EP20K400EFC672-1XN - APEX 20KE FPGA, 400K Gates, 672-BGA | Intel
MPN: EP20K400EFC672-1XN ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 250 | $230 | $57,500.00 |
| 500 | $215 | $107,500.00 |
EP20K400EFC672-1XN Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable integrated circuit composed of an array of configurable logic blocks (CLBs), programmable routing, and embedded memory and DSP resources. FPGAs sit within the broader semiconductor hierarchy as programmable logic devices (PLDs) between fixed-function ASICs and software-defined processors. They are widely used for parallel data processing, custom I/O interfaces, and hardware acceleration in applications requiring deterministic latency or high I/O bandwidth. The APEX-20KE family extends the APEX 20K architecture with enhanced embedded memory and MultiVolt support, making it suitable for bridging multiple logic interfaces on a single board.
Key features of the EP20K400EFC672-1XN include 1,664 logic array blocks (LABs), 488 user I/O pins, 4 embedded PLL (phase-locked loop) blocks for clock management, and ESB (Embedded System Block) memory supporting dual-port RAM, ROM, and FIFO configurations. The device supports up to four configuration modes, including passive serial, passive parallel, and JTAG, enabling flexible in-system programming via IEEE 1149.1 boundary scan.
Architecturally, the EP20K400EFC672-1XN combines look-up table (LUT)-based logic with dedicated carry chains, embedded multiplier blocks (in the 'E' series), and an enhanced interconnect fabric. The high gate count combined with 488 user I/Os makes it suitable for data-path-intensive designs that require a large number of external interfaces and parallel processing paths.
Typical applications include telecom backplane bridging, high-speed serial protocol bridging, industrial control systems, custom DSP preprocessing, and ASIC prototyping. The wide I/O count supports legacy parallel bus standards such as PCI, and the embedded PLLs enable multiple clock-domain synthesis for SoC prototyping.
When designing with this device, ensure that the 672-ball BGA fan-out is achievable on the target PCB stack-up; high-density BGAs typically require at least 6 PCB layers with microvia technology for reliable assembly. The Quartus design suite provides pre-built IP cores including DDRx controllers and PLL macros.
This page consolidates distributor stock levels, parametric cross-references, drop-in alternative candidates, and design considerations that complement the manufacturer datasheet for the EP20K400EFC672-1XN.
Drop-in alternatives for EP20K400EFC672-1XN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400EFC672-1XN (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Family, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400EFC672-1N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP20K400EFC672-1
✅ Drop-In✓ In Stock
$110 / Unit
View Datasheet →EP20K400EBC652-3N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP20K400EFC672-1XN Maximum Ratings & Electrical Characteristics
| Series | APEX-20KE |
| Family | APEX 20K |
| Logic Elements / Cells | 16,640 |
| Logic Array Blocks (LABs) | 1,664 |
| System Gates | 400,000 |
| Total RAM Bits | 212,992 |
| User I/O | 488 |
| Supply Voltage - Core | 1.8 V |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Embedded PLLs | 4 |
| Process Technology | 0.18 µm CMOS |
| Package | 672-BBGA (FC-FBGA, FineLine BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial / Other (per MPN suffix) |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG (IEEE 1149.1) |
EP20K400EFC672-1XN 672-bbga (fc-fbga, fineline bga) Pin Configuration Guide
Pin configuration for EP20K400EFC672-1XN (672-bbga (fc-fbga, fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400EFC672-1XN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400EFC672-1XN is suitable for 6 applications: Telecom Backplane Bridging, ASIC Prototyping, Industrial Control Systems, Custom DSP Pre-Processing, Legacy Parallel Bus Bridging (PCI / VME / PMC), Aerospace & Defense Interface Consolidation.
Telecom Backplane Bridging
The EP20K400EFC672-1XN's 488 user I/O pins and 16,640 logic elements make it well suited for telecom backplane bridging applications that aggregate multiple serial or parallel links. The device's MultiVolt I/O supports 1.5 V / 1.8 V / 2.5 V / 3.3 V logic levels, allowing direct interface to legacy bus standards without external level shifters. Four embedded PLLs provide multiple clock-domain synthesis for converting between STS-1/STS-3, TDM, or proprietary backplane rates. The 212,992 bits of embedded RAM enable large LUT-based crossbar switches, while the 400K-gate capacity supports custom protocol adaptation logic. Engineers typically instantiate the device as a glue layer between line cards and a central ASIC.
Recommended
ASIC Prototyping
The EP20K400EFC672-1XN serves as a credible ASIC prototype platform for designs up to 400K system gates. With 16,640 logic elements distributed across 1,664 LABs, designers can map large RTL blocks one-to-one before taping out, simplifying verification and timing closure. The 212,992 bits of embedded RAM model SRAMs and FIFOs common in ASIC designs, and JTAG-based configuration via IEEE 1149.1 allows rapid in-system reprogramming during bring-up. Quartus synthesis and place-and-route produce timing reports directly comparable to ASIC static-timing analysis, accelerating sign-off. The 672-BGA package also supports breakout boards that expose all 488 I/Os for prototype benchmarking.
