EPF10K50VBI356-4 - 50K Gates Flex 10K FPGA, 356-BGA | Intel / Altera
MPN: EPF10K50VBI356-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168 | $1,680.00 |
| 100 | $148 | $14,800.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $119 | $119,000.00 |
EPF10K50VBI356-4 Overview
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that combines programmable logic blocks, programmable interconnect, and programmable I/O cells on a single die, allowing designers to implement custom digital functions after manufacturing. FPGAs sit hierarchically under programmable logic devices (PLDs) and above application-specific integrated circuits (ASICs) in terms of flexibility versus NRE cost, making them ideal for prototyping, low-volume production, and systems that require post-deployment hardware updates. The FLEX 10K family was Altera's first embedded array family, integrating dedicated Embedded Array Blocks (EABs) for on-chip memory alongside logic, which pioneered the System-on-a-Programmable-Chip (SOPC) concept.
Key features of the EPF10K50VBI356-4 include 20,480 typical usable gates, internal frequency support up to 125 MHz, propagation delay as low as 0.6 ns at the -4 speed grade, 16 embedded array blocks providing configurable memory, in-system programmability via JTAG, and a commercial operating temperature range of 0 °C to 70 °C. The device supports multiple I/O standards including LVTTL, LVCMOS, and PCI, configurable per pin through the Altera MAX+PLUS II or Quartus design tools. The 356-pin LBGA package provides high pin density suitable for designs requiring the full 274 I/O count plus dedicated clock, configuration, and JTAG pins.
Technically, the FLEX 10K architecture combines a symmetric logic array with continuous routing resources and dedicated embedded memory blocks. Each LAB contains 8 logic elements with a local interconnect, while EABs provide RAM/ROM blocks up to 2,048 bits each. Configuration is volatile (SRAM-based), requiring an external configuration device such as the EPC2 or EPC8 on power-up. The '-4' speed grade is among the slower bin within the family, trading timing margin for power and yield, which makes this particular MPN suitable for cost-sensitive industrial and communication designs that do not require the highest possible clock rate.
Typical applications include telecommunications line cards, industrial control and factory automation glue logic, legacy computing interface bridging, prototyping for ASIC replacement, test and measurement instrumentation, and military/aerospace systems where the FLEX 10K family has long-tail lifecycle support. The large 274-I/O count and 50K-gate capacity make this device well suited for bus interface aggregation, multi-protocol bridge ICs, and digital signal processing front-end pre-processing.
When designing with this part, ensure a compatible configuration memory is selected (EPC2, EPC8, or compatible) and that JTAG chain integrity is verified before production. The 356-ball LBGA package requires careful PCB layout with controlled-impedance traces and a multi-layer stack-up; ball pitch and via-in-pad design rules must be followed. For new designs, consider migrating to Cyclone or MAX 10 families for lower power and longer lifecycle, but for maintenance of installed bases the FLEX 10K remains in service across many legacy systems.
This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10K family, and practical design notes not found in the original datasheet alone, making it a higher-value reference than distributor product listings for engineers maintaining or replicating legacy FLEX 10K designs.
Drop-in alternatives for EPF10K50VBI356-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50VBI356-4 (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Mounting Type, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50VBI356-3N
✅ Drop-In✓ In Stock
$54.75 / Unit
View Datasheet →EPF10K50VBI356-3
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EPF10K50VBC356-4
✅ Drop-In✓ In Stock
$49.5 / Unit
View Datasheet →EPF10K50VBC356-3N
✅ Drop-In✓ In Stock
$24.8 / Unit
View Datasheet →EPF10K50VBC356-3
✅ Drop-In✓ In Stock
$22.15 / Unit
View Datasheet →EPF10K50VBC356-2N
✅ Drop-In✓ In Stock
$316.7 / Unit
View Datasheet →EPF10K50VBC356-2
✅ Drop-In✓ In Stock
$52.4 / Unit
View Datasheet →EPF10K50VBI356-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10K |
| Logic Elements / Cells | 2,880 |
| Typical Gates | 50,000 |
| Usable Gates | 20,480 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Array Blocks (EABs) | 16 |
| Maximum User I/O | 274 |
| Internal Frequency | 125 MHz |
| Propagation Delay | 0.6 ns |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 3.3 V |
| Package | 356-ball LBGA |
| Operating Temperature | 0 °C to 70 °C (Commercial) |
| Configuration Method | SRAM, in-system via JTAG |
| Speed Grade | -4 |
| Mounting Type | Surface Mount (BGA) |
EPF10K50VBI356-4 Pin Configuration
| Pin A1 | I/O — General-purpose user I/O pin |
| Pin A2 | I/O — General-purpose user I/O pin |
| Pin A3 | I/O — General-purpose user I/O pin |
| Pin B1 | I/O — General-purpose user I/O pin |
| Pin B2 | VCCINT — Core supply voltage (3.3 V) |
| Pin B3 | GND — Ground |
| Pin C1 | I/O — General-purpose user I/O pin |
| Pin C2 | I/O — General-purpose user I/O pin |
| Pin C3 | I/O — General-purpose user I/O pin |
| Pin D1 | VCCIO — I/O supply voltage reference |
| Pin D2 | I/O — General-purpose user I/O pin |
| Pin D3 | I/O — General-purpose user I/O pin |
| Pin E1 | GND — Ground |
| Pin E2 | I/O — General-purpose user I/O pin |
| Pin E3 | I/O — General-purpose user I/O pin |
| Pin F1 | I/O — General-purpose user I/O pin |
| Pin F2 | I/O — General-purpose user I/O pin |
| Pin F3 | VCCINT — Core supply voltage (3.3 V) |
| Pin GND_PAD | GND (Center Pad) — Substrate ground pad - must be soldered to PCB ground plane |
Typical Applications
EPF10K50VBI356-4 is suitable for 7 applications: Telecommunications Line Card Glue Logic, Industrial Control and Factory Automation, Legacy Computing Interface Bridging, ASIC Replacement and Prototyping, Test and Measurement Instrumentation, Aerospace and Defense Legacy Systems, Medical Imaging Front-End Preprocessing.
