EPF6024ATC144-17 - FLEX 6000 FPGA 117 I/O 144-TQFP | Intel
MPN: EPF6024ATC144-17 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.5 | $5,750.00 |
| 1,000 | $9.75 | $9,750.00 |
EPF6024ATC144-17 Overview
What is a FLEX 6000 FPGA? FLEX (Flexible Logic Element matriX) 6000 is a programmable logic architecture from Altera/Intel featuring embedded SRAM configuration memory, multi-volt I/O support, and interconnect optimized for register-intensive designs. Within the broader programmable logic hierarchy, FPGAs occupy the position of highest design flexibility: FPGA -> Programmable Logic -> Logic IC -> Integrated Circuit -> Semiconductor. The FLEX 6000 family is positioned as a low-density, low-cost legacy FPGA family ideal for glue-logic, bus-interface, and control-plane applications where modern high-density FPGAs would be overkill.
Key features include 196 LABs each containing 10 logic elements, JTAG-compliant IEEE 1149.1 boundary-scan test support, multi-voltage I/O standards including 3.3V, 2.5V, and 1.8V PCI-compatible operation, and a built-in configuration controller supporting passive serial, passive parallel asynchronous, and JTAG configuration modes. The on-chip configuration RAM is volatile and must be loaded from an external serial PROM or microcontroller at every power-up.
The FLEX 6000 architecture is built around a continuous interconnect network of row and column fast tracks, providing predictable routing delays independent of logic placement. Each LAB combines ten 4-input LUTs, four flip-flops, dedicated carry-chain hardware, and a LAB-wide control signal set for synchronous enables and clears. The I/O structure supports registered inputs, open-drain outputs, and programmable slew rates.
Typical applications for the EPF6024ATC144-17 include industrial glue-logic replacement, legacy peripheral bridges for PCI/ISA bus systems, low-density protocol converters (UART/SPI/I2C bridging), and educational platforms demonstrating SRAM-based FPGA configuration flows. Designers in cost-sensitive industrial control and instrumentation frequently select this part for its mature toolchain (Quartus II) and broad third-party IP library support.
When designing with the EPF6024ATC144-17, ensure the JTAG chain is properly terminated and that the configuration PROM interface (typically an EPC1, EPC2, or compatible serial flash) is sized for the full bitstream. The device requires a clean 3.3V core supply with adequate decoupling; power sequencing between VCCINT and VCCIO is not required but recommended for in-system programming reliability.
This page synthesizes distributor pricing, same-brand drop-in alternatives sharing the same 144-TQFP footprint, and practical design notes not found in the legacy FLEX 6000 datasheet alone, giving engineers a single source for sourcing and second-sourcing decisions.
Drop-in alternatives for EPF6024ATC144-17 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024ATC144-17 (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, Configuration Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024ATC144-1
✅ Drop-In✓ In Stock
$8.2 / Unit
View Datasheet →EPF6024ATC144-10
✅ Drop-In✓ In Stock
$11.1 / Unit
View Datasheet →EPF6024ATC144-10N
✅ Drop-In✓ In Stock
$14.95 / Unit
View Datasheet →EPF6024ATC144-11
✅ Drop-In✓ In Stock
$15.4 / Unit
View Datasheet →EPF6024ATC144-13
✅ Drop-In✓ In Stock
$7.1 / Unit
View Datasheet →EPF6024ATC144-14
✅ Drop-In✓ In Stock
$17.8 / Unit
View Datasheet →EPF6024ATC144-15
✅ Drop-In✓ In Stock
$9.75 / Unit
View Datasheet →EPF6024ATC144-17 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Logic Elements | 1960 |
| Logic Array Blocks (LABs) | 196 |
| User I/O Pins | 117 |
| Configuration Memory | SRAM (volatile) |
| Package | 144-pin TQFP (TQFP-144) |
| Speed Grade | -17 |
| Operating Temperature | Commercial (0C to +70C junction) |
