentiating features include 274 user I/Os (a high pin count for a 356-ball BGA device), 360 LABs each containing 8 Logic Elements, embedded array blocks (EABs) for memory-intensive functions, an internal performance up to 66.67 MHz in the -3 speed grade, and in-system programmability through the IEEE 1149.1 JTAG interface. The device supports multi-volt I/O operation including 5.0V, 3.3V, and 2.5V signaling, enabling bridging between legacy and modern logic families without external level shifters.
The architecture is built on a 0.42 µm CMOS SRAM process with 5 layers of metal interconnect. Each LAB contains 8 LEs, and each LE includes a 4-input look-up table, a programmable register, and dedicated carry and cascade chains for high-speed arithmetic. The EAB provides 2 Kbits of dual-port RAM that can be configured as RAM, ROM, or FIFO, delivering the embedded memory density that distinguishes FLEX 10K from pure-logic FPGAs of its era.
Typical applications include high-volume glue-logic replacement, custom peripheral controllers for embedded systems, industrial bus-interface bridges (PCI, VME), telecommunications backplane glue, and legacy system repair where the original part is now obsolete. The high I/O count and embedded RAM make it well-suited for datacom and telecom infrastructure that was designed in the late 1990s and is still in production service.
When designing with this device, note that the -3 speed grade is the mid-tier offering; a -4 grade variant exists for higher performance applications. Ensure your JTAG chain and configuration PROM are properly designed, since FLEX 10K is configured from external serial EPROM at power-up. The 356-ball BGA requires careful PCB layout with controlled-impedance traces and a minimum of 4-layer stack-up to maintain signal integrity on the high-pin-count package.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the original datasheet, providing engineers with a single reference for sourcing and designing with the EPF10K50VBC356-3.
Drop-in alternatives for EPF10K50VBC356-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50VBC356-3 (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Process Technology, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50VBC356-2N
✅ Drop-In✓ In Stock
$316.7 / Unit
View Datasheet →EPF10K50VBC356-2
✅ Drop-In✓ In Stock
$52.4 / Unit
View Datasheet →EPF10K50VBC356-1N
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EPF10K100ABC356-3
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K30ABC356-1
✅ Drop-In✓ In Stock
$62 / Unit
View Datasheet →EPF10K50VBC356-3 Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (Intel) |
| Series | FLEX 10K |
| Device Type | FPGA - Field Programmable Gate Array |
| Typical Gates | 50,000 |
| Logic Elements | 360 LABs x 8 LEs (2880 LEs family-wide) |
| User I/Os | 274 |
| Embedded Memory | 2880 Kbits (via EABs) |
| Embedded Array Blocks (EABs) | 10 |
| Speed Grade | -3 (commercial) |
| Internal Performance | 66.67 MHz |
| Propagation Delay | 0.6 ns |
| Logic Family | CMOS, SRAM-based |
| Process Technology | 0.42 µm CMOS, 5 metal layers |
| Package | 356-ball LBGA (BGA-356) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Supply Voltage | 5.0 V core, multi-volt I/O |
| Configuration Method | Serial PROM, JTAG (IEEE 1149.1) |
EPF10K50VBC356-3 356-ball lbga (bga-356) Pin Configuration Guide
Pin configuration for EPF10K50VBC356-3 (356-ball lbga (bga-356) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K50VBC356-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K50VBC356-3 is suitable for 6 applications: Industrial Bus-Interface Bridge, Telecommunications Backplane Glue Logic, Legacy Embedded System Repair, Custom Peripheral Controller, High-Volume Glue Logic Replacement, Data Acquisition Front-End.
Industrial Bus-Interface Bridge
The EPF10K50VBC356-3 is well suited to industrial bus-interface bridging between legacy parallel buses (PCI, VME, ISA) and modern serial interfaces, where its 274 user I/Os provide sufficient pin count to implement multi-bus glue logic in a single device. Its 2,880 Kbits of embedded RAM via 10 EABs allows on-chip implementation of FIFOs and address-mapping tables without external memory, simplifying PCB layout for industrial controllers. The commercial 0-70 °C temperature range is appropriate for factory-floor enclosures with controlled thermal environments. Engineers should budget for external bus-termination resistors and consider adding a configuration EPROM for fail-safe boot behavior.
Recommended
Telecommunications Backplane Glue Logic
In telecommunications backplane applications, the EPF10K50VBC356-3's combination of 274 I/Os, 50K gates, and embedded RAM enables implementation of TDM bus cross-connects, channelized framers, and protocol converters without external memory devices. The -3 speed grade provides 66.67 MHz internal performance, sufficient for OC-3/STM-1 line-rate processing at 155 Mbps when paired with external SERDES. The 356-ball LBGA package supports high-density board layouts typical in central-office equipment. For new deployments, verify that the lot date code is recent enough to meet carrier-grade reliability targets for the deployment lifetime.
Recommended
Legacy Embedded System Repair
The EPF10K50VBC356-3 is widely used to repair legacy embedded systems originally designed in the late 1990s and early 2000s, including industrial controllers, medical imaging equipment, and avionics subsystems where PCB redesign is not feasible. Its obsolete status means authorized aftermarket distributors stock factory-traceable parts with full traceability documentation. Engineers should validate date codes against their end-application's component qualification requirements and consider up-screening services for mission-critical deployments. The same FLEX 10K bitstream file generated for the original -3 part can be loaded into -2 or -1 speed grade replacements with appropriate timing margin verification.
