EP20K400GI655-1V - APEX 20K 400K Gate FPGA, 655-pin CBGA | Intel
MPN: EP20K400GI655-1V ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $198 | $19,800.00 |
| 500 | $175 | $87,500.00 |
| 1,000 | $155 | $155,000.00 |
EP20K400GI655-1V Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that designers can program after manufacturing to implement custom digital logic. The APEX 20K family combines FPGA fabric with embedded memory and is part of the broader hierarchy: FPGA -> programmable logic device -> logic IC -> semiconductor. The EP20K400GI655-1V occupies the high-density end of this family, targeting designs that require substantial logic capacity, on-chip memory, and high pin count for parallel interfaces.
Key features of the EP20K400GI655-1V include 16,640 logic elements, embedded array blocks for memory implementation, a MultiCore architecture combining fine-grain logic with coarse-grain storage, support for LVTTL, LVCMOS, PCI, and other I/O standards, and JTAG-based IEEE 1149.1 boundary-scan test. The device also integrates dedicated clock management circuitry and supports configuration schemes including serial, parallel, and JTAG-based programming.
The MultiCore architecture pairs logic elements for combinatorial and sequential functions with embedded system blocks (ESBs) that deliver up to 212 Kbits of RAM per device, suitable for FIFOs, dual-port memory, and content-addressable functions. The architecture allows designers to balance logic density with memory capacity, which is essential in high-performance data-path applications.
Typical applications for the EP20K400GI655-1V include telecommunications infrastructure, custom data processing pipelines, DSP front-end designs, and test and measurement instrumentation. Its 400 K gate capacity and 502 I/O lines suit designs with wide parallel buses and high-throughput interfaces. Legacy industrial control and avionics systems also use APEX 20K devices for their deterministic performance and ceramic package reliability.
When designing with the EP20K400GI655-1V, ensure adequate decoupling for both 2.5 V and 3.3 V supply rails and follow Intel (formerly Altera) APEX 20K reference design guidelines. Note that this device is now NRND/EOL; designers of new products should consult current Intel/Altera or comparable Cyclone and Stratix families for active production.
This page synthesizes distributor pricing, ceramic package details, and same-family drop-in alternatives not found in the manufacturer datasheet, plus application context and design considerations to help engineers evaluate the part for legacy support and replacement scenarios.
Drop-in alternatives for EP20K400GI655-1V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K400GI655-1V (same form factor and footprint) — differing in Mounting Type, Package, Process Technology, Operating Temperature, Propagation Delay.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K400GI655-1
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K400GC655-3V
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →EP20K400GC655-3
✅ Drop-In✓ In Stock
$310 / Unit
View Datasheet →EP20K400GC655-2
✅ Drop-In✓ In Stock
$80 / Unit
View Datasheet →EP20K400GC655-1
✅ Drop-In✓ In Stock
$135 / Unit
View Datasheet →EP20K400GI655-1V Maximum Ratings & Electrical Characteristics
| Family | APEX 20K |
| Typical Gates | 400,000 |
| Logic Elements | 16,640 |
| Maximum User I/O | 502 |
| Dedicated Inputs | 4 |
| Package Type | CBGA-655 (Ceramic Ball Grid Array) |
| Package Code (JESD-30) | S-CPGA-P655 |
| Package Equivalence Code | SPGA655, 47x47 |
| Process Technology | CMOS |
| Propagation Delay | 2.5 ns |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 2.5 V / 3.3 V |
| Configuration | In-system programmable via JTAG |
| Boundary Scan | IEEE 1149.1 JTAG |
| MSL Level | 1 |
| Package Body Material | Ceramic |
EP20K400GI655-1V ceramic Pin Configuration Guide
Pin configuration for EP20K400GI655-1V (ceramic package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K400GI655-1V.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K400GI655-1V is suitable for 6 applications: Telecommunications Infrastructure, DSP Front-End Signal Processing, Custom Data Processing Pipelines, Test and Measurement Instrumentation, Legacy Industrial Control Systems, Aerospace and Military Avionics.
Telecommunications Infrastructure
The EP20K400GI655-1V fits telecommunications backplane designs that require 400K gates of logic combined with 502 user I/O pins for wide parallel buses, multi-channel SERDES interfacing, and protocol bridging. Its 2.5 ns propagation delay supports line-rate processing at typical telecom clock domains (up to ~155 MHz internally), while embedded system blocks (ESBs) implement FIFOs and channelized buffers without external memory. The 2.5 V/3.3 V I/O compatibility interfaces directly to legacy bus transceivers and ATM/SONET framer ASICs. Ceramic CBGA packaging ensures operation across extended temperature ranges typical of outdoor telecom cabinets. Designers should use Quartus II with the APEX 20K device library and follow Intel/Altera reference designs for clock tree distribution.
Recommended
DSP Front-End Signal Processing
The EP20K400GI655-1V's MultiCore architecture combining logic elements with embedded system blocks makes it suitable for DSP front-end tasks such as FIR filtering, FFT preprocessing, and digital downconversion. The 16,640 logic elements and 212 Kbits of embedded RAM allow parallel multiplier-accumulator arrays and coefficient storage on-chip, reducing external memory accesses. The 502 I/O pins accept wide ADC/DAC buses (16 to 20 bits parallel) at sample rates up to ~80 MHz when paired with appropriate I/O standard selection. Designers can implement systolic FIR arrays or polyphase filterbanks efficiently using APEX 20K DSP reference designs. Pin-to-pin compatibility within the CBGA-655 family enables rapid speed-grade binning during design verification.
