10AX090U2F45I2SG - Arria 10 GX FPGA 900K LE FCBGA-1932 | Intel
MPN: 10AX090U2F45I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4520 | $45,200.00 |
| 100 | $4185 | $418,500.00 |
| 500 | $3890 | $1,945,000.00 |
| 1,000 | $3640 | $3,640,000.00 |
Drop-in alternatives for 10AX090U2F45I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX090U2F45I2LG
✅ Drop-In✓ In Stock
$7957.34 / Unit
View Datasheet →10AX090U2F45I1SG
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$6895.59 / Unit
View Datasheet →10AX090U2F45E2SG
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$5995 / Unit
View Datasheet →10AX090U2F45E2LG
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$3647.5 / Unit
View Datasheet →10AX090U2F45E1SG
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$5895 / Unit
View Datasheet →10AX090U1F45I1SG
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$9750 / Unit
View Datasheet →10AX090U1F45E1SG
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$8750 / Unit
View Datasheet →10AX090U2F45I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| User I/O Count | 480 |
| Transceivers | 24 channels |
| Max Transceiver Data Rate | 14.1 Gbps |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| DSP Blocks | 18x19 multipliers |
| Package | 1932-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| MSL Level | 3 (168 hours) |
| Configuration | AES-256 encrypted bitstream support |
| RoHS Status | Compliant |
| Hard IP | PCIe Gen3 x8, DDR4 memory controller |
| Speed Grade | 2 (medium) |
10AX090U2F45I2SG 1932-bbga, fcbga Pin Configuration Guide
Complete pinout information for 10AX090U2F45I2SG (1932-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090U2F45I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090U2F45I2SG is suitable for 6 applications: 100G Optical Line Card / OTU4 Framer, Wireless LTE / 5G Baseband Processing, Broadcast Video Processing and Routing, ASIC Prototyping and Emulation, Military Secure Radio / SIGINT, High-Performance Computing Accelerator.
100G Optical Line Card / OTU4 Framer
The 10AX090U2F45I2SG fits 100G optical line card designs because its 24 transceivers operate up to 14.1 Gbps, enough to aggregate 10 lanes of 10G for OTU4 or 4 lanes of 25G for 100GbE. The 900K logic elements and 3,377 18x19 multipliers implement the framer, mapper, and FEC (e.g., RS-FEC or Staircase FEC) in a single device. The hard PCIe Gen3 x8 block simplifies host-side control plane interconnect to a switch ASIC or CPU, reducing fabric utilization versus soft IP. Power dissipation at full 100G line rate is roughly 25-30W, manageable with the FCBGA heat-spreader lid.
Recommended
Wireless LTE / 5G Baseband Processing
The 10AX090U2F45I2SG is well matched to LTE-Advanced Pro and sub-6 GHz 5G baseband designs because the 900K LEs and high DSP block count handle downlink/uplink channel decoding (Turbo, LDPC), FFT/iFFT, and MIMO processing in real time. The 14.1 Gbps transceivers connect to RFICs via CPRI or JESD204B/C, while the hard DDR4 controllers feed external QDR-IV or RLDRAM for HARQ buffers. Partial reconfiguration lets one FPGA serve multiple sectors or RATs, and the industrial -40C to +100C temperature range handles outdoor base-station thermal envelopes.
Recommended
Broadcast Video Processing and Routing
The 10AX090U2F45I2SG supports uncompressed 4K/UHD video routing and processing because its 480 user I/Os and 24 transceivers handle dozens of SDI streams at 12G-SDI rates. The 59 Mbit embedded SRAM provides line buffers for color-space conversion, scaling, and frame-rate conversion without external memory. The hard memory controllers support DDR4 with ECC for larger GOP buffers. Industrial temperature grade and high reliability suit 24/7 broadcast studio and playout environments.
Recommended
ASIC Prototyping and Emulation
The 10AX090U2F45I2SG is a strong fit for ASIC prototyping because the 900K LEs (equivalent to ~22M ASIC gates) accommodate large SoC designs and the 24 transceivers emulate multi-gigabit SerDes. Multiple 10AX090 devices can be time-domain multiplexed via GT transceivers to emulate even larger ASICs. Industrial temperature grade and partial reconfiguration help with long bring-up cycles. JTAG and Quartus Prime integration simplify debug compared to custom ASIC validation flows.
