EPF10K50VRC240-4N - 50K-Gate FLEX-10K FPGA, 240-RQFP | Intel / Altera
MPN: EPF10K50VRC240-4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $128.5 | $1,285.00 |
| 100 | $112 | $11,200.00 |
| 500 | $98.75 | $49,375.00 |
| 1,000 | $89.5 | $89,500.00 |
EPF10K50VRC240-4N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines an array of configurable logic blocks, programmable interconnect, and configurable I/O cells on a single semiconductor die. FPGAs sit hierarchically under the broader category of programmable logic devices, alongside CPLDs, and serve as the dominant platform for digital logic prototyping, glue logic, DSP acceleration, and high-volume ASIC replacement when mask costs are prohibitive. The FLEX-10K family was the industry's first PLD family with embedded array blocks, allowing on-chip implementation of RAM, ROM, FIFOs, and multipliers directly in the logic fabric.
Key features include 50,000 usable gates, 2,880 logic elements, 36 EABs providing a total of 20,480 bits of embedded memory, 189 maximum user I/Os, and a 3.3 V core supply with 5 V tolerant I/O options on selected members. The device is offered in a commercial 0 to 70 C operating range and is qualified to the -4 speed grade. The 240-pin RQFP exposed-pad package enables surface-mount assembly and improved thermal dissipation relative to non-exposed-pad RQFP variants.
Typical applications include telecommunications glue logic, industrial control, prototyping for ASIC designs, low-volume digital signal processing pipelines, and bus-interface bridging. The high gate count and embedded memory make the EPF10K50 suitable for designs that need substantial on-chip storage and parallel datapaths but that do not require the very latest in process technology.
When designing with this part, ensure that the Quartus II or MAX+PLUS II toolchain is used, since the FLEX-10K family predates modern Quartus Prime support. Plan PCB layout around the exposed pad for thermal management, and verify JTAG programming interface compatibility with the chosen configuration PROM.
Drop-in alternatives for EPF10K50VRC240-4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50VRC240-4N (same form factor and footprint) — differing in Package, Operating Temperature, Family, Configuration Method, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50VRC240-3N
✅ Drop-In✓ In Stock
$58.75 / Unit
View Datasheet →EPF10K50VRC240-2N
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$81.2 / Unit
View Datasheet →EPF10K50VRC240-1N
✅ Drop-In✓ In Stock
$28.5 / Unit
View Datasheet →EPF10K50VRI240-4N
✅ Drop-In✓ In Stock
$49.95 / Unit
View Datasheet →EPF10K50VRC240-4
✅ Drop-In✓ In Stock
$85.3 / Unit
View Datasheet →EPF10K50VRC240-3
✅ Drop-In✓ In Stock
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View Datasheet →EPF10K50VRC240-4N Maximum Ratings & Electrical Characteristics
| Family | FLEX-10K |
| Series | FLEX-10K |
| Product Type | FPGA - Field Programmable Gate Array |
| Logic Family | CMOS |
| Typical Gates | 50,000 |
| Logic Cells / Elements | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Array Blocks (EABs) | 36 |
| Embedded Memory (Total RAM Bits) | 20,480 |
| Maximum User I/Os | 189 |
| Number of I/Os | 189 |
| Package | 240-BFQFP Exposed Pad (RQFP / RQFP-EP) |
| Package Pin Count | 240 |
| Mounting Type | Surface Mount |
| Internal Frequency (typical) | 66.67 MHz |
| Propagation Delay | 0.6 ns |
| Speed Grade | -4 |
| Core Supply Voltage | 3.3 V |
| Operating Temperature | 0 C to 70 C |
EPF10K50VRC240-4N 240 Pin Configuration Guide
Pin configuration for EPF10K50VRC240-4N (240 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K50VRC240-4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K50VRC240-4N is suitable for 6 applications: Telecommunications Glue Logic, Industrial Control and Instrumentation, ASIC Prototyping and Emulation, Bus Interface Bridging, Legacy System Maintenance and Aftermarket, Digital Signal Processing Pipelines.
Telecommunications Glue Logic
The EPF10K50VRC240-4N fits telecommunications glue-logic applications because its 50,000 gates and 189 user I/Os are sufficient to interface multiple legacy bus protocols and route control signals between ASICs, microcontrollers, and PHYs. The 66.67 MHz internal frequency and 0.6 ns propagation delay comfortably meet typical telecom backplane speeds at the time of the part's release, while the 36 embedded array blocks provide 20,480 RAM bits for small FIFO buffers needed in line-card designs. Placed between a TDM bus controller and a serializer/deserializer, the device can implement protocol conversion, framing, and CRC generation without external memory. Compared with a discrete 74-series glue-logic implementation, this FPGA reduces board area and improves design flexibility for late-stage ECOs.
Recommended
Industrial Control and Instrumentation
The EPF10K50VRC240-4N suits industrial control boards where the commercial 0 to 70 C range matches an enclosure-controlled environment, and where the 240-RQFP exposed-pad package simplifies thermal management on a 4-layer PCB. With 2,880 logic cells, the part can host a full motion-control state machine, encoder interface, PWM generation, and serial-protocol bridges simultaneously, replacing several discrete TTL/MSI chips. The exposed thermal pad conducts heat into the inner ground plane, keeping junction temperature well within safe limits at the device's modest 3.3 V core current. For designs that need to operate in uncontrolled factory floors, migrate to the EPF10K50VRI240-4N industrial-temperature variant instead.
