EPF10K50VRC240-2 - Flex 10K FPGA, 50K Gates, 240-RQFP | Intel
MPN: EPF10K50VRC240-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.9 | $289.00 |
| 100 | $24.75 | $2,475.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $18.95 | $18,950.00 |
EPF10K50VRC240-2 Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs/LABs) connected through programmable interconnect, allowing hardware designers to implement custom digital logic that can be reconfigured after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> System-on-Chip FPGA. The Flex 10K series introduced embedded array blocks (EABs) for System-on-a-Programmable-Chip (SOPC) integration, combining lookup-table based logic with on-chip RAM.
Key features of the EPF10K50VRC240-2 include 20,480 typical logic elements, a maximum internal frequency of approximately 125 MHz (66.67 MHz in some datasheet graphs), a propagation delay of 0.6 ns, and embedded array blocks for memory implementation. The -2 speed grade identifies a mid-range performance bin within the Flex 10K family. The device is graded for commercial operating temperature (0 °C to +70 °C) and ships in surface-mount gull-wing RQFP-240.
Architecturally, the Flex 10K combines a fine-grained logic fabric (LABs built from 8 logic elements each) with coarse-grained Embedded Array Blocks (EABs), enabling dense on-chip RAM and product-term logic. The 3.3 V core, 0.42 µm process, and SRAM-based configuration make the part volatile (configuration must be loaded at every power-up from a serial or parallel PROM).
Typical applications include glue logic and bus interfaces in telecommunications backplanes, industrial control and instrumentation, prototyping of ASIC-equivalent designs, embedded control in test equipment, and legacy system upgrades where the Flex 10K is already qualified. Designers continue to use EPF10K50VRC240-2 in maintenance and low-volume production of mature platforms.
When designing with this part, plan for external configuration memory (an EPC1/EPC2 configuration PROM, or a microcontroller) because SRAM configuration cells lose their contents on power-down. Provide proper decoupling on every VCCINT/VCCIO pin and observe I/O banking rules for mixed-voltage interfaces.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same Flex 10K family, and practical design notes that go beyond the manufacturer datasheet's tables.
Drop-in alternatives for EPF10K50VRC240-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50VRC240-2 (same form factor and footprint) — differing in Package, Speed Grade, Family, Operating Temperature, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50VRC240-1N
✅ Drop-In✓ In Stock
$28.5 / Unit
View Datasheet →EPF10K50VRC240-2N
✅ Drop-In✓ In Stock
$81.2 / Unit
View Datasheet →EPF10K50VRC240-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$61.75 / Unit
View Datasheet →EPF10K50VRC240-1
✅ Drop-In✓ In Stock
$130.32 / Unit
View Datasheet →EPF10K50VRC240-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$58.75 / Unit
View Datasheet →EPF10K50VRC240-2 Maximum Ratings & Electrical Characteristics
| Family | Flex 10K |
| Logic Cells | 2,880 |
| Typical Gates | 50,000 |
| Logic Elements (LEs) | 20,480 |
| Logic Array Blocks (LABs) | 360 |
| User I/Os | 189 |
| Maximum Internal Frequency | 125 MHz |
| Propagation Delay | 0.6 ns |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 3.3 V |
| Speed Grade | -2 (mid) |
| Package | 240-pin RQFP / HFQFP (exposed pad), gull-wing |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Configuration Memory | SRAM (volatile, external PROM required) |
EPF10K50VRC240-2 240-pin rqfp / hfqfp (exposed pad), gull-wing Pin Configuration Guide
Pin configuration for EPF10K50VRC240-2 (240-pin rqfp / hfqfp (exposed pad), gull-wing package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K50VRC240-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K50VRC240-2 is suitable for 6 applications: Telecommunications Backplane Glue Logic, Industrial Control & Instrumentation, ASIC Prototyping & Emulation, Legacy Test & Measurement Equipment, Aerospace & Defense Upgrade Programs, Embedded Control in Printers & Imaging.
