EPF10K50VRI240-3N - 50K Gates FLEX-10K FPGA | Altera | Industrial
MPN: EPF10K50VRI240-3N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42 | $420.00 |
| 100 | $35.75 | $3,575.00 |
| 500 | $29.8 | $14,900.00 |
| 1,000 | $25.4 | $25,400.00 |
EPF10K50VRI240-3N Overview
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the high density of gate arrays with the in-system reconfigurability of logic. The FLEX-10K family specifically pioneered the industry's first embedded programmable logic devices, providing System-on-a-Programmable-Chip (SOPC) integration by combining an Embedded Array Block (EAB) for megafunctions such as efficient memory and specialized logic, with a Logic Array Block (LAB) fabric for general-purpose logic. This architecture positions the FLEX-10K within the broader hierarchy: FPGA -> programmable logic device -> programmable logic IC -> semiconductor.
Key features of the EPF10K50VRI240-3N include 360 LABs, 12 EABs of 2,048 bits each, four Phase-Locked Loops (PLLs) for clock management, in-system programmability through the IEEE 1149.1 JTAG interface, multi-volt I/O support (2.5 V / 3.3 V / 5.0 V tolerant), and 4 mA typical quiescent current in standby. The 'I' in the part suffix indicates the industrial temperature range (-40 °C to +85 °C), and the 'N' suffix indicates a lead-free / Pb-free assembly suitable for RoHS-compliant designs.
Technically, the FLEX-10K architecture implements SRAM configuration memory, requiring a configuration device (EPC) or microcontroller for power-up bitstream loading. The Look-Up Table (LUT)-based LE provides fast 4-input combinational logic and a dedicated register, while the EABs implement dual-port RAM, ROM, FIFO, or multiplier megafunctions. The 240-pin RQFP package offers a 32.0 mm x 32.0 mm body with a 0.5 mm pitch, making it compatible with conventional SMT assembly lines and rework tooling.
Typical applications for the EPF10K50VRI240-3N include industrial control and factory automation PLCs, telecommunications interface cards, prototype ASIC emulation, glue-logic consolidation on legacy 5 V backplanes, digital signal processing front-ends, and bus-interface bridging (PCI, ISA, VME). The -3 speed grade and 189 user I/Os make it well suited to designs that require moderate logic density and high pin count rather than the highest possible clock frequency.
When designing with this part, note that it is a mature, legacy FPGA family and is no longer recommended for new designs. Modern replacements such as the Altera / Intel Cyclone IV or MAX 10 series offer lower cost, lower power, smaller packages, and active support. For new designs targeting the same density class, evaluate Cyclone IV EP4CE40 or EP4CE55 in EQFP or BGA packages as a forward-compatible migration path.
This page synthesizes distributor pricing, parametric specifications, and legacy cross-reference alternatives that are not consolidated on any single manufacturer datasheet or distributor product page.
Drop-in alternatives for EPF10K50VRI240-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50VRI240-3N (same form factor and footprint) — differing in Family, Package, Operating Temperature, Configuration Method, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50VRI240-3
✅ Drop-In✓ In Stock
$52.75 / Unit
View Datasheet →EPF10K50VRC240-3N
✅ Drop-In✓ In Stock
$58.75 / Unit
View Datasheet →EPF10K50VRC240-3
✅ Drop-In✓ In Stock
$61.75 / Unit
View Datasheet →EPF10K50VRI240-4N
✅ Drop-In✓ In Stock
$49.95 / Unit
View Datasheet →EPF10K50VRC240-4N
✅ Drop-In✓ In Stock
$89.5 / Unit
View Datasheet →EPF10K50VRI240-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX-10K |
| Series | EPF10K50 |
| Logic Elements / Cells | 2,880 |
| Typical Gates | 50,000 |
| Embedded Array Blocks (EABs) | 12 |
| Logic Array Blocks (LABs) | 360 |
| Total RAM Bits | 20,480 bits |
| User I/Os | 189 |
| Number of Pins | 240 |
| Package | 240-BFQFP / RQFP-240 with Exposed Pad |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 3.3 V |
| I/O Voltage Tolerance | 2.5 V / 3.3 V / 5.0 V |
| Speed Grade | -3 |
| Internal Performance | Up to 125 MHz |
| PLLs | 4 |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), EPC bootloader |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Mounting Type | Surface Mount |
| Terminal Form | Gull Wing |
| Lead-Free / RoHS | Yes (Pb-free 'N' suffix) |
| Package Code | HFQFP / RQFP-240 |
EPF10K50VRI240-3N hfqfp / rqfp-240 Pin Configuration Guide
Pin configuration for EPF10K50VRI240-3N (hfqfp / rqfp-240 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K50VRI240-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K50VRI240-3N is suitable for 6 applications: Industrial PLC Logic Consolidation, Telecom Interface Card Glue Logic, Legacy ASIC Emulation Prototype, PCI / VME Bus Interface Bridging, DSP Front-End Signal Processing, Field-Replacement and Legacy Sustaining Engineering.
