Intel

EP20K400EFC672-3N - APEX 20KE 400K FPGA, 488 I/O | Intel / Altera

MPN: EP20K400EFC672-3N ✗ End of Life
In Stock Ships in 1-3 business days
1.71 V to 1.89 V (1.8 V nominal) Vdss 672-BBGA (FC-FBGA) Package -3 Speed
From $171 USD / Unit
MOQ: 1 |
Price updated: 2026-09-07
Volume Pricing
Qty Unit Price Extended
1 $285 $285.00
10 $256.5 $2,565.00
100 $228 $22,800.00
500 $199.5 $99,750.00
1,000 $171 $171,000.00
ℹ️ All prices are in USD

EP20K400EFC672-3N Overview

The Intel / Altera EP20K400EFC672-3N is a member of the APEX 20KE family of Field Programmable Gate Arrays (FPGAs) that delivers 400,000 system gates, 16,640 logic elements, and 212,992 bits of embedded RAM in a 672-pin FC-FBGA (Fine-pitch Chip-scale Fine-pitch Ball Grid Array) package. It exposes 488 user I/O pins, supports LVCMOS/LVTTL/LVDS/PCI interfacing, and operates from a 1.71 V to 1.89 V core supply with a propagation delay of 2.5 ns at speed grade -3.

A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic fabric, interconnect, and I/O cells can be reconfigured after manufacture by the end user. The APEX 20KE device family introduced Altera's MultiCore architecture, which integrates look-up table (LUT) logic, embedded system blocks (ESBs) for dual-port RAM/ROM, and high-speed I/O on a single die - effectively an early System-on-a-Programmable-Chip (SOPC) platform. Within the broader taxonomy, this places FPGAs under Programmable Logic Devices (PLD) > CPLD/FPGA > Integrated Circuit > Semiconductor.

Key feature highlights include the MultiCore architecture combining LUT-based logic with embedded array blocks, 4 PLLs for clock management, True-LVDS support, and a 1.05M-system-gate density ceiling. The device supports in-system programmability via serial configuration and is offered with both commercial (0 °C to +85 °C) and industrial temperature grades. Speed grade -3 is the second-fastest of the APEX 20KE family, with -2, -1, and -X slower options also available.

Typical applications for the EP20K400EFC672-3N include high-performance digital signal processing, telecom baseband processing, networking line cards, and embedded control platforms where mid-1990s to early-2000s design ecosystems still remain in service. The combination of substantial embedded memory and abundant I/O makes it well suited for parallel datapath and protocol-bridging designs.

When designing with this part, verify the exact package footprint (FC-FBGA-672) against the PCB land pattern and confirm configuration interface voltage compatibility with the selected PROM or processor. Note that the APEX 20KE family has been classified NRND/EOL by Intel in favor of newer Cyclone/Arria series, so lifecycle planning and last-time-buy inventory strategy are critical.

This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, including comparison with related APEX 20KE speed grades and the same-density EFC672 footprint across speed bin -2 and -1.

Drop-in alternatives for EP20K400EFC672-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP20K400EFC672-3N (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Series, Family.

Intel
Operating Temperature: 0C to +85C (Commercial)
Package: 672-FBGA (FineLine BGA)
Compare with EP20K400EFC672-3N →
Intel
Operating Temperature: 0 °C to 85 °C (industrial)
Package: 672-ball FC-FBGA
Process Technology: 0.22 µm CMOS
Compare with EP20K400EFC672-3N →
Intel
Package: 672-BBGA (FC-FBGA, FineLine BGA)
Process Technology: 0.18 µm CMOS
Series: APEX-20KE
Compare with EP20K400EFC672-3N →
Intel
Operating Temperature: 0 C to 85 C
Process Technology: 0.22 um
Compare with EP20K400EFC672-3N →
Intel
Operating Temperature: 0 C to +85 C (commercial)
Package: 672-ball FC-FBGA
Process Technology: 0.22 um CMOS
Compare with EP20K400EFC672-3N →
Intel
Operating Temperature: 0 C to 85 C (TJ)
Process Technology: 0.22 um / 0.18 um CMOS
Series: APEX-20KE
Compare with EP20K400EFC672-3N →
Intel
Operating Temperature: 0 C to +85 C (commercial)
Package: 672-ball FineLine BGA
Series: APEX-20KE
Compare with EP20K400EFC672-3N →
Altera
Operating Temperature: -40 °C to +100 °C (TJ)
Process Technology: CMOS
Series: APEX-20K®
Compare with EP20K400EFC672-3N →
Intel
Operating Temperature: 0 °C to 85 °C (Industrial)
Package: 672-ball FineLine BGA (FC-FBGA), 27 × 27 mm
Process Technology: 0.22 µm CMOS
Compare with EP20K400EFC672-3N →
Altera
Process Technology: 0.22 µm
Series: APEX-20KC
Family: APEX 20KC
Compare with EP20K400EFC672-3N →
Altera
Operating Temperature: 0 °C to 85 °C (commercial)
Package: 672-ball FC-FBGA (Fine-pitch Chip-Scale BGA)
Compare with EP20K400EFC672-3N →
Altera
Package: S-PBGA-B672
Process Technology: CMOS
Series: EP20K400
Compare with EP20K400EFC672-3N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP20K400EFC672-3

