EPF6016BC256-3N - FLEX 6000 FPGA, 16K Gates, 256-BGA | Intel
MPN: EPF6016BC256-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $33.2 | $332.00 |
| 100 | $27.85 | $2,785.00 |
| 500 | $22.4 | $11,200.00 |
| 1,000 | $18.95 | $18,950.00 |
EPF6016BC256-3N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs) connected via programmable interconnect. Within the broader taxonomy, FPGAs sit alongside CPLDs as the two main branches of programmable logic devices (PLDs), which themselves are a category of digital integrated circuits in the semiconductor family. FPGAs differ from CPLDs in offering higher logic density, more complex routing, and SRAM-based configuration that supports in-system re-programmability.
Key specifications of the EPF6016BC256-3N include 1,320 logic elements, 16,000 typical gates, 204 user I/O pins, 5 V core I/O supply, a -3 speed grade (-3N suffix denotes industrial temperature range, 0 °C to +85 °C), and a maximum internal frequency around 125 MHz. The 256-pin FineLine BGA package offers a compact footprint suitable for high-density PCB designs. The part is shipped in tray packaging.
The architecture of the FLEX 6000 family combines look-up-table (LUT)-based logic elements with a continuous FastTrack interconnect routing structure, allowing predictable timing for registered and combinational paths. The 0.42 µm process supports 5 V operation, useful for legacy 5 V system designs and TTL-compatible interfaces. The device is configured via a serial configuration EPROM (EPC1, EPC2), supporting in-system programming.
Typical applications include glue logic replacement, custom peripheral interfacing in 5 V industrial backplanes, communications protocol bridging, retro-upgrades of legacy TTL/CMOS designs, ASIC prototyping, and educational development platforms. The fine-pitch BGA is well-suited to space-constrained PCBs but requires careful PCB layout and assembly.
Designers should plan for a 5 V-tolerant power supply and consider the legacy nature of the FLEX 6000 family. The -3N industrial temperature range suffix supports commercial/industrial environments. Designers should ensure modern software support via the Altera Quartus MAX+PLUS II toolchain, and verify long-term availability before committing to new production runs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for legacy FPGAs not commonly covered in newer datasheets, providing information gain beyond standard manufacturer documentation.
Drop-in alternatives for EPF6016BC256-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6016BC256-3N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Device Type, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6016BC256-3
✅ Drop-In✓ In Stock
$17.1 / Unit
View Datasheet →EPF6016BC256-2N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF6016BC256-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$10.85 / Unit
View Datasheet →EPF6016AFC256-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$22.1 / Unit
View Datasheet →EPF6016AFC256-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$33.05 / Unit
View Datasheet →EPF6016BC256-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | 1320 |
| Typical Gate Count | 16,000 gates |
| User I/Os | 204 |
| Internal Frequency (max) | 125 MHz |
| Process Technology | 0.42 µm CMOS |
| Supply Voltage | 5 V |
| Package | 256-BGA (FineLine) |
| Speed Grade | -3 |
| Temperature Range | 0 °C to +85 °C (industrial, N suffix) |
| Configuration Method | Serial configuration EPROM |
| Mounting Type | Surface Mount (BGA) |
| Packaging | Tray |
EPF6016BC256-3N Pin Configuration
| Pin 1 | I/O — User I/O pin (bank-dependent voltage tolerance) |
| Pin 2 | I/O — User I/O pin |
| Pin 3 | I/O — User I/O pin |
| Pin 4 | I/O — User I/O pin |
| Pin 5 | I/O — User I/O pin |
| Pin 6 | I/O — User I/O pin |
| Pin 7 | I/O — User I/O pin |
| Pin 8 | I/O — User I/O pin |
| Pin 9 | GND — Ground |
| Pin 10 | VCCIO — I/O supply voltage (5 V) |
| Pin 11 | I/O — User I/O pin |
| Pin 12 | I/O — User I/O pin |
| Pin 13 | nCONFIG — Configuration control (active low) |
| Pin 14 | nSTATUS — Configuration status (active low) |
| Pin 15 | CONF_DONE — Configuration complete indicator |
| Pin 16 | DCLK — Configuration clock input |
| Pin 17 | DATA0 — Configuration data input |
| Pin 18 | DEV_OE — Device-wide output enable (active low) |
| Pin 19 | DEV_CLRn — Device-wide clear (active low) |
| Pin 20 | TCK — JTAG test clock |
| Pin 21 | TMS — JTAG test mode select |
| Pin 22 | TDI — JTAG test data in |
| Pin 23 | TDO — JTAG test data out |
| Pin 24 | VCCINT — Core supply voltage (5 V) |
| Pin 25 | GND — Ground |
Typical Applications
EPF6016BC256-3N is suitable for 6 applications: Glue Logic Replacement, 5 V Industrial Backplane Interface, ASIC Prototyping and Emulation, Legacy Peripheral Bus Bridging, Custom Protocol Converter, Retro-Upgrade of TTL/CMOS Designs.
