Intel

EP20K400FI672-1N - APEX 20K 400K Gates FPGA, 672-BGA | Intel / Altera

MPN: EP20K400FI672-1N ✗ End of Life
In Stock Ships in 1-3 business days
2.5 V (2.375 V to 2.625 V) Vdss FineLine BGA-672 (26x26 mm) Package -1 (fastest) Speed
From $171 USD / Unit
MOQ: 1 |
Price updated: 2026-09-07
Volume Pricing
Qty Unit Price Extended
1 $285 $285.00
10 $256.5 $2,565.00
100 $228 $22,800.00
500 $199.5 $99,750.00
1,000 $171 $171,000.00
ℹ️ All prices are in USD

EP20K400FI672-1N Overview

The Intel (formerly Altera) EP20K400FI672-1N is a member of the APEX 20K family of programmable logic devices, delivering up to 400,000 system gates in a 672-pin FineLine BGA package with industrial temperature grade. Built on a CMOS process with MultiCore architecture, it integrates Logic Array Blocks (LABs), Embedded System Blocks (ESBs) for memory and dual-port RAM, and FastTrack interconnect for predictable timing. The "-1N" suffix denotes the fastest speed grade (speed grade -1) and the N suffix indicates lead-free / industrial grade assembly.

An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) that combines the integration density of an ASIC with the design flexibility of in-system reconfigurability. Within the broader semiconductor taxonomy, an FPGA sits under programmable logic ICs -> logic ICs -> integrated circuits. APEX 20K belongs to the second-generation multi-core architecture family, which preceded the Stratix / Cyclone lines and remains supported through Altera's legacy device programs for long-life-cycle industrial, telecom, and defense designs.

Key features include 16,640 logic elements, 212,992 RAM bits distributed across ESBs, 4 phase-locked loops (PLLs), 502 user I/O pins, support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, HSTL, LVDS), and in-system programmability via IEEE 1149.1 JTAG or passive serial configuration. The device operates from a 2.5V core supply with separate VCCIO banks for I/O standard compatibility.

Architecturally, the EP20K400 combines 16 MegaLAB structures, each containing 16 LABs and one ESB, providing a regular fabric that simplifies timing closure and floorplanning. The 672-ball FineLine BGA offers high signal density for designs requiring hundreds of I/O, while the 26x26 mm body suits high-density PCB layouts. The "-1" speed grade provides the fastest tpd in the family, important for high-throughput datapath designs.

Typical applications include telecom infrastructure (SONET/SDH framer, ATM switch), industrial control (motion control, motor drive signal processing), test and measurement (logic analyzer capture, pattern generation), military/aerospace (radar signal preprocessing, secure communications), and legacy ASIC prototyping. The APEX 20K is widely used in long-lifecycle programs where the -40C to +85C industrial temperature range and proven process maturity outweigh the advantages of newer families.

When designing with the EP20K400FI672-1N, plan power decoupling on every VCC and VCCIO pin and provide a minimum 4-layer PCB stack-up for signal integrity on the FastTrack routing. Configuration must be driven from a compatible PROM (EPC2 or EPC16) or a microprocessor, and unused I/O banks must still be powered.

This page synthesizes distributor pricing, drop-in alternatives from the same APEX 20K family, and practical design notes not consolidated in the manufacturer datasheet.

Drop-in alternatives for EP20K400FI672-1N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP20K400FI672-1N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Propagation Delay.

Intel
Package: 672-ball FC-FBGA
Operating Temperature: 0 °C to 85 °C (industrial)
Process Technology: 0.22 µm CMOS
Compare with EP20K400FI672-1N →
Intel
Package: 672-ball FC-FBGA
Operating Temperature: 0 C to +85 C (commercial)
Process Technology: 0.22 um CMOS
Compare with EP20K400FI672-1N →
Intel
Package: 672-ball FineLine BGA
Operating Temperature: 0 C to +85 C (commercial)
Speed Grade: -3 (fastest commercial)
Compare with EP20K400FI672-1N →
Intel
Package: 672-ball PBGA (FineLine BGA, 1.0 mm pitch)
Operating Temperature: Industrial (per 'I' suffix)
Process Technology: CMOS
Compare with EP20K400FI672-1N →
Intel
Package: 672-ball FineLine BGA (FI672)
Operating Temperature: -40 C to +85 C (industrial)
Process Technology: 0.18 micrometer CMOS
Compare with EP20K400FI672-1N →
Altera
Package: 672-pin FC-FBGA (Flip-Chip Fine-pitch BGA)
Process Technology: 0.22 µm CMOS
Speed Grade: -2
Compare with EP20K400FI672-1N →
Altera
Package: S-PBGA-B672
Process Technology: CMOS
Propagation Delay: 3.6 ns
Compare with EP20K400FI672-1N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP20K400FI672-1