Industrial PLC Logic Consolidation
The EPF10K50VRI240-3N fits industrial PLC front-end logic consolidation because its 2,880 Logic Elements and 189 user I/Os can absorb dozens of discrete 74-series glue-logic ICs into a single programmable device. At the -3 speed grade (125 MHz internal), the FPGA easily handles deterministic 1 ms / 10 ms PLC scan loops and 100 µs fast-counter tasks. The 240-RQFP package and exposed pad support conventional SMT assembly and rework on legacy 5 V backplanes. The industrial -40 °C to +85 °C range matches IEC 61131-2 cabinet environments. Place decoupling on every VCCINT/VCCIO bank pin and use a dedicated EPC configuration device on the JTAG chain so the bitstream loads on power-up without operator intervention.
Recommended
Telecom Interface Card Glue Logic
The EPF10K50VRI240-3N fits telecom interface cards (T1/E1 framer glue, HDB3 encoder, ATM SAR) because its 50K-gate density accommodates the protocol-state machines, FIFOs, and bus-arbiter logic between framers, SAR chips, and the host CPU. The 12 embedded EABs (20,480 bits total) implement dual-port FIFOs for cell/packet buffering without external SRAM. Multi-volt I/O (2.5 V / 3.3 V / 5.0 V tolerant) lets the FPGA bridge legacy 5 V bus-interface ASICs to modern 3.3 V framers without level shifters. The 240-RQFP footprint is large but easily routed on 4-layer backplanes with 0.5 mm pitch. Industrial temp grade supports outdoor cabinet installations.
Recommended
Legacy ASIC Emulation Prototype
The EPF10K50VRI240-3N fits ASIC prototyping/emulation because its FLEX-10K architecture implements real Look-Up Table (LUT)-based logic and dual-port EAB RAM that closely model the gate-level behavior of an ASIC netlist. Engineers in the late 1990s and early 2000s used FLEX-10K to prototype 50K-gate ASICs before committing to silicon, validating firmware one or two quarters ahead of ASIC samples. The 240-RQFP package exposes enough user I/O (189 pins) to break out all ASIC signals plus JTAG for bring-up. The -3 speed grade runs at 125 MHz internally, fast enough for USB 1.1 and PCI 33 MHz emulation. Program via JTAG using a ByteBlasterMV cable and the Quartus MAX+PLUS II toolchain.
Recommended
PCI / VME Bus Interface Bridging
The EPF10K50VRI240-3N fits PCI 2.1 (33 MHz, 32-bit) and VMEbus interface bridging because its 189 user I/Os and 125 MHz -3 speed grade can absorb the bus-master and target state machines, address-decoding logic, and FIFO glue between the local ASIC and the backplane. The 12 EABs (2,048 bits each) implement PCI posted-write and read-ahead FIFOs. Multi-volt I/O support means the same FPGA bridges 5 V PCI signaling and 3.3 V local ASICs without external level shifters. The 240-RQFP footprint is large enough to break out all 124 PCI signals plus VME control. Industrial temp grade handles harsh chassis environments.
Recommended
DSP Front-End Signal Processing
The EPF10K50VRI240-3N fits DSP front-end preprocessing because its EAB-based dual-port RAM implements 8x8 / 12x12 multiplier arrays and FIR-filter coefficient memory without external MAC ICs. At 125 MHz internal, the FPGA can run a 32-tap FIR filter at sample rates up to ~4 MSPS. The 12 EABs allocate to both coefficient ROM and data-RAM buffers. Multi-volt I/O interfaces directly to 5 V ADC front-ends (e.g., AD9220) and 3.3 V DSP processors (e.g., TMS320C5402). The 240-RQFP footprint accommodates 189 user I/Os, enough for 16-bit ADC data plus auxiliary status and clocking. Industrial temp grade suits outdoor base-station or line-card deployment.