Telecommunications Backplane Glue Logic
The EPF10K50VRC240-2 fits telecommunications backplane glue logic because its 189 user I/Os, 50K gates, and 3.3 V core give enough headroom for bus bridges, address decoding, and protocol conversion between legacy TDM and packet domains. Its 0.6 ns propagation delay supports glue logic running at bus speeds up to 125 MHz on short paths. Placed near connector banks with FIFO buffers and transceivers, the device absorbs timing skew across backplane traces while consuming a moderate ~300 mW core current. Compared with a discrete 74-series implementation, it cuts board area by roughly 70% and adds JTAG-driven in-system updates. The Flex 10K family has a long-proven track record in central-office equipment, and the VRC240 footprint is a drop-in for legacy Altera-based designs.
Recommended
Industrial Control & Instrumentation
The EPF10K50VRC240-2 serves industrial control platforms because its 240-pin RQFP exposes enough I/O for parallel encoder/decoder matrices, optocoupler interfaces, and relay drivers in motor-control cabinets. The 0.42 µm CMOS process delivers stable operation across the 0-70 °C commercial range typical of factory-floor enclosures. With 360 LABs and embedded array blocks, the part implements up to ~20 Kbytes of on-chip RAM for state machines and PID loops without external SRAM. Engineers often pair it with isolated ADC front-ends and CAN/RS-485 transceivers to build deterministic multi-axis controllers. Compared with a CPLD-only solution, the Flex 10K adds programmable 32-bit datapaths for trapezoidal commutation algorithms. Long-term availability through distribution channels remains stable for industrial retrofit programs.
Recommended
ASIC Prototyping & Emulation
The EPF10K50VRC240-2 is well-suited for ASIC prototyping because its 20,480 logic elements and embedded array blocks give 50K gates of usable logic, which is enough to host a medium-complexity ASIC netlist for functional verification. The 240-pin RQFP provides 189 user I/Os, allowing direct connection to ASIC-style parallel buses, memory interfaces, and external test fixtures. Combined with the Quartus II design flow (legacy support), engineers can iterate RTL quickly and re-use the same Flex 10K board across multiple ASIC tape-out cycles. The part supports JTAG boundary-scan (IEEE 1149.1) for in-system bring-up, plus serial configuration from an EPC2 PROM for standalone prototype deployment. Compared with HDL simulators, real-hardware emulation runs at near-real-time, exposing race conditions and reset bugs that pure simulation misses.
Recommended
Legacy Test & Measurement Equipment
The EPF10K50VRC240-2 fits legacy test and measurement equipment where decades-old ATE platforms use Flex 10K-based timing controllers, pattern generators, and pin-electronics interfaces. Its 0.6 ns propagation delay and 125 MHz internal frequency give deterministic timing for handshake protocols between the tester CPU and per-pin ASICs. The 240-pin RQFP leaves enough I/O for parallel tester channels with margin for future channel-count expansion. Designers retain the part because the existing DUT-board fixtures, calibration tables, and test programs are built around its exact timing behavior. Substitution to a Cyclone IV would require full re-characterization of every timing path, so maintainers keep the Flex 10K as long as Intel distribution remains open.
Recommended
Aerospace & Defense Upgrade Programs
The EPF10K50VRC240-2 is used in aerospace and defense upgrade programs where avionics and mission-computer subsystems qualified with the Flex 10K family must be reproduced or refreshed without re-certifying the entire board. Its commercial 0-70 °C range and known FIT-rate behavior fit retrofit programs that do not require full MIL-spec parts. The 240-pin RQFP and 3.3 V core match existing harness, power-tree, and FPGA-slot pin maps exactly. Engineers integrate the part with legacy MIL-STD-1553 transceivers, ARINC 429 line drivers, and discrete logic ICs to extend the service life of fielded platforms. Compared with re-spinning onto a newer FPGA, drop-in replacement minimizes re-validation scope and cuts FAA/DoD certification cycles by months.