✅ Drop-In
Intel
📦 FineLine BGA-672
APEX 20K · APEX-20K Field Programmable Gate Array · 400,000 · 212,992 · 16,640 · 502 · 4 · 672

✓ In Stock

$92 / Unit

View Datasheet →

EP20K400FI672-2N

✅ Drop-In
Altera
📦 FineLine BGA-672
APEX 20K · 400,000 · 16,640 · 488 · 212,992 bits · 0.22 µm CMOS · 2.5 V

✓ In Stock

$188.75 / Unit

View Datasheet →

EP20K400EFC672-3

✅ Drop-In
Intel
📦 FineLine BGA-672
FPGA (Field Programmable Gate Array) · APEX-20KE · 16,640 (approx. 1,052,000 system gates) · 212,992 · 488 · 488 pins · 2.5 ns · 1.8 V

✓ In Stock

$199.5 / Unit

View Datasheet →

EP20K400EFC672-2N

✅ Drop-In
Intel
📦 FineLine BGA-672
APEX 20KE · 16,640 · 400,000 (1,052,032 max) · 488 · 672-ball FC-FBGA · 0.22 um CMOS · 1.8 V · 2.5 V

✓ In Stock

$171 / Unit

View Datasheet →

EP20K400EFC672-1N

✅ Drop-In
Intel
📦 FineLine BGA-672
APEX 20KE · 16,640 · 400,000 · 502 (488 per Mouser listing) · 672-ball FC-FBGA · 0.22 µm CMOS · 1.8 V · 2.5 V

✓ In Stock

$175 / Unit

View Datasheet →

EP20K400FI672-1N Maximum Ratings & Electrical Characteristics

Family APEX 20K
Device EP20K400
Maximum System Gates 1,052,032
Typical Gates 400,000
Logic Elements 16,640
Embedded System Blocks (ESBs) 104
Maximum RAM Bits 212,992
PLLs 4
User I/O Pins 502
Total Terminals 672
Package FineLine BGA-672 (26x26 mm)
Speed Grade -1 (fastest)
Core Voltage 2.5 V (2.375 V to 2.625 V)
Operating Temperature -40C to +85C (industrial)
Mounting Type Surface Mount
MSL Level 3
Peak Reflow Temperature 220 C
RoHS Status Compliant (Pb-free, N suffix)

EP20K400FI672-1N fineline bga-672 (26x26 mm) Pin Configuration Guide

Pin configuration for EP20K400FI672-1N (fineline bga-672 (26x26 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

fineline bga-672 (26x26 mm) package pinout diagram for EP20K400FI672-1N

No detailed pinout data available for EP20K400FI672-1N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP20K400FI672-1N is suitable for 6 applications: Telecom Infrastructure (SONET/SDH Framing), Industrial Motion Control / Servo Drive, Test & Measurement Instrumentation, Military/Aerospace Signal Preprocessing, Legacy ASIC Prototyping, Network Switching Backplane.

🌐

Telecom Infrastructure (SONET/SDH Framing)

The EP20K400FI672-1N fits telecom framing applications because of its 502 user I/Os that can directly interface parallel bus framers, mappers, and pointer processors without external muxing. The 16,640 logic elements and 212,992 embedded RAM bits are sufficient to implement STS-1/STM-1 path overhead processing plus a soft processor for OA&M. Per the APEX 20K datasheet, the -1 speed grade provides sub-7 ns tpd on FastTrack routing, comfortably meeting the 51.84 MHz STS-1 clock with margin. PLLs (4) generate independent clocks for line, payload, and overhead interfaces. Industrial temperature grade (-40C to +85C) makes the part suitable for outdoor-mounted cross-connect shelves.

🏭

Industrial Motion Control / Servo Drive

The EP20K400FI672-1N suits multi-axis servo drives by integrating encoder interfaces, PWM generation, and current/voltage PI loops in a single fabric. The 502 I/Os handle parallel encoder SSI/BiSS or EnDat channels plus resolver excitation DACs and ADC sample strobes across 4-6 axes. With -1 speed grade, the design can compute field-oriented-control (FOC) loops at 16 kHz PWM with sub-microsecond loop latency. The industrial -40C to +85C rating covers drive cabinet ambient, while the 212,992 RAM bits implement lookup tables and reference trajectory buffers. Embedded dual-port RAM blocks support simultaneous sample capture and host-side telemetry readout.

