EP20K600CB652C8 - APEX 20KC FPGA 600K Gates 652-BGA | Intel
MPN: EP20K600CB652C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $142 | $14,200.00 |
| 500 | $120 | $60,000.00 |
| 1,000 | $105 | $105,000.00 |
EP20K600CB652C8 Overview
The APEX 20KC architecture combines Look-Up Table (LUT)-based logic elements with embedded system blocks (ESBs) that can be configured as either dual-port RAM, single-port RAM, ROM, or CAM (Content-Addressable Memory). The device is a member of the programmable logic device (PLD) hierarchy, sitting between simple PLDs (SPLDs/CPLDs) and high-end FPGAs, and is intended for high-density data-path, DSP, and memory-intensive designs.
Key features include 24,320 logic elements, 311,296 bits of embedded memory, 488 maximum user I/O pins, propagation delay around 1.48 ns, and operating frequency up to 301.21 MHz. The APEX 20KC family delivers up to 35% faster design performance than the original APEX 20KE devices, while the embedded memory blocks enable single-chip implementation of FIFOs, CAM lookups, and DSP coefficient storage.
Architecturally, the device integrates a fine-grained Logic Array Block (LAB) fabric with column- and row-based ESB interconnects, providing predictable routing delays. The 1.8 V core with multi-voltage I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V PCI-compatible) allows direct interface to legacy and modern logic families without external level translators.
Typical applications include telecommunications line cards, high-speed network switches, DSP data-path acceleration, image processing pipelines, and ASIC prototyping. Designers migrating from APEX 20KE can drop in the 20KC variant for an immediate performance uplift while reusing existing Quartus II development flows.
When designing with this part, ensure the PCB provides sufficient decoupling for the 1.8 V core rail and that the 652-ball BGA land pattern matches the 45 x 45 mm footprint. Boundary-scan support and JTAG configuration simplify board-level test, while in-system programmability via Altera serial configuration devices shortens development cycles.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not found in the manufacturer datasheet alone, providing engineers with a single reference for sourcing, replacement, and PCB layout decisions.
Drop-in alternatives for EP20K600CB652C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600CB652C8 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Device Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600CB652C7
✅ Drop-In✓ In Stock
$1320 / Unit
View Datasheet →EP20K600CB652C7N
✅ Drop-In✓ In Stock
$305 / Unit
View Datasheet →EP20K600CB652C7ES
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K600CB652C7E5
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP20K600CB652C-8
✅ Drop-In✓ In Stock
$86 / Unit
View Datasheet →EP20K600CB652C8 Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Device Type | SPLD / FPGA |
| System Gates | 600,000 |
| Logic Elements | 24,320 |
| Embedded Memory Bits | 311,296 |
| Maximum User I/O | 488 |
| Package | 652-BGA (45 x 45 mm, 1.27 mm pitch) |
| Process Technology | 0.15 µm (later revisions 0.18 µm) all-layer copper CMOS |
| Core Supply Voltage | 1.8 V |
| Propagation Delay | 1.48 ns |
| Maximum Operating Frequency | 301.21 MHz |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| Configuration Method | JTAG / Altera serial configuration device |
EP20K600CB652C8 652-bga (45 x 45 mm, 1.27 mm pitch) Pin Configuration Guide
Pin configuration for EP20K600CB652C8 (652-bga (45 x 45 mm, 1.27 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600CB652C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600CB652C8 is suitable for 6 applications: Telecommunications Line Cards, High-Speed Network Switches and Routers, DSP Data-Path Acceleration, Image Processing Pipelines, ASIC Prototyping, Industrial Control and Test Equipment.
Telecommunications Line Cards
The EP20K600CB652C8 is well suited to telecom line cards where 600,000 system gates and 311,296 bits of embedded memory let designers implement framing, HDLC controllers, and ATM segmentation-and-reassembly blocks in a single device. Its 488 user I/O pins drive parallel backplane interfaces and multi-channel T1/E1 framers without external bus expander logic. The 301 MHz internal fabric and 1.48 ns propagation delay meet the timing budget of OC-12 / STM-4 line-rate designs when properly pipelined in VHDL or Verilog.
Recommended
High-Speed Network Switches and Routers
In network switches the EP20K600CB652C8's 24,320 logic elements support 10/100/1000 Ethernet MAC aggregation, VLAN tag processing, and Quality-of-Service queuing structures in a single FPGA. The embedded ESB memory blocks act as packet buffers and CAM lookups for MAC address tables, eliminating external TCAM chips in many designs. The 488 I/O pins interface to multiple PHY devices and to the switch fabric ASIC across wide parallel buses, while the 1.8 V core keeps overall board power dissipation manageable for dense line-card layouts.
Recommended
DSP Data-Path Acceleration
The EP20K600CB652C8 accelerates DSP data paths such as FIR filters, FFT butterflies, and Reed-Solomon codecs by mapping arithmetic pipelines into dedicated logic and using the 311,296-bit embedded memory for coefficient ROM and delay-line storage. Distributed arithmetic implementations benefit from the high LUT count and predictable carry-chain timing. Designers can pair multiple EP20K600CB652C8 devices in a pipeline, with each device delivering up to 301 MHz operation to sustain real-time processing of baseband or audio sample streams.
