EPF10K50VRI240-4 - 50K Gates FLEX 10K FPGA 2880 Cells | Intel
MPN: EPF10K50VRI240-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.75 | $247.50 |
| 100 | $19.9 | $1,990.00 |
| 500 | $16.4 | $8,200.00 |
| 1,000 | $13.85 | $13,850.00 |
EPF10K50VRI240-4 Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that lets engineers implement arbitrary digital logic via a configurable array of logic elements, embedded memory blocks, and routing interconnect. FPGAs sit at the top of the programmable logic hierarchy: below FPGAs are CPLDs (less complex, non-volatile), and above are ASICs (custom silicon). The FLEX 10K family pioneered embedded array blocks (EABs) that combine SRAM lookup tables with dedicated dual-port RAM, enabling System-on-a-Programmable-Chip (SOPC) integration of logic and memory in a single device.
Key features include 360 Logic Array Blocks (LABs), embedded array blocks for on-chip memory, MultiVolt I/O for mixed-voltage interfacing, PCI-compliant I/O with clamping diodes, slew-rate control, and open-drain output options. The -4 speed grade targets high-performance operation at 125 MHz internal frequency, with support for hot-socketing and peripheral registers for fast setup and clock-to-output delay.
Typical applications include telecommunications infrastructure, industrial control systems, and legacy PCI-based designs. The 240-pin RQFP package is suitable for prototype development and through-hole-compatible layouts where BGA soldering is impractical, while exposed-pad construction provides enhanced thermal dissipation for sustained high-utilization designs.
When designing with this device, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each VCCINT and VCCIO pin. The exposed pad must be soldered to the ground plane for thermal and electrical performance. Programming requires the Quartus II or MAX+PLUS II development environment and a compatible ByteBlaster or ByteBlasterMV download cable.
This page synthesizes distributor pricing, same-brand FLEX 10K drop-in alternatives, lifecycle observations, and practical design guidance that complements the manufacturer datasheet for engineers maintaining legacy Altera FPGA designs.
Drop-in alternatives for EPF10K50VRI240-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50VRI240-4 (same form factor and footprint) — differing in Family, Package, Operating Temperature, Configuration Method, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50VRI240-4N
✅ Drop-In✓ In Stock
$49.95 / Unit
View Datasheet →EPF10K50VRI240-3N
✅ Drop-In✓ In Stock
$25.4 / Unit
View Datasheet →EPF10K50VRI240-3
✅ Drop-In✓ In Stock
$52.75 / Unit
View Datasheet →EPF10K50EQC240-2N
✅ Drop-In✓ In Stock
$87.2 / Unit
View Datasheet →EPF10K50EQC240-3N
✅ Drop-In✓ In Stock
$59.5 / Unit
View Datasheet →EPF10K50VRC240-4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$89.5 / Unit
View Datasheet →EPF10K50VRC240-4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$85.3 / Unit
View Datasheet →EPF10K50VRI240-4 Maximum Ratings & Electrical Characteristics
| Series | FLEX 10K |
| Family | Flex® 10K |
| Number of Logic Elements / Cells | 2880 |
| Number of LABs / CLBs | 360 |
| Total RAM Bits | 20480 |
| Typical Gates | 50000 |
| Maximum System Gates | 50000 |
| Number of I/O | 189 |
| Voltage - Supply | 3.3 V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C to 70°C |
| Package / Case | 240-RQFP Exposed Pad |
| Supplier Device Package | 240-BFQFP Exposed Pad |
| Process Technology | 0.42 µm CMOS |
| Speed Grade | -4 |
| Propagation Delay | 0.6 ns |
| RoHS Status | Non-Compliant |
EPF10K50VRI240-4 240-bfqfp exposed pad Pin Configuration Guide
Pin configuration for EPF10K50VRI240-4 (240-bfqfp exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K50VRI240-4.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K50VRI240-4 is suitable for 6 applications: Telecommunications Infrastructure, Industrial Control Systems, Legacy PCI-Based Designs, Test and Measurement Equipment, Medical Imaging Systems, Aerospace and Defense Avionics.
Telecommunications Infrastructure
The EPF10K50VRI240-4 fits telecommunications glue-logic and bus-interface applications where its 189 I/Os, 360 LABs, and 125 MHz -4 speed grade deliver ample headroom for legacy TDM, ATM, and SONET/SDH framer interfaces. With 20,480 RAM bits distributed across embedded array blocks, designers can integrate small FIFOs and lookup tables without external memory. The 240-RQFP exposed-pad package simplifies prototype debugging versus BGAs, making it well suited to lab and field-replaceable telecom line-card designs still in service two decades after launch. Maintenance engineers rebuilding EOL telecom hardware will find the device's PCI-compliant I/O and MultiVolt support particularly valuable for bridging 3.3 V and 5 V backplane logic. While the part is obsolete, it remains supported through distributor inventory and the Quartus II legacy toolchain.
