EP20K600CB652C7ES - 600K Gates APEX 20KC FPGA | Altera | BGA-652
MPN: EP20K600CB652C7ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $195 | $195,000.00 |
EP20K600CB652C7ES Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from configurable logic blocks, embedded memory, programmable interconnect, and I/O cells that the designer programs after manufacture. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors, providing hardware-timed parallelism for datapath, signal-processing, glue-logic, and prototype-to-production workloads. The APEX 20KC family sits in the high-density tier of legacy Altera FPGAs (now Intel Programmable Solutions Group), targeting bus interfaces, telecommunications backplanes, and high-throughput data-pipeline designs.
Key features of the EP20K600CB652C7ES include 488 user I/O, 1.71 V to 1.89 V core supply (1.8 V nominal), LVTTL/LVCMOS/SSTL/GTL+ I/O standards, embedded multiplier support via the Look-up Table based architecture, MultiVolt I/O for interfacing with 1.5 V, 1.8 V, 2.5 V, 3.3 V rails, in-system programmability through passive serial, passive parallel, or JTAG configuration, and JTAG boundary-scan test per IEEE 1149.1.
Architecturally, the EP20K600CB652C7ES combines 24,320 logic elements (LEs) with 26 ESB (Embedded System Block) memory arrays of 2,048 bits each, yielding 311,296 bits of dual-port RAM, ROM, or CAM. The MegaLAB structure groups 16 Logic Array Blocks per LAB, sharing local interconnect and FastTrack row/column routing. Four phase-locked loops (PLLs) provide clock multiplication, division, and skew management for high-speed synchronous designs.
Typical applications include high-speed telecommunications switching, ASIC prototyping, DSP co-processing, video and image processing pipelines, industrial control and automation backplanes, and military/aerospace signal-processing platforms. The 488 I/O make the device particularly suited for memory-rich designs that aggregate wide external buses (DDR, QDR, ZBT SRAM).
When designing with the EP20K600CB652C7ES, allocate at least four 0.1 µF decoupling capacitors per VCC/Ground pair around the package perimeter, use matched-length differential pairs for LVDS clocks, and verify signal-integrity of FastRow interconnect using IBIS models provided by Altera. Operating temperature is commercial (0 °C to +85 °C).
This page synthesizes distributor pricing, drop-in APEX 20KC family alternatives, and practical design guidance not found in the legacy datasheet alone.
Drop-in alternatives for EP20K600CB652C7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600CB652C7ES (same form factor and footprint) — differing in Process Technology, Package, Operating Temperature, Speed Grade, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600CB652C7
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP20K600CB652C7E5
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP20K600CB652C-8
✅ Drop-In✓ In Stock
$86 / Unit
View Datasheet →EP20K400CB652C7ES
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP20K400EBC652-1X
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EP20K600CB652C7ES Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Logic Elements | 24,320 |
| System Gates | 600,000 |
| Maximum System Gates | 1,053,840 |
| Embedded Memory Bits | 311,296 |
| Embedded System Blocks (ESB) | 26 |
| Maximum User I/O | 488 |
| User I/O (this package) | 488 (652-BGA) |
| Supply Voltage - Core | 1.71 V to 1.89 V (1.8 V nominal) |
| Maximum Internal Clock Frequency | 1666.6 MHz |
| Propagation Delay | 1.6 ns |
| Process Technology | 0.15 µm CMOS |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Package Type | 652-ball FineLine BGA |
| JEDEC Package Code | S-PBGA-B652 |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG |
| JTAG Boundary Scan | IEEE 1149.1 compliant |
| PLLs | 4 |
| Mounting Type | Surface Mount (BGA) |
EP20K600CB652C7ES s-pbga-b652 Pin Configuration Guide
Pin configuration for EP20K600CB652C7ES (s-pbga-b652 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600CB652C7ES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600CB652C7ES is suitable for 6 applications: High-Speed Telecommunications Switching, ASIC Prototyping and Emulation, DSP Co-Processor for Signal Processing, Video and Image Processing Pipelines, Industrial Control and Automation Backplanes, Legacy Avionics and Defense Signal Processing.
High-Speed Telecommunications Switching
The EP20K600CB652C7ES is well-suited for telecom switching fabrics where its 600K system gates and 488 user I/O aggregate multiple wide bus interfaces such as UTOPIA, POS-PHY, and 64-bit SRAM/DRAM buses. With 311,296 bits of embedded SRAM distributed across 26 ESBs, the device can buffer cell/packet headers and lookup tables on-chip, eliminating costly external lookups. The four PLLs and 1666.6 MHz fMAX support line-card designs at OC-48/STM-16 rates, while JTAG boundary-scan enables board-level test of dense BGA assemblies.
Recommended
ASIC Prototyping and Emulation
Designers historically used the EP20K600CB652C7ES as an ASIC prototype platform because its 24,320 logic elements and 600K system gates emulate million-gate ASICs with reasonable fidelity. The 488 I/O expose sufficient pins to map complex ASIC pad rings, and the APEX 20KC architecture preserves timing characteristics that closely model target ASIC gates, allowing pre-silicon software bring-up and system validation. Embedded ESB memory serves as on-chip scratch RAM, reducing I/O pressure during emulation cycles.
Recommended
DSP Co-Processor for Signal Processing
In DSP co-processing roles, the EP20K600CB652C7ES delivers hardware parallelism through its 24,320 logic elements, offloading compute-intensive kernels (FIR filters, FFTs, correlators) from a host CPU or DSP chip. The 311,296-bit embedded memory provides coefficient and sample-line storage close to the datapath, minimizing latency. The 1.6 ns propagation delay and 1666.6 MHz fMAX enable multi-tap filters and 1024-point FFTs at sample rates suitable for radar, sonar, and software-defined radio front-ends.