Recommended
Industrial Control Systems
In industrial control systems, the EP20K400EFC672-1XN 'XN' suffix indicates an industrial/extended temperature grade capable of operating from -40 °C to +85 °C. The high I/O count enables direct connection to multiple parallel sensor buses, motor-driver PWM lines, and encoder feedback channels, while the four embedded PLLs synthesize the various motor-control and fieldbus clocks required in factory automation. The 1.8 V core, combined with MultiVolt I/O, simplifies integration with both legacy 5 V-tolerant logic and modern 1.8 V SoCs. Industrial applications typically pair the FPGA with optocoupled I/O isolators and watchdog supervisors, leveraging the deterministic response of the APEX-20KE fabric.
Recommended
Custom DSP Pre-Processing
The EP20K400EFC672-1XN's embedded system blocks (ESBs) can be configured as multipliers and dual-port RAMs that accelerate DSP preprocessing pipelines. With 212,992 bits of memory and dedicated carry chains across 1,664 LABs, the device supports FIR filters, FFT pre/post-processing, and adaptive noise-cancellation kernels running at hundreds of MHz. The four PLLs allow independent clocking of input sampling, processing, and output stages. The 488 I/Os permit direct connection to high-speed ADCs and DACs without an intermediate bridge ASIC. Quartus provides DSP Builder integration for model-based DSP design entry.
Recommended
Legacy Parallel Bus Bridging (PCI / VME / PMC)
The EP20K400EFC672-1XN supports bridging legacy parallel bus standards such as PCI, VME, and PMC through its 488 user I/Os and MultiVolt I/O standards. The APEX-20KE fabric implements bus arbitration, parity, and interrupt logic with deterministic timing, while the embedded PLLs generate the bus clocks required by these legacy standards. The 400K-gate capacity allows the device to act as both bus master and target simultaneously, replacing multiple discrete bridge ASICs. Designers use the 672-BGA package on PCI mezzanine cards to retain legacy backplane compatibility while adding modern peripheral interfaces.
Recommended
Aerospace & Defense Interface Consolidation
The EP20K400EFC672-1XN's NRND status and high I/O count make it valuable for sustaining aerospace and defense platforms where PCB redesign is undesirable. The device consolidates disparate MIL-STD-1553, ARINC 429, and custom parallel interfaces onto a single FPGA, reducing component count and improving reliability. Industrial/extended temperature variants handle the demanding environmental conditions of avionics and ground-vehicle systems. The JTAG-based configuration supports secure bitstream loading and built-in test, while the 400K-gate capacity allows consolidation of multiple interface functions previously implemented in discrete ASICs.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400EFC672-1XN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400EFC672-1N | EP20K400EFC672-1 | EP20K400EBC652-3N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 672-BBGA (FC-FBGA) | 672-BBGA (FC-FBGA) - same | 672-BBGA (FC-FBGA) - same | 652-BBGA - different |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 |
| Total RAM Bits | 212,992 | 212,992 | 212,992 | 212,992 |
| Embedded PLLs | 4 | 4 | 4 | 4 |
| Temperature Grade | Industrial / Extended (XN suffix) | Industrial (N suffix) | Base grade | Industrial (N suffix) |
Key Differentiators
- Highest I/O count in the APEX-20KE 400K family (vs EP20K400EBC652-3N)
- Industrial/extended temperature grade (XN suffix) (vs EP20K400EFC672-1)
- Same silicon, flexible procurement alternative (vs EP20K400EFC672-1N)
Design Notes
Estimated: The 672-ball FC-FBGA package has a ball pitch of 1.0 mm, which typically requires a 6- or 8-layer PCB with microvia (laser-drilled) stack-ups for reliable assembly. Use a balanced stack-up with dedicated ground and power planes adjacent to the BGA, and route signal escapes on the top two layers with microvias to inner layers. The full breakout of 488 I/Os plus supply, ground, JTAG, and configuration pins typically demands the entire footprint, so plan the PCB outline carefully to accommodate all balls.
Estimated: The 1.8 V core supply and 400K-gate logic density produce a thermal envelope that scales with utilization and clock frequency. While the FC-FBGA package provides thermal balls for heat dissipation, designers should target a theta_JA below 15 C/W for industrial-temperature operation. Quartus PowerPlay early power estimator should be run during architecture phase to confirm junction temperature remains within the -40 °C to +85 °C 'XN' envelope at worst-case utilization.
Three common pitfalls when designing with the EP20K400EFC672-1XN: (1) failing to provide sufficient decoupling - the device requires bulk capacitance near each supply ball plus 0.1 µF and 0.01 µF ceramic capacitors for high-frequency decoupling; (2) ignoring configuration mode selection - the MSEL pins must be tied correctly for the chosen configuration scheme (passive serial, passive parallel, or JTAG); (3) assuming NRND parts are obsolete - while Intel recommends migration to Cyclone families, EP20K400EFC672-1XN remains available through authorized distributors for sustaining legacy designs.
Compliance Information
RoHS and lead-free status not explicitly stated in the provided distributor data; verify with Intel ordering information table for the specific 'XN' suffix before procurement.