Recommended
Industrial Control Systems
In industrial control backplanes the EPF10K50VRI240-4 serves as a protocol-bridging and timing-controller FPGA, with 360 LABs supporting real-time state machines for encoder feedback, motor-control PWM generation, and fieldbus glue logic. The 0-70°C commercial temperature range is adequate for cabinet-mounted controllers, while the exposed-pad 240-RQFP package enables rework-friendly prototyping during factory-acceptance testing. The 3.3 V VCCINT with MultiVolt VCCIO allows direct interfacing to 5 V legacy PLC I/O without external level shifters, reducing BOM cost. Designers maintaining long-lifecycle industrial lines (15-25 years) can source the part from authorized distributors' last-time-buy stock. The device's PCI pull-up clamping diodes and slew-rate-controlled outputs make it suitable for industrial backplane signaling where EMI and reflection control are essential.
Recommended
Legacy PCI-Based Designs
The EPF10K50VRI240-4 is PCI-compliant out of the box, making it ideal for legacy PCI add-in cards, embedded motherboards, and industrial PCs that predate PCIe migration. Its PCI pull-up clamping diodes, slew-rate control, and open-drain output options are configured pin-by-pin via Altera logic options, eliminating external glue logic. With 189 user I/Os the device easily handles a 32-bit/33 MHz PCI bus plus secondary interfaces such as ISA, VME, or local memory. The -4 speed grade comfortably meets the 33 MHz PCI timing budget with margin to spare for board-level signal integrity variations. Engineers extending the life of PCI-based test equipment, military/aerospace platforms, and factory-floor computers rely on this device for new production and field repairs.
Recommended
Test and Measurement Equipment
Test and measurement instruments from the late 1990s and early 2000s frequently use the EPF10K50VRI240-4 as a pattern-generator, timing-controller, or DSP glue-logic device, where its 50K gates and 2880 LEs provide the density needed for complex stimulus generation. The 0.6 ns propagation delay at the -4 speed grade enables deterministic timing for high-speed digitizers and logic analyzers. With 189 user I/Os the FPGA can directly drive parallel LCD/LED front-panel interfaces, GPIB/HPIB buses, and proprietary instrument backplanes without external bus expanders. The exposed-pad 240-RQFP package is favored for through-hole rework on legacy instruments where BGA replacement is impractical. Calibration labs maintaining vintage oscilloscopes, spectrum analyzers, and ATE systems depend on these FPGAs.
Recommended
Medical Imaging Systems
Pre-2010 medical imaging platforms such as ultrasound carts, MRI gradient controllers, and patient-monitoring backplanes use the EPF10K50VRI240-4 as a timing-and-control FPGA where deterministic behavior and long-term part availability matter more than raw speed. The 189 I/Os support legacy analog-to-digital converter interfaces, beam-former data paths, and front-panel keypads common in medical designs of that era. The 240-RQFP exposed-pad package allows hospitals and biomedical service organizations to perform board-level repair without BGA rework equipment, reducing equipment downtime. Compliance engineering teams maintaining FDA-cleared systems value the part's known behavior, stable timing, and unchanged firmware compatibility with the original Quartus II toolchain. Drop-in Pb-free variants support new production runs for compliance with medical RoHS requirements.
