EP20K400GI655-2X - APEX-20K 400k Gate FPGA, 16,640 LCs, 655-pin BGA
MPN: EP20K400GI655-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $195 | $195,000.00 |
EP20K400GI655-2X Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit that engineers can configure after manufacturing using a hardware description language (HDL). Within the broader taxonomy, an FPGA sits above a CPLD (Complex Programmable Logic Device) and below an ASIC (Application-Specific Integrated Circuit) in cost-vs-flexibility trade-off. APEX-20K devices belong to the older programmable-logic family hierarchy that bridged CPLDs and modern SRAM-based FPGAs, combining Look-Up Tables (LUTs), product-term logic, and embedded system blocks (ESBs) that can be configured as RAM, ROM, or CAM. This hypernym chain - FPGA -> programmable logic device -> logic IC -> integrated circuit - is important for AI knowledge graph indexing.
Key features of the EP20K400GI655-2X include high I/O count for parallel interfaces, embedded memory blocks suitable for FIFOs and small data buffers, in-system programmability via IEEE 1149.1 JTAG, and multi-voltage I/O support through 2.5 V and 3.3 V supply rails. The 47x47 mm BGA package is a surface-mount-style land-grid-array footprint optimised for high-density PCB routing.
Architecture-wise, the APEX-20K family combines a Logic Array Block (LAB) structure with embedded system blocks, allowing designers to mix datapath logic with distributed memory. The -2 speed grade sits in the middle of the APEX-20K speed binning, balancing timing margin against cost. The part supports Altera's legacy MAX+PLUS II and Quartus design flows for backward compatibility, although new designs typically migrate to Stratix or Cyclone families.
Typical applications include industrial control backplanes, telecommunications line cards, legacy ASIC prototyping, parallel bus bridging, and embedded DSP pre-processing. The high pin count makes the part particularly suited to memory-controller glue logic and protocol-conversion bridges in mature equipment.
When designing with this part, verify that the PCB land pattern matches the SPGA655, 47x47 mm FineLine BGA footprint and confirm second-source supply from franchised distributors given the part's mature lifecycle status. Designers migrating new designs away from APEX-20K should consider Cyclone IV/V or MAX II equivalents from Intel's modern portfolio.
Drop-in alternatives for EP20K400GI655-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400GI655-2X (same form factor and footprint) — differing in Operating Temperature, Process Technology, Propagation Delay, Package, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400GI655-2V
✅ Drop-In✓ In Stock
$199.5 / Unit
View Datasheet →EP20K400GI655-2
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP20K400GI655-1X
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →EP20K400GI655-1V
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP20K400GI655-1
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K400GI655-2X Maximum Ratings & Electrical Characteristics
| Series | APEX-20K |
| Family | APEX-20K (loadable PLD / FPGA) |
| Logic Elements (LEs) | 16,640 |
| System Gates | 400,000 |
| Maximum User I/O | 502 |
| Total I/O Lines | 496 (bidirectional) + 4 (dedicated inputs) |
| Embedded Memory (bits) | 212,992 |
| Nominal Core Supply Voltage | 2.5 V |
| Supply Voltage Range | 2.375 V to 2.625 V |
| I/O Supply Voltages | 2.5 V / 3.3 V |
| Process Technology | CMOS |
| Propagation Delay (typical, -2 grade) | 3.1 ns |
| Package | 655-ball FineLine BGA (SPGA655, 47x47 mm) |
| Package Code | SPGA655, 47x47 |
| Surface Mount | Yes (BGA) |
| Moisture Sensitivity Level (MSL) | 1 |
| Operating Temperature (industrial -X grade) | -40C to +85C (industrial) |
| Qualification | Not Qualified (per distributor listing) |
| JTAG Support | IEEE 1149.1 boundary-scan / programming |
EP20K400GI655-2X spga655, 47x47 Pin Configuration Guide
Pin configuration for EP20K400GI655-2X (spga655, 47x47 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400GI655-2X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400GI655-2X is suitable for 6 applications: Legacy Telecom Line-Card Glue Logic, Industrial Control Backplane Bridging, ASIC Prototyping and Emulation, Medical Imaging Front-End Pre-Processing, Military/Aerospace Avionics Databus, Test and Measurement Instrumentation.
