EP20K600CF33C7 - APEX-20K 600K Gate FPGA, 1020-FBGA | Altera
MPN: EP20K600CF33C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $156.1 | $156.10 |
| 10 | $148.5 | $1,485.00 |
| 100 | $134.2 | $13,420.00 |
| 500 | $118.75 | $59,375.00 |
| 1,000 | $105.4 | $105,400.00 |
EP20K600CF33C7 Overview
A Field-Programmable Gate Array (FPGA) is a programmable logic device whose logic fabric, interconnect, and I/O cells are configured by the designer after manufacture. The APEX-20K family pioneered Altera's multi-tiered architecture combining look-up table (LUT) logic, embedded system blocks (ESBs) for dual-port RAM/ROM, and a unified interconnect, positioning it as a precursor to later families such as APEX II and Cyclone. The EP20K600 sits at the top of the APEX-20K density range, replacing multiple discrete ASICs and PLDs in system-on-board designs.
Key features of the EP20K600CF33C7 include up to 24,320 logic elements, 311,296 embedded RAM bits, embedded array blocks (EABs) for memory and product-term functions, and configurable I/O voltage standards. The 1020-pin FCBGA package supports a high-pin-count interface for parallel external memory, high-speed I/O buses, and multiple industry-standard serializer/deserializer (SERDES) companion chips. Power is supplied at 1.71 V to 1.89 V core, with separate VCCIO planes supporting mixed-voltage I/O standards such as LVTTL, LVCMOS, PCI, and GTL.
The architecture uses a four-level hierarchy (logic elements, MegaLAB structures, embedded array blocks, and FastTrack interconnect) that allows the device to combine fine-grained logic with coarse-grained RAM/ROM blocks on a single die. The CF33 suffix indicates the 1020-ball FCBGA package with industrial-temperature (-40C to +85C) operating range and a 7 ns speed grade, while the trailing C7 indicates a specific speed/package bin. Designers typically use Altera's legacy Quartus II design software (or MAX+PLUS II for older designs) to compile Verilog HDL, VHDL, or schematic entries.
Typical applications include telecommunication line cards, high-speed data-acquisition front-ends, channelized DSP pipelines, industrial protocol bridges, and ASIC-prototyping platforms. The 600K-gate logic capacity and ~310 Kbits of distributed plus embedded RAM make the EP20K600 well suited to multi-channel baseband processing, RAID controllers, and protocol converters.
When designing with the EP20K600CF33C7, pay close attention to simultaneous-switching output (SSO) noise and decoupling. Place at least 16 low-ESR 0.1 uF ceramic capacitors directly beneath the FCBGA land pattern, plus bulk 10 uF-47 uF tantalum or polymer caps on each supply plane. The 33 mm FCBGA also requires controlled-impedance traces on the top microstrip layer and matched-length clocks for high-speed I/O.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same APEX-20K family, and practical board-layout guidance not found in the original APEX-20K datasheet alone.
Drop-in alternatives for EP20K600CF33C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600CF33C7 (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600CF1020C7
✅ Drop-In✓ In Stock
$212.4 / Unit
View Datasheet →EP20K600CF1020C8
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$92 / Unit
View Datasheet →EP20K600CF1020C9
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP20K600CF1020I7
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP20K600CF1020I8
✅ Drop-In✓ In Stock
$325 / Unit
View Datasheet →EP20K600CF1020I9
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$99.5 / Unit
View Datasheet →EP20K600CF33C7 Maximum Ratings & Electrical Characteristics
| Series | APEX-20K |
| Family | APEX-20K Field Programmable Gate Array |
| Typical Gate Count | 600,000 gates |
| Logic Elements | 24,320 |
| Embedded RAM Bits | 311,296 bits |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| Operating Temperature Range | -40C to +85C (Industrial) |
| Package | 1020-BBGA / FCBGA (33x33 mm) |
| Package Code | BGA, 1020 balls |
| Speed Grade | C7 (7 ns) |
| Terminal Form | Ball |
| Mounting Type | Surface Mount |
| Configuration Memory | SRAM (volatile, requires external config device) |
EP20K600CF33C7 bga, 1020 balls Pin Configuration Guide
Pin configuration for EP20K600CF33C7 (bga, 1020 balls package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600CF33C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600CF33C7 is suitable for 6 applications: Telecommunications Line Card, High-Speed Data Acquisition Front-End, ASIC Prototyping Platform, Industrial Protocol Bridge / Converter, Channelized DSP Pipeline, RAID / Storage Controller.
