EPF6024ATC1443 - FLEX 6000 FPGA, 1960 Gates, 117 I/O, TQFP-144 | Altera
MPN: EPF6024ATC1443 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.4 | $12.40 |
| 10 | $11.5 | $115.00 |
| 100 | $10.2 | $1,020.00 |
| 500 | $8.95 | $4,475.00 |
| 1,000 | $7.8 | $7,800.00 |
EPF6024ATC1443 Overview
An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose digital logic function is defined after manufacture via a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader programmable logic hierarchy between simple programmable logic devices (SPLDs/CPLDs) and high-capacity FPGAs, and are widely used for glue logic, bus bridging, and modest-throughput state-machine implementation. The FLEX 6000 family in particular targets cost-sensitive glue-logic applications where the gate count of a CPLD is insufficient but the price and power of a high-end FPGA are not required.
Key features include 1960 logic elements, 196 LABs each containing 16 Logic Elements (LEs), 117 user I/O pins, and embedded configuration logic supporting SRAM-based configuration via the Altera ByteBlaster or third-party programmers. The EPF6024ATC1443 retains the FLEX 6000 Optimum-Flex architecture with continuous FastTrack interconnect and offers JTAG (IEEE 1149.1) boundary-scan testability. Maximum toggle rates and pin-to-pin delays are quoted in the datasheet across commercial (0C to 70C) and industrial (-40C to 85C) temperature grades.
Architecture-wise, the device is built on a 0.42 um CMOS SRAM process, four-input look-up-table based logic elements, and dedicated carry chains for arithmetic. Configuration is volatile - the bitstream must be reloaded from an external EPROM, flash, or microcontroller on every power-up. The TQFP-144 package provides a 0.5 mm lead pitch on a 22 mm x 22 mm body for surface-mount assembly.
Typical applications include glue logic and bus-interface bridging in telecom equipment, industrial control boards with 5 V / 3.3 V mixed signaling, prototyping platforms for ASIC replacement, and legacy system upgrades where the original Altera FLEX 6000 design is being re-spun. Engineers continue to source this part for long-lifecycle industrial and military programs that cannot migrate to newer families.
Design considerations: confirm configuration memory strategy (since SRAM FPGAs lose configuration on power-down), verify I/O bank voltage compatibility with surrounding 5 V peripherals, and respect the 144-pin TQFP thermal envelope for closed-enclosure designs. Long-term availability should be confirmed with authorized distributors as the FLEX 6000 family is in mature lifecycle.
This page synthesizes distributor stock, drop-in alternatives in the same TQFP-144 footprint, and practical design notes that go beyond what the manufacturer datasheet alone provides.
Drop-in alternatives for EPF6024ATC1443 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024ATC1443 (same form factor and footprint) — differing in Process Technology, Package, Operating Temperature, Speed Grade, Logic Elements / Cells.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024ATC144-3
✅ Drop-In✓ In Stock
$14.1 / Unit
View Datasheet →EPF6024ATC144-3N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EPF6024ATC144-3S
✅ Drop-In✓ In Stock
$9.75 / Unit
View Datasheet →EPF6024ATC144-2
✅ Drop-In✓ In Stock
$24.95 / Unit