✅ Drop-In
Intel
📦 672-BBGA (FC-FBGA)
FPGA (Field Programmable Gate Array) · APEX-20KE · 16,640 (approx. 1,052,000 system gates) · 212,992 · 488 · 488 pins · 2.5 ns · 1.8 V

✓ In Stock

$199.5 / Unit

View Datasheet →

EP20K400EFC672-2X

✅ Drop-In
Intel
📦 672-BBGA (FC-FBGA)
APEX-20KE · APEX-20KE · Intel (formerly Altera) · 16,640 · 1,664 · 212,992 · 488 · 1,052,000

✓ In Stock

$118.9 / Unit

View Datasheet →

EP20K400EFC672-2N

✅ Drop-In
Intel
📦 672-BBGA (FC-FBGA)
APEX 20KE · 16,640 · 400,000 (1,052,032 max) · 488 · 672-ball FC-FBGA · 0.22 um CMOS · 1.8 V · 2.5 V

✓ In Stock

$171 / Unit

View Datasheet →

EP20K400EFC672-1XN

✅ Drop-In
Intel
📦 672-BBGA (FC-FBGA)
APEX-20KE · APEX 20K · 16,640 · 1,664 · 400,000 · 212,992 · 488

✓ In Stock

$215 / Unit

View Datasheet →

EP20K400EFC672-1N

✅ Drop-In
Intel
📦 672-BBGA (FC-FBGA)
APEX 20KE · 16,640 · 400,000 · 502 (488 per Mouser listing) · 672-ball FC-FBGA · 0.22 µm CMOS · 1.8 V · 2.5 V

✓ In Stock

$175 / Unit

View Datasheet →

EP20K400EFC672-2

✅ Drop-In
Intel
📦 672-BBGA (FC-FBGA)
APEX 20KE · 16640 · 212992 · 488 · 400000 · 1.8 V · 2.5 ns · 0 C to 85 C

✓ In Stock

$92.75 / Unit

View Datasheet →

EP20K400EFC672-1

✅ Drop-In
Intel
📦 672-BBGA (FC-FBGA)
APEX 20KE · 400,000 · 16,640 · 488 · 212,992 bits · 1.8 V · 2.5 V / 3.3 V compatible · 0.22 um CMOS

✓ In Stock

$110 / Unit

View Datasheet →

EP20K400EFC672-3N Maximum Ratings & Electrical Characteristics

Family APEX 20KE
Series APEX 20K
Device Type FPGA - Field Programmable Gate Array
System Gates 1,052,000
Logic Elements 16,640
Logic Array Blocks (LABs) 1,664 macros
Embedded RAM (EAB/ESB bits) 212,992 bits
User I/O Pins 488
Package 672-BBGA (FC-FBGA)
Pin Count 672
Propagation Delay 2.5 ns
Core Supply Voltage 1.71 V to 1.89 V (1.8 V nominal)
I/O Supply Voltage 2.5 V
Operating Temperature 0 °C to +85 °C (commercial)
Speed Grade -3
Technology CMOS, 0.18 µm (per APEX 20KE family)
PLL Count 4
Architecture MultiCore (LUT + Embedded System Blocks)

EP20K400EFC672-3N 672-bbga (fc-fbga) Pin Configuration Guide

Pin configuration for EP20K400EFC672-3N (672-bbga (fc-fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

672-bbga (fc-fbga) package pinout diagram for EP20K400EFC672-3N

No detailed pinout data available for EP20K400EFC672-3N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP20K400EFC672-3N is suitable for 6 applications: Telecommunications Baseband Processing, Networking Line Card Packet Processing, Industrial Control and Machine Automation, DSP Co-Processor / Hardware Accelerator, Test and Measurement Instrumentation, Legacy Embedded Computing Platforms.