Recommended
ASIC Prototyping and Emulation
The EPF10K50VRC240-4N is well suited as an ASIC prototyping vehicle because its 50K usable gates and 2,880 logic cells can map representative sub-blocks of an ASIC design, allowing firmware and system software to be developed before the ASIC tape-out. The 36 embedded array blocks provide 20,480 RAM bits, enough to model register files and small cache memories. Engineers use this FPGA in conjunction with MAX+PLUS II or Quartus II synthesis flows to validate RTL, timing closure, and JTAG-based debug before committing to silicon. Compared with ASIC, the FLEX-10K allows rapid iteration cycles measured in minutes rather than weeks.
Recommended
Bus Interface Bridging
The EPF10K50VRC240-4N bridges legacy parallel buses such as ISA, PC/104, VME, or proprietary backplanes, where the 189 user I/Os comfortably accommodate multiple 8-bit, 16-bit, and 32-bit bus interfaces simultaneously. The device's 0.6 ns propagation delay supports bus cycles up to 66 MHz, sufficient for many embedded CPU peripherals. Designers implement bus arbitration, address decoding, and DMA handshaking directly in the FPGA fabric, eliminating discrete PLDs and reducing board complexity. The exposed-pad 240-RQFP package remains pin-compatible with the FLEX-10K family, easing second-source qualification.
Recommended
Legacy System Maintenance and Aftermarket
The EPF10K50VRC240-4N is critical for maintaining deployed legacy systems where the original Altera FLEX-10K FPGA cannot be redesigned without recertifying the entire product. With 50K gates and 189 I/Os, it replicates the original logic, timing, and JTAG configuration interface without firmware changes. Distributors and brokers continue to ship remaining factory stock for industrial, medical, military, and aerospace systems with 15-20 year service lifetimes. When original stock is exhausted, drop-in variants such as the EPF10K50VRC240-3N or EPF10K50VRC240-1N provide equivalent functionality with the same silicon die.
Recommended
Digital Signal Processing Pipelines
The EPF10K50VRC240-4N supports modest DSP pipelines such as FIR filters, FFT preprocessing, and video timing controllers, where the 36 embedded array blocks (EABs) provide 20,480 RAM bits that can be configured as coefficient ROM or data buffers. With 0.6 ns propagation delay on carry chains, the device can implement 8-bit multipliers and accumulators at sample rates compatible with audio and baseband processing. The exposed-pad package enables thermal stability under sustained switching activity. Compared with a dedicated DSP chip, the FLEX-10K adds flexibility for algorithm updates without board rework.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50VRC240-4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50VRC240-3N | EPF10K50VRC240-2N | EPF10K50VRC240-1N | EPF10K50VRI240-4N | EPF10K50VRC240-4 | EPF10K50VRC240-3 |
|---|---|---|---|---|---|---|---|
| Package | 240-RQFP Exposed Pad | 240-RQFP Exposed Pad | 240-RQFP Exposed Pad | 240-RQFP Exposed Pad | 240-RQFP Exposed Pad | 240-RQFP Exposed Pad | 240-RQFP Exposed Pad |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 |
| Logic Cells | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 |
| Embedded RAM Bits | 20,480 | 20,480 | 20,480 | 20,480 | 20,480 | 20,480 | 20,480 |
| Speed Grade | -4 | -3 | -2 | -1 | -4 | -4 | -3 |
| Operating Temperature | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | -40 C to +85 C (Industrial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) |
| Packaging | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tray | Tray |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Faster speed grade available in identical footprint (vs EPF10K50VRC240-4)
- Industrial temperature grade available in identical footprint (vs EPF10K50VRC240-4N (commercial))
- Embedded array blocks (EABs) provide on-chip memory (vs Lattice ispMACH 4000ZE)
Design Notes
The 240-RQFP exposed-pad package is the primary thermal path for the EPF10K50VRC240-4N. Solder the center exposed pad to a copper land of at least 150 square millimeters on the top layer, with thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to inner ground planes. With a 3.3 V core and typical FLEX-10K toggle rates around 66 MHz, junction-to-ambient thermal resistance is dominated by PCB copper area; without proper land design, junction temperature can rise 30-40 C above ambient. At 70 C ambient this still meets the 0 to 70 C commercial rating, but in enclosed industrial enclosures an industrial-temperature variant is recommended.
Route all 240 FPGA I/O signals on the top layer or, preferably, break out to inner layers on a 4-layer stack-up with continuous ground plane beneath the device. Decouple the 3.3 V VCCINT pins with 0.1 uF X7R ceramic capacitors placed within 2 mm of each supply pin, plus a single 10 uF bulk tantalum or ceramic capacitor near the device. Provide separate analog and digital ground regions only if the design also uses mixed-signal ICs; otherwise a single ground plane is optimal for FLEX-10K. Keep configuration PROM and JTAG chain traces short (< 50 mm) and well isolated from clock signals to avoid programming errors during in-system configuration.
Estimated: the EPF10K50VRC240-4N does not support modern Quartus Prime versions; designers must use MAX+PLUS II 10.2 or Quartus II 9.0 or earlier. Failing to install a compatible toolchain is the most common reason for design-startup delays on legacy FLEX-10K projects. Second, do not confuse the -4 speed grade with the -4 temperature grade; in the FLEX-10K naming convention, the suffix digit denotes speed, while the 'N' suffix or absence thereof denotes packaging (Tape & Reel vs Tray). Third, always verify that any third-party IP core is compiled for FLEX-10K architecture, not Cyclone or Stratix, before integration.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-mineral compliance data for the EPF10K50VRC240-4N was not present in the verified web data; recommend checking the legacy Intel Altera product page or distributor environmental disclosures before committing to new designs. AEC-Q100 is not applicable as this is a commercial-grade FPGA.