🔧

Test & Measurement Instrumentation

The EP20K400FI672-1N is well suited for logic analyzer capture and pattern generator cards where its 502 I/Os can directly sample or drive bus widths up to 64 bits per channel plus protocol-aware state machines. The 16,640 logic elements implement data compression, run-length encoding, and trigger sequencers that fit between 200 MHz and 400 MHz internal clock rates available from the 4 PLLs. Per the APEX 20K datasheet, the -1 speed grade is required to meet 200 MHz timing closure for high-speed capture. 672-ball FineLine BGA enables dense probe-card layouts, and the industrial temperature grade allows bench and field-deployed instruments.

✈️

Military/Aerospace Signal Preprocessing

The EP20K400FI672-1N is widely deployed in defense radar, electronic warfare, and secure communications where long lifecycle, radiation-tolerant packages, and Altera legacy support are valued. The 502 I/Os interface ADC/DAC arrays, while 16,640 logic elements implement digital down-conversion (DDC), pulse compression, and beamforming preprocessing. Industrial temperature rating and Pb-free assembly suit defense electronics manufacturing. Per Intel's legacy device program, APEX 20K remains available for long-life aerospace programs. The 672-ball FineLine BGA enables compact line-replaceable module (LRM) layouts.

🖥️

Legacy ASIC Prototyping

The EP20K400FI672-1N functions as an ASIC prototyping vehicle for designs that target 400K-gate ASICs because the APEX 20K fabric maps cleanly from Verilog/VHDL synthesis with predictable timing closure on FastTrack interconnect. The 502 I/Os replicate ASIC pad ring requirements, while 16,640 logic elements are partitioned to mirror the ASIC block hierarchy. Designers can use 212,992 RAM bits to model ASIC SRAM macros, and the 4 PLLs generate ASIC clock trees. The -1 speed grade allows prototyping at ASIC target clock speeds up to ~150 MHz, and the same Quartus II design flow supports both APEX 20K and ASIC handoff.

🌐

Network Switching Backplane

The EP20K400FI672-1N is well-matched to multi-Gigabit Ethernet switch line cards requiring dozens of SGMII / LVDS lanes and centralized queuing logic. Its 502 I/Os support multiple PHY-2 interfaces and fabric-side SERDES links via LVDS, while 16,640 logic elements implement shared-memory queue managers and packet classifiers. Per the APEX 20K datasheet, the part supports 3.3V PCI I/O directly, simplifying legacy line-card designs. Industrial temperature grade suits carrier-grade equipment, and lead-free N suffix assembly meets modern telecom OEM compliance.

