EP20K600CB652C7N - 600K Gates APEX 20KC FPGA, 652-BGA | Intel
MPN: EP20K600CB652C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $332 | $166,000.00 |
| 1,000 | $305 | $305,000.00 |
EP20K600CB652C7N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic fabric and routing can be configured by the customer after manufacture, enabling hardware re-programmability for prototyping, design iteration, and low-to-medium volume production. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. The APEX 20KC family extends the APEX 20K architecture, and APEX itself belongs to the larger class of complex programmable logic devices (CPLDs) used in lieu of fixed-function ASICs when time-to-market and design flexibility outweigh per-unit silicon cost.
Key features of the EP20K600CB652C7N include 24,320 logic elements (LEs), 311,296 embedded memory bits, 488 maximum user I/Os, an internal operating frequency up to 375.94 MHz, and 0.15 um all-layer copper-metal fabrication. The 1.8 V core supply is paired with multi-voltage I/O standards supported by the APEX 20K I/O structure. The device also integrates PLLs for clock management and supports in-system configuration via passive serial, passive parallel, and JTAG modes.
The architecture combines LUT-based logic elements with embedded memory blocks (Embedded System Blocks, ESBs) on a MultiCore interconnect. The 0.15 um copper process yields roughly 35 percent faster design performance than the prior APEX 20KE generation, while the MultiCore fabric improves utilization for wide datapath designs. Eight PLLs are distributed across the device to support skew-managed clock trees.
Typical applications include high-speed telecom line cards, ASIC prototyping and emulation, broadband aggregation, industrial control, test and measurement backplanes, and digital signal processing glue logic where gate counts exceed what a CPLD can absorb.
Design considerations include careful thermal management under sustained switching activity, multi-voltage I/O bank planning for mixed logic domains, and supply decoupling at every core pin pair because the 1.8 V rail is sensitive to IR drop during simultaneous switching.
This page synthesizes distributor pricing, a curated drop-in alternatives list drawn from the APEX 20K/20KC family, and design guidance that the manufacturer datasheet does not present in a single consolidated view.
Drop-in alternatives for EP20K600CB652C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600CB652C7N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Device Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600CB652C7
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP20K600CB652C7ES
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K600CB652C7E5
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP20K600CB652C-8
✅ Drop-In✓ In Stock
$86 / Unit
View Datasheet →EP20K600CB652C9N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$128 / Unit
View Datasheet →EP20K600CB652I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$158 / Unit
View Datasheet →EP20K600CB652C7N Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Device Type | SPLD / Loadable PLD (FPGA) |
| System Gates | 600,000 |
| Logic Elements | 24,320 |
| Embedded Memory (bits) | 311,296 |
| Maximum User I/Os | 488 |
| Propagation Delay | 1.48 ns |
| Internal Operating Frequency | 375.94 MHz |
| Process Technology | 0.15 um all-layer copper-metal |
| Core Supply Voltage | 1.8 V |
| Package | 652-ball BGA (PBGA-652, S-PBGA-B652) |
| Package Dimensions | 45 x 45 mm |
| Ball Pitch | 1.27 mm |
| Operating Temperature | 0 C to 85 C |
EP20K600CB652C7N 45 x 45 mm Pin Configuration Guide
Pin configuration for EP20K600CB652C7N (45 x 45 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600CB652C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600CB652C7N is suitable for 6 applications: High-Speed Telecom Line Card Glue Logic, ASIC Prototyping and Emulation, Broadband Aggregation and Routing, Industrial Control and Machine Automation, Test and Measurement Backplanes, Digital Signal Processing Glue Logic.