Recommended
Custom Peripheral Controller
The EPF10K50VBC356-3 functions as a custom peripheral controller in embedded systems, implementing non-standard I/O protocols, motor-control timing logic, or sensor-fusion preprocessing in a single programmable device. The 10 EABs deliver 2,880 Kbits of dual-port RAM that can be configured as lookup tables, calibration storage, or small data buffers. The 274 user I/Os accommodate wide parallel sensor buses and multiple chip-select outputs to external peripherals. Designers should leverage Quartus II or MAX+PLUS II for synthesis, with IP cores available from Altera's legacy IP library for common peripherals such as UART, SPI, and I2C controllers.
Recommended
High-Volume Glue Logic Replacement
For high-volume glue-logic replacement, the EPF10K50VBC356-3 consolidates dozens of 74-series logic devices, small CPLDs, and discrete glue into a single programmable device, reducing PCB area and BOM cost. With 50,000 typical gates and 360 LABs, the device easily absorbs the equivalent of 200-500 discrete SSI/MSI packages. The SRAM-based architecture enables in-system reprogramming for late-stage design changes and field firmware updates via JTAG. Engineers should verify configuration-data retention by adding a watchdog supervisor that triggers reconfiguration if the FPGA fails to assert CONF_DONE within the expected boot window.
Recommended
Data Acquisition Front-End
In data acquisition front-ends, the EPF10K50VBC356-3's 274 user I/Os allow direct interfacing with multi-channel ADC/DAC arrays, while its 10 EABs implement deep sample buffers and trigger-detection look-up tables without external memory. The 66.67 MHz internal performance supports real-time digital filtering, decimation, and channel-arbitration logic at sample rates up to ~30 MSPS. Designers should pay close attention to power-rail decoupling: each VCCINT pin requires a 0.1 µF ceramic plus a 10 µF bulk capacitor to suppress switching transients during simultaneous-output switching (SSO) events typical in high-I/O-count BGA packages.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50VBC356-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50VBC356-2N | EPF10K50VBC356-2 | EPF10K50VBC356-1N | EPF10K100ABC356-3 | EPF10K30ABC356-1 |
|---|---|---|---|---|---|---|
| Package | 356-ball LBGA (BGA-356) | 356-ball LBGA (BGA-356) - same | 356-ball LBGA (BGA-356) - same | 356-ball LBGA (BGA-356) - same | 356-ball LBGA (BGA-356) - same | 356-ball LBGA (BGA-356) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K (ACE 10K100A) | FLEX 10K (ACE 10K30A) |
| Typical Gates | 50,000 | 50,000 (same) | 50,000 (same) | 50,000 (same) | 100,000 (+100%) | 30,000 (-40%) |
| User I/Os | 274 | 274 (same) | 274 (same) | 274 (same) | 274 (same) | 246 (-10%) |
| Speed Grade | -3 | -2 (faster) | -2 (faster) | -1 (slower) | -3 (same) | -1 (slower) |
| Embedded Memory | 2880 Kbits (10 EABs) | 2880 Kbits (same) | 2880 Kbits (same) | 2880 Kbits (same) | 4992 Kbits (+73%) | 12288 bits (-57% ratio) |
| Core Voltage | 5.0 V (V suffix) | 5.0 V (same) | 5.0 V (same) | 5.0 V (same) | 5.0 V (same) | 5.0 V (same) |
Key Differentiators
- Highest user I/O count in the EPF10K50 family (vs EPF10K50EQC240-3 (240-pin PQFP))
- -3 speed grade balances cost and performance (vs EPF10K50VBC356-1N (-1 speed grade))
- Footprint-compatible higher-density upgrade path (vs EPF10K100ABC356-3 (100K gates))
Design Notes
The EPF10K50VBC356-3 requires a stable 5.0 V VCCINT supply with ±5% tolerance. Estimated: at 66.67 MHz with all 274 I/Os toggling at 25 MHz, the device draws approximately 200-300 mA from VCCINT, requiring a 1.5 A-rated LDO or switching regulator with 100 mV peak-to-peak ripple maximum. Place one 0.1 µF X7R ceramic decoupling capacitor adjacent to every VCCINT pin and add 4-6 bulk 10 µF tantalum capacitors distributed around the BGA footprint. Multi-volt I/O banks (VCCIO) require separate supplies for 5.0 V, 3.3 V, or 2.5 V signaling depending on the downstream interface.
The 356-ball LBGA package has a 1.27 mm ball pitch and requires a minimum 4-layer PCB stack-up with a dedicated ground plane adjacent to the BGA. Estimated: escape routing from the inner-row balls uses 0.15 mm trace-and-space (6 mil) on the top layer, transitioning to internal layers through microvias. Maintain a continuous ground reference under all high-speed signal traces to control impedance at 50 Ω ±10%. Thermal vias (8-12 mil plated through-holes) under the center balls improve heat dissipation to the inner ground/power plane stack.
Three common pitfalls when designing with the EPF10K50VBC356-3: (1) Forgetting to add a configuration EPROM (EPC2 or compatible) - the device does not retain its configuration without external serial memory at every power-up; (2) Mixing VCCIO banks inadvertently - each I/O bank has its own VCCIO pin and must be tied to a single supply rail, not split between 3.3 V and 5 V on the same bank; (3) Ignoring simultaneous switching output (SSO) limits - driving all 274 outputs simultaneously can cause ground bounce exceeding 1.5 V, so use staggered output enables or series-damping resistors for heavily-loaded buses.
Compliance Information
Compliance status not stated in the verified web data. The FLEX 10K family predates widespread RoHS adoption; lead-free variants are designated by 'N' suffix in the MPN (e.g., EPF10K50VBC356-2N). Engineers should request compliance documentation from the distributor for their specific lot/date code.