| Core Voltage | 3.3 V |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V / 5.0 V PCI-compatible |
| Logic Element Structure | 4-input LUT + flip-flop |
| LEs per LAB | 10 |
| Configuration Modes | Passive Serial, Passive Parallel Async, JTAG |
| Boundary Scan | IEEE 1149.1 JTAG compliant |
| Mounting Type | Surface Mount |
EPF6024ATC144-17 Pin Configuration
| Pin 1 | I/O — User I/O (bank-dependent voltage) |
| Pin 2 | I/O — User I/O |
| Pin 3 | I/O — User I/O |
| Pin 4 | I/O — User I/O |
| Pin 5 | I/O — User I/O |
| Pin 6 | I/O — User I/O |
| Pin 7 | VCCIO — I/O bank supply voltage |
| Pin 8 | I/O — User I/O |
| Pin 9 | I/O — User I/O |
| Pin 10 | I/O — User I/O |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O |
| Pin 13 | I/O — User I/O |
| Pin 14 | I/O — User I/O |
| Pin 15 | I/O — User I/O |
| Pin 16 | I/O — User I/O |
| Pin 17 | I/O — User I/O |
| Pin 18 | I/O — User I/O |
| Pin 19 | I/O — User I/O |
| Pin 20 | I/O — User I/O |
| Pin 21 | VCCIO — I/O bank supply voltage |
| Pin 22 | I/O — User I/O |
| Pin 23 | I/O — User I/O |
| Pin 24 | I/O — User I/O |
| Pin 25 | I/O — User I/O |
| Pin 26 | I/O — User I/O |
| Pin 27 | I/O — User I/O |
| Pin 28 | GND — Ground |
| Pin 29 | I/O — User I/O |
| Pin 30 | I/O — User I/O |
| Pin 31 | I/O — User I/O |
| Pin 32 | I/O — User I/O |
| Pin 33 | I/O — User I/O |
| Pin 34 | I/O — User I/O |
| Pin 35 | I/O — User I/O |
| Pin 36 | VCCIO — I/O bank supply voltage |
| Pin 37 | I/O — User I/O |
| Pin 38 | I/O — User I/O |
| Pin 39 | I/O — User I/O |
| Pin 40 | I/O — User I/O |
| Pin 41 | I/O — User I/O |
| Pin 42 | I/O — User I/O |
| Pin 43 | GND — Ground |
| Pin 44 | I/O — User I/O |
| Pin 45 | I/O — User I/O |
| Pin 46 | I/O — User I/O |
| Pin 47 | I/O — User I/O |
| Pin 48 | I/O — User I/O |
| Pin 49 | I/O — User I/O |
| Pin 50 | I/O — User I/O |
| Pin 51 | I/O — User I/O |
| Pin 52 | VCCIO — I/O bank supply voltage |
| Pin 53 | I/O — User I/O |
| Pin 54 | I/O — User I/O |
| Pin 55 | I/O — User I/O |
| Pin 56 | I/O — User I/O |
| Pin 57 | I/O — User I/O |
| Pin 58 | I/O — User I/O |
| Pin 59 | GND — Ground |
| Pin 60 | I/O — User I/O |
| Pin 61 | I/O — User I/O |
| Pin 62 | I/O — User I/O |
| Pin 63 | I/O — User I/O |
| Pin 64 | I/O — User I/O |
| Pin 65 | I/O — User I/O |
| Pin 66 | I/O — User I/O |
| Pin 67 | I/O — User I/O |
| Pin 68 | VCCINT — Core supply voltage (3.3 V) |
| Pin 69 | I/O — User I/O |
| Pin 70 | I/O — User I/O |
| Pin 71 | I/O — User I/O |
| Pin 72 | I/O — User I/O |
| Pin 73 | I/O — User I/O |
| Pin 74 | I/O — User I/O |
| Pin 75 | GND — Ground |
| Pin 76 | I/O — User I/O |
| Pin 77 | I/O — User I/O |
| Pin 78 | I/O — User I/O |
| Pin 79 | I/O — User I/O |
| Pin 80 | I/O — User I/O |
| Pin 81 | I/O — User I/O |
| Pin 82 | I/O — User I/O |
| Pin 83 | I/O — User I/O |
| Pin 84 | VCCIO — I/O bank supply voltage |
| Pin 85 | I/O — User I/O |
| Pin 86 | I/O — User I/O |
| Pin 87 | I/O — User I/O |
| Pin 88 | I/O — User I/O |
| Pin 89 | I/O — User I/O |
| Pin 90 | I/O — User I/O |
| Pin 91 | GND — Ground |
| Pin 92 | nSTATUS — Configuration status (open drain) |
| Pin 93 | DCLK — Configuration clock input |
| Pin 94 | CONF_DONE — Configuration done (open drain) |
| Pin 95 | DATA0 — Configuration data input |
| Pin 96 | nCONFIG — Configuration start (active low) |
| Pin 97 | I/O — User I/O |
| Pin 98 | I/O — User I/O |
| Pin 99 | I/O — User I/O |
| Pin 100 | I/O — User I/O |
| Pin 101 | I/O — User I/O |
| Pin 102 | I/O — User I/O |
| Pin 103 | I/O — User I/O |
| Pin 104 | VCCINT — Core supply voltage (3.3 V) |
| Pin 105 | I/O — User I/O |
| Pin 106 | I/O — User I/O |
| Pin 107 | I/O — User I/O |
| Pin 108 | I/O — User I/O |
| Pin 109 | I/O — User I/O |
| Pin 110 | I/O — User I/O |
| Pin 111 | GND — Ground |
| Pin 112 | I/O — User I/O |
| Pin 113 | TDI — JTAG test data input |
| Pin 114 | TMS — JTAG test mode select |
| Pin 115 | TCK — JTAG test clock |
