EP20K600CB652C7 - APEX 20K 600K Gates FPGA | Altera | BGA-652
MPN: EP20K600CB652C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1807.81 | $1,807.81 |
| 10 | $1690 | $16,900.00 |
| 100 | $1550 | $155,000.00 |
| 500 | $1420 | $710,000.00 |
| 1,000 | $1320 | $1,320,000.00 |
EP20K600CB652C7 Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that uses a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells to implement arbitrary digital circuits. FPGAs sit hierarchically under programmable logic, alongside CPLDs, and above fixed-function ASICs in the silicon IP taxonomy. The APEX 20K family specifically pioneered MultiCore™ architecture, embedding both look-up-table logic and dual-port RAM in each logic element, eliminating the need for external memory in many designs.
Key features include 24,320 logic elements, 311,296 embedded RAM bits, 488 user I/Os, and a maximum toggle frequency of approximately 375.94 MHz. The device uses a 1.8V core supply with MultiVolt™ I/O support for interfacing to 1.8V, 2.5V, 3.3V, and 5V systems. The MultiCore™ architecture combines LUT logic with embedded system blocks (ESBs), enabling on-chip implementation of FIFO buffers, CAM, and RAM without consuming general-purpose gates.
The APEX 20K device family delivers 25-35% faster design performance than competing CPLD/FPGA devices of its generation while consuming lower power through high-performance copper interconnect. The 652-ball BGA package is pin-compatible with the APEX 20KE family, giving designers a migration path to higher-density or enhanced-feature parts without PCB redesign. The device is fabricated using an all-layer copper interconnect process for improved speed and reliability.
Typical applications include high-speed digital signal processing, telecom switching fabrics, network routers, video processing pipelines, and ASIC prototyping where 600K system gates of programmable logic are required. The 488 user I/Os make it suitable for memory-rich designs interfacing to external DDR SRAM or SDRAM banks.
When designing with this device, note that the APEX 20K series has been superseded by Stratix and Cyclone families. Existing designs should consider migration to EP20K600CB652C8 or later speed-grade variants only after verifying pin compatibility. The 652-ball BGA requires controlled-impedance PCB stack-up with matched-length traces for the global clock network.
This page synthesizes distributor pricing, datasheet specifications, drop-in alternatives, and practical design notes not found in the original Altera datasheet, providing a comprehensive engineering reference for the EP20K600CB652C7.
Drop-in alternatives for EP20K600CB652C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600CB652C7 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Propagation Delay, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600CB652C7
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP20K600CB652C-8
✅ Drop-In✓ In Stock
$86 / Unit
View Datasheet →EP20K400CB652C7ES
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP20K400CB652C8N
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP20K400CB652C9
✅ Drop-In✓ In Stock
$89.2 / Unit
View Datasheet →EP20K400CB652I7
✅ Drop-In✓ In Stock
$149.5 / Unit
View Datasheet →EP20K400CB652I8N
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EP20K600CB652C7 Maximum Ratings & Electrical Characteristics
| Series | APEX 20K |
| Family | APEX 20KC |
| System Gates | 600,000 |
| Logic Elements | 24,320 |
| Embedded RAM | 311,296 bits |
| User I/O Count | 488 |
| Package | 652-ball BGA |
| Process Technology | 0.15 µm CMOS (all-layer copper interconnect) |
| Core Voltage | 1.8 V |
| I/O Voltage Support | 1.8V / 2.5V / 3.3V / 5V (MultiVolt) |
| Maximum Frequency | 375.94 MHz |
| Architecture | MultiCore (LUT + embedded memory) |
| Operating Temperature | Commercial (0C to +70C) |
| Speed Grade | C7 |
EP20K600CB652C7 652-ball bga Pin Configuration Guide
Pin configuration for EP20K600CB652C7 (652-ball bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600CB652C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600CB652C7 is suitable for 6 applications: Telecom Switching Fabric, ASIC Prototyping Platform, High-Speed DSP Pipeline, Network Router Backplane Interface, Industrial Automation Controller, Video Processing Subsystem.
Telecom Switching Fabric
The EP20K600CB652C7's 600K system gates and 488 user I/Os make it well-suited for telecom switching fabrics requiring high-density parallel data routing. Its MultiCore architecture integrates LUT logic with 311,296 bits of embedded RAM, enabling on-chip packet buffer FIFOs without external memory. At 375.94 MHz maximum frequency, the device handles OC-48/STM-16 line card processing while the 652-ball BGA provides sufficient I/O for 16-bit parallel bus interfaces to network processors and traffic managers.
Recommended
ASIC Prototyping Platform
With 24,320 logic elements and 311K bits of embedded memory, the EP20K600CB652C7 served as an ASIC prototyping vehicle for designs targeting 0.18µm ASIC processes. Its 652-ball BGA and pin-compatible APEX 20KE migration path let design teams validate ASIC RTL before tapeout. The 1.8V core with MultiVolt I/O support for 2.5V, 3.3V, and 5V interfaces enabled direct connection to ASIC-prototype daughter cards using standard logic families.
