EP20K400GI655-3X - 16,640-Cell FPGA | Intel | APEX 20K
MPN: EP20K400GI655-3X ✗ End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP20K400GI655-3X Overview
An FPGA is a field-programmable gate array: a semiconductor device containing programmable logic blocks, programmable interconnects, and configurable I/O elements. Unlike a fixed ASIC, an FPGA can be configured after manufacture and reprogrammed during development or in-service. FPGA belongs to programmable logic, which also includes CPLD technology, and is used to implement digital logic, interface bridging, state machines, signal processing, and prototype ASIC functions. The APEX 20K family places this FPGA in Intel's older high-density programmable-logic hierarchy, so architecture, software, and lifecycle support may differ substantially from current FPGA families.
The principal verified characteristics are 16,640 logic elements/cells, 655 terminals, CMOS technology, and a 655-pin SPGA package. A package of this size supports many external connections, but it also requires careful escape routing, controlled-impedance analysis, robust power distribution, and a substantial PCB thermal design. The supplied information also lists 2.5 V and 2.5/3.3 V supply arrangements. This makes power-rail sequencing, decoupling placement, and interface-voltage verification important implementation tasks.
Architecturally, the part should be evaluated as a configurable CMOS logic platform rather than as a conventional processor or memory device. Its programmable fabric can map parallel datapaths, glue logic, communications interfaces, and control functions into one device. Configuration storage, supported design software, security features, I/O standards, and clock resources are not present in the supplied evidence and require datasheet-level verification. Do not infer them from similarly named APEX 20K devices.
Typical applications include telecommunications infrastructure, industrial automation, test and measurement, medical imaging controllers, military and aerospace electronics, and legacy systems requiring pin-compatible FPGA replacements. The 655-terminal package is relevant where a board already has a large SPGA footprint and must retain that physical implementation. It is not suitable for new ultra-compact designs without considering package area, assembly capability, and tool availability.
The key design trade-off is compatibility versus modernization. EP20K400GI655-3X can reduce board-level changes when maintaining an established SPGA655 platform, but legacy architecture and support constraints may make migration more attractive for a new design. Confirm pinout, timing, temperature, configuration method, and package drawings from the manufacturer datasheet before schematic capture. This page synthesizes verified identity, package, logic-density, and power-supply facts with clearly marked gaps where the supplied sources do not support a specification.
Drop-in alternatives for EP20K400GI655-3X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400GI655-3X (same form factor and footprint) — differing in Family, Mounting Type, Process Technology, Operating Temperature, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400GI655-3V
✅ Drop-In✓ In Stock
$142.5 / Unit
View Datasheet →EP20K400GI655-3
✅ Drop-In✓ In Stock
$55 / Unit
View Datasheet →EP20K400GI655-2X
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K400GI655-1X
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →EP20K400GC655-3X
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EP20K400GI655-3X Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array |
| Device Family | APEX 20K |
| Logic Elements/Cells | 16,640 |
| Technology | CMOS |
| Terminal Count | 655 |
| Package Type | SPGA |
| Package Designation | SPGA655 |
| Package Dimensions | 47 mm x 47 mm |
| Power Supply | 2.5 V |
| Power Supply Option | 2.5/3.3 V |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
EP20K400GI655-3X 47 mm x 47 mm Pin Configuration Guide
Pin configuration for EP20K400GI655-3X (47 mm x 47 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400GI655-3X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400GI655-3X is suitable for 6 applications: Legacy Telecommunications Infrastructure, Industrial Automation Controllers, Test and Measurement Equipment, Medical Imaging Controller Legacy Platform, Aerospace and Defense Signal Processing, Legacy Digital Interface Bridge.
