5M160ZM68I5N - MAX V CPLD, 128 Macro Cells, 68-MBGA | Intel
MPN: 5M160ZM68I5N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $12.95 | $129.50 |
| 100 | $10.85 | $1,085.00 |
| 500 | $9.2 | $4,600.00 |
| 1,000 | $7.95 | $7,950.00 |
| 3,000 | $6.8 | $20,400.00 |
Drop-in alternatives for 5M160ZM68I5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5M160ZM68C5N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$3.12 / Unit
View Datasheet β5M160ZM68A5N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$5.1 / Unit
View Datasheet β5M160ZM68C4N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$3.21 / Unit
View Datasheet βEPM240ZM100I5N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
LCMXO2-256ZE-68MG100I
β Drop-Inπ Reference alternative (not in catalog)
5M160ZM68I5N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macro Cells | 128 |
| Logic Elements | 160 |
| Maximum Operating Frequency | 118.3 MHz |
| Number of LABs | 8 |
| User I/O Pins | 79 |
| Core Supply Voltage | 1.8 V |
| Package | 68-ball MBGA (Micro FBGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Configuration Memory | Non-volatile flash (instant-on) |
| Programmable I/O Standards | LVCMOS, LVTTL, PCI |
| Programming Interface | JTAG (in-system programmable) |
| Lead Free | Yes |
| RoHS Status | Compliant |
5M160ZM68I5N Pin Configuration
| Pin A1 | IO β User I/O pin (bank 1) |
| Pin A2 | IO β User I/O pin (bank 1) |
| Pin A3 | IO β User I/O pin (bank 1) |
| Pin A4 | IO β User I/O pin (bank 1) |
| Pin A5 | IO β User I/O pin (bank 1) |
| Pin A6 | IO β User I/O pin (bank 1) |
| Pin A7 | IO β User I/O pin (bank 1) |
| Pin A8 | VCCIO1 β I/O bank 1 supply voltage |
| Pin B1 | IO β User I/O pin (bank 1) |
| Pin B2 | GND β Ground |
| Pin B3 | IO β User I/O pin (bank 1) |
| Pin B4 | IO β User I/O pin (bank 1) |
| Pin B5 | IO β User I/O pin (bank 1) |
| Pin B6 | IO β User I/O pin (bank 1) |
| Pin B7 | IO β User I/O pin (bank 1) |
| Pin B8 | VCCINT β Core supply voltage (1.8 V) |
| Pin C1 | IO β User I/O pin (bank 2) |
| Pin C2 | IO β User I/O pin (bank 2) |
| Pin C3 | GND β Ground |
| Pin C4 | IO β User I/O pin (bank 2) |
| Pin C5 | IO β User I/O pin (bank 2) |
| Pin C6 | GND β Ground |
| Pin C7 | TDI β JTAG Test Data In |
| Pin C8 | TMS β JTAG Test Mode Select |
| Pin D1 | IO β User I/O pin (bank 2) |
| Pin D2 | IO β User I/O pin (bank 2) |
| Pin D3 | IO β User I/O pin (bank 2) |
| Pin D4 | VCCIO2 β I/O bank 2 supply voltage |
| Pin D5 | IO β User I/O pin (bank 2) |
| Pin D6 | IO β User I/O pin (bank 2) |
| Pin D7 | IO β User I/O pin (bank 2) |
| Pin D8 | TCK β JTAG Test Clock |
| Pin E1 | IO β User I/O pin (bank 3) |
| Pin E2 | IO β User I/O pin (bank 3) |
| Pin E3 | IO β User I/O pin (bank 3) |
| Pin E4 | IO β User I/O pin (bank 3) |
| Pin E5 | IO β User I/O pin (bank 3) |
| Pin E6 | IO β User I/O pin (bank 3) |
| Pin E7 | IO β User I/O pin (bank 3) |
| Pin E8 | TDO β JTAG Test Data Out |
| Pin F1 | IO β User I/O pin (bank 3) |
| Pin F2 | GND β Ground |
| Pin F3 | IO β User I/O pin (bank 3) |
| Pin F4 | IO β User I/O pin (bank 3) |
| Pin F5 | IO β User I/O pin (bank 3) |
| Pin F6 | IO β User I/O pin (bank 3) |
| Pin F7 | IO β User I/O pin (bank 3) |
| Pin F8 | VCCIO3 β I/O bank 3 supply voltage |
| Pin G1 | IO β User I/O pin (bank 4) |
| Pin G2 | IO β User I/O pin (bank 4) |
| Pin G3 | GND β Ground |
| Pin G4 | IO β User I/O pin (bank 4) |
| Pin G5 | IO β User I/O pin (bank 4) |
| Pin G6 | GND β Ground |
| Pin G7 | IO β User I/O pin (bank 4) |
| Pin G8 | nCE β Chip enable (active low) |
| Pin H1 | IO β User I/O pin (bank 4) |
| Pin H2 | IO β User I/O pin (bank 4) |
| Pin H3 | IO β User I/O pin (bank 4) |
| Pin H4 | VCCIO4 β I/O bank 4 supply voltage |
| Pin H5 | IO β User I/O pin (bank 4) |
| Pin H6 | IO β User I/O pin (bank 4) |
| Pin H7 | nCONFIG β Configuration control (active low) |
| Pin H8 | nSTATUS β Configuration status (active low) |
| Pin J1 | IO β User I/O pin (bank 4) |
| Pin J2 | IO β User I/O pin (bank 4) |
| Pin J3 | IO β User I/O pin (bank 4) |
| Pin J4 | GND β Ground |
| Pin J5 | IO β User I/O pin (bank 4) |
| Pin J6 | IO β User I/O pin (bank 4) |
| Pin J7 | IO β User I/O pin (bank 4) |
