EP3CLS100F780C8 - 100K LE Cyclone III LS FPGA | Intel
MPN: EP3CLS100F780C8 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 100 | $76 | $7,600.00 |
| 250 | $70 | $17,500.00 |
| 500 | $65 | $32,500.00 |
EP3CLS100F780C8 Overview
What is a Cyclone III LS FPGA? A Cyclone III LS FPGA is a low-power programmable logic device that combines lookup-table based logic, embedded SRAM blocks, embedded multipliers, and user I/O on a single die, hardened by an on-chip configuration controller and (in the LS variant) AES-256 bitstream decryption. Within the broader taxonomy it sits under FPGA -> programmable logic -> digital semiconductor. The Cyclone III LS family targets cost-sensitive applications where static power, deterministic configuration, and design-security features are required.
Key features of the EP3CLS100F780C8 include 4 PLLs for clock management, 483 18x18 hardware multipliers for DSP, support for LVDS, LVPECL, SSTL, and HSTL I/O standards, and a Cyclone III LS configuration controller with AES bitstream protection. The 780-pin FBGA package supports up to 413 user I/O with 8 I/O banks and offers hot-socketing capability.
Architecturally the device uses SRAM configuration cells and 4-input ALMs (Adaptive Logic Modules), each capable of implementing a 4-input LUT plus associated register. Embedded M9K memory blocks total 483 instances of 9 Kbit, addressable as RAM, ROM, shift registers, or FIFO buffers. Dedicated 18x18 multipliers feed optional accumulator chains for DSP-heavy pipelines.
Typical applications span industrial motor control, video processing bridges, automotive infotainment prototypes, software-defined radio baseband, and secure industrial gateways. The wide I/O count (413) and ample DSP bandwidth also suit multi-channel data-acquisition front ends and parallel sensor aggregation.
Designers using this part must observe 1.2 V core and 2.5 V/3.3 V auxiliary supply sequencing rules from the Cyclone III LS datasheet, and must generate configuration bitstreams with Quartus II (legacy) or Quartus Prime 13.0+. For new designs, evaluate Cyclone V or Cyclone 10 LP families before committing, as Cyclone III LS is a mature generation.
This page synthesizes distributor pricing, drop-in same-package alternatives, comparison data, and practical design considerations not consolidated on the manufacturer datasheet.
Drop-in alternatives for EP3CLS100F780C8 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS100F780C8 (same form factor and footprint) β differing in Process Technology, Speed Grade, Package, Embedded 18x18 Multipliers, Logic Elements (LE).
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3CLS100F780C7N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$298.75 / Unit
View Datasheet βEP3CLS100F780C7
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$632.4 / Unit
View Datasheet βEP3C120F780C8N
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View Datasheet βEP3C120F780C7N
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$162 / Unit
View Datasheet βEP3C55F780C8
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$126.01 / Unit
View Datasheet βEP3C55F780C7
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$76.75 / Unit
View Datasheet βEP3CLS100F780C8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone III LS |
| Logic Elements (LE) | 100,448 |
| Total Embedded Memory | 4,451,328 bits |
| Embedded Memory Blocks (M9K) | 483 |
| Embedded 18x18 Multipliers | 483 |
| Maximum User I/O | 413 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm low-power TSMC |
| Package | 780-ball FBGA (F780) |
| Device Type | FPGA - Field Programmable Gate Array |
| Bitstream Encryption | AES-256 (Cyclone III LS feature) |
| Operating Temperature Grade | Commercial (C8 speed grade) |
| Speed Grade | 8 (slowest commercial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Configuration Controller | Cyclone III LS (AES-enabled) |
EP3CLS100F780C8 780-ball fbga (f780) Pin Configuration Guide
Pin configuration for EP3CLS100F780C8 (780-ball fbga (f780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS100F780C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS100F780C8 is suitable for 6 applications: Industrial Motor Control (Multi-axis FOC), Video Processing Bridge / Display Controller, Automotive Infotainment Prototype, Software-Defined Radio Baseband, Multi-Channel Data Acquisition Front End, Secure Industrial Gateway / Edge Node.
Industrial Motor Control (Multi-axis FOC)
The EP3CLS100F780C8 fits multi-axis industrial motor control because 100,448 logic elements, 483 18x18 multipliers, and 4 PLLs deliver enough DSP bandwidth to run three or more field-oriented-control (FOC) loops at 32 kHz PWM rates concurrently. The 413 user I/O accommodate encoder quadrature inputs, Hall sensors, current-sense ADCs, and CAN/EtherCAT peripherals on a single device. AES bitstream encryption protects proprietary commutation algorithms in deployed industrial servo drives.
Recommended
Video Processing Bridge / Display Controller
The EP3CLS100F780C8 functions as a video-format bridge (e.g., MIPI-CSI to parallel RGB, HDMI to LVDS) because 4,451,328 embedded bits of M9K SRAM buffer full-HD line buffers while 483 18x18 multipliers handle chroma upsampling and color-space conversion. The 413 user I/O support wide parallel video buses plus LVDS channels for display panels. Designers use the 4 PLLs to synthesize independent pixel clocks for input and output sides without external clock-gen ICs.
Recommended
Automotive Infotainment Prototype
The EP3CLS100F780C8 suits automotive infotainment prototypes and pre-production units because 100,448 logic elements implement HMI graphics compositing, audio mixing, and rear-seat entertainment routing on one die. The AES bitstream encryption prevents aftermarket bitstream cloning of OEM infotainment software. The 780-ball FBGA offers 413 user I/O for touch-panel, CAN, MOST, and LVDS display interfaces, while industrial temperature variants in the same family support -40C to +105C environments.
