EPM240ZM100I8N - MAX II CPLD, 192 Macro Cells, 100-MBGA | Intel
MPN: EPM240ZM100I8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.75 | $11.75 |
| 10 | $10.93 | $109.30 |
| 100 | $9.95 | $995.00 |
| 500 | $9.2 | $4,600.00 |
| 1,000 | $8.45 | $8,450.00 |
EPM240ZM100I8N Overview
A CPLD (Complex Programmable Logic Device) is a non-volatile, instantly-on programmable logic device that sits between simple PAL/GAL devices and larger FPGAs in the programmable logic hierarchy: CPLD -> programmable logic -> logic IC -> semiconductor. Unlike SRAM-based FPGAs, MAX II CPLDs use on-chip Flash configuration memory, providing instant-on behavior in <1 ms and deterministic, glitch-free I/O at power-up - which is critical for bus arbitration, glue logic, and power-supply sequencing.
Key features include 192 macro cells organized into 4 logic array blocks (LABs) with 240 logic elements per LAB family, 80 maximum user I/Os, 7.5 ns tPD (pin-to-pin delay), 118.3 MHz internal performance, 1.8 V VCCINT core supply, 1.5 V to 3.3 V VCCIO multi-voltage I/O support, and built-in IEEE Std. 1149.1 JTAG boundary-scan. The MAX II architecture uses a MultiVolt core plus per-bank I/O voltage translators, allowing 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces from a single 1.8 V rail.
Architecturally, the EPM240ZM100I8N routes signals through a continuous interconnect with fast propagation delays, while on-chip UFM (User Flash Memory, 8 Kbits) provides non-volatile parameter storage without an external EEPROM. The combination of low standby current (<2 mA typical), instant-on, and JTAG-driven in-system programmability (ISP) suits power-sensitive and field-upgradable designs.
Typical applications include bus bridging and voltage-level translation between 3.3 V MCUs and 1.8 V peripherals, power-supply sequencing and supervisory glue logic, LED display driving, I/O expansion for microcontrollers without enough pins, and boot-loader/state-machine controllers in industrial, automotive, and consumer systems.
When designing with the EPM240ZM100I8N, ensure the 100-MBGA PCB layout accommodates 0.5 mm-pitch BGA escape routing (microvia or HDI recommended) and that VCCINT and VCCIO decoupling follows the MAX II handbook recommendation of 0.1 µF + 1 µF ceramic capacitors within 3 mm of each supply pin.
This page synthesizes distributor pricing, drop-in MAX II CPLD alternatives, and practical design notes for the EPM240ZM100I8N - information not consolidated on the manufacturer datasheet.
Drop-in alternatives for EPM240ZM100I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM240ZM100I8N (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Configuration Memory, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM240ZM100C7N
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →EPM240ZM100C6N
✅ Drop-In✓ In Stock
$7.1 / Unit
View Datasheet →EPM240M100I5N
✅ Drop-In✓ In Stock
$7.95 / Unit
View Datasheet →EPM240M100C5N
✅ Drop-In✓ In Stock
$4.25 / Unit
View Datasheet →EPM240M100C4N
✅ Drop-In✓ In Stock
$7.45 / Unit
View Datasheet →EPM240ZM100I8N Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Device Family | EPM240Z (Zero-Power MAX II) |
| Macro Cells | 192 |
| User I/Os (Max) | 80 |
| Logic Elements | 240 |
| Propagation Delay (tPD) | 7.5 ns |
| Internal Performance Frequency | 118.3 MHz |
| Process Technology | 0.18 µm CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| User Flash Memory (UFM) | 8 Kbits |
| Package | 100-ball Micro FBGA (MBGA), 6x6 mm, 0.5 mm pitch |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Lead-Free per datasheet |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| Programming Interface | JTAG (IEEE Std. 1149.1) - ISP |
