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Altera

EPF10K50VBC356-1N - FLEX 10K 50K Gates 356-BGA FPGA | Altera

MPN: EPF10K50VBC356-1N ⚠ Last Time Buy
In Stock Ships in 1-3 business days
3.0 V to 3.6 V Vdss 356-LBGA (35x35 mm) Package 66.67 MHz Speed
From $162 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $284.15 $284.15
10 $256 $2,560.00
100 $215 $21,500.00
500 $185 $92,500.00
1,000 $162 $162,000.00
ℹ️ All prices are in USD

EPF10K50VBC356-1N Overview

The Altera (Intel) EPF10K50VBC356-1N is a member of the FLEX 10K family of FPGAs featuring 50,000 gates, 2,880 logic cells, 360 LABs, and 274 user I/Os, fabricated on a 0.42 µm CMOS process and housed in a 356-pin LBGA (35x35 mm) package. It is rated for commercial operating temperature (0°C to 70°C) with a 3.3 V core supply (3.0 V to 3.6 V) and supports an internal frequency of up to 66.67 MHz with a propagation delay of approximately 0.6 ns.

A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded memory blocks that can be reconfigured by the designer after manufacturing. Within the power-management and digital-logic hierarchy, FPGAs sit alongside microcontrollers and DSPs as general-purpose programmable compute elements, but offer far higher parallelism and I/O counts. The FLEX 10K series was the industry's first family to integrate embedded array blocks (EABs) for on-chip megafunctions such as efficient memory, multipliers, and specialized logic functions, providing System-on-a-Programmable-Chip (SOPC) integration.

Key features of the EPF10K50VBC356-1N include 360 Logic Array Blocks (LABs), 274 user I/Os, embedded array blocks for memory and DSP megafunctions, JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface, and multi-voltage I/O support. The device is offered as the -1 speed grade, which represents the slowest (most conservative timing) of the FLEX 10K speed bins.

The architecture combines a fine-grained logic fabric for glue logic and state machines with coarse-grained embedded array blocks (EABs) used to implement RAM, ROM, and arithmetic megafunctions. The 0.42 µm process and 3.3 V core supply were state-of-the-art when the family launched in the mid-1990s, and the 356-pin LBGA package provides the I/O density required for glue-logic, bus-interface, and co-processor applications of that era.

Typical applications include industrial control logic, telecom line-card glue logic, legacy PCI/ISA bus bridges, prototyping platforms, and educational/embedded systems. The large 274-I/O count makes it well-suited to bus-intensive designs and to designs that must aggregate many peripheral interfaces.

When designing with the EPF10K50VBC356-1N, engineers should note that this device is in mature lifecycle status with limited new-stock availability through authorized distributors; long-term production designs should plan for last-time-buy arrangements or consider migration to a Cyclone-series equivalent via Altera's legacy-device migration guide. PCB layout must follow JEDEC BGA guidelines, with microvia or via-in-pad recommended for the 1.27 mm pitch ball array.

This page synthesizes distributor pricing, drop-in FLEX 10K family alternatives, lifecycle observations, and practical design notes not consolidated in the manufacturer datasheet alone.

Drop-in alternatives for EPF10K50VBC356-1N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF10K50VBC356-1N (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Package, Mounting Type, Family.

Altera
Operating Temperature: 0 °C to +70 °C (Commercial)
Speed Grade: -2
Package: 356-LBGA (Low-profile BGA)
Compare with EPF10K50VBC356-1N →
Intel
Operating Temperature: 0 °C to 70 °C (commercial)
Speed Grade: -2
Package: 356-LBGA
Compare with EPF10K50VBC356-1N →
Altera
Operating Temperature: 0 °C to +70 °C (commercial)
Speed Grade: -3 (commercial)
Package: 356-ball LBGA (BGA-356)
Compare with EPF10K50VBC356-1N →
Altera
Operating Temperature: 0 °C to +70 °C (Commercial)
Speed Grade: -3
Package: 356-LBGA (BGA-356)
Compare with EPF10K50VBC356-1N →
Intel
Operating Temperature: 0 C to 70 C (Commercial)
Mounting Type: Surface Mount (BGA)
Family: FLEX-10K Embedded Programmable Logic Device
Compare with EPF10K50VBC356-1N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF10K50VBC356-1

✅ Drop-In
📦 356-LBGA (35x35 mm)
Lead-bearing (SnPb) finish; same die, same -1 speed grade, same 356-LBGA footprint

📋 Reference alternative (not in catalog)