Glue Logic Replacement
The EPF6016BC256-3N's 1,320 logic elements and 204 user I/Os make it ideal for replacing multiple discrete 74-series TTL/CMOS glue-logic chips with a single programmable device. Designers typically consolidate address decoding, bus arbitration, chip-select generation, and timing-control logic that would otherwise require dozens of SSI/MSI packages. The 5 V I/O tolerance is directly compatible with legacy TTL buses, eliminating level shifters. At 125 MHz internal frequency, the FLEX 6000 family comfortably handles any glue-logic timing constraint in industrial backplane designs, while the JTAG-based in-system programming enables last-minute design changes without board rework.
Recommended
5 V Industrial Backplane Interface
The EPF6016BC256-3N is purpose-built for 5 V industrial backplane interface applications where TTL-compatible signaling and industrial temperature tolerance are mandatory. Its 5 V VCCIO and VCCINT supplies eliminate the need for level shifting when interfacing to legacy 5 V peripherals, sensors, and bus transceivers. With 204 user I/Os, the device can directly fan out to multiple backplane connectors while the 1320 logic elements implement bus protocol converters and framing logic. The -3N industrial temperature rating (0 °C to +85 °C) suits factory-floor enclosures and outdoor cabinets. The 256-BGA FineLine package delivers high I/O density for compact backplane line cards.
Recommended
ASIC Prototyping and Emulation
The EPF6016BC256-3N serves as a fast-turnaround ASIC prototyping and emulation platform for early-stage ASIC development before mask fabrication. Designers map RTL designs onto the 1,320 logic elements to validate functionality, verify timing closure, and demonstrate working silicon prototypes to customers without committing to NRE mask costs. The in-system re-programmability allows rapid design iteration: a new bitstream is loaded from a serial configuration EPROM or JTAG in seconds. According to the FLEX 6000 datasheet, the FastTrack interconnect delivers predictable timing for registered paths, which aids timing-driven synthesis. For larger ASIC emulation, multiple FLEX 6000 devices can be cascaded on a prototyping board.
Recommended
Legacy Peripheral Bus Bridging
The EPF6016BC256-3N excels at legacy peripheral bus bridging between incompatible bus architectures such as ISA, PC/104, VME, and custom parallel buses. With 204 user I/Os and 1,320 logic elements, a single device implements a complete bus bridge including address decoding, data buffering, wait-state generation, and interrupt steering. The 5 V I/O tolerance integrates directly with 5 V peripheral logic, and the 125 MHz internal frequency provides ample timing margin for slow legacy buses. Industrial temperature grade (-3N) suits chassis-mounted bridge cards in factory automation and test equipment. The 256-BGA package fits on a standard PCI-104 card footprint.
Recommended
Custom Protocol Converter
The EPF6016BC256-3N is well suited to custom protocol converter designs that bridge UART, SPI, I2C, parallel ports, and proprietary industrial protocols. The 1320 logic elements handle state machines, FIFOs, and CRC engines for protocol framing, while the 204 user I/Os accommodate multiple bus interfaces simultaneously. Industrial temperature tolerance supports outdoor and factory-floor deployment, and 5 V I/O matches legacy industrial sensor interfaces. JTAG-based programming allows last-minute protocol updates in the field. According to Altera application notes, the FLEX 6000 family is widely used in industrial protocol gateway designs due to its 5 V tolerance and robust I/O count.
Recommended
Retro-Upgrade of TTL/CMOS Designs
The EPF6016BC256-3N provides a practical retro-upgrade path for legacy TTL/CMOS circuit boards that need to fix bugs, add features, or modernize without a full PCB redesign. By replacing dozens of 74LS/74HC chips with one FLEX 6000 FPGA, designers reduce component count, improve reliability, and add features such as JTAG boundary-scan testability. The 5 V supply matches existing power rails, the 204 user I/Os fit complex retrofits, and the industrial temperature rating suits equipment deployed in factories. According to industry retro-upgrade guidelines, FPGAs in the same voltage class as the original logic eliminate level-shift complications and simplify the migration.
