EP20K600CB652C9 - 1.537M Gates APEX 20KC FPGA, 652-BGA | Altera
MPN: EP20K600CB652C9 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $213.75 | $21,375.00 |
| 500 | $171 | $85,500.00 |
| 1,000 | $142.5 | $142,500.00 |
EP20K600CB652C9 Overview
An APEX 20KC device is a programmable logic device (PLD) that combines look-up-table based logic, embedded memory, and PLLs on a single die. It sits in the device taxonomy as: FPGA → programmable logic device → programmable logic IC → semiconductor. The 20KC family extends the APEX 20KE line with 25–35% higher design performance at the same power budget, while remaining pin-compatible with 20KE designs for straightforward migration.
Key features include 2,432 LABs/CLBs, 488 maximum user I/Os, a 1.48 ns propagation delay class, and JTAG-based IEEE 1149.1 boundary-scan support. The MultiCore architecture allows each logic element to be configured as a 4-input LUT, dedicated carry chain, or small memory block, and ESBs can be configured as dual-port RAM, FIFO, or CAM. The BGA-652 package (45 × 45 mm, 1.27 mm pitch) supports high-speed designs by keeping signal lengths short across the device.
The 0.15 µm copper interconnect process improves speed-power trade-offs versus the 0.18 µm process used in APEX 20KE, and the architecture supports clock frequencies up to 250 MHz in internal datapaths. Designers can use Quartus II design software for synthesis, place-and-route, and timing closure. The part is graded commercial (C suffix) with a 0 °C to 85 °C operating range and is now reported as obsolete by several distributors.
Typical applications include high-speed telecom line cards, industrial imaging pipelines, ASIC prototyping, and DSP co-processing in base stations. Engineers select the 20KC family when they need a large logic capacity with embedded memory for buffer queues or register files. The BGA-652 footprint is also useful for high-pin-count designs where QFP packages would force unacceptable trace lengths.
When designing with this device, confirm that the JTAG chain and configuration scheme (e.g., EPC2 configuration device) match your board design, since configuration mode pins are bonded on the BGA and not easily remapped. Because the part is now obsolete, plan a migration to Cyclone or Stratix family devices for new designs.
This page synthesizes APEX 20KC family specs, distributor stock levels, drop-in speed-grade alternatives, and design notes not found in the standalone Altera datasheet.
Drop-in alternatives for EP20K600CB652C9 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600CB652C9 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, Device Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600CB652C8
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EP20K600CB652C8N
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EP20K600CB652C7
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP20K600CB652C7N
✅ Drop-In✓ In Stock
$305 / Unit
View Datasheet →EP20K600CB652C7ES
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K600CB652C-8
✅ Drop-In✓ In Stock
$86 / Unit
View Datasheet →EP20K600CB652C9 Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Logic Elements / Cells | 24,320 |
| Number of LABs / CLBs | 2,432 |
| System Gates | 1,537,000 |
| Total RAM Bits | 311,296 |
| User I/O | 488 |
| Supply Voltage | 1.71 V to 1.89 V |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Internal Datapath Frequency | up to 250 MHz |
| Propagation Delay (typ.) | 1.48 ns |
| Operating Temperature | 0 °C to 85 °C (commercial) |
| Package | 652-BGA (45 × 45 mm, 1.27 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| Configuration | JTAG IEEE 1149.1 / serial / EPC2-compatible |
| RoHS Status | Compliant (per Altera product page) |
| Product Status | Obsolete (per distributor listings) |
EP20K600CB652C9 652-bga (45 × 45 mm, 1.27 mm pitch) Pin Configuration Guide
Pin configuration for EP20K600CB652C9 (652-bga (45 × 45 mm, 1.27 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600CB652C9.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600CB652C9 is suitable for 6 applications: Telecom Line-Card ASIC Prototyping, Industrial Imaging Pipeline, ASIC Emulation Platform, DSP Co-Processor for Base-Station Channel Cards, High-Speed Test and Measurement Backplane, Legacy Network Switch Datapath Engine.
Telecom Line-Card ASIC Prototyping
The EP20K600CB652C9 fits telecom line-card prototyping because it delivers 1.537M system gates plus 311 kbit of embedded RAM, enough to instantiate a full framer/mapper datapath before committing to an ASIC. According to the APEX 20KC datasheet, the 488 I/Os comfortably accommodate 32-bit LVTTL dataplanes, UTOPIA/POS-PHY interfaces, and per-channel status LEDs. Engineers typically run the part at -1 speed bin with internal fMAX ~250 MHz for STS-1/AU-3 overhead processing. Compared with a fixed ASIC, the 20KC's MultiCore architecture lets the same silicon act as different line-card variants by reloading the bitstream via JTAG, shortening development cycles.
Recommended
Industrial Imaging Pipeline
The EP20K600CB652C9's 24,320 logic elements and 488 I/Os suit multi-camera industrial imaging systems that need parallel pixel processing at line rate. The 311 kbit of embedded RAM can buffer one or more raster lines of pixel data, while the 1.48 ns propagation delay supports pipelined Sobel/Hough-style kernels at video clock rates. Per the APEX 20KC datasheet, LVDS I/O pairs (typical for camera-link interfaces) are supported on this device. Designers place the 20KC between Camera-Link receivers and a host CPU, using one ESB per scan line to double-buffer pixel data and prevent FIFO overflow at 40–80 MHz pixel rates.