Recommended
Image Processing Pipelines
Image processing pipelines - including convolution, color-space conversion, and motion-estimation engines - fit naturally in the EP20K600CB652C8's high-logic-count fabric. The 488 I/O pins accommodate multi-channel video buses such as BT.656, Camera Link, or parallel RGB interfaces. Embedded memory buffers hold scan-line data and frame statistics, while the 301 MHz fabric sustains pixel-rate processing for standard-definition and many high-definition video formats when the design is carefully pipelined.
Recommended
ASIC Prototyping
The EP20K600CB652C8 is widely used for ASIC prototyping because its 600K gates approximate mid-complexity ASICs and the Quartus II toolchain supports rapid design iteration. Engineers map gate-level netlists into the APEX 20KC fabric and use JTAG-based in-system programmability to swap prototypes quickly. Multi-FPGA partitioning tools can split a large ASIC across several EP20K600CB652C8 devices, exploiting the 488 I/O pins to interconnect daughter boards at high speed.
Recommended
Industrial Control and Test Equipment
Industrial control and test-and-measurement systems leverage the EP20K600CB652C8's combination of high logic density, 488 I/O pins, and embedded memory to implement custom timing engines, waveform generators, and parallel bus capture logic. The 0 °C to +85 °C commercial temperature range suits factory-floor enclosures and laboratory instruments. Engineers use the FPGA to consolidate glue logic, microsequencer state machines, and protocol decoders that previously required multiple CPLDs and discrete logic.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600CB652C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600CB652C7 | EP20K600CB652C7N | EP20K600CB652C7ES | EP20K600CB652C-8 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 652-BGA (45 x 45 mm, 1.27 mm pitch) | 652-BGA (45 x 45 mm) - same | 652-BGA (45 x 45 mm) - same | 652-BGA (45 x 45 mm) - same | 652-BGA (45 x 45 mm) - same |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded Memory Bits | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 |
| Maximum User I/O | 488 | 488 | 488 | 488 | 488 |
| Maximum Frequency | 301.21 MHz | > 301.21 MHz (faster -7 grade) | > 301.21 MHz (faster -7 grade) | > 301.21 MHz (faster -7 grade) | 301.21 MHz (same -8 grade) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lead-Free / RoHS | Standard (non-N suffix) | Standard | Lead-free (RoHS) | Engineering sample | Standard |
Key Differentiators
- Same-family speed-grade alternatives within identical CB652 footprint (vs EP20K600CB652C7)
- Lead-free RoHS-compatible variant in same package (vs EP20K600CB652C7N)
- Engineering-sample ordering options for low-volume prototyping (vs EP20K600CB652C7ES / EP20K600CB652C7E5)
Design Notes
The EP20K600CB652C8 requires a tightly regulated 1.8 V core supply capable of delivering several amps during configuration and dynamic operation. Use a dedicated LDO or switching regulator with at least 20% current headroom above the calculated worst-case ICC, and place bulk decoupling (220 µF tantalum or polymer) within 25 mm of the BGA. Multiple 0.1 µF and 1 µF ceramic decoupling capacitors must be placed as close as possible to every power and ground ball pair to suppress simultaneous-switching-noise (SSN) on the 488 I/O pins.
Estimated: at maximum toggle activity across all 488 I/O pins and 50% logic utilization, the EP20K600CB652C8 may dissipate 4-6 W. The 652-ball BGA provides a low thermal resistance path through the PCB via inner power/ground planes and thermal vias; a minimum 4-layer stack-up with continuous inner ground planes is recommended. For high-utilization designs or sealed enclosures, attach a heatsink or use forced-air cooling to keep junction temperature below 100 °C for reliability margin.
Use a 652-ball BGA land pattern with 1.27 mm pitch and NSMD (non-solder-mask-defined) pads for best joint reliability. Escape routing on outer layers with via-in-pad or microvia technology is essential; 4/4 mil trace-and-space rules are typical. Maintain reference-plane continuity under the BGA to preserve signal integrity for high-speed I/O, and match trace lengths within ±50 mil for bus-oriented interfaces (DDR-style external memories or parallel video buses).
Avoid mixing APEX 20KC configuration schemes between board revisions: serial-configuration-device pinouts differ between EPC and EPCS families. Ensure JTAG chain order matches the Quartus II BSDL file when multiple FPGAs share a boundary-scan bus. Do not assume the -8 speed grade timing models apply to -7 or -3 grades - re-run static timing analysis whenever the speed grade is changed. Finally, verify that the 1.8 V supply ramps monotonically; some APEX 20KC devices fail to configure if VCC ramps non-monotonically.
Compliance Information
Standard EP20K600CB652C8 was released before RoHS directives took full effect and may use lead-bearing BGA balls; lead-free variant available as EP20K600CB652C8N. AEC-Q100 not applicable (FPGA is not an automotive-qualified part).