| Pin J8 | IO β User I/O pin (bank 4) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M160ZM68I5N is suitable for 7 applications: Industrial Control Glue Logic, Consumer Electronics Interface Bridging, Telecommunications Line-Card Bus Decoders, Automotive Body Electronics (Non-Safety), I/O Expansion and Bus Width Translation, Power Sequencing and Reset Management, Test and Measurement Equipment.
Industrial Control Glue Logic
The 5M160ZM68I5N replaces discrete TTL/CMOS glue logic in industrial control systems, where its 128 macro cells and 79 user I/O consolidate multiple 74-series logic functions into a single non-volatile device. Its industrial temperature rating (-40C to +100C) and instant-on flash configuration suit factory-floor PLCs, motor-control boards, and sensor-interface modules that must boot deterministically without external boot PROMs. The 1.8 V core with multi-voltage I/O bank support allows direct interfacing to 3.3 V sensors, 5 V actuator drivers, and 1.8 V processors on the same board, eliminating external level shifters and reducing BOM count in PLC and DCS designs.
Recommended
Consumer Electronics Interface Bridging
The 5M160ZM68I5N bridges between incompatible display, memory, and processor interfaces in consumer devices such as set-top boxes, smart-home hubs, and digital cameras. Its 118.3 MHz maximum operating frequency supports standard display interfaces (RGB-to-MIPI, LVDS-to-eDP), while the multi-voltage I/O banks translate between 1.8 V, 2.5 V, and 3.3 V domains without external translators. The 68-ball MBGA package measures 5 mm x 5 mm with 0.5 mm pitch, fitting consumer-product form factors, and the flash-based instant-on behavior eliminates user-visible boot delays in always-on consumer appliances.
Recommended
Telecommunications Line-Card Bus Decoders
Telecommunications line cards use the 5M160ZM68I5N to decode address, control, and status signals between network processors, framers, and PHY devices. The 128 macro cells and 79 I/O provide enough logic to implement custom bus decoders, interrupt controllers, and watchdog timers per line card. The device's deterministic timing and zero-configuration instant-on behavior are critical for telecom equipment where power-on sequencing must be repeatable across temperature and voltage variations. The industrial temperature grade supports outdoor cabinet and central-office environments.
Recommended
Automotive Body Electronics (Non-Safety)
For non-safety automotive body applications (HVAC controls, instrument-cluster I/O expansion, infotainment auxiliary logic), the 5M160ZM68I5N delivers reliable glue-logic integration with industrial temperature performance. For AEC-Q100-qualified automotive designs, the 5M160ZM68A5N variant is the drop-in alternative. The CPLD handles tasks such as stepper-motor control sequencing, LED backlight driving, and CAN/LIN bus auxiliary decoding. The flash-based instant-on behavior supports cold-crank automotive scenarios where the supply rail drops briefly during engine start.
Recommended
I/O Expansion and Bus Width Translation
The 5M160ZM68I5N expands processor I/O when an MCU or SoC lacks sufficient pins for peripheral connectivity. Designers implement custom shift registers, multiplexer/demultiplexer logic, and parallel-to-serial converters in the 128 macro cells. The device also performs bus-width translation between 8-bit, 16-bit, and 32-bit buses using its multi-voltage I/O banks, allowing legacy 5 V peripherals to interface with modern 1.8 V processors without external transceivers. JTAG in-system programmability enables last-minute logic changes during development without PCB rework.
Recommended
Power Sequencing and Reset Management
The 5M160ZM68I5N implements multi-rail power-sequencing controllers for systems requiring specific power-up and power-down ordering of voltage rails. Using its non-volatile flash configuration, the CPLD boots instantly at power-on and asserts enables to DC-DC converters, LDOs, and load switches in the correct sequence. The 128 macro cells provide enough logic to monitor multiple PG (power-good) signals, implement watchdog timers, and generate system-reset pulses. Industrial temperature grade supports server, networking, and industrial equipment power-supply subsystems.