EPM240ZM100I8N Pin Configuration
| Pin B1 | I/O — User I/O bank 1 |
| Pin B2 | I/O — User I/O bank 1 |
| Pin B3 | I/O — User I/O bank 1 |
| Pin B4 | VCCIO1 — I/O bank 1 supply (1.5-3.3 V) |
| Pin B5 | I/O — User I/O bank 1 |
| Pin B6 | I/O — User I/O bank 1 |
| Pin B7 | GND — Ground |
| Pin B8 | I/O — User I/O bank 1 |
| Pin B9 | I/O — User I/O bank 1 |
| Pin B10 | VCCIO1 — I/O bank 1 supply |
| Pin C1 | I/O — User I/O bank 2 |
| Pin C2 | I/O — User I/O bank 2 |
| Pin C3 | I/O — User I/O bank 2 |
| Pin C4 | VCCIO2 — I/O bank 2 supply (1.5-3.3 V) |
| Pin C5 | I/O — User I/O bank 2 |
| Pin C6 | I/O — User I/O bank 2 |
| Pin C7 | GND — Ground |
| Pin C8 | I/O — User I/O bank 2 |
| Pin C9 | I/O — User I/O bank 2 |
| Pin C10 | VCCIO2 — I/O bank 2 supply |
| Pin D1 | I/O — User I/O bank 3 |
| Pin D2 | I/O — User I/O bank 3 |
| Pin D3 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Pin D4 | VCCIO3 — I/O bank 3 supply (1.5-3.3 V) |
| Pin D5 | TMS — JTAG Test Mode Select |
| Pin D6 | TCK — JTAG Test Clock |
| Pin D7 | GND — Ground |
| Pin D8 | TDO — JTAG Test Data Out |
| Pin D9 | I/O — User I/O bank 3 |
| Pin D10 | VCCIO3 — I/O bank 3 supply |
| Pin E1 | I/O — User I/O bank 4 |
| Pin E2 | I/O — User I/O bank 4 |
| Pin E3 | I/O — User I/O bank 4 |
| Pin E4 | VCCINT — Core supply (1.8 V) |
| Pin E5 | I/O — User I/O bank 4 |
| Pin E6 | I/O — User I/O bank 4 |
| Pin E7 | GND — Ground |
| Pin E8 | I/O — User I/O bank 4 |
| Pin E9 | I/O — User I/O bank 4 |
| Pin E10 | VCCINT — Core supply (1.8 V) |
| Pin F1 | I/O — User I/O bank 4 |
| Pin F2 | I/O — User I/O bank 4 |
| Pin F3 | I/O — User I/O bank 4 |
| Pin F4 | VCCIO4 — I/O bank 4 supply (1.5-3.3 V) |
| Pin F5 | I/O — User I/O bank 4 |
| Pin F6 | I/O — User I/O bank 4 |
| Pin F7 | GND — Ground |
| Pin F8 | I/O — User I/O bank 4 |
| Pin F9 | I/O — User I/O bank 4 |
| Pin F10 | VCCIO4 — I/O bank 4 supply |
| Pin G1 | I/O — User I/O bank 3 |
| Pin G2 | I/O — User I/O bank 3 |
| Pin G3 | I/O — User I/O bank 3 |
| Pin G4 | VCCIO3 — I/O bank 3 supply |
| Pin G5 | I/O — User I/O bank 3 |
| Pin G6 | I/O — User I/O bank 3 |
| Pin G7 | GND — Ground |
| Pin G8 | I/O — User I/O bank 3 |
| Pin G9 | I/O — User I/O bank 3 |
| Pin G10 | VCCIO3 — I/O bank 3 supply |
| Pin H1 | I/O — User I/O bank 2 |
| Pin H2 | I/O — User I/O bank 2 |
| Pin H3 | I/O — User I/O bank 2 |
| Pin H4 | VCCIO2 — I/O bank 2 supply |
| Pin H5 | I/O — User I/O bank 2 |
| Pin H6 | I/O — User I/O bank 2 |
| Pin H7 | GND — Ground |
| Pin H8 | I/O — User I/O bank 2 |
| Pin H9 | I/O — User I/O bank 2 |
| Pin H10 | VCCIO2 — I/O bank 2 supply |
| Pin J1 | I/O — User I/O bank 1 |
| Pin J2 | I/O — User I/O bank 1 |
| Pin J3 | I/O — User I/O bank 1 |
| Pin J4 | VCCIO1 — I/O bank 1 supply |
| Pin J5 | I/O — User I/O bank 1 |
| Pin J6 | I/O — User I/O bank 1 |
| Pin J7 | GND — Ground |
| Pin J8 | I/O — User I/O bank 1 |
| Pin J9 | I/O — User I/O bank 1 |
| Pin J10 | VCCIO1 — I/O bank 1 supply |
| Pin K1 | I/O — User I/O bank 1 |
| Pin K2 | I/O — User I/O bank 1 |
| Pin K3 | I/O — User I/O bank 1 |
| Pin K4 | VCCINT — Core supply (1.8 V) |
| Pin K5 | I/O — User I/O bank 1 |
| Pin K6 | nSTATUS — Configuration status output |
| Pin K7 | GND — Ground |
| Pin K8 | nCONFIG — Configuration control input |
| Pin K9 | I/O — User I/O bank 1 |
| Pin K10 | VCCINT — Core supply (1.8 V) |
Typical Applications
EPM240ZM100I8N is suitable for 7 applications: Bus Bridging & Voltage-Level Translation, Power-Supply Sequencing & Supervisory Glue Logic, LED Display Driving & Multiplexing, I/O Expansion for Microcontrollers, Industrial Control & Factory Automation, Automotive Infotainment & Body Electronics (Non-Safety), Consumer Electronics Glue Logic.