High-Speed Telecom Line Card Glue Logic
The EP20K600CB652C7N fits telecom line-card glue logic because it delivers 600K system gates, 24,320 logic elements, and 311 Kbits of embedded SRAM in a single device. The 1.48 ns propagation delay in the C7 speed grade enables fabric crossings at multi-hundred-megahertz rates, while 488 user I/Os accommodate wide datapath buses, UTOPIA / POS-PHY interfaces, and multiple S/PDIF or Ethernet ports. Compared with a CPLD, the APEX 20KC supports deeper state machines and on-chip FIFOs without resorting to external SRAM. Compared with an ASIC, it shortens NPI cycles for protocol revisions such as SONET/SDH framing, ATM SAR segmentation, or 10G backplane aggregation. Designers should still validate I/O bank voltages per port because mixing 3.3 V LVTTL with 2.5 V LVCMOS on the same die requires careful bank planning.
Recommended
ASIC Prototyping and Emulation
The EP20K600CB652C7N is well-suited to ASIC prototyping because 600K gates can absorb a moderate-complexity ASIC netlist at 1:1 mapping. The 311 Kbits of embedded memory allow distributed register banks and small FIFO emulation, and 488 I/Os let the FPGA mimic a wide external ASIC pin-out. Quartus II and MAX+PLUS II both support APEX 20KC, and the JTAG configuration mode is compatible with standard emulators such as the ByteBlaster. Designers should map ASIC clock trees to the device's PLLs and budget hold time carefully because routing delays differ between FPGA and ASIC back-end flows. For multi-ASIC prototyping, designers can ganged multiple EP20K600 parts over LVDS interconnects because the I/O structure supports LVDS at up to 840 Mbps.
Recommended
Broadband Aggregation and Routing
Broadband aggregation nodes require packet classification, queuing, and backplane serialization - functions the EP20K600CB652C7N handles with 24,320 logic elements and 488 user I/Os. Designers can implement custom CAM interfaces, IPv4/v6 lookup tables in distributed SRAM, and multi-queue schedulers on a single device. The 1.48 ns delay supports line-rate processing for OC-48 (2.488 Gbps) and slower backplanes; for OC-192 a faster speed grade such as the C9N should be considered. Power estimation is critical: a fully utilized APEX 20KC at 1.8 V core with 50 percent toggle rate can dissipate 4 to 6 W, so designers must allocate adequate copper pour under the 45 x 45 mm BGA.
Recommended
Industrial Control and Machine Automation
The APEX 20KC's 24,320 logic elements support multi-axis motion control, deterministic I/O expansion, and protocol bridging (EtherCAT, PROFINET, Modbus) on the EP20K600CB652C7N. The 488 user I/Os accommodate hundreds of encoder inputs, PWM outputs, and isolated GPIO without external muxing. Designers can leverage the embedded SRAM blocks as ping-pong buffers for high-speed ADC capture, and the eight on-chip PLLs synchronize servo loops with sub-nanosecond jitter. For factory-floor deployment, the C7ES or C7E5 temperature variants extend the operating range to -40 C to 100 C or -40 C to 125 C respectively. Industrial designers should still place TVS diodes and common-mode chokes on every external connector because the BGA-652 has limited ESD tolerance.
Recommended
Test and Measurement Backplanes
ATE backplanes benefit from the EP20K600CB652C7N's 488 I/Os and 311 Kbit SRAM for per-pin waveform memory. The 1.48 ns delay lets designers implement deep pattern generators with sub-2 ns edge placement accuracy, while JTAG configuration allows per-test-head reprogramming of the same board. The 1.8 V core requires a low-noise LDO such as a TPS7A4701 to keep ripple below the APEX 20KC's 5 percent VCC tolerance. Designers should use separate analog and digital ground planes because mixing backplane switching transients with sensitive measurement front-ends degrades jitter. Heat dissipation is modest - typically 2 to 3 W at 30 percent utilization - so a 1-square-inch copper pour is sufficient.