🌐

Telecommunications Baseband Processing

The EP20K400EFC672-3N fits telecommunications baseband processing because its 16,640 logic elements and 212,992 bits of embedded dual-port RAM provide the parallel datapath resources needed for multi-channel baseband demodulation. With 488 user I/O pins, designers can connect multiple LVDS ADC/DAC pairs and backplane interfaces without external bus multiplexing. The four on-chip PLLs generate the precise clock trees required for symbol-rate conversion and chip-rate processing. Unlike modern FPGAs, the APEX 20KE's MultiCore architecture integrates embedded system blocks that can be configured as FIFO buffers for inter-stage data hand-off, reducing external SRAM overhead in legacy line-card designs.

🖥️

Networking Line Card Packet Processing

For networking line cards, the EP20K400EFC672-3N delivers 400K system gates and 488 I/O sufficient for IPv4 forwarding engines, ATM SAR functions, and SONET framer glue logic. The 2.5 ns propagation delay at speed grade -3 sustains the ~213 MHz internal fabric frequency required for 64-bit datapath classification at line rate. The FC-FBGA-672 package's high ball count exposes multiple LVDS and PCI interfaces for connection to network processors and PHYs. Designers value the APEX 20KE's embedded system blocks when implementing CAM-adjacent lookup tables or statistics counters in hardware-accelerated routers.

🏭

Industrial Control and Machine Automation

The EP20K400EFC672-3N supports industrial control applications where deterministic real-time response is required from 0 °C to +85 °C commercial grade. Its 488 I/O pins can interface with dozens of digital sensors, encoder inputs, and PWM outputs without external bus expanders. The four PLLs and MultiCore architecture enable hardware-implemented PID loops, motion controllers, and fieldbus protocol bridges. The embedded system blocks (ESBs) can hold production-line recipes or motion profile tables, eliminating external EEPROMs in cost-sensitive machine designs.

DSP Co-Processor / Hardware Accelerator

When used as a hardware accelerator paired with a host processor, the EP20K400EFC672-3N's 16,640 logic elements and 212,992 embedded RAM bits offload compute-intensive DSP kernels such as FFTs, FIR filters, and convolutional coders. The 2.5 ns propagation delay enables pipelined multiply-accumulate structures at hundreds of MSPS, offloading the host CPU. The PCI-compatible I/O banks allow direct attachment to PowerPC or StrongARM processors via the PCI bus commonly used in embedded compute platforms of the APEX 20KE era.

🔧

Test and Measurement Instrumentation

The EP20K400EFC672-3N is well matched to test and measurement equipment where flexible logic capture, custom protocol decoding, and high I/O count are required. Its 488 user I/O can drive display controllers, ADC front-ends, and front-panel keypads simultaneously while the embedded RAM holds captured waveform samples. Speed grade -3 supports the high-speed state machines and pattern generators used in protocol analyzers. The 672-pin FC-FBGA package exposes sufficient I/O banks for mixed-voltage (2.5 V I/O with 1.8 V core) instrument architectures.

✈️

Legacy Embedded Computing Platforms

For sustaining legacy embedded computing platforms - VME boards, CompactPCI carrier cards, and military/aerospace subsystems designed in the late 1990s and early 2000s - the EP20K400EFC672-3N provides a form-fit-function continuation supply. Its MultiCore architecture, configuration bitstream format, and Quartus II toolchain compatibility enable software-only redesign when re-spins are needed. Designers maintaining long-lifecycle programs rely on the APEX 20KE family because obsolescence planning requires only last-time-buy inventory rather than full hardware redesign and certification re-qualification.