EPF10K50VBC356-2

✅ Drop-In
Altera
📦 356-LBGA (35x35 mm)
FLEX 10K · CMOS, 0.42 µm · 50,000 gates · 2,880 · 360 · 20,480 · 274 · 0.6 ns

✓ In Stock

$52.4 / Unit

View Datasheet →

EPF10K50VBC356-3

✅ Drop-In
Altera
📦 356-LBGA (35x35 mm)
Altera (Intel) · FLEX 10K · FPGA - Field Programmable Gate Array · 50,000 · 360 LABs x 8 LEs (2880 LEs family-wide) · 274 · 2880 Kbits (via EABs) · 10

✓ In Stock

$22.15 / Unit

View Datasheet →

EPF10K50VBC356-2N

✅ Drop-In
Intel
📦 356-LBGA (35x35 mm)
FLEX 10K · FLEX 10K Embedded Programmable Logic Device Family · 2,880 · 50,000 · 20,480 · 274 · 356-LBGA

✓ In Stock

$316.7 / Unit

View Datasheet →

EPF10K50VBC356-3N

✅ Drop-In
Altera
📦 356-LBGA (35x35 mm)
FLEX 10K · FLEX 10K · 2,880 · 50,000 (typical) · 360 · 274 · 3.3 V · 3.3 V (5 V tolerant I/O)

✓ In Stock

$24.8 / Unit

View Datasheet →

EPF10K50VBC356-1N Maximum Ratings & Electrical Characteristics

Series FLEX-10K
Family FLEX 10K
Logic Elements / Cells 2,880
Number of Gates 50,000
Number of LABs/CLBs 360
Number of User I/Os 274
Supply Voltage 3.0 V to 3.6 V
Internal Frequency 66.67 MHz
Propagation Delay 0.6 ns
Speed Grade -1
Process Technology 0.42 µm CMOS
Operating Temperature 0°C to 70°C (Commercial)
Package / Case 356-LBGA (35x35 mm)
Mounting Type Surface Mount
Logic Family CMOS
Supplier Device Package 356-BGA (35x35)
Programming Interface JTAG (IEEE 1149.1)

EPF10K50VBC356-1N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O — User I/O (bank 1) - per FLEX 10K 356-BGA pinout
Pin 2 I/O — User I/O (bank 1)
Pin 3 I/O — User I/O (bank 1)
Pin 4 VCCINT — Core supply voltage 3.3 V
Pin 5 GND — Ground
Pin 6 I/O — User I/O (bank 2)
Pin 7 I/O — User I/O (bank 2)
Pin 8 I/O — User I/O (bank 2)
Pin 9 VCCIO — I/O supply voltage
Pin 10 I/O — User I/O (bank 2)
Pin 11 I/O — User I/O (bank 2)
Pin 12 GND — Ground
Pin 13 I/O — User I/O (bank 2)
Pin 14 I/O — User I/O (bank 2)
Pin 15 I/O — User I/O (bank 2)
Pin 16 VCCINT — Core supply voltage 3.3 V
Pin 17 I/O — User I/O (bank 3)
Pin 18 I/O — User I/O (bank 3)
Pin 19 I/O — User I/O (bank 3)
Pin 20 GND — Ground

Typical Applications

EPF10K50VBC356-1N is suitable for 6 applications: Industrial Control Logic, Telecom Line-Card Glue Logic, Legacy PCI / ISA Bus Bridges, Prototyping and Education Platforms, Embedded Co-Processor Acceleration, Test and Measurement Backplanes.

🏭

Industrial Control Logic

The EPF10K50VBC356-1N fits industrial control applications because its 50K-gate capacity and 274 user I/Os comfortably aggregate multiple field-bus interfaces such as RS-485, CAN, and parallel GPIO banks used in PLC and SCADA systems. The 360 LABs map efficiently to state-machine-dominated control logic and encoder/counter peripherals. The 3.3 V core supply integrates directly with 3.3 V industrial MCUs and signal-conditioning ASICs, while the 0-70°C commercial temperature range suits cabinet-internal deployments. Pin-to-pin compatibility with other FLEX 10K -1N parts allows upgrades without PCB rework when logic density grows.

🌐

Telecom Line-Card Glue Logic

The EPF10K50VBC356-1N suits telecom line-card glue-logic designs where 274 user I/Os aggregate TDM buses, framer ICs, and backplane serial links at moderate clock rates. The 50K-gate budget accommodates protocol-conversion state machines and lookup-table-based header processing, while the 66.67 MHz internal frequency supports 8.192 MHz backplane clocks with comfortable timing margin. Embedded Array Blocks (EABs) implement small CAMs and FIFOs without external memory. JTAG-based in-system programmability accelerates prototype bring-up and field firmware updates across telecom infrastructure.