Recommended
Recommended Products Summary
Engineering reference data for EPF6016BC256-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6016BC256-3 | EPF6016BC256-2N | EPF6016BC256-2 | EPF6016AFC256-3 | EPF6016AFC256-2 |
|---|---|---|---|---|---|---|
| Package | 256-BGA (FineLine) | 256-BGA (FineLine) - same | 256-BGA (FineLine) - same | 256-BGA (FineLine) - same | 256-BGA (FineLine) - same | 256-BGA (FineLine) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1320 LEs | 1320 LEs - same | 1320 LEs - same | 1320 LEs - same | 1320 LEs - same | 1320 LEs - same |
| Speed Grade | -3 (125 MHz max) | -3 - same | -2 (slower) | -2 (slower) | -3 - same | -2 (slower) |
| Temperature Range | 0C to +85C (industrial) | 0C to +70C (commercial) | 0C to +85C (industrial) - same | 0C to +70C (commercial) | 0C to +70C (commercial) | 0C to +70C (commercial) |
| Silicon Revision | B | B - same | B - same | B - same | A (earlier revision) | A (earlier revision) |
| Supply Voltage | 5 V | 5 V - same | 5 V - same | 5 V - same | 5 V - same | 5 V - same |
| User I/Os | 204 | 204 - same | 204 - same | 204 - same | 204 - same | 204 - same |
Key Differentiators
- Industrial 0C to +85C temperature range (N suffix) (vs EPF6016BC256-3)
- Higher -3 speed grade (125 MHz max) (vs EPF6016BC256-2N)
- 204 user I/Os in 256-BGA FineLine (vs EPF6016AQC208-3N)
Design Notes
Estimated: The FLEX 6000 family at 5 V supply and 125 MHz toggling on ~30% of 1,320 LEs draws approximately 250-400 mA, dissipating 1.25-2 W in the 256-BGA package. With a typical theta_JA of 18 C/W for the FineLine BGA on a 4-layer PCB with adequate thermal vias, junction temperature rise is ~22-36 C above ambient. In a sealed enclosure at +60 C ambient, the junction could approach +85 C, derating industrial-temperature headroom. Recommended: use a thermal pad pattern, thermal vias under the BGA, and adequate airflow. For full industrial-temperature operation (-40 to +85 C), consult the FLEX 6000 device-specific datasheet for verified thermal models.
The 256-pin FineLine BGA uses a 1.0 mm pitch which requires laser-drilled or precision-drilled PCB vias, ENIG or immersion-silver surface finish, and via-in-pad or dog-bone fanout. Place a continuous ground plane on layer 2 directly under the BGA to provide a low-impedance return path. Decoupling: place 0.1 uF X7R ceramic capacitors every 10-15 power pins, plus bulk 10 uF tantalum or polymer capacitors on each supply rail near the BGA. Differential pairs (if used for LVDS) must be length-matched within 25 mils. Do not route signals under the BGA escape area on layer 1.
Common pitfalls when designing with the EPF6016BC256-3N: (1) Using the MAX+PLUS II toolchain without setting the correct device family target - Quartus must be set to FLEX 6000 compatibility mode; (2) Forgetting to connect the JTAG chain TCK/TMS/TDI/TDO properly to allow in-system programming; (3) Mixing 5 V VCCIO and 3.3 V peripherals on the same I/O bank - FLEX 6000 supports bank-based voltage reference but only at 5 V; (4) Omitting the serial configuration EPROM (EPC1/EPC2) - the FLEX 6000 family does not support standalone non-volatile configuration without an external EPROM or JTAG programmer. Always verify the configuration scheme before PCB layout.
For BGA escape routing, use microvia-in-pad or 4-mil trace/space with 8-mil via pads to maximize routing channels on the top layer. Match impedance for high-speed signals (target 50 ohm single-ended, 100 ohm differential). Isolate high-frequency clock traces (DCLK, TCK) from analog-sensitive signals with a ground guard trace or guard via fence. Place the configuration EPROM (EPC1/EPC2) within 1 inch of the FLEX 6000 device and route DATA0/DCLK/nCONFIG/nSTATUS/CONF_DONE as point-to-point signals with no branches. JTAG chain order should follow the BSDL file specification in the FLEX 6000 datasheet.
Compliance Information
EPF6016BC256-3N is a legacy FLEX 6000 family part introduced in the mid-1990s. RoHS and REACH compliance status is unknown from the verified distributor data; the part pre-dates RoHS standardization. Lead-free and halogen-free status not documented in the verified web data. For modern compliance requirements, request a manufacturer compliance letter from Intel FPGA.