Recommended
ASIC Emulation Platform
The EP20K600CB652C9 is widely used in multi-FPGGA ASIC emulation because its 1.537M gate capacity lets a single part absorb large logic cones from the RTL. When stacked across multiple 20KC devices on an emulation board, the 488 I/Os serve as high-bandwidth interconnect channels between FPGAs, partitioning cleanly by clock region. Per the Altera APEX 20KC datasheet, the MultiCore architecture preserves netlist-level timing fidelity, making the 20KC a popular emulation vehicle for ARM- and DSP-class designs. Engineering teams use Quartus II with partitioning tools to split the ASIC netlist and balance utilization across the array of EP20K600 devices.
Recommended
DSP Co-Processor for Base-Station Channel Cards
The EP20K600CB652C9 acts as a co-processor in 3G/4G base-station channel cards where a DSP or PowerPC host handles MAC scheduling but offloads forward-error-correction and digital up-conversion to the FPGA. With 24,320 LEs and ~250 MHz internal frequency, the 20KC can sustain Viterbi or turbo decoding for 3GPP channels while leaving headroom for DUC FIR chains. The BGA-652 footprint supports the 32+ bit datapath and clock-tree routing typical in base-station designs. Designers benefit from the APEX 20KC's ESB blocks to implement small lookup tables for log-likelihood ratios without consuming dedicated memory ICs.
Recommended
High-Speed Test and Measurement Backplane
The EP20K600CB652C9 suits high-speed ATE backplanes because the 652-BGA package supports dense LVDS routing between the FPGA and downstream DAC/ADC arrays. The 488 user I/Os handle 16+ bit-wide data buses plus extensive trigger and handshake lines, and the 1.48 ns propagation delay class enables sub-ns comparator edges critical for timing-margin measurements. According to the APEX 20KC datasheet, the device's 0.15 µm copper process delivers the deterministic timing needed for repeatable test patterns. Engineers often pair the 20KC with high-speed ADCs on a single PCB to form a stimulus-and-capture sub-system within the larger ATE rack.
Recommended
Legacy Network Switch Datapath Engine
The EP20K600CB652C9 powers the datapath engine in legacy enterprise switches that require line-rate packet classification, header parsing, and queue management. With 1.537M gates and 311 kbit of embedded RAM, designers implement CAM-assisted longest-prefix-match and small ACL TCAMs on-chip, reducing external memory accesses per packet. The 488 I/Os support multiple 10/100 Ethernet MACs plus SPI/PCI host interfaces to a switch controller. Per the Altera APEX 20KC datasheet, ESB dual-port RAM blocks are used for packet buffer descriptors, freeing logic resources for the actual forwarding pipeline.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600CB652C9 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600CB652C8 | EP20K600CB652C8N | EP20K600CB652C7 | EP20K600CB652C7N | EP20K600CB652C7ES | EP20K600CB652C-8 |
|---|---|---|---|---|---|---|---|
| Package | 652-BGA (45x45) | 652-BGA (45x45) - same | 652-BGA (45x45) - same | 652-BGA (45x45) - same | 652-BGA (45x45) - same | 652-BGA (45x45) - same | 652-BGA (45x45) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Speed Grade | C9 (fastest) | C8 (-1 step) | C8, lead-free | C7 (-2 steps) | C7, lead-free | C7, engineering sample | C-8 (legacy naming) |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| User I/O | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Total RAM Bits | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 |
| Lead-Free / RoHS | RoHS-compliant | RoHS status varies by date code | Lead-free (N suffix) | RoHS status varies by date code | Lead-free (N suffix) | Engineering sample, lead status varies | Legacy, may not be Pb-free |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest available speed grade in APEX 20KC 600K 652-BGA family (vs EP20K600CB652C8)
- Lead-free build option not required at C9 speed grade (vs EP20K600CB652C8N)
- Engineering sample tier available with C7 speed grade (vs EP20K600CB652C7ES)
Design Notes
The APEX 20KC family has been EOL'd by Intel PSG, so confirm long-term supply before designing the EP20K600CB652C9 into any new product. Use the Quartus II toolchain (max 13.0sp1) and lock to a specific Quartus II revision in source control, since later versions dropped APEX 20KC support and existing projects will fail to compile after a tool upgrade.
Route the 652-BGA with 1.27 mm pitch using microvia or 0.2 mm via-in-pad technology on a high-Tg FR-4 stackup. Provide at least four PCB layers dedicated to GND/VCC planes beneath the device to deliver the high-transient current demanded by simultaneous switching of 488 I/Os. Keep all configuration and JTAG traces under 50 mm and add 33 Ω series damping resistors on TMS and TCK if the JTAG chain exceeds 100 mm.
Estimated: at 250 MHz internal frequency with 60% I/O toggle rate, total power consumption is roughly 3–5 W depending on utilization. Provide 0.1 µF decoupling per power pin within 5 mm of each BGA ball, plus bulk 47 µF tantalum or ceramic capacitors on each VCC rail. The 0.15 µm process does not require exotic thermal management for typical utilization, but the BGA's center cavity should receive thermal vias to a copper pour for headroom in high-utilization designs.
Use IBIS models (available from Altera) for SI simulation on LVDS and GTL+ outputs above 100 MHz. Match trace lengths to within ±0.5 mm (±150 ps) on each LVDS pair and to within ±1 mm on parallel source-synchronous buses. The BGA's 1.27 mm pitch keeps breakout short, but outer-layer escapes still require careful via-fanning to avoid crosstalk on adjacent LVDS pairs.
Compliance Information
RoHS compliance per Altera product page; APEX 20KC is a commercial/industrial FPGA, so AEC-Q100 does not apply. Halogen-free status not explicitly listed in available data — marked unknown.