Recommended
Field-Replacement and Legacy Sustaining Engineering
The EPF10K50VRI240-3N fits sustaining engineering for installed industrial, medical, and aerospace systems designed in the late 1990s and 2000s with FLEX-10K as the central glue-logic device. Its 240-RQFP footprint matches the original PCB land pattern, allowing direct board-level replacement of failed FPGAs in field-deployed equipment without respinning the system. The 189 user I/Os and 50K gates are sufficient to absorb all originally-allocated logic, and the -3 speed grade preserves the original timing budget. The 'N' (lead-free, RoHS) suffix supports EU-market shipping. Always verify against the original MAX+PLUS II / Quartus netlist before substitution and validate timing closure in the bitstream.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50VRI240-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50VRI240-3 | EPF10K50VRC240-3N | EPF10K50VRC240-3 | EPF10K50VRI240-4N | EPF10K50VRC240-4N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 240-RQFP (with exposed pad) | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same |
| Speed Grade | -3 (125 MHz) | -3 (125 MHz) | -3 (125 MHz) | -3 (125 MHz) | -4 (100 MHz) | -4 (100 MHz) |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C (Commercial) |
| Logic Elements / Cells | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 |
| Total Gates | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 |
| Embedded RAM Bits | 20,480 | 20,480 | 20,480 | 20,480 | 20,480 | 20,480 |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 |
| Lead-Free (N suffix) | Yes | No (non-N) | Yes | No (non-N) | Yes | Yes |
Key Differentiators
- Industrial temperature range with lead-free finish (vs EPF10K50VRC240-3N)
- Higher -3 speed grade performance (vs EPF10K50VRI240-4N)
- RoHS-compliant lead-free assembly (vs EPF10K50VRI240-3)
Design Notes
The EPF10K50VRI240-3N requires four independent power rails: VCCINT (3.3 V core, ~50 mA typical / ~200 mA peak), VCCIO (2.5 V / 3.3 V / 5.0 V tolerant, dependent on bank configuration), VCCPD (3.3 V pre-driver), and a separate analog VCC for the PLLs. Decouple every VCC/VCCIO pin with a 0.1 µF X7R ceramic placed within 3 mm of the pin. Add bulk 47 µF tantalum and 220 µF aluminum caps at the regulator output. Estimated: at 125 MHz toggle rate and 50% utilization, total supply current peaks near 350 mA; budget 700 mA worst case to allow transient headroom.
The FLEX-10K uses SRAM configuration memory that loses its bitstream on power-down. A non-volatile configuration device (EPC2LC20, EPC4, EPC8) must be connected to the JTAG chain and the nCONFIG/nSTATUS/CONF_DONE/DCLK/DATA0 pins for stand-alone boot. Without an EPC, the FPGA requires active serial loading from a microcontroller at every power-up. Estimated: bitstream size for a 90% utilized EPF10K50 is approximately 180 Kbytes; choose EPC2LC20 (2 Mbit) for adequate headroom. The 'N' lead-free suffix supports RoHS assemblies - verify the configuration device also carries the 'N' suffix.
The 240-RQFP with exposed pad (ePAD) dissipates heat primarily through the ePAD copper land on the PCB. Tie the ePAD to a continuous inner-plane copper pour connected to GND. Estimated: with θJA of approximately 28 °C/W on a 4-layer JEDEC test board (EIA/JESD51-7) at 1.0 W total dissipation, junction temperature rises ~28 °C above ambient. For industrial enclosures at 70 °C ambient and 1.5 W dissipation, junction temperature reaches ~112 °C - within spec but with limited margin. Do not rely on forced-air cooling; verify with a thermocouple on the ePAD during worst-case burn-in.
Route the 240-RQFP package on a 4-layer PCB (signal / GND / VCC / signal) with 0.5 mm pitch escape traces. Use a 6-mil trace with 5-mil space on the top layer between RQFP leads to escape without dogbones. Match all global clocks (CLK0-CLK3) and PLL feedback traces to within 100 mil of each other to minimize clock skew. Place the EPC configuration device within 50 mm of the FPGA DATA0/DCLK pins to avoid bitstream timing violations. Keep JTAG signals away from switching I/O to prevent programming errors.
Three common pitfalls when designing with the EPF10K50VRI240-3N: (1) Confusing the -3 and -4 speed grades - both use the same bitstream but the -4 fails timing closure for designs specified against the -3 125 MHz timing model. (2) Using MAX+PLUS II legacy project files - migrate to Quartus II for modern OS support; MAX+PLUS II does not run on 64-bit Windows. (3) Forgetting the JTAG chain termination - if TCK and TMS are left floating, the FPGA may inadvertently enter EXTEST boundary-scan mode and refuse configuration. Always pull-up nCONFIG and nSTATUS through a 10 kΩ resistor.
Compliance Information
Lead-free and RoHS compliant per 'N' suffix; AEC-Q100 automotive qualification not in scope for legacy FLEX-10K family; REACH / halogen-free / conflict-minerals status not documented in available datasheet.
