EPF6016BC256-2 - FLEX 6000 FPGA, 16K Gates, 204 I/O | Altera
MPN: EPF6016BC256-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.95 | $1,395.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.85 | $10,850.00 |
EPF6016BC256-2 Overview
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines programmable logic elements, configurable interconnect, and I/O blocks into a single silicon die. FPGAs sit above CPLDs in the programmable logic hierarchy and below ASICs in NRE cost; SRAM-based devices like the FLEX 6000 family are reconfigurable in-system, allowing rapid prototyping, field updates, and design reuse across product revisions without retooling.
Key features include up to 1320 logic elements, 204 user I/Os, embedded array blocks for memory implementation, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The device operates across the commercial 0C to 85C temperature range and supports fast synchronous state machines, register-intensive datapaths, and glue-logic replacement.
The FLEX 6000 architecture is built on a 0.42-micron SRAM process with a four-input look-up table (LUT) per logic element and a continuous FastTrack interconnect. This delivers predictable timing, low static power, and deterministic place-and-route results - ideal for bus-interface bridging, peripheral controllers, and custom I/O expansion.
Typical applications include industrial glue-logic, communication bridging between legacy microcontrollers and modern peripherals, ASIC prototyping, low-volume custom controllers, and DSP co-processing front-ends. The 204 I/O count makes it well-suited for parallel bus interfacing and bus-width conversion.
When designing with this FPGA, ensure the 5V VCCIO and VCCINT rails share a clean power source and that decoupling follows the reference design. Quartus II (legacy) or MAX+PLUS II toolchains are used for place-and-route, and JTAG programming requires the ByteBlasterMV download cable.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone - providing engineers with the cross-reference intelligence needed to manage the FLEX 6000 lifecycle.
Drop-in alternatives for EPF6016BC256-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016BC256-2 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Device Type, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016AFC256-2
✅ Drop-In✓ In Stock
$33.05 / Unit
View Datasheet →EPF6016AFC256-3
✅ Drop-In✓ In Stock
$22.1 / Unit
View Datasheet →EPF6016BC256-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Logic Elements | 1320 |
| Typical Gates | 16,000 |
| Maximum Logic Gates | 24,000 |
| User I/O Pins | 204 |
| Supply Voltage (VCCINT / VCCIO) | 4.75 V to 5.25 V |
| Package | 256-FBGA (FineLine BGA, 17x17 mm) |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | -2 |
| Process Technology | 0.42 um SRAM |
| Programmability | SRAM-based, in-system reconfigurable |
| Configuration Interface | JTAG (IEEE 1149.1) + serial |
| Internal Memory | Embedded array blocks (EABs) |
| Mounting Type | Surface Mount (BGA) |
EPF6016BC256-2 Pin Configuration
| Pin A1 | IO — User I/O ball (pin assignment depends on configuration) |
| Pin A2 | IO — User I/O ball |
| Pin A3 | IO — User I/O ball |
| Pin A4 | VCCINT — Core supply voltage (4.75-5.25V) |
| Pin A5 | GND — Ground |
| Pin A6 | VCCIO — I/O supply voltage (4.75-5.25V) |
| Pin A7 | IO — User I/O ball |
| Pin A8 | IO — User I/O ball |
| Pin B1 | IO — User I/O ball |
| Pin B2 | nCONFIG — Configuration control (active-low reset) |
| Pin B3 | IO — User I/O ball |
| Pin B4 | IO — User I/O ball |
| Pin B5 | IO — User I/O ball |
| Pin B6 | IO — User I/O ball |
| Pin B7 | nSTATUS — Configuration status (active-low) |
| Pin B8 | CONF_DONE — Configuration complete indicator |
| Pin C1 | IO — User I/O ball |
| Pin C2 | IO — User I/O ball |
| Pin C3 | TDI — JTAG Test Data In |
| Pin C4 | TCK — JTAG Test Clock |
| Pin C5 | TMS — JTAG Test Mode Select |
| Pin C6 | TDO — JTAG Test Data Out |
| Pin C7 | DCLK — Configuration clock input |
| Pin C8 | IO — User I/O ball |
| Pin D1 | IO — User I/O ball |
| Pin D2 | IO — User I/O ball |