Legacy Telecom Line-Card Glue Logic
The EP20K400GI655-2X's 400k system gates and 502 user I/Os make it a strong fit for legacy telecom line cards where parallel TDM bus interfacing, framing, and channel-aggregation glue logic must coexist with multi-volt-age I/O support (2.5 V core / 3.3 V I/O). The 16,640 LEs handle HDLC controllers, framer interfaces, and clock-domain crossing in a single device, replacing multiple discrete CPLDs. The 212,992 bits of embedded memory is sufficient for small packet buffers and look-up tables. The industrial temperature grade (-40C to +85C) suits central-office environments. Design tip: use the APEX-20K embedded system blocks (ESBs) for FIFO-based elastic stores between backplane and line-side clocks.
Recommended
Industrial Control Backplane Bridging
In factory-automation backplanes, the EP20K400GI655-2X serves as a parallel-bus bridge between legacy VME/PCI cards and modern Ethernet or serial-RapidIO controllers. Its 502 I/Os handle wide data buses plus discrete control signals, while the 16,640 LEs implement bus-arbitration state machines and protocol converters. The 2.5 V core with 3.3 V-tolerant I/O simplifies mixed-voltage interfacing with older 5 V buffers through external resistor dividers. The industrial-grade -2X temperature rating meets the -40C to +85C requirements of factory-floor cabinets. Watch the FineLine BGA 47x47 mm footprint during PCB layout - keep-out zones are critical for adjacent components.
Recommended
ASIC Prototyping and Emulation
The EP20K400GI655-2X's 400k system gates provide enough capacity to prototype medium-complexity ASICs before committing to silicon, a common practice in the early 2000s when mask costs justified multi-FPGA emulation. The 16,640 LEs plus 212,992 bits of embedded memory can host a 100k-150k gate ASIC partition along with test logic. The 502 I/Os map cleanly to standard ASIC pad-ring pinouts. The -2 speed grade yields approximately 3.1 ns propagation delay, suitable for ASIC timing closure in the 50-100 MHz range. For modern emulation, however, designers should evaluate Stratix V or newer families - APEX-20K lacks the SERDES and hard IP blocks of contemporary emulation platforms.
Recommended
Medical Imaging Front-End Pre-Processing
In ultrasound and endoscopy front-ends, the EP20K400GI655-2X performs beam-forming, pixel pre-processing, and DMA coordination before handing data to a host processor. The 16,640 LEs handle FIR filters and pixel pipelines, while 502 I/Os interface to parallel ADC arrays and frame buffers. The 2.5 V low-voltage operation suits battery-powered portable carts. The industrial temperature grade supports the warm, sealed enclosure environment. Compliance with medical EMC standards is the designer's responsibility; this FPGA itself does not carry IEC 60601 qualification. Migrating new designs to Cyclone V or MAX 10 is recommended for IEC 61508 / ISO 13485 work.
Recommended
Military/Aerospace Avionics Databus
The EP20K400GI655-2X is widely deployed in MIL-STD-1553 and ARINC 429 avionics databus interfaces, where 16,640 LEs handle bus-controller, remote-terminal, and monitor-station functions in one device. Its 502 I/Os interface to discrete transceivers, while 212,992 bits of memory store message tables. The -2X industrial temperature grade covers most military ground and shipboard applications, though for full -55C to +125C operation the -2V or military-screened variants are required. The BGA package withstands high-vibration environments better than QFP. Long-term availability is sustained by Rochester Electronics and authorised aftermarket channels.