Recommended
Digital Signal Processing Glue Logic
The EP20K600CB652C7N serves as DSP glue logic by providing 24,320 LEs for FIR filter banks, FFT butterfly stages, and CRC engines that offload housekeeping tasks from a co-resident DSP or GPP. The 311 Kbits of embedded memory host coefficient tables and ping-pong sample buffers, removing the need for external SRAM in many designs. The 488 I/Os support glueless connection to TI C6000 or Analog Devices SHARC host DSPs through their external memory interface. Designers can target multi-channel pipelines at 100 MHz fabric clock while leaving the DSP core free for algorithm kernels. For multi-DSP systems, use the APEX 20KC's LVDS capability to keep inter-DSP traces short; longer runs require external LVDS buffers.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600CB652C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600CB652C7 | EP20K600CB652C7ES | EP20K600CB652C7E5 | EP20K600CB652C-8 | EP20K600CB652C9N | EP20K600CB652I7N |
|---|---|---|---|---|---|---|---|
| Package | 652-ball BGA (45 x 45 mm, 1.27 mm pitch) | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded SRAM | 311,296 bits | 311,296 bits | 311,296 bits | 311,296 bits | 311,296 bits | 311,296 bits | 311,296 bits |
| Propagation Delay | 1.48 ns | 1.48 ns | 1.48 ns | 1.48 ns | ~1.7 ns (C8 grade) | ~1.2 ns (C9 grade) | ~1.5 ns (I7 grade) |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C | -40 C to 100 C | -40 C to 125 C | 0 C to 85 C | 0 C to 85 C | -40 C to 100 C |
| Lead-Free Finish (N suffix) | Yes | No (SnPb balls) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- RoHS-compliant lead-free BGA finish in the C7N suffix (vs EP20K600CB652C7)
- C7 speed grade is the most widely stocked commercial option (vs EP20K600CB652C9N)
- Commercial 0 C to 85 C range aligns with mainstream industrial designs (vs EP20K600CB652C7ES)
- Drop-in replacement for the legacy APEX 20KE family 652-ball BGA designs (vs EP20K600EBC652-2X (APEX 20KE))
Design Notes
The APEX 20KC core runs at 1.8 V and is sensitive to rail noise. Estimated: at 50 percent toggle rate and 75 percent utilization, ICC_core can reach 2.5 A (about 4.5 W). Use a low-noise LDO such as a TPS7A4701 followed by a 22 uF input bulk and 10 x 10 uF ceramic decoupling caps distributed around the BGA periphery. Keep the 1.8 V plane at least 2 oz copper to limit IR drop on simultaneous-switching events.
The 45 x 45 mm BGA-652 has a theta_JA in the 8 to 12 C/W range with adequate copper pour. Estimated: at 5 W dissipation, junction rises 40 to 60 C above ambient; for a 70 C ambient application the C7N commercial part (rated 85 C) is acceptable, but extended-temperature variants must be used above 70 C ambient. Place thermals vias under the central die-flag balls to spread heat into inner copper planes.
BGA-652 with 1.27 mm pitch requires 0.6 mm pads with NSMD (non-solder mask defined) geometry for reliable assembly. Use a 4+ mil via-in-pad with copper-filled and capped plating for signal balls under the die. Maintain 50 ohm controlled impedance for LVDS pairs and 60 ohm for LVDS bus topologies. Escape routing on the top layer should fan out on a 1.0 mm grid to allow fan-out between balls.
Mixing 5 V tolerant and 3.3 V banks without proper VREF decoupling is the most common failure. The APEX 20KC I/O structure supports 1.8/2.5/3.3 V standards but does NOT tolerate 5 V input on non-5V-tolerant banks - verify each bank voltage in the Quartus pin planner. Also, do not load configuration data from a 3.3 V EEPROM without a level shifter; the configuration pins expect 1.8 V logic levels during multi-device configuration chains.
Synchronous output switching on 488 I/Os can cause SSO-induced ground bounce of 0.3 to 0.5 V. Spread switching outputs across multiple I/O banks, use slew-rate control bits set to 'slow' on non-timing-critical nets, and add 33 ohm series damping resistors on long traces (>50 mm) to the backplane. Ground-bounce measurement should be performed with the device in its actual socket to capture package lead inductance.
Compliance Information
The N suffix indicates lead-free terminal finish. RoHS compliance is inferred from the N suffix and Intel's published RoHS statements for the APEX 20KC family; reach, halogen, and conflict-mineral status were not found in the provided web data and are marked unknown.