What is the EP20K400EFC672-3N and what family does it belong to?
The EP20K400EFC672-3N is a Field Programmable Gate Array (FPGA) from Intel / Altera belonging to the APEX 20KE family. According to the Octopart datasheet listing, the device provides 400K system gates, 16,640 logic elements, 212,992 bits of embedded RAM, and 488 user I/O pins in a 672-pin FC-FBGA package. Speed grade -3 indicates a mid-tier performance bin within the APEX 20KE family.
How many user I/O pins does the EP20K400EFC672-3N provide?
The EP20K400EFC672-3N provides 488 user I/O pins, per the DigiKey and Mouser product listings. These I/O cells support LVCMOS, LVTTL, LVDS, and PCI signaling standards per the APEX 20KE family datasheet. The 672-ball FC-FBGA package includes dedicated power, ground, configuration, and clock pins in addition to the 488 user I/O pins.
What is the operating voltage of the EP20K400EFC672-3N?
The EP20K400EFC672-3N operates from a 1.71 V to 1.89 V core supply (1.8 V nominal) with a 2.5 V I/O supply, per the DigChip datasheet entry. This dual-voltage configuration is characteristic of late-1990s Altera APEX devices. Decoupling must follow the APEX 20KE power distribution guidelines with multiple bulk and ceramic capacitors near each power pin.
Is the EP20K400EFC672-3N still in production?
The EP20K400EFC672-3N is classified NRND (Not Recommended for New Designs) by Intel, with the APEX 20KE family having been moved off active production in favor of Cyclone and Arria series. Per the current distributor listings on DigiKey and Mouser, the part is available primarily from authorized distributors' remaining inventory and the secondary market. Lifecycle status verified as of 2026-09-08.
What is the difference between EP20K400EFC672-3N and EP20K400EFC672-2N?
The EP20K400EFC672-3N and EP20K400EFC672-2N share the same 672-ball FC-FBGA package, 400K system gates, and 16,640 logic elements, differing only in speed grade. According to the FindIC comparison, the -3N speed grade delivers 213 MHz operation while the -2N bin provides slightly slower performance. Both are pin-compatible drop-in alternatives for designs where maximum clock rate is not critical.
Where can I buy the EP20K400EFC672-3N online and what is the price?
The EP20K400EFC672-3N is available from DigiKey, Mouser, Octopart-listed distributors, and authorized resellers like Veswin Electronics and WIN SOURCE. As of 2026-09-08, pricing from authorized distributors ranges approximately $171-$285 per unit depending on quantity break. Octopart compares bulk discounts across 15 distributors; lead time is typically stock-to-2 weeks given NRND lifecycle status.
What is the lead time and stock status for EP20K400EFC672-3N?
Per the DigiKey listing accessed 2026-09-08, the EP20K400EFC672-3N ships today from in-stock inventory at authorized distributors. Mouser and Octopart aggregators list comparable stock levels. Because the APEX 20KE family is NRND with no new wafer starts, designers should confirm multi-source availability and consider ordering lifetime-need quantities to mitigate future obsolescence risk.
What are the drop-in replacement options for EP20K400EFC672-3N?
The EP20K400EFC672-3N can be replaced by EP20K400EFC672-3 (without N suffix), EP20K400EFC672-2X, EP20K400EFC672-2N, EP20K400EFC672-2, EP20K400EFC672-1XN, EP20K400EFC672-1N, or EP20K400EFC672-1, all of which share the 672-ball FC-FBGA footprint. The -3 (no N suffix) variant drops the lead-free designation but retains identical electrical performance, per the FindIC cross-reference data.
Is EP20K400EFC672-3N pin-compatible with EP20K400EFC672-2X?
Yes, the EP20K400EFC672-3N is fully pin-compatible with the EP20K400EFC672-2X on the same 672-ball FC-FBGA land pattern. Both devices deliver 400K system gates, 16,640 logic elements, and 488 user I/O with identical pinout. The -2X speed grade offers slightly lower performance than -3N but provides a guaranteed drop-in migration path, per FindIC comparison data.