Recommended
Embedded Control in Printers & Imaging
The EPF10K50VRC240-2 fits embedded control in high-end printers, plotters, and imaging systems that need precise stepper-motor timing, paper-path sensor fusion, and high-speed image-data routing. With 189 I/Os the device can fan-out to multiple print-head controllers, ADCs, and DRAM interfaces without external bus expander logic. The 0.6 ns propagation delay keeps image pipelines within deterministic latency budgets at pixel rates above 100 MHz. Combined with on-chip EABs, the part stores line buffers and gamma tables directly, simplifying the BOM and lowering the bill of materials. Designers prefer this part because the Flex 10K generation is well-characterized in the imaging industry and its RQFP-240 footprint is already laid out in mature reference designs from major printer OEMs.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50VRC240-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50VRC240-1N | EPF10K50VRC240-2N | EPF10K50VRC240-3 | EPF10K50VRC240-1 | EPF10K50VRC240-3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 240-RQFP (HFQFP) | 240-RQFP (HFQFP) - same | 240-RQFP (HFQFP) - same | 240-RQFP (HFQFP) - same | 240-RQFP (HFQFP) - same | 240-RQFP (HFQFP) - same |
| Speed Grade | -2 | -1 (slower) | -2 (same) | -3 (faster) | -1 (slower) | -3 (faster) |
| Lead-free Termination | Pb-containing (legacy) | Yes (Pb-free) | Yes (Pb-free) | Pb-containing | Pb-containing | Yes (Pb-free) |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Typical Gates | 50K | 50K | 50K | 50K | 50K | 50K |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 |
Key Differentiators
- Identical silicon and footprint as the entire VRC240 family (vs EPF10K50EQC240-2)
- Drop-in compatibility with -1N and -2N variants (vs EPF10K50VRC240-1N)
- Long-proven Flex 10K architecture in telecom and industrial (vs EPF10K30RC240-4N)
Design Notes
The EPF10K50VRC240-2 draws roughly 300 mA on its VCCINT (3.3 V core) rail when fully utilized at 125 MHz, plus 50-100 mA on each VCCIO bank depending on switching activity. Estimated: at VCCINT=3.3 V and 300 mA core current, total core power is about 1.0 W, so a 1.5 W LDO (e.g. LT1117-3.3) is sufficient for core; for VCCIO add a separate regulator per bank if mixing 3.3 V and 5 V peripherals. Decouple every VCC/VCCIO pin with a 0.1 µF X7R placed within 3 mm of the pin, and add four bulk 22 µF tantalum or polymer caps distributed around the package footprint. Configure unused I/Os as outputs driving ground and tie nCONFIG high through a 10 kΩ resistor to ensure clean power-up.
Lay out the EPF10K50VRC240-2 on a 4-layer PCB with a continuous ground plane directly under the package to provide a low-impedance return path for high-speed signals. Estimated: the 240-pin RQFP at 0.5 mm pitch needs 0.15 mm/0.20 mm trace/space on outer layers to escape from all four sides; on inner layers use 0.20 mm/0.20 mm. The exposed thermal pad (when present on the package variant) must be soldered to a 10 mm × 10 mm copper pour with 6-9 thermal vias (0.3 mm drill) to a ground plane to keep θJA below 25 °C/W. Place the EPC1/EPC2 configuration PROM within 25 mm of the FPGA to keep the DCLK trace short and avoid reflection-induced configuration errors.
Three pitfalls trip first-time Flex 10K designers: (1) MSEL pin settings - tie MSEL0/MSEL1 to VCCINT or GND via 10 kΩ resistors to select the configuration mode, never leave them floating; (2) nSTATUS and CONF_DONE need 10 kΩ pull-ups to VCCIO - if nSTATUS stays low after config the FPGA entered an error state, usually from a corrupt EPC image or a noisy DCLK; (3) I/O banking - mixing 5 V inputs into a 3.3 V bank without a series resistor can latch-up the I/O, so always check VCCIO bank assignments in the Quartus pin-planner before layout. A 1 ms CONFIG_DELAY is typical; if the host holds nCONFIG low for longer than 100 ms, re-check the POR circuit.
Estimated: the 240-pin RQFP package has a θJA of roughly 25 °C/W with the recommended copper pad layout. At 1.0 W core power and ambient 60 °C inside a sealed enclosure, the junction runs at ~85 °C - well within the 0-70 °C commercial limit when derated. If the application exceeds 70 °C ambient, switch to a Flex 10K industrial variant or improve airflow; the EPF10K50VRC240-2 is commercial grade only. Use the on-die thermal diode (when present) with an external sensor to monitor junction temperature during bring-up and qualification.
Compliance Information
RoHS and REACH status not stated in the verified data; the part was originally offered with Pb-containing termination. Choose the EPF10K50VRC240-2N suffix variant for lead-free assembly.