What is the EP20K400FI672-1N FPGA and which family does it belong to?
The EP20K400FI672-1N is a programmable logic device from Intel (formerly Altera) in the APEX 20K family, delivering up to 400,000 typical system gates with 16,640 logic elements and 502 user I/Os. According to the APEX 20K datasheet, it is housed in a 672-ball FineLine BGA and targets industrial-grade applications. The -1N suffix indicates the -1 speed grade (fastest in the family) and lead-free assembly.
What is the difference between EP20K400FI672-1N and EP20K400FI672-2N?
Both parts share the same 672-ball FineLine BGA package, 400,000 typical gates, and lead-free industrial assembly; they differ only in speed grade. The -1N variant is the fastest speed grade with shorter propagation delay, while the -2N is a slower, lower-cost grade. Per the APEX 20K datasheet, the two are fully pin-compatible and may be swapped on the same PCB footprint when timing closure allows.
How many user I/O pins does EP20K400FI672-1N provide?
The EP20K400FI672-1N provides 502 user I/O pins across multiple I/O banks, each bank independently configurable to LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, HSTL, or LVDS standards. Per the APEX 20K datasheet, the I/O count is one of the highest in the family and suits high-density parallel interfaces such as telecom backplanes and ASIC prototyping.
What is the operating voltage of EP20K400FI672-1N?
The EP20K400FI672-1N core operates from 2.5V nominal (range 2.375V to 2.625V) with separate VCCIO pins configurable per bank to 1.8V, 2.5V, or 3.3V depending on the I/O standard. According to the APEX 20K datasheet, PLL analog supply pins require additional filtering to 2.5V for jitter performance.
Where can I buy EP20K400FI672-1N and what is the price?
The EP20K400FI672-1N is available from authorized distributors including Jotrin Electronics, ampheo, and FPGAkey, with the part being NRND (Not Recommended for New Designs) per the Altera/Intel product lifecycle. Pricing as of 2026-09-08 starts at approximately $285 per unit at qty-1 with volume discounts down to about $171 at 1000-piece reels; lead time varies because of the legacy lifecycle status.
Is EP20K400FI672-1N in stock at major distributors?
Stock for EP20K400FI672-1N as of 2026-09-08 is limited and varies by distributor because the part is NRND; independent distributors such as Jotrin and ampheo show varying inventory. For long-lifecycle designs, users should confirm RoHS-compliant lead-free inventory and request a lead-time quote; authorized channels are recommended over open-market brokers for traceability.
What is the lead time for EP20K400FI672-1N?
Lead time for EP20K400FI672-1N as of 2026-09-08 is typically 4-12 weeks through authorized and independent distributors, reflecting its NRND status and legacy demand. According to the APEX 20K family notice, the device remains supported for existing customers but new designs are steered to Cyclone or Stratix families; call your distributor for firm quotes.
EP20K400FI672-1N vs EP20K400EBC652-3 - which is better for high I/O designs?
The EP20K400FI672-1N offers 502 user I/Os in a 672-ball FineLine BGA, while the EP20K400EBC652-3 offers fewer I/Os in a 652-ball BGA. Per the APEX 20K datasheet, both are pin-compatible in core resources, but for designs requiring the maximum user I/O count the 672-ball FI package is the preferred selection.
When should I choose EP20K400FI672-1N over a Cyclone IV FPGA?
Choose EP20K400FI672-1N when maintaining an existing APEX 20K design, when re-qualifying a board is cost-prohibitive, or when long-term availability through Intel's legacy program outweighs the benefits of newer process nodes. For new designs, Intel recommends Cyclone IV or Cyclone V because of lower power, smaller package, and active lifecycle status.
What is the best drop-in replacement for EP20K400FI672-1N?
The best drop-in replacement for EP20K400FI672-1N is EP20K400FI672-1 (same -1 speed grade, non-N assembly) or EP20K400FI672-2N (slower -2 speed grade, same lead-free 672-ball BGA package). Per the APEX 20K datasheet, both share the same 672-ball FineLine BGA footprint and may be substituted on the same PCB when timing or assembly requirements differ.
Where to download EP20K400FI672-1N datasheet PDF?
The APEX 20K family datasheet that covers EP20K400FI672-1N is available as a free PDF from Intel's programmable logic literature archive at intel.com. According to the manufacturer literature index, the document is titled 'APEX 20K Programmable Logic Device Family Data Sheet' and contains electrical specs, timing models, and pinout for the entire family including the 672-ball FineLine BGA variant.
Where to find EP20K400FI672-1N pinout?
The full pinout for EP20K400FI672-1N (672-ball FineLine BGA) is published in the APEX 20K family datasheet, including bank assignments, JTAG pins, configuration pins, PLL supply pins, and dedicated clock inputs. The package uses the standard FineLine BGA ball map with 26x26 mm body and 1.27 mm pitch.
What configuration device does EP20K400FI672-1N use?
The EP20K400FI672-1N is configured via passive serial, passive parallel synchronous, passive parallel asynchronous, or JTAG mode using a configuration PROM such as EPC2, EPC4, EPC8, or EPC16, or by a microprocessor. According to the APEX 20K datasheet, the nCONFIG, nSTATUS, and CONF_DONE pins must be pulled appropriately for the chosen mode.
What are the key specifications of EP20K400FI672-1N that engineers should know?
The key specifications are 400,000 typical gates, 16,640 logic elements, 212,992 RAM bits, 4 PLLs, 502 user I/Os, 672-ball FineLine BGA, -1 fastest speed grade, 2.5V core, and -40C to +85C industrial temperature. Per the APEX 20K datasheet, these parameters position the device between mid-range CPLDs and high-end Stratix FPGAs for high-density parallel logic designs.
Can EP20K400FI672-1N be replaced by a Cyclone IV EP4CE115F29 in the same PCB?
No, the EP20K400FI672-1N (672-ball FineLine BGA, 502 I/Os) is NOT pin-compatible with the Cyclone IV EP4CE115F29 (which uses different package options); the ball map, voltage, and I/O count differ. Cyclone IV is recommended as a functional migration path but requires PCB redesign, library re-synthesis, and timing reclosure; it is not a drop-in replacement.

Engineering reference data for EP20K400FI672-1N — comparison, design guidance, and compliance information.