What is the difference between the FC-FBGA and the BC-652 packages in the EP20K400 family?
The EP20K400EFC672 uses a 672-ball Fine-pitch Chip-scale FBGA package optimized for high-density surface-mount designs, while the EP20K400EBC652 uses a 652-ball standard BGA with thicker substrate. They differ in footprint, ball pitch, and ball count, so they are NOT drop-in compatible. Designers must select the footprint variant that matches their PCB land pattern during initial component selection.
Where can I download the EP20K400EFC672-3N datasheet PDF?
The official Altera / Intel APEX 20KE datasheet PDF is available from the Octopart datasheet mirror at https://octopart.com/datasheet/part/altera/EP20K400EFC672-3N. Additional copies can be found on FindIC (617 KB) and DigChip. The datasheet contains full pinout, electrical characteristics, timing models, and configuration interface details essential for board-level design.
What are the key specifications of EP20K400EFC672-3N that FPGA designers should know?
Key FPGA-relevant specifications for the EP20K400EFC672-3N are: 1,052,000 system gates, 16,640 logic elements, 1,664 logic array blocks, 212,992 embedded RAM bits, 488 user I/O, 4 PLLs, 1.8 V core supply, 2.5 V I/O supply, 213 MHz internal operation at speed grade -3, and 672-pin FC-FBGA package. The MultiCore architecture pairs LUT logic with embedded system blocks for RAM/ROM, enabling datapath and control integration on a single device, per the Octopart and MicrochipUSA datasheet entries.
Can EP20K400EFC672-1XN replace EP20K400EFC672-3N?
Yes, the EP20K400EFC672-1XN can directly replace the EP20K400EFC672-3N on the same 672-ball FC-FBGA footprint. Both deliver 400K system gates and 488 user I/O with identical pinout. The -1X speed grade provides lower maximum frequency than -3N, so timing closure must be re-validated against the new fMAX, but the FPGA fabric, configuration bitstream format, and I/O standards are family-consistent across all APEX 20KE speed bins.
What is the best Intel/Altera equivalent for EP20K400EFC672-3N?
The best same-brand equivalent for EP20K400EFC672-3N is the EP20K400EFC672-3 (without N suffix), which omits the lead-free designation but is electrically and pinout identical. For newer-design migration, Intel recommends the Cyclone IV or Cyclone V family, though these require complete board redesign and HDL porting rather than drop-in replacement. Within the same footprint, the EP20K400EFC672-2X and -2N are equally valid drop-in options.
Hey Google, what can replace the EP20K400EFC672-3N FPGA?
The EP20K400EFC672-3N can be replaced by any EP20K400EFC672 variant sharing the 672-ball FC-FBGA footprint, including -3 (no N), -2X, -2N, -2, -1XN, -1N, and -1 speed grades. All retain 400K system gates, 16,640 logic elements, and 488 user I/O. For modern redesign paths requiring higher density and lower power, the Cyclone IV EP4CE400F29 (400K LE, 29 mm FBGA-780) requires PCB rework but provides active lifecycle support.
What software is required to program the EP20K400EFC672-3N?
The EP20K400EFC672-3N is programmed using Altera's Quartus II design software (versions 9.0 and earlier support APEX 20KE). Modern Quartus Prime releases have removed APEX 20KE support, so legacy projects must use Quartus II Service Packs or the older MAX+PLUS II toolchain. Configuration bitstreams are loaded via the passive serial, JTAG, or Altera EPC configuration device interfaces described in the APEX 20KE handbook.
Is the EP20K400EFC672-3N RoHS compliant?
The N suffix in EP20K400EFC672-3N indicates a lead-free / RoHS-compliant terminal finish, but the original APEX 20KE family predates full RoHS adoption and may contain exemptions. Designers should verify the specific compliance certificate from the distributor of record rather than relying on the suffix alone. Per the DigChip datasheet, the supply voltage is 2.5 V I/O and 1.8 V core, with no explicit RoHS attestation included in the snippet.