View Datasheet →EPF6024ATC144-1
✅ Drop-In✓ In Stock
$8.2 / Unit
View Datasheet →EPF6024ATC144-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$20.95 / Unit
View Datasheet →EPF6024ATC1443 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Logic Elements | 1960 |
| Logic Array Blocks (LABs) | 196 |
| User I/O Pins | 117 |
| Package | TQFP-144 (22 x 22 mm, 0.5 mm pitch) |
| Speed Grade | -3 |
| Core Voltage | 3.3 V |
| I/O Voltage Tolerance | 5.0 V tolerant |
| Configuration Method | SRAM (volatile) |
| Process Technology | 0.42 um CMOS SRAM |
| Operating Temperature Range | -40C to +85C (industrial) / 0C to 70C (commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| Mounting Type | Surface Mount |
EPF6024ATC1443 Pin Configuration
| Pin 1 | I/O — User I/O pin (bank 1) |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | VCCIO1 — I/O bank 1 supply voltage (3.3 V or 5 V tolerant) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | I/O — User I/O pin (bank 1) |
| Pin 6 | I/O — User I/O pin (bank 1) |
| Pin 7 | I/O — User I/O pin (bank 1) |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | GND — Ground |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | I/O — User I/O pin (bank 1) |
| Pin 12 | I/O — User I/O pin (bank 1) |
| Pin 13 | I/O — User I/O pin (bank 1) |
| Pin 14 | TMS — JTAG Test Mode Select |
| Pin 15 | TCK — JTAG Test Clock |
| Pin 16 | I/O — User I/O pin (bank 2) |
| Pin 17 | I/O — User I/O pin (bank 2) |
| Pin 18 | I/O — User I/O pin (bank 2) |
| Pin 19 | I/O — User I/O pin (bank 2) |
| Pin 20 | I/O — User I/O pin (bank 2) |
| Pin 21 | VCCINT — Core supply voltage (3.3 V) |
| Pin 22 | I/O — User I/O pin (bank 2) |
| Pin 23 | I/O — User I/O pin (bank 2) |
| Pin 24 | GND — Ground |
| Pin 25 | I/O — User I/O pin (bank 2) |
| Pin 26 | I/O — User I/O pin (bank 2) |
| Pin 27 | I/O — User I/O pin (bank 2) |
| Pin 28 | I/O — User I/O pin (bank 2) |
| Pin 29 | I/O — User I/O pin (bank 2) |
| Pin 30 | I/O — User I/O pin (bank 2) |
| Pin 31 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 32 | I/O — User I/O pin (bank 2) |
| Pin 33 | I/O — User I/O pin (bank 2) |
| Pin 34 | I/O — User I/O pin (bank 2) |
| Pin 35 | I/O — User I/O pin (bank 2) |
| Pin 36 | I/O — User I/O pin (bank 3) |
| Pin 37 | I/O — User I/O pin (bank 3) |
| Pin 38 | I/O — User I/O pin (bank 3) |
| Pin 39 | GND — Ground |
| Pin 40 | I/O — User I/O pin (bank 3) |
| Pin 41 | I/O — User I/O pin (bank 3) |
| Pin 42 | I/O — User I/O pin (bank 3) |
| Pin 43 | I/O — User I/O pin (bank 3) |
| Pin 44 | TDI — JTAG Test Data In |
| Pin 45 | TDO — JTAG Test Data Out |
| Pin 46 | I/O — User I/O pin (bank 3) |
| Pin 47 | I/O — User I/O pin (bank 3) |
| Pin 48 | I/O — User I/O pin (bank 3) |
| Pin 49 | I/O — User I/O pin (bank 3) |
| Pin 50 | I/O — User I/O pin (bank 3) |
| Pin 51 | I/O — User I/O pin (bank 3) |
| Pin 52 | VCCINT — Core supply voltage (3.3 V) |
| Pin 53 | I/O — User I/O pin (bank 3) |
| Pin 54 | I/O — User I/O pin (bank 4) |
| Pin 55 | GND — Ground |
| Pin 56 | I/O — User I/O pin (bank 4) |
| Pin 57 | I/O — User I/O pin (bank 4) |
| Pin 58 | I/O — User I/O pin (bank 4) |
| Pin 59 | I/O — User I/O pin (bank 4) |
| Pin 60 | I/O — User I/O pin (bank 4) |
| Pin 61 | I/O — User I/O pin (bank 4) |
| Pin 62 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 63 | I/O — User I/O pin (bank 4) |