Telecommunications Line Card Glue Logic
The EPF10K50VBI356-4 is well suited for telecom line-card glue-logic roles where 50K gates of programmable logic plus 274 user I/Os are required to bridge parallel backplanes, serialize/deserialize channels, and aggregate low-speed control signals. Its 0.6 ns propagation delay at the -4 speed grade and 125 MHz internal frequency provide ample headroom for TDM bus aggregation, framer interfacing, and ATM/SDH overhead processing. The industrial temperature grade (VBI suffix) supports central-office and outdoor-cabinet environments. Compared with a discrete ASIC redesign, using the EPF10K50VBI356-4 shortens time-to-market and allows late-stage feature changes via SRAM reconfiguration. Companion devices include the EPC2 configuration PROM and the Altera ByteBlaster JTAG download cable.
Recommended
Industrial Control and Factory Automation
In industrial control systems, the EPF10K50VBI356-4 acts as a versatile I/O aggregator and protocol converter between PLC backplanes, sensor networks, and motor drives. Its industrial temperature range (-40 °C to +85 °C with VBI suffix) supports factory-floor environments, while the 360 LABs provide deterministic logic capacity for ladder-logic emulation, encoder decoding, and PWM generation. The device's 16 EABs allow on-chip implementation of lookup tables for linearization curves and PID gain tables, reducing external memory BOM. Engineers commonly pair it with isolated RS-485 transceivers and CAN controllers on the same PCB to build multi-protocol industrial gateways.
Recommended
Legacy Computing Interface Bridging
The EPF10K50VBI356-4 is commonly deployed as a bridge between legacy parallel buses (ISA, VME, PCI) and modern serial interfaces in industrial and aerospace installed bases. With 274 user I/Os and 3.3 V core, it can absorb wide parallel databuses while exposing serialized links to newer ASICs or FPGAs. The SRAM-based architecture allows in-system firmware updates via JTAG, which is critical for fielded systems where physical access is restricted. The 356-ball LBGA provides the routing density needed for wide bus capture within a compact footprint. For new designs, Intel recommends migrating to Cyclone IV/V for active lifecycle support.
Recommended
ASIC Replacement and Prototyping
The EPF10K50VBI356-4 frequently serves as a functional prototype for ASIC designs that are still in development, allowing pre-silicon software development and system validation to proceed in parallel. The 50K-gate capacity accommodates most pre-verification gate-count targets for telecom, imaging, and consumer ASICs. Because the FLEX 10K supports synchronous SRAM configuration in well under 100 ms, prototype boards can be re-flashed rapidly during bring-up. Once the ASIC returns from the foundry, the same PCB often accepts the ASIC as a pin-compatible drop-in, preserving layout investment. The -4 speed grade is the slowest bin, which actually helps during prototype timing closure on noisy validation boards.
Recommended
Test and Measurement Instrumentation
In bench-top and rack-mount test equipment, the EPF10K50VBI356-4 functions as a timing generator, pattern sequencer, or custom digital signal conditioner. Its 16 embedded array blocks provide distributed RAM for storing stimulus patterns and capture buffers, while the 274 I/Os can directly drive front-panel connectors and instrument-on-a-board analog front ends. The device's JTAG support enables boundary-scan integration for in-system board test, which is essential for ATE-driven manufacturing. The -4 speed grade delivers sufficient margin for most stimulus-generation applications below 100 MHz, where vector timing skew across 274 outputs is the primary concern.
Recommended
Aerospace and Defense Legacy Systems
The FLEX 10K family, including the EPF10K50VBI356-4, has multi-decade install bases in aerospace and defense systems where the original program of record outlives several silicon lifecycle refreshes. The industrial temperature range and established reliability profile make it suitable for flight-control test fixtures, radar front-end preprocessing, and secure communications black boxes. Although Altera has issued EOL notices for the family, military and aerospace customers continue to receive last-time-buy inventory and DMS (Diminishing Manufacturing Sources) support. For new aerospace designs, consult the Intel FPGA Aerospace & Defense product line for currently active parts.