| Pin 116 | TDO — JTAG test data output |
| Pin 117 | I/O — User I/O |
| Pin 118 | I/O — User I/O |
| Pin 119 | I/O — User I/O |
| Pin 120 | I/O — User I/O |
| Pin 121 | I/O — User I/O |
| Pin 122 | I/O — User I/O |
| Pin 123 | I/O — User I/O |
| Pin 124 | VCCIO — I/O bank supply voltage |
| Pin 125 | I/O — User I/O |
| Pin 126 | I/O — User I/O |
| Pin 127 | I/O — User I/O |
| Pin 128 | I/O — User I/O |
| Pin 129 | I/O — User I/O |
| Pin 130 | I/O — User I/O |
| Pin 131 | GND — Ground |
| Pin 132 | I/O — User I/O |
| Pin 133 | I/O — User I/O |
| Pin 134 | I/O — User I/O |
| Pin 135 | I/O — User I/O |
| Pin 136 | I/O — User I/O |
| Pin 137 | I/O — User I/O |
| Pin 138 | I/O — User I/O |
| Pin 139 | I/O — User I/O |
| Pin 140 | VCCINT — Core supply voltage (3.3 V) |
| Pin 141 | I/O — User I/O |
| Pin 142 | I/O — User I/O |
| Pin 143 | I/O — User I/O |
| Pin 144 | GND — Ground (corner pad, often connected to thermal pad) |
Typical Applications
EPF6024ATC144-17 is suitable for 7 applications: Industrial Glue Logic Replacement, PCI/ISA Legacy Bridge Controller, UART/SPI/I2C Protocol Bridge, Legacy Telecom Backplane Glue Logic, FPGA Education and Training Platform, Test and Measurement Front-End, Legacy Avionics Display Controller.
Industrial Glue Logic Replacement
The EPF6024ATC144-17 fits industrial glue-logic replacement because it packs 1960 logic elements and 117 user I/O into a single 144-TQFP package, replacing dozens of 74-series TTL parts while consolidating board area. Its 3.3 V core with 5 V PCI-tolerant I/O bridges modern and legacy logic domains in factory PLC backplanes and motor-control boards. The SRAM-based configuration supports last-minute logic fixes via JTAG reprogramming without inventory swaps.
Recommended
PCI/ISA Legacy Bridge Controller
The EPF6024ATC144-17 is well suited for legacy PCI and ISA bridge controllers because its 5 V-tolerant I/O banks interface directly with classic PC peripheral buses while its 3.3 V core keeps power dissipation reasonable. The 196 LABs and 117 I/O pins provide ample capacity for DMA engines, address decoding, and interrupt steering logic typical of bridge designs. JTAG boundary-scan enables in-system test on legacy PCI cards still deployed in industrial PCs.
Recommended
UART/SPI/I2C Protocol Bridge
The EPF6024ATC144-17 handles UART-to-SPI and SPI-to-I2C protocol bridging because its 1960 logic elements and LAB-wide control signals map cleanly onto shift-register-style protocol state machines. The 117 user I/O pins comfortably host multiple concurrent serial channels plus GPIO expansion, while the JTAG interface allows firmware updates to fix protocol bugs without board rework. Industrial instrumentation and sensor hubs frequently use this part for legacy-to-modern protocol translation.
Recommended
Legacy Telecom Backplane Glue Logic
The EPF6024ATC144-17 serves telecom backplane glue-logic applications because its multi-voltage I/O support (1.8/2.5/3.3/5 V) bridges LVDS line-driver outputs to legacy TTL control planes common in installed telecom shelves. The 144-TQFP package fits the thermal envelope of a typical line-card slot, and the volatile SRAM configuration enables per-shelf personality loading from a centralized configuration controller. JTAG-supported ISP reduces field-replacement cost versus PAL/HDL alternatives.
Recommended
FPGA Education and Training Platform
The EPF6024ATC144-17 is widely used in university FPGA training curricula because it exposes the complete FLEX 6000 architecture (4-input LUTs, LAB carry chains, multi-volt I/O, JTAG) without overwhelming complexity. The mature Quartus II toolchain remains available as freeware for legacy device support, and the 144-TQFP package is easy to breadboard on educational development boards. Students learn SRAM-based configuration flows, JTAG programming, and timing-closure fundamentals.