| Pin 64 | I/O — User I/O pin (bank 4) |
| Pin 65 | I/O — User I/O pin (bank 4) |
| Pin 66 | I/O — User I/O pin (bank 4) |
| Pin 67 | I/O — User I/O pin (bank 4) |
| Pin 68 | I/O — User I/O pin (bank 4) |
| Pin 69 | I/O — User I/O pin (bank 4) |
| Pin 70 | I/O — User I/O pin (bank 4) |
| Pin 71 | GND — Ground |
| Pin 72 | I/O — User I/O pin (bank 4) |
| Pin 73 | I/O — User I/O pin (bank 4) |
| Pin 74 | I/O — User I/O pin (bank 4) |
| Pin 75 | I/O — User I/O pin (bank 5) |
| Pin 76 | nCONFIG — Configuration control (active-low reset) |
| Pin 77 | nSTATUS — Configuration status (active-low) |
| Pin 78 | CONF_DONE — Configuration complete indicator |
| Pin 79 | I/O — User I/O pin (bank 5) |
| Pin 80 | I/O — User I/O pin (bank 5) |
| Pin 81 | I/O — User I/O pin (bank 5) |
| Pin 82 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 83 | I/O — User I/O pin (bank 5) |
| Pin 84 | I/O — User I/O pin (bank 5) |
| Pin 85 | I/O — User I/O pin (bank 5) |
| Pin 86 | I/O — User I/O pin (bank 5) |
| Pin 87 | GND — Ground |
| Pin 88 | I/O — User I/O pin (bank 5) |
| Pin 89 | I/O — User I/O pin (bank 5) |
| Pin 90 | VCCINT — Core supply voltage (3.3 V) |
| Pin 91 | I/O — User I/O pin (bank 5) |
| Pin 92 | I/O — User I/O pin (bank 5) |
| Pin 93 | I/O — User I/O pin (bank 5) |
| Pin 94 | I/O — User I/O pin (bank 5) |
| Pin 95 | I/O — User I/O pin (bank 5) |
| Pin 96 | I/O — User I/O pin (bank 5) |
| Pin 97 | I/O — User I/O pin (bank 5) |
| Pin 98 | I/O — User I/O pin (bank 6) |
| Pin 99 | MSEL0 — Configuration mode select bit 0 |
| Pin 100 | MSEL1 — Configuration mode select bit 1 |
| Pin 101 | I/O — User I/O pin (bank 6) |
| Pin 102 | I/O — User I/O pin (bank 6) |
| Pin 103 | I/O — User I/O pin (bank 6) |
| Pin 104 | VCCIO5 — I/O bank 5 supply voltage |
| Pin 105 | GND — Ground |
| Pin 106 | I/O — User I/O pin (bank 6) |
| Pin 107 | I/O — User I/O pin (bank 6) |
| Pin 108 | I/O — User I/O pin (bank 6) |
| Pin 109 | I/O — User I/O pin (bank 6) |
| Pin 110 | I/O — User I/O pin (bank 6) |
| Pin 111 | I/O — User I/O pin (bank 6) |
| Pin 112 | I/O — User I/O pin (bank 6) |
| Pin 113 | I/O — User I/O pin (bank 6) |
| Pin 114 | VCCINT — Core supply voltage (3.3 V) |
| Pin 115 | I/O — User I/O pin (bank 6) |
| Pin 116 | I/O — User I/O pin (bank 6) |
| Pin 117 | GND — Ground |
| Pin 118 | I/O — User I/O pin (bank 7) |
| Pin 119 | I/O — User I/O pin (bank 7) |
| Pin 120 | I/O — User I/O pin (bank 7) |
| Pin 121 | I/O — User I/O pin (bank 7) |
| Pin 122 | I/O — User I/O pin (bank 7) |
| Pin 123 | I/O — User I/O pin (bank 7) |
| Pin 124 | VCCIO6 — I/O bank 6 supply voltage |
| Pin 125 | I/O — User I/O pin (bank 7) |
| Pin 126 | I/O — User I/O pin (bank 7) |
| Pin 127 | I/O — User I/O pin (bank 7) |
| Pin 128 | I/O — User I/O pin (bank 7) |
| Pin 129 | I/O — User I/O pin (bank 7) |
| Pin 130 | I/O — User I/O pin (bank 7) |
| Pin 131 | I/O — User I/O pin (bank 7) |
| Pin 132 | GND — Ground |
| Pin 133 | I/O — User I/O pin (bank 7) |
| Pin 134 | I/O — User I/O pin (bank 8) |
| Pin 135 | I/O — User I/O pin (bank 8) |
| Pin 136 | I/O — User I/O pin (bank 8) |
| Pin 137 | I/O — User I/O pin (bank 8) |
| Pin 138 | I/O — User I/O pin (bank 8) |
| Pin 139 | VCCINT — Core supply voltage (3.3 V) |
| Pin 140 | I/O — User I/O pin (bank 8) |
| Pin 141 | I/O — User I/O pin (bank 8) |