Recommended
Test and Measurement Equipment
Test and measurement instruments benefit from the 5M160ZM68I5N's deterministic timing and instant-on behavior for trigger conditioning, pulse generation, and counter logic. Its 118.3 MHz maximum operating frequency supports high-resolution timing measurements, while the 79 user I/O accommodate multiple parallel measurement channels. The industrial temperature grade ensures stable operation in laboratory and field-test environments. Programmable I/O standards allow direct interface to 1.8 V ADC/DAC devices, 3.3 V FPGAs, and 5 V legacy instruments on the same board.
Recommended
Recommended Products Summary
Engineering reference data for 5M160ZM68I5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M160ZM68C5N | 5M160ZM68A5N | 5M160ZM68C4N | LCMXO2-256ZE-68MG100I |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Package | 68-ball MBGA (Micro FBGA) | 68-ball MBGA - same | 68-ball MBGA - same | 68-ball MBGA - same | 68-ball MBGA - same |
| Macro Cells | 128 | 128 | 128 | 128 | 256 (FPGA LEs) |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Automotive AEC-Q100 | Commercial 0C to +85C | Industrial -40C to +100C |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.2 V / 2.5-3.3 V |
| Speed Grade | 5 (118.3 MHz fmax) | 5 | 5 | 4 (slower) | N/A (FPGA) |
| User I/O | 79 | 79 | 79 | 79 | 44 |
| Configuration Memory | Non-volatile flash (instant-on) | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash (FlashBAK) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Same-family drop-in with commercial temperature grade (vs 5M160ZM68C5N)
- Automotive-grade variant available in same package (vs 5M160ZM68A5N)
- Cross-brand alternative with flash-based instant-on (vs LCMXO2-256ZE-68MG100I)
- Lower-power MAX V architecture vs MAX II legacy (vs EPM240ZM100I5N)
Design Notes
The 68-ball MBGA package uses a 0.5 mm ball pitch, which requires PCB land patterns per JEDEC MO-225. Recommended PCB design rules: 0.4 mm solder mask openings, NSMD (non-solder mask defined) pads, and microvia-in-pad for BGA break-out routing. Place at least one 0.1 uF decoupling capacitor per VCCIO bank as close to the respective VCCIO ball as possible, plus a bulk 10 uF ceramic near VCCINT. Use 4-layer PCB with continuous ground plane beneath the BGA for thermal dissipation and signal integrity. Via-in-pad plating must be filled and planarized to prevent solder wicking during reflow.
The 5M160ZM68I5N operates from a 1.8 V VCCINT core supply and four independent VCCIO bank supplies. Each VCCIO bank (1-4) can be independently powered at 1.5 V, 1.8 V, 2.5 V, or 3.3 V to support mixed-voltage interfaces. All VCCIO pins must be powered, even if a bank is unused, or the I/O buffers may latch up. VCCINT must ramp monotonically from 0 V to 1.8 V within the datasheet-specified time. Use a dedicated LDO for VCCINT rather than sharing with digital logic rails to prevent supply-noise-induced timing violations in the CPLD's flash configuration circuitry.
Three common pitfalls when designing with the 5M160ZM68I5N: (1) Confusing JTAG pin directionality - TDI, TMS, TCK are inputs; TDO is output; ensure proper pull-ups on TMS/TCK (typically 10 kohm to VCCIO of JTAG bank). (2) Forgetting the nCONFIG initialization sequence - nCONFIG must be held low then released high to initiate reconfiguration; leaving it floating may cause unintended reconfiguration during power glitches. (3) Mixing I/O standards within a single bank - all I/O pins in one VCCIO bank must use the same I/O standard to avoid buffer contention; cross-bank assignment is required for mixed-voltage designs.
Although the 5M160ZM68I5N consumes low static current, dynamic power dissipation depends on switching frequency and I/O toggle rate. Estimated: at 118.3 MHz with 50% I/O toggle, internal power dissipation is approximately 50-80 mW. The 68-ball MBGA thermal resistance theta_JA is approximately 35 C/W on a standard JEDEC 4-layer test board. For enclosed or high-temperature industrial environments, ensure ambient temperature plus self-heating does not exceed the +100C industrial limit. Add thermal vias under the center BGA balls and connect to inner ground planes for improved heat spreading.
Compliance Information
RoHS compliant and lead-free per Intel product page. Standard industrial temperature grade - not AEC-Q100 qualified; choose 5M160ZM68A5N for AEC-Q100 automotive applications.