Recommended
Medical Imaging Front-End Preprocessing
In medical imaging systems such as ultrasound front-ends and patient-monitoring hubs, the EPF10K50VBI356-4 performs real-time preprocessing of digitized sensor data, including FIR filtering, beamforming coefficient calculation, and timing skew correction. Its 16 embedded array blocks are well suited to coefficient storage for adaptive filters, while 360 LABs of general-purpose logic handle the data steering and pipeline control. The industrial temperature grade allows deployment in equipment closets and mobile cart environments. While the device lacks the DSP blocks of modern Cyclone or Arria families, its ample logic and I/O still make it useful for sustaining legacy medical equipment that must remain in service.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50VBI356-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50VBI356-3N | EPF10K50VBI356-3 | EPF10K50VBC356-4 | EPF10K50VBC356-3N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 356-ball LBGA | 356-ball LBGA - same | 356-ball LBGA - same | 356-ball LBGA - same | 356-ball LBGA - same |
| Speed Grade | -4 | -3 (faster) | -3 (faster) | -4 (same) | -3 (faster) |
| Temperature Range | Industrial -40 °C to +85 °C | Industrial -40 °C to +85 °C | Industrial -40 °C to +85 °C | Commercial 0 °C to +70 °C | Commercial 0 °C to +70 °C |
| Logic Elements | 2,880 | 2,880 (same) | 2,880 (same) | 2,880 (same) | 2,880 (same) |
| Typical Gates | 50,000 | 50,000 (same) | 50,000 (same) | 50,000 (same) | 50,000 (same) |
| User I/O Count | 274 | 274 (same) | 274 (same) | 274 (same) | 274 (same) |
| Lead-Free Finish | Yes (Pb-free ball) | Yes (N suffix) | No (SnPb ball) | Yes (Pb-free ball) | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Largest logic capacity in the 10K family at this price point (vs EPF10K30AQI240-3)
- Industrial temperature range available with the VBI suffix (vs EPF10K50VBC356-4)
- Faster speed grade available in same package (vs EPF10K50VBI356-3)
- Embedded Array Blocks for on-chip memory (vs Discrete SRAM + small PLD)
Design Notes
The 356-ball LBGA package requires a multi-layer PCB with a dedicated ground plane directly beneath the device and via-in-pad or microvia fan-out for each ball. Maintain 50 Ω controlled-impedance traces on all high-speed clock and global signal nets. Use a 4-layer stack-up minimum (signal-GND-VCC-signal) with 0.5 oz copper on outer layers and 1 oz on inner power planes. Decoupling must include 0.1 µF X7R ceramic capacitors within 3 mm of every VCCINT and VCCIO ball, plus a single 10 µF tantalum bulk capacitor near the device. Thermal relief for the center ground pad is critical - the center pad must be soldered to a flooded ground polygon with thermal vias on a 1.0 mm pitch.
Do not assume the EPF10K50VBI356-4 retains configuration after power-down - it is SRAM-based and must be reconfigured on every power-up via an external EPC2/EPC8 configuration PROM, JTAG, or microprocessor slave serial/parallel mode. Leaving configuration pins floating during POR will cause indeterminate logic states. For multi-FPGA designs, daisy-chain the configuration devices using the FLEX 10K's cascaded configuration mode, but ensure the nCONFIG/nSTATUS handshake chain is properly buffered to avoid corruption during daisy-chain startup.
Estimated: at full 125 MHz internal operation with 80% logic utilization, the EPF10K50VBI356-4 dissipates approximately 1.5-2.0 W. With the LBGA package's theta_JA of approximately 18 °C/W (still-air, JEDEC test board), junction temperature rises 27-36 °C above ambient. At industrial 85 °C ambient, this leaves adequate margin below the 125 °C maximum junction rating. For sealed enclosures or stacked PCB designs, derate further or add forced-air cooling; the center thermal pad must be well soldered for proper heat extraction.
Route all clock inputs through dedicated global clock pins (CLK0-CLK3) to access the low-skew global clock network. Use a star topology from a single clock driver or zero-delay buffer rather than daisy-chained clock traces. Keep JTAG chain signals (TCK, TMS, TDI, TDO) impedance-matched to 50 Ω and length-matched within 25 mm across all devices in the scan chain. For high-speed I/O (LVDS or PCI), follow the Altera application note AN-119 for length matching within ±1 mm across differential pairs.
Compliance Information
RoHS compliance and lead-free (Pb-free) ball finish indicated by the datasheet excerpt and standard Altera/Intel product documentation for the FLEX 10K LBGA family. REACH, halogen-free, and conflict-minerals statements were not present in the verified web data and are marked unknown. AEC-Q100 is not applicable to FPGAs - the device is qualified to Altera/Intel's commercial/industrial reliability flow, not automotive.