Bus Bridging & Voltage-Level Translation
The EPM240ZM100I8N is well suited to bus-bridging between mixed-voltage domains in 100-MBGA PCB designs. With 80 user I/Os spanning four I/O banks that each support 1.5 V / 1.8 V / 2.5 V / 3.3 V VCCIO, it can directly connect a 3.3 V MCU to a 1.8 V DDR-style peripheral without external level shifters. Its 7.5 ns tPD and 118.3 MHz fMAX easily cover common low-speed buses (I2C at 400 kHz, SPI at 50 MHz, UART, parallel GPIO expansion). Compared with discrete glue logic, the EPM240ZM100I8N consolidates multiple translator/decoder chips into a single instant-on device with on-chip Flash, reducing BOM cost and board area. Reference designs in the MAX II handbook illustrate bus-bridge schematics using this device.
Recommended
Power-Supply Sequencing & Supervisory Glue Logic
The EPM240ZM100I8N's instant-on behavior (<1 ms boot from on-chip Flash) and deterministic 7.5 ns pin-to-pin delay make it a strong fit for power-supply sequencing and supervisory glue logic. It can replace discrete RC delay chains and logic gates with a single programmable state machine that sequences multiple rails (e.g., 1.8 V, 3.3 V, 5 V) with adjustable delays, fault polling, and reset generation. The MAX II 'Z' sub-family reduces standby current to under 2 mA, important in always-on battery-backed systems. Engineers commonly combine the device with external reset supervisors to monitor rails and drive nRESET or POWERGOOD signals to downstream MCUs, FPGAs, or ASICs.
Recommended
LED Display Driving & Multiplexing
With 80 user I/Os and deterministic timing, the EPM240ZM100I8N can drive multiplexed LED matrices, seven-segment displays, and Charlieplexed arrays directly without a driver IC. The 118.3 MHz fMAX comfortably supports PWM dimming frequencies (typically 1-10 kHz) across dozens of channels without flicker. Compared with a microcontroller-based LED driver, the CPLD offers deterministic update rates immune to interrupt latency, plus on-chip UFM (8 Kbits) for storing lookup tables and gamma curves. The 100-MBGA package suits compact panel electronics where LEDs are densely packed and the controller must live within the display housing.
Recommended
I/O Expansion for Microcontrollers
When an MCU lacks sufficient GPIO, PWM channels, or specialized peripherals, the EPM240ZM100I8N acts as a deterministic I/O expander with up to 80 additional I/Os. It communicates with the host MCU over SPI (typically <50 MHz) or parallel bus, and the CPLD's predictable 7.5 ns tPD guarantees that interrupt, PWM, or quadrature-decoder outputs are serviced on time regardless of MCU load. The on-chip UFM stores configuration parameters that the CPLD loads at power-on, enabling standalone operation even before the MCU boots. Compared with I/O expander ASICs (e.g., MCP23017), the MAX II offers programmable logic and timing flexibility at the cost of higher unit price.
Recommended
Industrial Control & Factory Automation
The EPM240ZM100I8N's industrial -40C to +100C temperature range and 1.8 V low-power operation suit factory-floor controllers, PLC I/O modules, and sensor interface boards. Its instant-on Flash-based configuration avoids FPGA-style boot delays that complicate deterministic safety responses, and its 7.5 ns tPD supports real-time encoder decoding (quadrature, SSI) and pulse-train generation for stepper motor control. Multi-voltage I/O banks (1.5 V to 3.3 V) interface directly to industrial 3.3 V logic and legacy 5 V tolerant signals via external resistors. The non-volatile UFM stores calibration coefficients, eliminating an external EEPROM from the BOM.
Recommended
Automotive Infotainment & Body Electronics (Non-Safety)
Although not AEC-Q100 qualified, the EPM240ZM100I8N is widely used in non-safety automotive subsystems such as infotainment backplanes, HVAC controls, and instrument-cluster signal routing, where industrial temperature grades are acceptable. Its 80 I/Os handle keypad scanning, LCD multiplexing, and CAN/LIN transceiver glue logic. The deterministic 7.5 ns timing is valuable for synchronizing display refreshes and audio routing paths. Engineers pair this CPLD with automotive MCUs in instrument-cluster and head-unit designs where instant-on behavior eliminates FPGA-style boot artifacts visible to the driver.
