10M08DFV81I7G - MAX 10 FPGA, 8K LE, 81-BGA | Intel
MPN: 10M08DFV81I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $37.52 | $37.52 |
| 10 | $33.77 | $337.70 |
| 100 | $30.02 | $3,002.00 |
| 500 | $26.27 | $13,135.00 |
| 1,000 | $22.51 | $22,510.00 |
Drop-in alternatives for 10M08DFV81I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08DFV81C8G
✅ Drop-In✓ In Stock
$7.4 / Unit
View Datasheet →10M08DCV81I7G
✅ Drop-In✓ In Stock
$26.85 / Unit
View Datasheet →10M08DCV81C7G
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →10M08DFV81I7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements | 8000 |
| Embedded Memory (Bits) | 387072 |
| User I/O Count | 56 |
| Package | 81-UFBGA, WLCSP |
| Mounting Type | Surface Mount |
| Configuration Memory | Internal Flash (non-volatile) |
| Integrated ADC | 12-bit SAR, up to 1 MSPS |
| Operating Temperature | -40C to +100C (Industrial) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Toolchain | Intel Quartus Prime |
10M08DFV81I7G 81-ufbga, wlcsp Pin Configuration Guide
Complete pinout information for 10M08DFV81I7G (81-ufbga, wlcsp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08DFV81I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08DFV81I7G is suitable for 6 applications: Industrial Control and I/O Expansion, Motor Control (BLDC / Stepper / FOC), Portable Instrumentation and Data Logging, Video Bridging and Display Interfaces, Low-Volume ASIC Prototyping, Sensor Fusion and System Management.
Industrial Control and I/O Expansion
The 10M08DFV81I7G is well suited to industrial control systems and I/O expansion modules. Its 8,000 logic elements and 56 user I/Os can aggregate multiple legacy interfaces (SPI, I2C, UART, parallel) into a single industrial bus such as EtherCAT or PROFINET. The integrated 12-bit SAR ADC eliminates an external ADC for analog sensor inputs. The industrial temperature rating (-40C to +100C) and on-chip flash provide reliable operation in factory automation panels without external boot memory.
Recommended
Motor Control (BLDC / Stepper / FOC)
For motor control, the 10M08DFV81I7G's DSP blocks deliver fixed- and floating-point arithmetic for field-oriented control (FOC) loops, while the integrated 12-bit ADC samples phase currents and back-EMF. The 8K logic elements easily accommodate space-vector PWM, commutation tables, and protection logic. The 81-ball UFBGA package keeps the design compact on small inverter PCBs, and the instant-on flash enables fast fault-recovery startup.
Recommended
Portable Instrumentation and Data Logging
The 10M08DFV81I7G is ideal for portable test and measurement instruments. Its non-volatile flash enables instant data logging on power-up without boot delay, and user flash memory (UFM) stores calibration constants and configuration parameters. The integrated 12-bit ADC with up to 18 channels supports multi-sensor data acquisition, while 56 user I/Os interface LCDs, keypads, and serial ports. Low-power operation extends battery life in field-portable instruments.
Recommended
Video Bridging and Display Interfaces
The 10M08DFV81I7G can bridge video formats between CMOS cameras, LCDs, and HDMI/DVI transmitters. The 8K logic elements implement timing controllers, color-space converters, and limited scaling, while 56 user I/Os accommodate parallel RGB or LVDS data buses. The integrated ADC and DSP blocks enable on-screen overlay and graphics processing, making this part suitable for industrial HMIs and digital signage controllers.
Recommended
Low-Volume ASIC Prototyping
The 10M08DFV81I7G serves as an ASIC prototyping platform for designs that will later convert to structured ASIC or full-custom silicon. Its 8K logic elements, 387 Kbits of block RAM, and DSP blocks closely match mid-range ASIC gate counts. Quartus Prime supports rapid design iteration, and the integrated flash enables production-ready configuration memory. Engineers can validate firmware, timing, and I/O behavior before committing to NRE.
Recommended
Sensor Fusion and System Management
The 10M08DFV81I7G's combination of logic elements, embedded SRAM, ADC, and user flash makes it ideal for sensor-fusion hubs that aggregate temperature, pressure, current, and voltage data into a single I2C/SPI/CAN interface. The on-chip flash stores calibration coefficients, and the instant-on capability ensures sensor readings begin immediately at power-up. The 81-ball UFBGA footprint supports compact PCB designs in space-constrained embedded systems.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DFV81I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DFV81C8G | 10M08DCV81I7G | 10M08DCV81C7G |
|---|---|---|---|---|
| Package | 81-UFBGA, WLCSP | 81-UFBGA, WLCSP - same | 81-UFBGA, WLCSP - same | 81-UFBGA, WLCSP - same |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 8000 | 8000 | 8000 | 8000 |
| Embedded Memory (Kbits) | 378 | 378 | 378 | 378 |
| User I/O | 56 | 56 | 56 | 56 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Flash Configuration | Single | Single | Dual | Dual |
| ADC Channels | [DATA_NEEDED] | [DATA_NEEDED] | More than DF variant | More than DF variant |
| Lifecycle Status | Active | Active | Active | Active |
Key Differentiators
- Same-package upgrade with dual-configuration flash (vs 10M08DCV81I7G)
- Industrial temperature grade (vs 10M08DFV81C8G)
- Instant-on non-volatile configuration (vs XC7A35T (Xilinx))
Design Notes
The 81-ball UFBGA (WLCSP) package has a 0.4 mm ball pitch and small 4 mm x 4 mm body, requiring via-in-pad PCB technology with filled and plated-over vias for reliable assembly. Use NSMD (non-solder-mask-defined) pads and follow Intel's MAX 10 package-specific layout guidelines for fanout escape routing. Decoupling capacitors should be placed as close as possible to each power pin.
Estimated: with the UFBGA package's small body size, thermal dissipation is limited. At typical 1.0V core voltage and 50% utilization, expect ~0.5-1W dissipation. Ensure the PCB has sufficient copper pour connected to the package thermal balls to dissipate heat. The industrial temperature rating supports ambient up to +100C with adequate thermal management.
Do not confuse the 10M08DFV81I7G (single-config flash, 81-UFBGA) with the 10M08DAU324I7G (dual-config flash, 324-UBGA). The packages are not pin-compatible. When migrating density within the MAX 10 family, verify both the package code and configuration mode (single vs dual) match. Use Intel's MAX 10 vertical migration table for guidance.
Compliance Information
RoHS compliant per distributor listings. Halogen-free status not stated in verified web data - defaulting to unknown. Industrial temp grade; not AEC-Q100 qualified.