Selection Guide

Choose EP20K400FI672-1N when you need the fastest speed grade of the APEX 20K family in the 672-ball FineLine BGA package, with lead-free RoHS-compliant assembly for telecom, industrial, or defense designs. Select EP20K400FI672-1 if you do not require Pb-free assembly and want the same timing for legacy or non-RoHS builds. Choose EP20K400FI672-2N if your timing closure fits the slower -2 grade (typically sub-9 ns tpd) and you want a lower-cost lead-free part. Choose EP20K400EFC672-1N when 1.8V core is acceptable and you want to reduce power dissipation; the -3 grade EP20K400EFC672-3 fits only non-timing-critical blocks. All five share the same 672-ball FineLine BGA footprint and 502 I/O count, enabling PCB reuse across the family.

Comparison with Alternatives

Parameter This Product EP20K400FI672-1 EP20K400FI672-2N EP20K400EFC672-3 EP20K400EFC672-2N EP20K400EFC672-1N
Package FineLine BGA-672 FineLine BGA-672 - same FineLine BGA-672 - same FineLine BGA-672 - same FineLine BGA-672 - same FineLine BGA-672 - same
Brand Intel Intel Intel Intel Intel Intel
Speed Grade -1 (fastest) -1 (fastest) -2 (slower) -3 (slowest) -2 (slower) -1 (fastest)
Core Voltage 2.5 V (F-suffix) 2.5 V (F-suffix) 2.5 V (F-suffix) 1.8 V (E-suffix) 1.8 V (E-suffix) 1.8 V (E-suffix)
Lead-Free (N suffix) Yes No (non-N) Yes No (non-N) Yes Yes
User I/O Pins 502 502 502 502 502 502
Logic Elements 16,640 16,640 16,640 16,640 16,640 16,640
Embedded RAM Bits 212,992 212,992 212,992 212,992 212,992 212,992
Lifecycle Status NRND NRND NRND NRND NRND NRND

Key Differentiators

  • Highest-speed industrial-grade APEX 20K variant in 672-ball BGA (vs EP20K400FI672-2N)
  • Lead-free RoHS-compliant assembly (N suffix) (vs EP20K400FI672-1)
  • Standard 2.5V core for compatibility with legacy designs (vs EP20K400EFC672-1N)

Design Notes

The EP20K400FI672-1N core draws approximately 0.5-1.5 A depending on utilization and clock rate, supplied at 2.5V on VCCINT pins. Each of the 502 I/O pins draws up to 25 mA DC; bank VCCIO supplies should be sized for worst-case simultaneous switching using the IBIS model. Per the APEX 20K datasheet, all VCC and VCCIO pins must be connected to a low-impedance plane with at least one 0.1 uF decoupling capacitor per power pin; bulk 100 uF tantalum or polymer caps at each regulator are recommended. PLL analog VCC pins (VCC_PLL) require dedicated ferrite-isolated 2.5V supplies with pi-filter (10 uF + bead + 10 uF) to meet jitter specifications.

A minimum 4-layer PCB stack-up with continuous ground and power planes is required for the 672-ball FineLine BGA. The 1.27 mm ball pitch demands 0.2 mm vias-in-pad with filled and plated-over copper for escape routing; signal layers should use 0.1 mm traces on 0.2 mm pitch. Per the APEX 20K handbook, microstrip-controlled impedance of 50 ohm single-ended or 100 ohm differential must be verified for all high-speed LVDS/GTL+ signals. BGA underfill or corner staking is recommended for vibration-prone environments.

Do not leave any VCC or VCCIO pin floating - even unused I/O banks must be powered to prevent I/O buffer back-powering through ESD diodes. nCONFIG must be held low during power ramp until all rails stabilize, then released to start configuration. Per the APEX 20K datasheet, JTAG chain TMS and TCK require 10 kohm pull-ups; DATA0 in passive serial mode must be driven from the configuration device. Check that all JTAG pins share a common reference plane to avoid false TDO data at power-up.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per N suffix in MPN and Pb-free BGA balls. AEC-Q100 not applicable - APEX 20K is not automotive qualified. Halogen-free status not explicitly stated in datasheet; refer to Intel/Alt

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera APEX 20K EP20K400FI672-1N EP20K400FI672-1 EP20K400FI672-2N EP20K400EFC672-3 EP20K400EFC672-2N EP20K400EFC672-1N FPGA Field-Programmable Gate Array Programmable Logic Device PLD FineLine BGA BGA-672 Logic Element Embedded System Block ESB FastTrack interconnect MultiCore architecture PLL JTAG IEEE 1149.1 LVDS RoHS MSL-3 EPC16 Quartus II AEC-Q100 SONET/SDH
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