Recommended
Military Secure Radio / SIGINT
The 10AX090U2F45I2SG suits secure radio and SIGINT systems because AES-256 bitstream encryption and tamper-resistant configuration protect classified IP. The 14.1 Gbps transceivers digitize wideband IF directly behind ADCs via JESD204B/C, while the high DSP count runs FFTs, channelizers, and demodulators in real time. Industrial temperature grade is adequate for many ground-mobile platforms; extended (-E) variants support harsher environments. Conformal coating and locked pin assignments simplify ITAR-controlled designs.
Recommended
High-Performance Computing Accelerator
The 10AX090U2F45I2SG accelerates HPC workloads such as genomics, financial Monte Carlo, or compression offload because the 900K LEs plus 3,377 DSP blocks deliver high FLOPS at low latency. The hard PCIe Gen3 x8 block provides ~8 GB/s host bandwidth, and the 14.1 Gbps transceivers can chain multiple FPGAs for cluster-style scaling. DDR4 controllers with ECC handle large working sets. Power Toolkit flow in Quartus Prime lets designers hit thermal envelopes for air-cooled accelerator cards in 1U/2U servers.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090U2F45I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090U2F45I2LG | 10AX090U2F45I1SG | 10AX090U2F45E2SG | 10AX090U2F45E2LG | 10AX090U2F45E1SG | 10AX090U1F45I1SG | 10AX090U1F45E1SG |
|---|---|---|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | 2 (medium) | 2 (medium) | 1 (slower) | 2 (medium) | 2 (medium) | 1 (slower) | 1 (slower) | 1 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Extended | Extended | Extended | Industrial | Extended |
| Terminal Finish | Pb-free (G suffix) | Leaded (L suffix) | Pb-free | Pb-free | Leaded | Pb-free | Pb-free | Pb-free |
| Transceivers | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps | 24 @ 14.1 Gbps |
| User I/O | 480 | 480 | 480 | 480 | 480 | 480 | 480 | 480 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Key Differentiators
- Same silicon with industrial temp + leaded finish option (vs 10AX090U2F45I2LG)
- Higher Fmax headroom available in same package (vs 10AX090U3F45I2SG)
- Mid-range density vs larger Stratix 10 devices (vs Stratix 10 SX / GX)
Design Notes
The 10AX090U2F45I2SG core rail (0.9V) can draw 30A+ on dense designs. Use a 6-layer PCB with a dedicated core power plane and at least 10x 22uF ceramic decoupling capacitors placed within 5mm of the BGA balls. Combine with a buck converter such as the LTM4677 or LTM4620 for the core rail, and separate LDOs for PLL and transceiver auxiliary rails to minimize jitter. Use the Intel PowerPlay Early Power Estimator before PCB layout to size the regulators.
Estimated: at full 100G utilization the 10AX090U2F45I2SG dissipates approximately 25-30W. The FCBGA-1932 package requires a heat-spreader lid and thermal interface material (TIM). Junction-to-ambient thermal resistance with a properly attached heatsink is roughly 1.5-2.0 C/W. Design the heatsink for a 50C ambient with a maximum junction temperature of 100C for industrial grade, leaving adequate margin for transient workloads.
The 1932-ball FCBGA uses a 1.0mm ball pitch with microvia stack-ups required on at least the top two layers. Follow Intel's Arria 10 pin connection guidelines for unused transceiver and PCIe pins - leave them floating or tied per the table to avoid leakage or back-power. For 14.1 Gbps serial links, use 100-ohm differential pairs with intra-pair skew below 1 ps and reference the signals to a solid ground plane on layer 2.
Do not confuse the 10AX (FPGA-only) with the 10AS (SoC with ARM Cortex-A9 hard cores). The packages share the same FCBGA outline but have different ball maps and cannot be substituted on the same PCB. Also confirm you have selected the correct speed grade - speed grade 2 (this part) is the mainstream choice; speed grade 3 yields higher Fmax at higher power, and speed grade 1 saves power at lower Fmax.
Compliance Information
RoHS compliant per Altera/Intel product page. Pb-free (G suffix). Not AEC-Q100 qualified - this is a logic IC, not an automotive analog part. Halogen-free status not explicitly stated in retrieved data.