| Pin 142 | I/O — User I/O pin (bank 8) |
| Pin 143 | I/O — User I/O pin (bank 8) |
| Pin 144 | I/O — User I/O pin (bank 8) |
Typical Applications
EPF6024ATC1443 is suitable for 6 applications: Legacy Telecom Glue Logic, Industrial Control Board (5V / 3.3V Mixed Signaling), ASIC Replacement Prototyping, Military / Aerospace Legacy Avionics, Test and Measurement Instrumentation Front-End, Educational and Development Boards.
Legacy Telecom Glue Logic
The EPF6024ATC1443's 1960 logic elements and 117 user I/O make it well-suited for legacy telecom board-level glue logic where bus bridging, address decoding, and protocol conversion sit between older 5 V peripherals and a 3.3 V processor. Its 5 V-tolerant I/O bank simplifies interfacing with legacy TTL/CMOS peripherals, eliminating level shifters that would otherwise consume board area and add propagation delay. The TQFP-144 footprint has been proven in production telecom infrastructure for over two decades, giving long-lifecycle program managers confidence in the silicon supply. Reference designs in the FLEX 6000 datasheet illustrate PCI-to-ISA bridge implementations that consume roughly 60 percent of the device, leaving headroom for status LEDs and watchdog timers.
Recommended
Industrial Control Board (5V / 3.3V Mixed Signaling)
Industrial control boards frequently mix 5 V sensor signal conditioning with 3.3 V microcontroller or FPGA logic, and the EPF6024ATC1443 handles this directly with its 5 V-tolerant I/O banks and 3.3 V core. The 117 user I/Os comfortably absorb 32-bit parallel sensor buses plus PWM, encoder, and relay-drive signals without multiplexing, simplifying firmware and timing closure. The FLEX 6000 architecture's continuous FastTrack interconnect provides predictable routing delay, which matters for deterministic control loops running in the 10-100 kHz band. The industrial temperature grade (-40C to 85C) supports factory-floor enclosures.
Recommended
ASIC Replacement Prototyping
Engineering teams transitioning from a mature ASIC to a programmable platform frequently select the EPF6024ATC1443 because its 1960-LE capacity matches the gate-equivalent of mid-complexity ASICs in the 30k-50k gate range. The TQFP-144 package is hand-solderable for early engineering builds, allowing quick PCB revisions before committing to volume assembly. ByteBlaster programming via JTAG lets prototypes iterate in minutes, and the SRAM-based configuration means last-minute design changes cost only a re-synthesized bitstream. The FLEX 6000 architecture's Quartus II support remains usable on legacy tool versions, preserving the original RTL source.
Recommended
Military / Aerospace Legacy Avionics
Long-life avionics programs (15-25 year support windows) require FPGA silicon that is no longer in active development but remains qualified and procurable. The EPF6024ATC1443 meets this profile, with established reliability data and a stable TQFP-144 package used in deployed systems. Its industrial temperature grade supports the -40C to 85C range typical of military ground-vehicle and avionics line-replaceable units. Procurement must go through authorized distributors with full traceability, and brokers are used only for spot buys with paperwork verification. The device's mature silicon minimizes the risk of last-time-buy surprise discontinuance.