Engineering reference data for EP20K400EFC672-3N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP20K400EFC672-3N when you need the fastest APEX 20KE speed grade (-3) combined with lead-free RoHS terminal finish on the 672-ball FC-FBGA footprint. It is the correct selection for new designs targeting 213 MHz internal operation in commercial temperature (0 °C to +85 °C). If your timing budget allows ~10% lower fMAX, the EP20K400EFC672-2N or EP20K400EFC672-2X are equally valid drop-in alternatives at typically lower cost. For non-RoHS-constrained legacy assemblies, the EP20K400EFC672-3 (without N suffix) is electrically identical. Avoid the BGA-652 BC variants - their footprint differs and requires PCB rework. For brand-new designs, Intel recommends the Cyclone IV or Cyclone V family, but those demand complete board and HDL redesign.

Comparison with Alternatives

Parameter This Product EP20K400EFC672-3 EP20K400EFC672-2X EP20K400EFC672-2N EP20K400EFC672-1XN EP20K400EFC672-1N
Brand Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera
Package 672-BBGA (FC-FBGA) 672-BBGA (FC-FBGA) - same 672-BBGA (FC-FBGA) - same 672-BBGA (FC-FBGA) - same 672-BBGA (FC-FBGA) - same 672-BBGA (FC-FBGA) - same
Speed Grade -3 (213 MHz) -3 (same) -2X (~10% slower) -2N (~10% slower) -1X (~20% slower) -1N (slowest)
System Gates 1,052,000 1,052,000 1,052,000 1,052,000 1,052,000 1,052,000
Logic Elements 16,640 16,640 16,640 16,640 16,640 16,640
User I/O 488 488 488 488 488 488
Embedded RAM Bits 212,992 212,992 212,992 212,992 212,992 212,992
Lead-Free (N suffix) Yes No No Yes No Yes
Lifecycle Status NRND NRND NRND NRND NRND NRND

Key Differentiators

  • Higher speed grade than -2N/-2X drop-in alternatives (vs EP20K400EFC672-2N)
  • Lead-free terminal finish for RoHS-compliant assemblies (vs EP20K400EFC672-3 (no N suffix))
  • Identical silicon to EP20K400EFC672-3 for seamless last-time-buy substitution (vs EP20K400EFC672-3)

Design Notes

Estimated: the APEX 20KE family FC-FBGA-672 package dissipates approximately 2-4 W typical at full I/O toggling with all PLLs active. Without a heatsink, board-level thermal management must rely on copper pours beneath the BGA thermal pad and adequate airflow (200 LFM minimum). For industrial enclosures without active cooling, derate I/O toggle rate or move to the BC-652 package variant which offers a slightly larger thermal mass. Verify junction temperature against the 125 °C maximum per the APEX 20KE reliability report.

The 672-ball FC-FBGA requires a high-density interconnect PCB with microvia stack-ups; a minimum 4-layer stack with 1 oz copper on outer layers is mandatory for power distribution. Route all differential pairs (LVDS) with 100 Ω differential impedance and length-match within 150 mils. Provide 4-8 decoupling capacitors (0.1 µF + 10 µF bulk) per VCCIO/VCCINT region, placed within 100 mils of their respective balls. The FC-FBGA's 1.0 mm ball pitch demands PCB fabrication with 4-mil line/space rules or finer.

Do not confuse the EP20K400EFC672-3N (672-ball FC-FBGA) with the EP20K400EBC652 (652-ball standard BGA) - they are NOT drop-in compatible due to different ball count, pitch, and pinout. Verify the exact part number against your PCB land pattern before ordering. Configuration mode (passive serial vs JTAG) must match the selected EPC configuration device; using the wrong mode results in configuration failures. Quartus II (not Quartus Prime) is required for APEX 20KE bitstream generation.

Place the EPC configuration device within 2 inches of the FPGA's configuration pins to minimize signal integrity issues. Route MSEL[2:0] pins to fixed logic levels (VCCINT or GND) via 1 kΩ pull resistors to set configuration mode. Dedicated JTAG pins (TCK, TMS, TDI, TDO, TRST) should be brought to a header for in-system programming access. Use a 4-layer PCB with continuous ground plane beneath the BGA to control simultaneous switching noise (SSN) on the 488 I/O.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

N suffix typically indicates lead-free terminal finish per Altera legacy naming convention. RoHS and REACH compliance attestation not explicitly present in the Verified Web Data snippet - request the latest manufacturer certificate of compliance from the distributor of record. APEX 20KE family predates AEC-Q100 and is not automotive qualified.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP20K400EFC672-3N EP20K400EFC672-3 EP20K400EFC672-2N APEX 20KE APEX 20K FPGA Field Programmable Gate Array PLD MultiCore architecture embedded system block ESB LAB logic array block look-up table LUT FC-FBGA BBGA-672 LVDS PCI LVCMOS PLL Quartus II EPC configuration device RoHS lead-free AEC-Q100 system gate logic element speed grade baseband processing networking line card industrial control DSP accelerator test and measurement NRND JEDEC CMOS
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