Legacy Telecommunications Infrastructure
EP20K400GI655-3X is a candidate for legacy telecommunications infrastructure where an existing board already implements a 655-terminal FPGA footprint. Its verified 16,640 logic cells support substantial digital control, protocol-interface, glue-logic, and data-path functions, while the SPGA655 package preserves the mechanical architecture of an established system. The part is useful when redesigning the PCB would create unacceptable qualification, software, and certification cost. Engineers should verify timing closure, supported I/O standards, configuration method, and power sequencing because the supplied evidence does not expose those limits. The 2.5 V and 2.5/3.3 V supply references make local rail integrity important. For a new telecommunications platform, compare this legacy solution with a smaller, actively supported FPGA before committing to the 47 mm by 47 mm package.
Recommended
Industrial Automation Controllers
EP20K400GI655-3X can support industrial automation controllers that require configurable digital logic, multiple interface paths, and a large existing connector and routing area. The verified 16,640-cell capacity is relevant to state machines, sensor aggregation, motion-control sequencing, and industrial communication bridges. The 655-terminal SPGA655 package can be advantageous for legacy control boards because it preserves the established footprint, but it also creates demanding escape-routing and assembly requirements. Industrial suitability cannot be concluded without an operating-temperature range, reliability qualification, and I/O electrical data. Review the exact manufacturer ordering information, clocking resources, configuration interface, and environmental ratings before prototype release. A modern FPGA should be considered for new controller designs where smaller packages, lower power, and current software support outweigh the value of maintaining the APEX 20K architecture.
Recommended
Test and Measurement Equipment
EP20K400GI655-3X is suited to maintaining or extending test and measurement equipment with an existing 16,640-cell APEX 20K implementation. It can implement instrument control, timing generation, data capture coordination, interface translation, and signal-conditioning control while retaining the original SPGA655 land pattern. That compatibility can shorten a board-repair or lifecycle-extension program because the mechanical and electrical architecture may remain unchanged. The available data does not state the supported I/O standards, maximum clock rate, embedded-memory capacity, or measurement-specific accuracy, so the part should not be selected from logic count alone. Confirm pinout, timing constraints, power distribution, and configuration flow from official documentation. For newly designed instruments, assess whether a current FPGA can reduce board area and power while providing longer tool and supply support.
Recommended
Medical Imaging Controller Legacy Platform
EP20K400GI655-3X may be used to maintain a medical imaging controller whose design is already built around an APEX 20K FPGA. The verified 16,640 logic cells provide a known capacity point for control, image-data routing, timing coordination, and peripheral interfacing, while the 655-terminal package can preserve the existing board implementation. This reduces redesign risk for a mature system but does not by itself establish medical-device compliance, electrical safety, or long-term reliability. The supplied data does not include temperature ratings, radiation or ESD performance, timing specifications, or quality documentation. Medical equipment manufacturers must use the applicable quality system, risk-management process, and validated component documentation. Do not introduce this part into a new medical design without confirming lifecycle, supply, and regulatory requirements with the component owner.
Recommended
Aerospace and Defense Signal Processing
EP20K400GI655-3X is relevant to aerospace and defense signal-processing systems that already use a large APEX 20K FPGA. Its 16,640 logic cells can support configurable datapaths, control logic, communications functions, and test interfaces, while the 655-terminal SPGA655 footprint can maintain an established board design. The package dimension of 47 mm by 47 mm must be considered against vibration, shock, thermal, and connector requirements. The verified web data does not establish radiation tolerance, military temperature grade, hermeticity, controlled-bom status, or reliability level. Those attributes must be confirmed from the manufacturer's applicable product documentation and the system's governing specifications. A redesign may be preferable if the current architecture cannot meet modern lifecycle, security, or supply-chain requirements. Use the part as a legacy maintenance solution unless formal qualification evidence supports broader deployment.