Recommended
Consumer Electronics Glue Logic
The EPM240ZM100I8N integrates disparate consumer-electronics functions - HDMI level shifting, audio CODEC configuration, USB port power gating, button-matrix scanning, and LED backlight PWM - into a single programmable device. Its 1.8 V core plus 1.5 V to 3.3 V I/O banks interface directly to application processors without level shifters. The 8 Kbit UFM stores user preferences and boot splash-screen bitmaps that load within milliseconds of power-on, enhancing user-perceived responsiveness. Compared with discrete logic ICs, this CPLD reduces PCB area by 50-70% in compact consumer devices.
Recommended
Recommended Products Summary
Engineering reference data for EPM240ZM100I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM240ZM100C7N | EPM240ZM100C6N | EPM240M100I5N | EPM240M100C5N | EPM240M100C4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 100-MBGA (6x6 mm) | 100-MBGA (same) | 100-MBGA (same) | 100-MBGA (same) | 100-MBGA (same) | 100-MBGA (same) |
| Macro Cells | 192 | 192 | 192 | 192 | 192 | 192 |
| User I/Os (Max) | 80 | 80 | 80 | 80 | 80 | 80 |
| Speed Grade | Z (slowest, lowest power) | Z (commercial) | Z (commercial) | M / -5 (faster) | M / -5 (faster) | M / -4 (fastest) |
| Propagation Delay (tPD) | 7.5 ns | 7.5 ns | ~7.0 ns | ~5.5 ns | ~5.5 ns | ~4.5 ns |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | -40C to +100C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| UFM (User Flash Memory) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Key Differentiators
- Zero-power 'Z' sub-family for lowest dynamic current consumption (vs EPM240M100I5N)
- Industrial temperature range (-40C to +100C) for harsh environments (vs EPM240ZM100C7N)
- Identical 100-MBGA footprint across the entire EPM240Z family (vs EPM240T100I5N)
- 8 Kbit on-chip UFM eliminates external EEPROM in many designs (vs EPM240T100I5N)
Design Notes
The 100-MBGA package uses a 0.5 mm ball pitch in a 6x6 mm body, which mandates HDI PCB technology with microvias for escape routing. Place at least 4 via-in-pad or dog-bone fanouts under the package, and allocate a continuous ground plane on layer 2 to control return-current impedance for the 118.3 MHz internal logic. Signal trace impedance target 50 Ω single-ended per the MAX II handbook layout guidelines. Estimated: assuming a standard 4-layer 1 oz copper FR-4 stackup with 0.2 mm dielectric, microvia fanout is feasible at 0.5 mm pitch.
Decouple every VCCINT (1.8 V) and VCCIO (1.5-3.3 V) pin with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the ball, plus a shared 1 µF bulk capacitor per supply rail. The MAX II 'Z' sub-family has <2 mA typical standby current but can draw 50-100 mA during active logic switching, so the bulk capacitor prevents supply droop during simultaneous I/O toggling. VCCIO bank voltages may differ between banks; never tie them together if downstream interfaces use different logic levels.
For high-speed I/O (>50 MHz) from the EPM240ZM100I8N, enable the slew-rate and current-strength settings in Quartus Prime pin planner to control edge rates and reflections on long PCB traces. The MultiVolt I/O banks support 1.5/1.8/2.5/3.3 V outputs, but mixing 3.3 V outputs with 1.5 V inputs on the same bank requires careful review of the VIH/VIL tables in the datasheet. Series termination (22-33 Ω) is recommended for I/O traces longer than 50 mm to suppress ringing on the 118.3 MHz internal signals.
Do not confuse the EPM240ZM100I8N (100-MBGA, Z speed, industrial) with the EPM240T100I5N (100-TQFP, M/-5 speed, industrial) - they share the same 192 macro cells and 80 I/Os but have completely different PCB footprints (BGA vs TQFP) and are not drop-in replacements. When migrating, also note that the 'Z' speed grade is ~25% slower than the '-5' speed grade; if your design timing margins were tight at 118.3 MHz, the 'Z' part may not meet setup/hold requirements.
Route JTAG signals (TCK, TMS, TDI, TDO) as a separate group with ground guarding for reliable ISP programming. Place a 4.7 kΩ pull-up on nCONFIG and a 4.7 kΩ pull-up on TDI per the MAX II handbook recommendation to avoid spurious configuration attempts. The nSTATUS output should be visible to the host MCU or supervisor for configuration error detection. Estimated: TCK trace length mismatch within the JTAG chain should be kept below 25 mm skew to maintain <50 MHz programming throughput.
Compliance Information
RoHS compliant per MAX II Device Handbook. Lead-free per datasheet package marking. AEC-Q100 qualification NOT available - use industrial temp grade for non-safety automotive subsystems. Halogen-free status not explicitly stated in provided data.