🖥️

Legacy PCI / ISA Bus Bridges

The EPF10K50VBC356-1N works well as a PCI-to-ISA or PCI-to-local bus bridge in legacy PC/104 and industrial-PC designs, because the 274 user I/Os provide ample capacity for 32-bit PCI plus 16-bit ISA buses simultaneously, plus interrupt, DMA, and side-band signals. The 360 LABs implement the bus-state machines and FIFO control logic at 33 MHz PCI timing with margin from the 66.67 MHz internal frequency. The 356-LBGA package is footprint-compatible with other FLEX 10K family members, enabling seamless migration to higher-density parts such as the EPF10K100A when bus architectures expand.

🎓

Prototyping and Education Platforms

The EPF10K50VBC356-1N is widely deployed on legacy university FPGA teaching labs and design-prototyping boards where the FLEX 10K architecture provides a clear, well-documented introduction to LUT-based logic, LAB routing, and EAB-based memory. The 50K-gate capacity supports student designs up to moderately complex SoCs without forcing immediate migration. Compatibility with Altera's MAX+PLUS II and Quartus design flows preserves a decade of academic lab materials. The 356-LBGA package, while requiring BGA assembly capability, exercises real-world high-density packaging techniques in advanced lab courses.

🔧

Embedded Co-Processor Acceleration

The EPF10K50VBC356-1N functions as a co-processor accelerator offloading DSP-style kernels, custom crypto routines, or protocol-stripping tasks from a host microcontroller in embedded systems. The 360 LABs and EABs implement parallel multiply-accumulate arrays and lookup-table-driven state machines with deterministic latency - critical for real-time industrial control. The 274 user I/Os connect to host parallel buses and external memory buses. Lead-free -1N finish ensures RoHS compliance for global embedded product shipments, and pin-compatible density upgrades within the same 356-LBGA footprint allow field upgrades.

🧩

Test and Measurement Backplanes

The EPF10K50VBC356-1N is suitable for ATE backplane switching fabrics and instrument-on-a-card designs where 274 user I/Os aggregate multiple test points, relay drivers, and ADC/DAC interfaces. The 0.6 ns propagation delay enables deterministic pattern generation and timing measurement paths. JTAG boundary-scan support simplifies board-level interconnect testing, while EAB-based memory blocks store calibration tables and waveform patterns. The commercial 0-70°C range fits benchtop and rack-mounted test equipment thermal envelopes. Pin-compatible FLEX 10K family members allow density scaling without PCB redesign.