Recommended
Video and Image Processing Pipelines
The EP20K600CB652C7ES supports real-time video processing pipelines that require simultaneous high I/O bandwidth and on-chip frame buffering. Its 488 user I/O accommodate wide parallel video buses (RGB 24-bit plus control), while the 311,296-bit embedded SRAM provides line buffers for deinterlacing, scaling, and color-space conversion. The 1.8 V core and MultiVolt I/O enable direct interface to 1.5 V, 2.5 V, and 3.3 V video ADCs/DACs without level shifters, simplifying PCB layout for broadcast and medical imaging equipment.
Recommended
Industrial Control and Automation Backplanes
The EP20K600CB652C7ES integrates multiple industrial protocols (PROFIBUS, CAN, EtherCAT) into a single programmable device, replacing dozens of discrete glue-logic ICs on factory-automation backplanes. Its 488 I/O interface to backplane connectors carrying parallel fieldbus data, while the four PLLs synchronize to multiple reference clocks across modules. The JTAG boundary-scan facilitates in-system test of densely populated BGA assemblies on the backplane, reducing manufacturing test cost in production volumes.
Recommended
Legacy Avionics and Defense Signal Processing
Although the EP20K600CB652C7ES is commercial-grade, long-life programs in avionics and defense continue to source it through authorized obsolete-stock channels for upgrades and repairs of fielded systems. The 600K gates and embedded multiplier-friendly architecture suit radar DSP and electronic-warfare front-ends, while the 652-ball BGA supports high-density board layouts constrained by SWaP-C requirements. Stock continuity through Rochester Electronics and authorized franchisees is the primary supply path for these programs.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600CB652C7ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600CB652C7 | EP20K600CB652C7E5 | EP20K600CB652C-8 | EP20K400CB652C7ES |
|---|---|---|---|---|---|
| Package | 652-BGA (FineLine, S-PBGA-B652) | 652-BGA (FineLine) - same | 652-BGA (FineLine) - same | 652-BGA (FineLine) - same | 652-BGA - same |
| Brand | Altera (now Intel PSG) | Altera | Altera | Altera | Altera |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 400,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 16,640 |
| Embedded Memory (bits) | 311,296 | 311,296 | 311,296 | 311,296 | 212,992 |
| User I/O | 488 | 488 | 488 | 488 | 488 |
| Maximum Internal Clock | 1666.6 MHz (C7 speed grade) | 1666.6 MHz | 1500 MHz | 1333 MHz | 1666.6 MHz |
| Core Voltage | 1.8 V nominal | 1.8 V nominal | 1.8 V nominal | 1.8 V nominal | 1.8 V nominal |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- High-density 600K gate APEX 20KC with embedded SRAM (vs EP20K400CB652C7ES)
- C7 speed grade (1666.6 MHz fMAX) - fastest APEX 20KC variant (vs EP20K600CB652C-8)
- 488 user I/O - the maximum for the APEX 20KC family in 652-BGA (vs EP20K600CB652C7E5)
- FineLine BGA package with optimized signal/power integrity (vs Larger 672-BGA or older PQFP APEX packages)
Design Notes
Estimated: The EP20K600CB652C7ES draws quiescent and dynamic current from 1.8 V VCCINT and separate VCCIO rails. Decoupling must include at least four 0.1 µF X7R ceramic capacitors per VCCINT/VSS pair placed within 5 mm of the BGA balls, plus 100 µF bulk tantalum or polymer capacitors at the supply inputs. Programmable I/O banks allow independent VCCIO (1.5 V / 1.8 V / 2.5 V / 3.3 V), each requiring its own decoupling network per bank.
Estimated: At maximum toggle rate (1666.6 MHz fMAX with high-utilization designs), core power dissipation can exceed 5 W. The 652-BGA package typically presents θJA around 12-15 °C/W with proper thermal via array under the die. Use a 6×6 or larger thermal via farm in pad with 0.3 mm drilled holes filled and plated, capped on the top side for optimal heat extraction to inner copper planes.
The 652-ball FineLine BGA uses 1.27 mm pitch. PCB stackup must include a high-Tg FR-4 or low-loss mid-loss laminate (e.g., Isola FR408HR or Rogers RO4350B for high-speed designs). Microvia or via-in-pad construction is recommended for signal escape; dog-bone fanout is acceptable for low-speed control signals. Impedance-controlled traces (50 Ω single-ended, 100 Ω differential) must be verified with the foundry's stackup calculator before fabrication.
Configure LVDS and SSTL interfaces only after running Quartus II fitter reports and IBIS simulations. For DDR/QDR memory interfaces, length-match all byte lanes within ±25 ps and route differential clocks with 100 Ω differential impedance. Avoid routing signals across BGA reference plane splits, particularly between VCCINT and VCCIO domains. Use series termination resistors on high-speed outputs as recommended in AN 75 (Altera High-Speed Board Design).
Do not assume the EP20K600CB652C7ES supports 5 V tolerant I/O - the LVTTL/LVCMOS standards are 3.3 V maximum. Always tie nCONFIG high through a 4.7 kΩ resistor and use the proper configuration PROM (EPC2, EPC4, or EPC8 family) sized to the compressed bitstream. Verify JTAG chain order before in-system programming; an incorrect TDO-to-TDI loop will halt configuration silently.
Compliance Information
RoHS, REACH, and lead-free status are not documented in the verified data; APEX 20KC family predates widespread RoHS enforcement. AEC-Q100 not applicable (FPGA, not automotive-grade IC).