Recommended
Legacy Digital Interface Bridge
EP20K400GI655-3X can implement a configurable digital interface bridge between legacy controllers, memories, converters, and backplanes. The verified 16,640 logic cells provide enough capacity for protocol conversion, clock-domain handling, buffering control, and diagnostic logic, while the 655-terminal package supports a broad physical interface on an existing board. The listed 2.5 V and 2.5/3.3 V supply arrangements require careful power-tree design, decoupling, and voltage-domain verification. The supplied data does not identify supported I/O standards, I/O count, configuration storage, or timing limits, so schematic design must wait for the official datasheet and package drawing. For a new interface bridge, a modern FPGA may offer more package choices and longer support. For a repair or controlled redesign, preserving the SPGA655 footprint can reduce mechanical changes, but every electrical and pin-level claim must be validated before substitution.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400GI655-3X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400GI655-3V | EP20K400GI655-3 | EP20K400GI655-2X | EP20K400GC655-3X |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | SPGA655, 47 x 47 mm | SPGA655, 47 x 47 mm | SPGA655, 47 x 47 mm | SPGA655, 47 x 47 mm | SPGA655, 47 x 47 mm |
| Terminal Count | 655 | 655 | 655 | 655 | 655 |
| Ordering Condition | -3X | -3V | -3 | -2X | -3X |
| Drop-in Verification Status | Target device | Candidate; equivalence not confirmed | Candidate; equivalence not confirmed | Candidate; equivalence not confirmed | Candidate; equivalence not confirmed |
Key Differentiators
- Verified high-density logic capacity (vs EP20K400GI655-3V)
- Large established SPGA655 interface (vs EP20K400GI655-2X)
- CMOS programmable-logic architecture (vs EP20K400GC655-3X)
- Legacy board maintenance suitability (vs EP20K400GI655-3)
Design Notes
Route the SPGA655 footprint as a high-pin-count legacy BGA-style escape rather than as a conventional perimeter package. Confirm the official pin-number orientation and all power, ground, clock, configuration, and no-connect locations from the manufacturer package drawing before layout. Preserve enough through-plane access for power and ground, and verify the selected socket or assembly process supports the 47 mm by 47 mm package. The supplied sources confirm 655 terminals but do not provide a complete pinout, so no pin-level connection should be inferred from the MPN.
The verified listing reports 2.5 V and 2.5/3.3 V power supplies, so generate each required rail from independently controlled regulators only if the final design requires sequencing or fault isolation. Place local bulk and high-frequency decoupling at the associated supply balls according to the official datasheet, while keeping high-current return paths continuous. Estimate power with measured or documented rail current and worst-case toggle activity; actual current and power were not supplied, so junction-temperature calculations are not reliable from the available data.
Do not equate the -3V, -3, -2X, or -GC suffix variants with automatic pin-to-pin or timing equivalence. Similar logic capacity and package descriptions do not prove identical pinout, speed grade, temperature grade, voltage limits, configuration behavior, or reliability. Build a comparison matrix from manufacturer ordering tables, package drawings, and qualification records, then prototype the selected part on the existing board. Confirm programming support and security features as well, because the supplied data does not identify those capabilities.
Treat the 47 mm by 47 mm SPGA655 package as a board-level thermal and mechanical system. Use the manufacturer thermal model and measured worst-case current rather than estimating junction temperature from package area alone. Check the socket, PCB stack-up, copper density, airflow, and adjacent heat sources together. For new designs, compare this large legacy package with a current FPGA using lower power and a smaller footprint; for legacy boards, preserve the mechanical design only after validating assembly and thermal margins.
The 655-terminal package and unspecified I/O architecture require an early signal-integrity review. Identify the supported single-ended and differential standards, maximum frequencies, drive strengths, termination requirements, and clocking resources from the official datasheet before assigning nets. Use controlled impedance for high-speed routes, maintain return-path continuity through the escape region, and reserve test points for configuration and clock verification. The supplied evidence does not provide I/O count, I/O standards, or timing limits, so those values must not be guessed.
Compliance Information
The supplied verified data does not provide compliance declarations for EP20K400GI655-3X. No compliance status is inferred from the distributor listings.