| Pin D3 | IO — User I/O ball |
| Pin D4 | GND — Ground |
| Pin D5 | VCCINT — Core supply voltage |
| Pin D6 | GND — Ground |
| Pin D7 | IO — User I/O ball |
| Pin D8 | IO — User I/O ball |
| Pin E1 | IO — User I/O ball |
| Pin E2 | IO — User I/O ball |
| Pin E3 | IO — User I/O ball |
| Pin E4 | VCCIO — I/O supply voltage |
| Pin E5 | GND — Ground |
| Pin E6 | VCCIO — I/O supply voltage |
| Pin E7 | IO — User I/O ball |
| Pin E8 | IO — User I/O ball |
| Pin F1 | IO — User I/O ball |
| Pin F2 | IO — User I/O ball |
| Pin F3 | IO — User I/O ball |
| Pin F4 | GND — Ground |
| Pin F5 | VCCINT — Core supply voltage |
| Pin F6 | GND — Ground |
| Pin F7 | IO — User I/O ball |
| Pin F8 | IO — User I/O ball |
| Pin G1 | IO — User I/O ball |
| Pin G2 | IO — User I/O ball |
| Pin G3 | IO — User I/O ball |
| Pin G4 | VCCIO — I/O supply voltage |
| Pin G5 | GND — Ground |
| Pin G6 | VCCIO — I/O supply voltage |
| Pin G7 | IO — User I/O ball |
| Pin G8 | IO — User I/O ball |
| Pin H1 | IO — User I/O ball |
| Pin H2 | IO — User I/O ball |
| Pin H3 | IO — User I/O ball |
| Pin H4 | GND — Ground |
| Pin H5 | VCCINT — Core supply voltage |
| Pin H6 | GND — Ground |
| Pin H7 | IO — User I/O ball |
| Pin H8 | IO — User I/O ball |
Typical Applications
EPF6016BC256-2 is suitable for 6 applications: Industrial Glue Logic Replacement, Legacy Communication Bus Bridging, ASIC Prototyping and Validation, DSP Front-End Co-Processing, Low-Volume Custom Controllers, Test and Measurement Equipment.
Industrial Glue Logic Replacement
The EPF6016BC256-2 replaces multiple discrete 74-series logic ICs (gates, muxes, latches, buffers) on legacy industrial PCBs. With 1320 logic elements and 204 user I/Os in the 256-FBGA package, it absorbs up to ~50 standard-logic chips into one device, drastically reducing board area, BOM count, and assembly cost. The 5V tolerant I/O makes it ideal for industrial 5V backplanes. Designers typically describe their logic in VHDL/Verilog using MAX+PLUS II, then synthesize to the FLEX 6000 LUT-based architecture, replacing 7400-series glue logic and freeing PCB real estate for new functionality.
Recommended
Legacy Communication Bus Bridging
The EPF6016BC256-2 is widely used as a bridge between legacy parallel buses (ISA, PC/104, VME) and modern high-speed serial interfaces. Its 204 I/Os comfortably handle 16-bit and 32-bit wide bus widths plus handshaking signals, while internal logic elements implement protocol conversion state machines. The 1320-LE fabric fits typical bridge designs with margin for debug logic. The 5V VCCIO directly interfaces legacy 5V peripherals without level shifters, simplifying PCB design and reducing BOM. Speed grade -2 supports bus clocks up to 60 MHz typical, sufficient for most legacy bus applications.
Recommended
ASIC Prototyping and Validation
Designers use the EPF6016BC256-2 as a low-cost prototyping vehicle for ASIC designs targeting 5V-rail industrial or consumer ASICs. Its 1320 logic elements are sufficient to validate control logic, glue logic, and basic datapath blocks before committing to mask costs. FPGAs in the FLEX 6000 family have predictable timing that closely emulates ASIC behavior for control-dominated designs, and JTAG-based in-system reconfigurability enables rapid iteration. The 204 I/Os expose enough test points for real-time logic-analyzer probing of internal nets, making FPGA prototypes a powerful validation step before silicon spin.
Recommended
DSP Front-End Co-Processing
The EPF6016BC256-2 can serve as a co-processor for DSP front-end tasks including FIR filtering, FFT preprocessing, and digital up/down-conversion in cost-sensitive applications. Its embedded array blocks (EABs) implement small distributed RAMs for coefficient storage, and the LUT-based logic elements run parallel multiply-accumulate structures. The 256-FBGA package's short traces preserve signal integrity at DSP clock rates, and the 204 I/Os provide enough bandwidth for parallel data paths. While modern designs use dedicated DSP blocks in Cyclone/Stratix families, FLEX 6000 remains viable for legacy DSP subsystems.