Recommended
Software-Defined Radio Baseband
The EP3CLS100F780C8 handles moderate-complexity SDR baseband processing including digital down-conversion, channelization, and demodulation because its 483 18x18 hardware multipliers feed FFT and FIR pipelines with deterministic throughput. The 4 PLLs synthesize independent sample-rate clocks from a single reference, and AES bitstream encryption protects proprietary waveform IP. For wideband RF workloads above ~80 MHz of signal bandwidth, designers should migrate to Cyclone V GT or Cyclone 10 GX devices with integrated transceivers.
Recommended
Multi-Channel Data Acquisition Front End
The EP3CLS100F780C8 fits parallel multi-channel data-acquisition front ends (DAQ) because 413 user I/O aggregate LVDS pairs from multiple ADCs while 483 M9K memory blocks implement per-channel FIFOs and trigger logic. The 483 18x18 multipliers enable on-chip FIR filtering and FFT pre-processing, reducing host-processor load. Designers targeting medical imaging, sonar arrays, or industrial vibration monitoring leverage the AES bitstream protection to safeguard calibration coefficients and proprietary DSP IP.
Recommended
Secure Industrial Gateway / Edge Node
The EP3CLS100F780C8 is well-suited for secure industrial gateways aggregating Modbus, PROFINET, EtherCAT, and serial fieldbus traffic because 100,448 logic elements implement multiple protocol stacks and an on-chip packet classifier. AES-256 bitstream encryption plus 4,451,328 bits of M9K RAM for secure key storage make it a hardened platform for edge-of-network nodes in industrial IoT deployments. The 413 user I/O connect to multiple PHYs, RS-485 transceivers, and Wi-Fi/Bluetooth co-processors without external muxing logic.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS100F780C8 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS100F780C7N | EP3CLS100F780C7 | EP3C120F780C8N | EP3C120F780C7N | EP3C55F780C8 | EP3C55F780C7 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA (F780) | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same | 780-ball FBGA (F780) - same |
| Family | Cyclone III LS (secure) | Cyclone III LS (secure) | Cyclone III LS (secure) | Cyclone III (non-LS) | Cyclone III (non-LS) | Cyclone III (non-LS) | Cyclone III (non-LS) |
| Logic Elements | 100,448 | 100,448 | 100,448 | 119,088 (+18%) | 119,088 (+18%) | 55,856 (-44%) | 55,856 (-44%) |
| Embedded Memory (bits) | 4,451,328 | 4,451,328 | 4,451,328 | 3,981,312 | 3,981,312 | 2,396,160 | 2,396,160 |
| 18x18 Multipliers | 483 | 483 | 483 | 576 | 576 | 312 | 312 |
| Maximum User I/O | 413 | 413 | 413 | 531 | 531 | 377 | 377 |
| AES Bitstream Encryption | Yes | Yes | Yes | No | No | No | No |
| Speed Grade | 8 (slowest) | 7 | 7 | 8 | 7 | 8 | 7 |
| Unit Price (qty 1, USD, approx) | 95.00 | 110.00 (approx) | 105.00 (approx) | 120.00 (approx) | 135.00 (approx) | 60.00 (approx) | 70.00 (approx) |
Key Differentiators
- AES-256 bitstream encryption built in (vs EP3C120F780C8N)
- Same 780-ball FBGA package as EP3C120 family enables drop-in LE scaling (vs EP3C55F780C8)
- Speed grade 8 (slowest) offers relaxed timing margins for cost-sensitive designs (vs EP3CLS100F780C7N)
Design Notes
The EP3CLS100F780C8 requires three rails sequenced in this order: 1.2 V VCCINT first, then 2.5 V VCCAUX, then 2.5/3.3 V VCCIO. Reverse sequencing or simultaneous ramp-up can latch the device into an undefined configuration state. Use a multi-rail power supervisor (e.g., TI TPS3890 trio) or a discrete RC delay on VCCAUX relative to VCCINT. Decouple each VCCINT pin with a 0.1 uF X7R 0402 ceramic plus a 10 uF bulk cap per VCCINT bank.
The 780-ball FineLine BGA requires a 0.8 mm or 1.0 mm ball pitch PCB land pattern with microvia stack-ups (laser-drilled). Use a 4-6 layer stack-up with at least two internal ground planes directly under the device for return-path integrity and thermal spreading. Route all differential pairs (LVDS) with 100 ohm differential impedance and length-match to within 150 mil. The exposed die-attach paddle (if present on this package) must be soldered to a continuous ground pad with thermal vias (0.3 mm drill, 1.2 mm pitch) for heatsinking.
Do not use Quartus Prime Standard or Pro editions with this device - the Cyclone III LS library was dropped after Quartus Prime Lite 16.1. Use Quartus II 13.0sp1 subscription or Quartus Prime Lite 16.1 for compilation. When migrating from a non-LS Cyclone III (e.g., EP3C80F780C8), the pin map is NOT identical to EP3CLS100F780C8 - regenerate the pin assignments with the F780 pin file. Also note that the 'LS' configuration controller rejects unencrypted bitstreams unless bitstream security is explicitly disabled during generation.
Estimated: at 100% logic utilization toggling at 200 MHz on 100,448 LEs, the EP3CLS100F780C8 dissipates approximately 1.0-1.5 W of dynamic power plus 100-300 mW of static power per the Cyclone III LS power calculator. With theta_JA around 15-20 C/W on a 6-layer JEDEC test board, junction-to-ambient rise is 20-40 C above ambient, well within commercial limits. For industrial-temperature variants (-40 to +100 C), design margin of 15 C above max ambient is recommended.
Compliance Information
RoHS and lead-free per Intel/Altera product page. AEC-Q100 not directly claimed for this commercial speed grade; industrial-temperature variants are available in the same family. Conflict-minerals compliance per Intel published CMRT.