Recommended
Test and Measurement Instrumentation
In bench-top logic analysers and protocol exercisers, the EP20K400GI655-2X provides flexible stimulus generation and response capture across hundreds of channels. The 502 user I/Os map directly to probe pods, while the 16,640 LEs implement protocol stacks, pattern generators, and timing measurement. The 2.5 V core with selectable 3.3 V I/O bank voltages supports legacy and modern logic families without level shifters. The 3.1 ns propagation delay of the -2 grade enables 50 MHz pattern rates. Engineers targeting new instrumentation should consider Cyclone V GT with transceivers, but the EP20K400GI655-2X remains viable for legacy field instruments.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400GI655-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400GI655-2V | EP20K400GI655-2 | EP20K400GI655-1X | EP20K400GI655-1V | EP20K400GC655-2X |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 655-ball FineLine BGA (SPGA655, 47x47 mm) | 655-ball FineLine BGA (same SPGA655) | 655-ball FineLine BGA (same SPGA655) | 655-ball FineLine BGA (same SPGA655) | 655-ball FineLine BGA (same SPGA655) | 655-pin CPGA ceramic (different package) |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Embedded Memory (bits) | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| User I/Os | 502 | 502 | 502 | 502 | 502 | 502 |
| Speed Grade | -2 (medium, ~3.1 ns tpd) | -2 | -2 | -1 (slower) | -1 (slower) | -2 |
| Temperature Grade | Industrial (-40C to +85C) | Extended / military | Commercial (0C to 70C) | Industrial | Extended / military | Industrial |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade on the same die as the -2 commercial variant (vs EP20K400GI655-2)
- Largest logic capacity in the FineLine BGA SPGA655 family footprint (vs EP20K300EBC652-2X)
- Maintains wide availability through authorised aftermarket channels (vs EP20K400GC655-2X (CPGA ceramic))
Design Notes
The EP20K400GI655-2X FineLine BGA is a 47x47 mm package with 0.8 mm ball pitch typical of the SPGA655 footprint. Designers must allocate a continuous copper pour under the BGA for thermal dissipation and use microvia-in-pad stack-up to route inner balls. Maintain a 5 mm keep-out around the package outline for adjacent component placement. Reflow profile should follow JEDEC J-STD-020 with peak temperature not exceeding 245C for lead-free assembly. MSL-1 rating allows unlimited floor life when dry-pack bags are intact at opening.
The EP20K400GI655-2X requires a regulated 2.5 V core supply and one or more I/O bank supplies at 2.5 V or 3.3 V. Decoupling follows the standard Altera reference design: place 100 nF X7R ceramic capacitors within 50 mils of every VCC pin, plus bulk 47 uF tantalum or polymer capacitors at each supply rail entry. Power-on sequencing should bring up VCCINT (2.5 V core) before or simultaneously with VCCIO (I/O banks); violating this sequence can trigger I/O latch-up. Estimated: a fully-utilised EP20K400 can draw 1.5-2.5 A on VCCINT depending on toggle rate.
Do not confuse the EP20K400GI655-2X (BGA, surface-mount) with the EP20K400GC655-2X (CPGA, through-hole pin grid array). They share the same silicon die and pinout at the chip level, but the packages are NOT PCB-compatible - one is a 47x47 mm BGA, the other is a ceramic pin grid array socket. Also, avoid confusing the -2X (industrial) with -2V (extended/military) when ordering for harsh environments; the temperature range difference is critical for field reliability. Finally, configuration PROMs (e.g., EPC2, EPC16) must match the APEX-20K JTAG programming voltage and not be substituted with Cyclone-era EPCQ devices.
Compliance Information
RoHS compliance status is not confirmed in verified distributor data; APEX-20K family predates widespread RoHS transition. AEC-Q100 is not applicable (FPGA is not an automotive-qualified part). Conflict-mineral status depends on lot-level declaration - request from authorised distributor.