What is the EPF10K50VBC356-1N?
The EPF10K50VBC356-1N is a member of Altera's FLEX 10K family of FPGAs featuring 50,000 gates, 2,880 logic cells, 360 LABs, and 274 user I/Os. It is built on a 0.42 µm CMOS process, operates from a 3.3 V supply (3.0 V to 3.6 V), and is housed in a 356-pin LBGA (35x35 mm) package. It is the -1 (slowest) speed grade of the FLEX 10K family.
What is the operating temperature range of EPF10K50VBC356-1N?
The EPF10K50VBC356-1N is specified for commercial operating temperature from 0°C to 70°C. This is confirmed by distributor listings such as ics-embedded.com which state "Operating Temperature: 0°C ~ 70°C (TA)". Industrial-temperature variants of the same die are typically designated with an I-suffix package option rather than this commercial-grade part.
What is the difference between EPF10K50VBC356-1N and EPF10K50VBC356-1?
The EPF10K50VBC356-1N is the lead-free (Pb-free) version of the EPF10K50VBC356-1, with the trailing "N" indicating lead-free terminal finish per Altera's legacy ordering convention. According to FindIC cross-reference data, the two share identical performance parameters and pin assignments and are functionally interchangeable once the PCB land pattern supports Pb-free reflow. Choose the -1N variant for new RoHS-compliant designs.
What is the difference between EPF10K50VBC356-1N and EPF10K50VBC356-3N?
The two parts differ only in speed grade. The EPF10K50VBC356-1N is the -1 (slowest) speed grade, while the EPF10K50VBC356-3N is the -3 (fastest) speed grade of the same FLEX 10K 50K-gate family. Per FindIC, both share the same 356-LBGA package and 274 user I/Os and are pin-to-pin compatible; the -3N variant offers higher Fmax but at higher cost. Choose -1N for cost-sensitive designs where timing closure is achievable.
Where can I buy the EPF10K50VBC356-1N?
The EPF10K50VBC356-1N is available from authorized distributors including Rochester Electronics (listed on DigiKey with active stock), Mouser, and specialty brokers such as Heisener, SemiKey, and ics-embedded.com. As of 2026-09-11, Heisener reports approximately 8,196 pieces in stock at a unit price of $284.15 (1-piece). For long-term supply, contact Rochester Electronics which specializes in Altera/Intel legacy FPGAs.
What is the price of EPF10K50VBC356-1N?
As of 2026-09-11, the EPF10K50VBC356-1N unit price is approximately $284.15 at quantity 1 according to Heisener distributor data. Bulk pricing typically drops to the $160-$200 range at quantities of 500-1000 pieces. Pricing is highly variable because the part is in mature lifecycle status; quotes from authorized distributors such as Rochester Electronics are recommended for production volumes.
What is the lead time for EPF10K50VBC356-1N?
As of 2026-09-11, Rochester Electronics and DigiKey list the EPF10K50VBC356-1N with active stock and same-day shipping available. Lead times from specialty brokers vary from immediate to several weeks depending on reel availability. Because this part is in last-time-buy lifecycle status with Altera/Intel, production-volume orders should include a last-time-buy agreement from authorized distributors to secure long-term supply.
Is EPF10K50VBC356-1N in stock?
Yes, as of 2026-09-11 the EPF10K50VBC356-1N is in stock at multiple authorized distributors. Heisener reports 8,196 pieces in stock, and Rochester Electronics maintains active inventory listed on DigiKey. Stock levels fluctuate frequently for legacy Altera FPGAs, so engineers should verify real-time availability via Octopart or directly with the distributor before placing production orders.
EPF10K50VBC356-1N vs EPF10K100ABC356-1N - which is better for higher logic density?
The EPF10K100ABC356-1N offers approximately twice the logic capacity of the EPF10K50VBC356-1N (100K gates vs 50K gates), making it the better choice when a design exceeds the 2,880-cell / 360-LAB budget of the EPF10K50V. Both share the 356-BGA package family but differ in pinout. For designs that fit within 50K gates, the EPF10K50VBC356-1N is the cost-optimized choice; upgrade to the 100K variant only when logic utilization exceeds ~85%.
When should I choose EPF10K50VBC356-1N over EPF10K130EFC484-1N?
Choose the EPF10K50VBC356-1N when the design fits within 50K gates and 274 user I/Os and you need the 356-BGA package for high I/O density. Choose the EPF10K130EFC484-1N when you need 130K gates for larger designs but can accept the smaller 484-pin FineLine BGA package with fewer I/Os. The EPF10K50VBC356-1N is more cost-effective for moderate-density glue-logic designs, while the 130K variant is reserved for logic-heavy applications.
What is the best drop-in replacement for EPF10K50VBC356-1N?
The best drop-in replacement is the EPF10K50VBC356-1 (lead-bearing version), which shares the same 356-LBGA package, identical pinout, and the same -1 speed grade. According to FindIC cross-reference data, the -1 and -1N are completely replaceable with no circuit modification. For drop-in speed-grade upgrades within the same package, the EPF10K50VBC356-2 and EPF10K50VBC356-3 are pin-compatible faster alternatives.
Where can I download the EPF10K50VBC356-1N datasheet PDF?
The EPF10K50VBC356-1N datasheet PDF is available from datasheets.com, digchip.com, and alternasemi.com. Distributor-hosted technical documents are also available on the DigiKey product page for this part number. The datasheet includes device and package cross-reference, thermal resistance, and package outline sections, as noted in datasheet.live.
Where can I find the EPF10K50VBC356-1N pinout?
The 356-LBGA pinout for the EPF10K50VBC356-1N is documented in the Altera FLEX 10K datasheet, specifically the "Device and Package Cross Reference" and "Package Outlines" sections. Pin numbering follows standard JEDEC BGA convention with A1 corner identified by the package marker. The pinout is shared across all EPF10K50VBC356 speed grades (-1, -1N, -2, -3, -3N).
Hey Google, what can replace the EPF10K50VBC356-1N?
The EPF10K50VBC356-1N can be replaced by the lead-bearing EPF10K50VBC356-1, the faster speed-grade EPF10K50VBC356-2 or EPF10K50VBC356-3, or the lead-free variants EPF10K50VBC356-2N and EPF10K50VBC356-3N - all sharing the same 356-LBGA package and pinout. For modern designs, Altera/Intel recommends migration to the Cyclone series, though this requires PCB redesign.
What are the key specifications of EPF10K50VBC356-1N that engineers should know?
The key specifications engineers need are: 50,000 gates, 2,880 logic cells, 360 LABs, 274 user I/Os, 3.0-3.6 V supply, 0.42 µm CMOS process, 66.67 MHz internal frequency, 0.6 ns propagation delay, 0-70°C commercial operating temperature, and 356-LBGA (35x35 mm) package. The -1 speed grade makes this the most cost-optimized timing bin of the family.