Recommended
Low-Volume Custom Controllers
For low-volume production runs (hundreds to a few thousand units) where ASIC NRE costs are prohibitive, the EPF6016BC256-2 delivers ASIC-like integration with FPGA programmability. Designers implement custom motor-control, sensor-fusion, or peripheral controllers in VHDL, burn the configuration into the SRAM via JTAG at production, and deploy. With 1320 logic elements and 204 I/Os, it supports substantial state-machine complexity plus multiple peripheral interfaces. The FLEX 6000 family's mature toolchain (MAX+PLUS II) and broad IP library shorten development time, while Altera/Intel's long-term supply program supports end-of-life bridging.
Recommended
Test and Measurement Equipment
Test equipment manufacturers use the EPF6016BC256-2 to implement pattern generators, custom timing controllers, and signal-conditioning logic in bench-top instruments. Its 204 user I/Os drive multiple DUT parallel interfaces simultaneously, while 1320 logic elements implement timing/state-machine cores. The 5V VCCIO directly interfaces legacy instrumentation signal levels without level translation, simplifying the analog front-end design. SRAM-based reconfigurability allows field upgrades to add new test patterns or fix bugs without hardware recall - a major advantage over fixed-function ASIC solutions in T&M markets.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016BC256-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016AFC256-2 | EPF6016AFC256-3 |
|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-FBGA FineLine (17x17 mm) | 256-FBGA FineLine - same | 256-FBGA FineLine - same |
| Logic Elements | 1320 | 1320 | 1320 |
| Typical Gates | 16,000 | 16,000 | 16,000 |
| User I/Os | 204 | 204 | 204 |
| Speed Grade | -2 (mid) | -2 (mid) | -3 (fastest) |
| Supply Voltage | 4.75V to 5.25V | 4.75V to 5.25V | 4.75V to 5.25V |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Drop-in Compatible | N/A (reference) | Yes (100% pin-compatible) | Yes (pin-compatible, faster fMAX) |
Key Differentiators
- True second-source availability with identical silicon (vs EPF6016AFC256-2)
- Mid-tier speed grade balances cost and performance (vs EPF6016AFC256-3)
- 204 user I/Os versus smaller density competitors (vs EPF6016AQC208-2)
Design Notes
The EPF6016BC256-2 requires separate VCCINT (core) and VCCIO (I/O) rails, both within 4.75V to 5.25V. Place 0.1uF ceramic decoupling capacitors adjacent to every pair of VCC/GND balls, with bulk 10uF tantalum or ceramic caps at board entry. Estimated: with 1320 LEs at 100% utilization and 50 MHz toggle, expect ICCINT ~150 mA and ICCIO ~100 mA - plan power budget and thermal dissipation accordingly. For mixed-voltage designs, drive 5V outputs into 3.3V loads only with series resistors or level shifters; the FLEX 6000 I/O is 5V tolerant but not 3.3V compatible without design care.
While the FLEX 6000 family is not high-power, sustained operation near the 85C commercial limit requires thermal management. Theta-JA for the 256-FBGA package is approximately 25 C/W typical with a JEDEC-standard test board. Estimated: at 1W total dissipation, junction temperature rise is ~25C above ambient. In enclosed industrial cabinets with ambient near 70C, consider 100 LFM airflow or a heat spreader to maintain reliability. Avoid placing the FPGA directly next to high-power components like DC-DC converters; route ground plane unbroken beneath the BGA for heat spreading.
Do not assume 3.3V peripherals work directly with the FLEX 6000 - the 5V VCCIO and TTL/CMOS-compatible I/O standards can damage 3.3V-only inputs. Use bidirectional level shifters (e.g., 74LVC245) when bridging to 3.3V devices. Also note: SRAM-based FPGAs require configuration at every power-up; ensure the JTAG chain is properly terminated and the ByteBlasterMV header is accessible for field updates. Estimated: in production, configure from a serial configuration PROM (e.g., EPC1) for one-time setup. Finally, this part is OBSOLETE - new designs should target Cyclone IV or Cyclone 10 LP for long-term supply.
Compliance Information
RoHS and lead-free status not explicitly stated in verified distributor data; marked unknown. Commercial temperature grade (0C to 85C); no AEC-Q100 automotive qualification. For automotive or medical applications, verify compliance directly with Intel/Altera material declarations before design-in.