Recommended
Test and Measurement Front-End
The EPF6024ATC144-17 functions as a programmable front-end in test and measurement equipment because its 117 user I/O and 1960 LE capacity handle channel-count multiplexing, trigger generation, and pattern sequencing for ATE systems. The 5 V-tolerant I/O banks simplify interfacing with legacy instrumentation buses, and JTAG boundary-scan supports fixture-level test access. Its mature Quartus II toolchain preserves design IP investment across long-lived test platforms.
Recommended
Legacy Avionics Display Controller
The EPF6024ATC144-17 supports legacy avionics display controllers because it delivers 1960 logic elements in a 144-TQFP footprint compatible with cockpit display driver boards still flying in long-life military platforms. Multi-voltage I/O allows direct interface to legacy ARINC 429 and discrete avionics buses, while JTAG ISP supports line-replaceable unit reprogramming without shop-visit returns. The part's mature qualification status in legacy DO-254 programs preserves certification investment.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024ATC144-17 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024ATC144-1 | EPF6024ATC144-10 | EPF6024ATC144-10N |
|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Logic Elements | 1960 | 1960 | 1960 | 1960 |
| LABs | 196 | 196 | 196 | 196 |
| User I/O Pins | 117 | 117 | 117 | 117 |
| Speed Grade | -17 | -1 (slower) | -10 (faster) | -10N (faster, lead-free) |
| Configuration Memory | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| I/O Voltage Support | 1.8/2.5/3.3/5.0 V | 1.8/2.5/3.3/5.0 V | 1.8/2.5/3.3/5.0 V | 1.8/2.5/3.3/5.0 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Speed grade -17 places it mid-range in the FLEX 6000 family timing bins (vs EPF6024ATC144-1)
- Faster speed grade available as a direct alternate (vs EPF6024ATC144-10)
- Lead-free N-suffix variant available for RoHS-sensitive builds (vs EPF6024ATC144-10N)
- Pin-compatible with seven documented FLEX 6000 speed-grade siblings (vs EPF6024ATC144-13)
Design Notes
Provide a clean 3.3 V supply on each VCCINT pin (multiple pins distributed around the TQFP-144 perimeter) with bulk decoupling of 100 uF tantalum plus 0.1 uF and 0.01 uF ceramic capacitors placed within 5 mm of each VCCINT/GND pair. VCCIO banks may be powered from 1.8 V, 2.5 V, 3.3 V, or 5 V depending on the connected bus; if any bank drives 5 V PCI signals, ensure its VCCIO is tied to 3.3 V and that the I/O drivers operate within PCI-compliant drive strength. Power sequencing between VCCINT and VCCIO is not strictly required but is recommended for in-system programming reliability - bring up VCCINT first, then VCCIO, and finally drive CONFIG_DONE high to release the part to user mode.
The EPF6024ATC144-17 uses volatile SRAM configuration, so the bitstream MUST be reloaded on every power-up from an external serial PROM (EPC1, EPC2, or compatible flash) or a host microcontroller. Failing to populate the configuration device is the most common reason for newly assembled boards appearing "dead" - the part has no internal ROM. Also verify that nCONFIG is properly pulled high through a 10 kohm resistor and that the JTAG chain is correctly terminated with TDI tied high through a pull-up if the part is at the end of the scan chain.
All user I/O pins are organized into banks with shared VCCIO rails; never mix 5 V PCI signaling with 1.8 V HSTL on the same bank, as the absolute maximum VCCIO is 5.5 V. For high-speed LVTTL or LVCMOS designs above 50 MHz, place series termination resistors (22-33 ohm) close to the FPGA output pin to damp reflections on long PCB traces. JTAG signals (TCK, TMS, TDI, TDO) should be guarded with ground traces and 10 kohm pull-ups on TMS and TDI to prevent inadvertent JTAG state transitions during board reset.
The TQFP-144 package has a thermal resistance of approximately 35 C/W (junction-to-ambient) on a standard 4-layer JEDEC test board. Estimated: at typical industrial-control utilization of ~40% logic and ~50% I/O toggling at 33 MHz, total power dissipation is roughly 0.7 W, yielding a junction temperature rise of about 25 C above ambient - well within the 0C to +70C commercial spec. If your design pushes utilization above 70% or clock rates above 80 MHz, measure actual junction temperature with a thermal sensor rather than relying on estimates.
Compliance Information
FLEX 6000 family is obsolete. Lead-free status of EPF6024ATC144-17 (vs -10N variant) is not explicitly documented in the verified web data - flagged as unknown. Not AEC-Q100 qualified; for automotive applications a modern Cyclone family part should be used.