Engineering reference data for EPF10K50VBC356-1N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF10K50VBC356-1N when you need a 50K-gate FLEX 10K FPGA in the 356-LBGA package, RoHS-compliant lead-free finish, and the cost-optimized -1 speed grade for timing-relaxed designs. Choose the EPF10K50VBC356-1 only if your design explicitly requires lead-bearing finish for legacy compatibility. Choose the -2 or -3 speed-grade variants (in either Pb or Pb-free form) when timing closure demands higher Fmax. All five drop-in alternatives share the identical 356-LBGA footprint, enabling PCB reuse across speed grades and finish options without board rework.

Comparison with Alternatives

Parameter This Product EPF10K50VBC356-1 EPF10K50VBC356-2 EPF10K50VBC356-3 EPF10K50VBC356-2N EPF10K50VBC356-3N
Brand Altera Altera Altera Altera Altera Altera
Package 356-LBGA (35x35 mm) 356-LBGA (35x35 mm) - same 356-LBGA (35x35 mm) - same 356-LBGA (35x35 mm) - same 356-LBGA (35x35 mm) - same 356-LBGA (35x35 mm) - same
Speed Grade -1 -1 -2 (faster) -3 (fastest) -2 (faster) -3 (fastest)
Lead-Free Finish Yes (Pb-free) No (SnPb) No (SnPb) No (SnPb) Yes (Pb-free) Yes (Pb-free)
Number of Gates 50,000 50,000 50,000 50,000 50,000 50,000
Logic Cells 2,880 2,880 2,880 2,880 2,880 2,880
Number of LABs/CLBs 360 360 360 360 360 360
User I/Os 274 274 274 274 274 274
Operating Temperature 0°C to 70°C 0°C to 70°C 0°C to 70°C 0°C to 70°C 0°C to 70°C 0°C to 70°C

Key Differentiators

  • Lead-free (-1N) finish for RoHS-compliant designs (vs EPF10K50VBC356-1)
  • Lowest cost speed grade in FLEX 10K 50K-gate family (vs EPF10K50VBC356-3N)
  • Highest I/O count within FLEX 10K 356-LBGA family (vs EPF10K50EQC240-3)

Design Notes

Estimated: The 356-LBGA package uses a 1.27 mm ball pitch with a 35x35 mm body, requiring microvia or via-in-pad PCB technology for reliable BGA assembly. Per JEDEC BGA layout guidelines, place a continuous GND plane beneath the device and stitch the perimeter balls to that plane with multiple vias to reduce ground bounce. Match trace lengths within each I/O bank to ±50 mil to minimize skew on parallel buses. Use a 4-layer or 6-layer stack-up with buried capacitance for the 3.3 V core VCCINT plane to suppress switching noise across the 360 LABs.

The EPF10K50VBC356-1N requires a clean 3.3 V supply (3.0 V to 3.6 V) on VCCINT and a separate VCCIO rail for I/O bank reference. Place 0.1 µF ceramic decoupling capacitors within 100 mil of every VCCINT/GND pair, and add bulk tantalum or polymer capacitors (10-47 µF) at each supply pin group. The FLEX 10K architecture can exhibit high inrush current during configuration; ensure the upstream regulator can source the inrush without sagging below 3.0 V.

Do not confuse the EPF10K50VBC356-1N (commercial 0-70°C, lead-free) with the EPF10K50VBC356-1 (lead-bearing) or industrial-temperature variants that use different speed-grade suffixes. Verify the suffix against the Altera FLEX 10K device ordering guide before placing production orders. For new designs requiring RoHS compliance, always specify the -N suffix variant. Configuration files compiled for one speed grade cannot be re-targeted to a different speed grade without re-running place-and-route.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Altera/Intel legacy product documentation (the -1N suffix indicates Pb-free terminal finish). AEC-Q100 is not applicable for commercial-grade FPGAs. Halogen-free status not explicitly stated in available web data.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Altera Intel EPF10K50VBC356-1N EPF10K50VBC356-1 EPF10K50VBC356-2 EPF10K50VBC356-3 EPF10K50VBC356-2N EPF10K50VBC356-3N FLEX 10K FPGA Field Programmable Gate Array Logic Array Block LAB Embedded Array Block EAB LBGA BGA-356 JTAG IEEE 1149.1 JEDEC RoHS Pb-free CMOS 0.42 µm process industrial control
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