Recommended
Custom Data Processing Pipelines
The EP20K400GI655-1V enables custom data pipelines requiring 400K gates of configurable logic, 502 I/O for wide data paths, and on-chip memory for packet buffering or scratchpad storage. Its embedded system blocks deliver dual-port RAM and FIFO functions at full fabric speed, supporting pipelined processing stages operating at clock rates up to ~155 MHz. Applications include protocol converters, image preprocessing, and high-speed sorting networks. The 2.5 V core and 2.5/3.3 V I/O compatibility ensures straightforward interfacing to standard CMOS logic families and PCI bus transceivers. The ceramic CBGA package supports industrial and military temperature grades for harsh-environment deployment. Designers should plan PCB layout with proper power plane segmentation for the dual-supply requirement.
Recommended
Test and Measurement Instrumentation
The EP20K400GI655-1V suits test and measurement equipment where parallel pattern generation, custom trigger logic, and protocol-aware timing analysis are required. Its 502 I/O pins accept wide data buses from logic analyzers, pattern generators, and ADC front-ends, while the 16,640 logic elements implement state machines and pattern-matching engines. The 2.5 ns propagation delay enables timing resolution suitable for high-speed serial protocol analysis (PCI, LVDS, custom). Embedded system blocks store captured waveforms and reference patterns on-chip. The JTAG boundary-scan support simplifies board-level test integration per IEEE 1149.1. Ceramic packaging ensures measurement repeatability across temperature, important for laboratory and production-line ATE deployments.
Recommended
Legacy Industrial Control Systems
The EP20K400GI655-1V is found in long-lifecycle industrial control systems where design qualification, certification, and field deployment span decades. Its 400K gate capacity handles complex state machines, motion control algorithms, and safety-logic subsystems, while 502 I/O pins connect to multi-axis servo drivers, sensor arrays, and HMI interfaces. The ceramic CBGA package provides reliability required for factory automation, mining equipment, and outdoor industrial installations. In-system programmability via JTAG allows field firmware updates without board removal. Given Last Time Buy status, designers maintaining such systems should plan migration to current Intel Cyclone IV/10 LP or consult FPGA brokers for guaranteed multi-year inventory. APEX 20K tool support continues in legacy Quartus II versions.
Recommended
Aerospace and Military Avionics
The EP20K400GI655-1V in ceramic CBGA packaging targets aerospace and military avionics applications requiring wide operating temperature ranges, radiation tolerance considerations, and long-term reliability. The 502 I/O pins support MIL-STD-1553, ARINC 429, and custom avionics bus interfaces, while the 16,640 logic elements implement flight control logic, sensor fusion, and display drive. Embedded system blocks provide deterministic on-chip memory for redundant processing paths. The ceramic package and metal-sealed construction meet hermeticity requirements for airborne and naval deployment. Designers should consult Intel/Altera military-grade documentation and DO-254 certification guidance for safety-critical applications. Migration to radiation-hardened FPGAs (Microsemi, Xilinx) may be required for space-grade deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP20K400GI655-1V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K400GI655-1 | EP20K400GC655-3V | EP20K400GC655-3 | EP20K400GC655-2 | EP20K400GC655-1 |
|---|---|---|---|---|---|---|
| Package | CBGA-655 (47x47 mm) | CBGA-655 - same | CBGA-655 - same | CBGA-655 - same | CBGA-655 - same | CBGA-655 - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Speed Grade | -1V | -1 | -3V (slower) | -3 (slower) | -2 (mid) | -1 |
| Maximum User I/O | 502 | 502 | 502 | 502 | 502 | 502 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| I/O Voltage | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Faster speed grade within APEX 20K 400K CBGA-655 family (vs EP20K400GC655-3V)
- Ceramic CBGA package for harsh-environment reliability (vs EP4CE115F29C7N (Cyclone IV, plastic BGA))
- High I/O count at 502 pins for parallel-bus architectures (vs Smaller APEX 20K members (e.g. EP20K200))
Design Notes
The EP20K400GI655-1V requires dual supply rails: a 2.5 V core and 2.5/3.3 V I/O. Use separate power planes for each domain with decoupling placed adjacent to every VCC pin group. Bulk decoupling of 100 uF per supply plus 0.1 uF and 0.01 uF ceramic capacitors near each VCC pin is recommended per Altera APEX 20K reference designs. Estimated: total quiescent current at full fabric utilization can reach 1.5-2 A on VCCINT; size the regulator with at least 30% margin.
The CBGA-655 ceramic package provides excellent thermal conductivity but junction temperature must still be managed. Estimated: at full utilization with 500 mA core current, dissipation reaches 1.25 W; with theta_JA around 15-20 C/W for ceramic CBGA, junction rise is ~25 C above ambient. Forced airflow is recommended for high-utilization designs. Monitor junction temperature using the on-chip temperature-sensing diode with the dedicated JTAG instruction set.
The 47x47 mm CBGA-655 package requires a 4-layer or higher PCB stackup with controlled-impedance routing for high-speed signals. Maintain 50 ohm single-ended and 100 ohm differential impedance per Altera reference designs. Use microvia technology where available to route inner-ball signals; the 1.27 mm ball pitch allows escape routing on outer two layers. Power plane islands under the BGA should be solid to provide low-inductance return paths and adequate thermal dissipation.
Do not substitute APEX 20K 400K parts with APEX 20K 200K (EP20K200...) or 100K (EP20K100...) variants even if pinout appears similar - logic capacity and I/O count differ significantly and the configuration bitstream is device-specific. Always verify the device ID via JTAG IDCODE instruction before configuration. Using the wrong bitstream can damage the device or cause unpredictable behavior. Use the Quartus II Assembler output specifically targeted to the EP20K400 device.
Compliance Information
Ceramic CBGA packages historically were not RoHS-compliant due to lead-based ceramic and ball metallurgy; verify with manufacturer documentation before specifying in RoHS systems. Compliance status not present in verified web data - marked unknown.