Recommended
Aerospace and Defense Avionics
Military and aerospace programs with 20+ year lifecycle requirements continue to use the EPF10K50VRI240-4 in avionics databuses, radar signal pre-processors, and flight-control test fixtures, where design re-qualification of modern FPGAs is prohibitively expensive. The -4 speed grade's 125 MHz performance and 189 I/Os address MIL-STD-1553, ARINC 429, and discrete-signal interfaces found in legacy avionic LRUs (Line Replaceable Units). Extended-temperature FLEX 10KE variants like the EPF10K50EQI240-2N serve military applications requiring -40°C to +85°C operation. Aerospace sustainment programs source this part through QPL-approved distributors and DLA-land supply chains. The exposed-pad 240-RQFP package meets the rework requirements of depot-level avionics maintenance facilities that lack BGA inspection capability.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50VRI240-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50VRI240-4N | EPF10K50VRI240-3N | EPF10K50VRI240-3 | EPF10K50EQC240-2N | EPF10K50EQC240-3N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 240-RQFP Exposed Pad | 240-RQFP Exposed Pad (same) | 240-RQFP Exposed Pad (same) | 240-RQFP Exposed Pad (same) | 240-RQFP (same) | 240-RQFP (same) |
| Family | FLEX 10K | FLEX 10K (same) | FLEX 10K (same) | FLEX 10K (same) | FLEX 10KE (enhanced) | FLEX 10KE (enhanced) |
| Logic Elements | 2880 | 2880 (same) | 2880 (same) | 2880 (same) | 2880 (same density) | 2880 (same density) |
| User I/Os | 189 | 189 (same) | 189 (same) | 189 (same) | 189 (same) | 189 (same) |
| Speed Grade / Frequency | -4 / 125 MHz | -4 / 125 MHz (same) | -3 / 100 MHz (-20%) | -3 / 100 MHz (-20%) | -2 / slower (-30%) | -3 / 100 MHz (-20%) |
| Lead Finish / RoHS | Leaded / Non-Compliant | Pb-free / Compliant | Pb-free / Compliant | Leaded / Non-Compliant | Pb-free / Compliant | Pb-free / Compliant |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Operating Temperature | 0°C to +70°C | 0°C to +70°C (same) | 0°C to +70°C (same) | 0°C to +70°C (same) | 0°C to +70°C (same) | 0°C to +70°C (same) |
Key Differentiators
- Higher speed grade than -3 variant (vs EPF10K50VRI240-3N)
- Genuine FLEX 10K architecture vs FLEX 10KE (vs EPF10K50EQC240-2N)
- Full 189 I/O count vs smaller-density FPGAs (vs EPF10K30RC240-4N)
Design Notes
Place 0.1 µF decoupling capacitors within 5 mm of every VCCINT/VCCIO pin pair and add a single 10 µF bulk capacitor near each power plane entry point. According to the FLEX 10K datasheet, the device draws high transient currents during simultaneous-switching-output (SSO) events; insufficient decoupling causes VCC sag and logic errors. The exposed thermal pad (pin 241) must be soldered to a continuous ground plane with at least 8 thermal vias (0.3 mm drill, 0.2 mm annular ring) for proper heat dissipation and electrical grounding.
Do not confuse the EPF10K50VRI240-4 (leaded, RoHS non-compliant) with the EPF10K50VRI240-4N (Pb-free, RoHS compliant) when ordering for new RoHS-compliant designs. The datasheet warns that mixing packages may cause tombstoning during reflow. Configuration mode (PS, AS, JTAG, or PPA) must be set by MSEL pins before power-up; an incorrect MSEL state prevents configuration even if the device is otherwise functional. Always re-compile the Quartus II/MAX+PLUS II project after substituting any -4 speed grade with a -3 grade to verify timing closure - the slower part reduces the worst-case slack by approximately 20%.
For PCI-compliant operation at 33 MHz, the FLEX 10K datasheet recommends series damping resistors (22-33 Ω) on PCI outputs driving long board traces to dampen reflections. MultiVolt I/O requires the VCCIO rail to be stable before VCCINT ramps; sequencing the 3.3 V core before the I/O voltage prevents I/O latch-up. For 5 V PCI signaling, use the VCCIO = 5 V option with the on-chip PCI clamping diodes; for 3.3 V signaling, set VCCIO = 3.3 V. Slew-rate control and open-drain options are configured per-pin via Altera logic option assignments in the Quartus II Assignment Editor.
Estimated thermal analysis: at 125 MHz with high SSO utilization, the EPF10K50VRI240-4 dissipates approximately 1.5-2 W typical. With a properly soldered exposed pad to a 4-layer 1 oz copper ground pour (theta_JA approximately 18 °C/W), junction temperature rise is roughly 27-36 °C above ambient, well within the 0-70°C commercial range. For forced-air cooling or sealed enclosures, verify thermal margin with a thermocouple on the package top. The 240-RQFP has 0.5 mm pitch leads - use ENIG or immersion-silver surface finish for best solderability, and avoid HASL finishes which produce inconsistent lead coplanarity on fine-pitch packages.
Compliance Information
The EPF10K50VRI240-4 is RoHS non-compliant due to SnPb lead finish; for RoHS-compliant designs use the EPF10K50VRI240-4N variant. The N-suffixed variants are lead-free and fully RoHS compliant per the original Altera FLEX 10K datasheet documentation.