Recommended
High-Speed DSP Pipeline
The EP20K600CB652C7's 24,320 LEs support multi-channel DSP pipelines for video processing, radar signal processing, and baseband modulation. Its embedded RAM blocks implement coefficient tables, delay lines, and FFT working memory without external SRAM access bottlenecks. The 375.94 MHz toggle rate enables 16-tap FIR filters and complex multipliers at sample rates up to 100 MHz, while 488 user I/Os route parallel data streams to external ADC/DAC converters.
Recommended
Network Router Backplane Interface
The 488 user I/Os of the EP20K600CB652C7 provide sufficient connectivity for network router backplane interfaces with multi-gigabit serial links and parallel bus aggregation. Its 600K-gate capacity implements forwarding engines, queue managers, and protocol translators on a single device. The MultiCore architecture's embedded system blocks implement CAM-based route lookup tables with deterministic access times critical for line-rate packet processing in core router line cards.
Recommended
Industrial Automation Controller
Industrial automation controllers leverage the EP20K600CB652C7's 600K gates to combine motion control, PLC logic, and HMI rendering in one programmable device. The MultiVolt I/O support enables direct connection to 24V industrial sensor inputs via external level shifters, while the 652-ball BGA package provides sufficient I/O for multi-axis servo drive control. The embedded RAM blocks store trajectory tables and process recipes for deterministic real-time control loops in factory automation systems.
Recommended
Video Processing Subsystem
The EP20K600CB652C7's 311K bits of embedded RAM implement line buffers and frame stores for video processing subsystems, eliminating external SRAM in many broadcast and surveillance applications. Its 488 I/Os support parallel ITU-R BT.656 / SMPTE 259M video interfaces and connect to external DDR memory for full-HD frame buffering. At 375.94 MHz, the device handles multi-standard video scaling, de-interlacing, and color space conversion pipelines used in professional video editing equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600CB652C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600CB652C-8 | EP20K400CB652C7 | EP20K400CB652C8N | EP20K400CB652C9 | EP20K400CB652I7 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 652-ball BGA | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same |
| System Gates | 600,000 | 600,000 (same) | 400,000 (-33%) | 400,000 (-33%) | 400,000 (-33%) | 400,000 (-33%) |
| Speed Grade | C7 | C8 (faster) | C7 (same) | C8 (faster) | C9 (fastest) | I7 industrial (same speed) |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +85C) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest-density APEX 20K member with 600K system gates (vs EP20K400CB652C7)
- MultiCore architecture with embedded system blocks (vs EP20K400CB652C8N)
- 488 user I/Os for high-density parallel interfaces (vs EP20K600CB652C-8)
Design Notes
The EP20K600CB652C7's 652-ball BGA package requires a controlled-impedance PCB stack-up with matched-length traces for the global clock network. Use 4-6 layer PCB with continuous ground planes beneath the BGA, and follow Altera's APEX 20K reference design for via-in-pad microvia construction. Decoupling capacitors (0.1µF ceramic + 10µF tantalum per VCCINT pin group) must be placed within 5mm of the BGA balls to suppress simultaneous switching noise on the 488 I/O banks.
Estimated: At 375.94 MHz toggle rate with all 488 I/Os switching simultaneously, the EP20K600CB652C7 can dissipate 3-5W. The 652-ball BGA package has a thermal resistance of approximately 12-15 C/W with a properly designed thermal via array beneath the exposed pad, so junction-to-ambient temperature rise is roughly 36-75C. A thermal via array of at least 25 vias (0.3mm diameter, 1mm pitch) filled with thermally conductive epoxy is required for reliable operation above 50C ambient.
The APEX 20K family's JTAG configuration pins (TCK, TMS, TDI, TDO) must be pulled to known states during power-up to prevent inadvertent configuration. Use 10kΩ pull-ups on TCK/TMS/TDI and verify the nCONFIG and nSTATUS signal timing against the Altera Configuration Handbook. Additionally, the 1.8V VCCINT ramp must complete within 100ms to avoid core logic latch-up; if your power supply cannot meet this requirement, add a supervisor circuit to hold nCONFIG low until VCCINT stabilizes.
For DDR SDRAM interfaces, route the 488 user I/Os in matched-length groups with impedance-controlled 50Ω traces (single-ended) or 100Ω differential pairs. The APEX 20K's MultiVolt I/O banks must each be assigned a single VCCIO voltage; mixing 3.3V and 5V within one bank will damage the device. Plan PCB layer stack-up with the BGA breakout on inner layers and signal routing on outer layers to minimize via stubs on high-speed clocks.
Compliance Information
Compliance data not available in verified web sources. The APEX 20K family predates RoHS-3 mandates; many production parts may not be RoHS compliant. Verify RoHS/REACH status with the distributor before using in restricted applications.