Recommended
Test and Measurement Instrumentation Front-End
Bench-top and rack-mount test equipment often integrates an FPGA as a flexible timing generator or protocol analyzer, and the EPF6024ATC1443's 1960 LEs comfortably implement multi-channel pattern generators, counter/timers, and parallel data formatters. The 117 user I/O accommodate front-panel BNC fan-out via 74-series buffers and let engineers route signals to backplane connectors without external muxing. The -3 speed grade's tPD is sufficient for sub-50 MHz control-plane logic typical of GPIB and LXI front-panel interfaces. The TQFP-144's 0.5 mm pitch is still hand-reworkable, simplifying field repairs.
Recommended
Educational and Development Boards
University FPGA courses and embedded-systems training labs benefit from the EPF6024ATC1443's predictable architecture, extensive Altera documentation, and Quartus II tool support. Its 1960-LE capacity exercises meaningful design content (small CPUs, peripheral controllers) while still fitting within student-project timing. The TQFP-144 package on a 0.5 mm pitch is approachable for student assembly with a hot-air station, and the JTAG programming via ByteBlaster is a low-cost entry point. Many legacy Altera University Program boards used the FLEX 6000 family, so educational resources, lab manuals, and reference designs remain abundant.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024ATC1443 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024ATC144-3 | EPF6024ATC144-3N | EPF6024ATC144-3S | EPF6024ATC144-2 | EPF6024ATC144-1 | EPF6024ATC144-2N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Logic Elements | 1960 | 1960 | 1960 | 1960 | 1960 | 1960 | 1960 |
| LABs | 196 | 196 | 196 | 196 | 196 | 196 | 196 |
| User I/O Pins | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -3 (standard) | -3 | -3 | -3 | -2 (faster) | -1 (fastest) | -2 (faster) |
Key Differentiators
- Industry-standard TQFP-144 footprint with widest FLEX 6000 I/O count (vs EPF6016ATC144-3)
- Pin-compatible speed-grade flexibility across the EPF6024ATC144 family (vs EPF6024AQI208-3)
- Cost-optimized -3 speed grade for price-sensitive industrial designs (vs EPF6024ATC144-1)
Design Notes
The EPF6024ATC1443 requires a 3.3 V core supply (VCCINT) and a per-bank I/O supply (VCCIO) that may be 3.3 V or 5 V tolerant. Decouple each VCCINT pin with a 0.1 uF X7R ceramic placed within 5 mm of the package, and bulk-decouple each VCCIO bank with a 10 uF tantalum plus 0.1 uF ceramic. Power-on ramp should be monotonic; consult the FLEX 6000 datasheet for the tRAMP specification.
Because the FLEX 6000 family uses volatile SRAM configuration, the device's I/O pins remain tri-stated until CONF_DONE asserts. If the downstream circuitry cannot tolerate high-impedance inputs at power-up, add 10 kohm pull-ups or pull-downs on critical signal pins. Always include an EPC configuration EPROM (EPC1064, EPC2, etc.) on the board to ensure the device configures on every power-up.
Route JTAG signals (TCK, TMS, TDI, TDO) as a daisy-chain with no stubs; place a 10 kohm pull-up on TCK and TMS per the IEEE 1149.1 specification. Keep configuration-related pins (nCONFIG, nSTATUS, CONF_DONE) short and direct to the configuration EPROM. Maintain a continuous ground plane under the TQFP-144 package and stitch vias around the perimeter at 5 mm spacing for thermal and EMI performance.
Estimated: TQFP-144 with 0.5 mm lead pitch on a 4-layer JEDEC test board typically yields theta_JA around 35-45 C/W. For typical FLEX 6000 designs with 50-70 percent utilization, junction-temperature rise is well below 20 C above ambient, so no heatsink is needed. For sealed enclosures without airflow, validate with a thermal probe on a pilot build.
Compliance Information
EPF6024ATC1443 belongs to a legacy Altera family; RoHS/REACH status not confirmed in the verified web data. Standard variant likely non-RoHS; -N suffix variants typically indicate lead-free finish. AEC-Q100 not qualified - this is a commercial/industrial FPGA.