Telecommunications Line Card
The EP20K600CF33C7 is widely deployed in legacy telecom line cards where it terminates T1/E1, T3/E3, or SONET/SDH data streams and performs framing, channelization, and bit-error-rate processing. With 600,000 gates and 311,296 bits of embedded RAM, it can implement multiple parallel channel processors and lookup tables for ATM/AAL2 segmentation and reassembly (SAR) on a single chip. Its 1020-ball FCBGA exposes sufficient I/O for 16-bit or 32-bit external SSRAM/SDRAM buses plus 4-8 high-speed serial links via external SERDES companions. The APEX-20K architecture supports per-channel logic while the embedded array blocks (EABs) buffer cells, allowing deterministic latency without off-chip memory contention. Industrial temperature grade -40C to +85C ensures operation in central-office and outdoor-cabinet environments.
Recommended
High-Speed Data Acquisition Front-End
In data-acquisition systems the EP20K600CF33C7 serves as the digital pre-processing engine between high-speed ADCs and a host CPU or DSP cluster. Its 24,320 logic elements can implement FIR filters, decimation stages, and trigger logic for ADC sample rates from 100 MSPS to 500 MSPS. The 311 Kbits of embedded RAM provide buffer storage for sample bursts before DMA transfer, eliminating the need for external FIFOs in many designs. The 1020-ball FCBGA supports LVTTL/LVCMOS I/O to industry-standard ADCs such as the AD9248 family. Quartus II design flow allows rapid iteration on filter coefficients and threshold triggers, and bitstream reload via JTAG enables in-field recalibration without powering down the host system.
Recommended
ASIC Prototyping Platform
Designers use the EP20K600CF33C7 as an ASIC prototype because its 600,000-gate capacity and EAB-based memory approximate mid-range ASIC cell libraries. ASIC RTL written in Verilog HDL or VHDL can be synthesized for the APEX-20K family with Quartus II, then run at near-ASIC clock speeds to validate functionality before committing to silicon. The 1020-ball FCBGA package supports board-level interfaces that mirror the target ASIC's pad-out, simplifying I/O modeling for ASIC vendors. The CF33C7 industrial temperature and 7 ns speed grade make timing closure representative of mid-tier ASIC process corners. Designers can chain multiple EP20K600 devices for partitioned ASIC validation when the design exceeds 600K gates.
Recommended
Industrial Protocol Bridge / Converter
Industrial automation systems often require bridging between legacy protocols (PROFIBUS, DeviceNet, Modbus RTU) and modern Ethernet-based protocols (PROFINET, EtherNet/IP). The EP20K600CF33C7 hosts multiple soft UART, SPI, and Ethernet MAC cores simultaneously, with EAB-based dual-port RAM acting as message buffers between protocol stacks. Its 600K-gate budget easily absorbs two or three full protocol stacks plus a TCP/IP offload engine. The industrial temperature range (-40C to +85C) suits factory-floor cabinets, and the 1020-ball FCBGA's high I/O count supports parallel GPIO expansion for digital I/O modules. Migration to newer Intel Cyclone families is recommended for new designs, but the EP20K600 remains in service across installed industrial base.
Recommended
Channelized DSP Pipeline
Multi-channel DSP systems for wireless base stations and software-defined radio use the EP20K600CF33C7 to implement channelizers, pulse-shaping filters, and symbol-rate converters. The APEX-20K EABs can be configured as coefficient ROM for FIR filters while the logic elements handle MAC operations and address generation. With 24,320 logic elements the device can process 64 to 128 simultaneous narrowband channels. The 311,296 bits of embedded RAM accommodate overlap-save buffers and FFT working memory, reducing external memory bandwidth. Designers typically pair the FPGA with external SDRAM for sample storage while keeping real-time data paths on-chip for deterministic throughput.
Recommended
RAID / Storage Controller
Legacy RAID controllers and storage area network (SAN) switches deployed the EP20K600CF33C7 as the central logic engine for XOR computation, parity generation, and command queuing across multiple disk channels. Its embedded array blocks act as cache lines for sector buffers, and the 600K-gate logic budget implements RAID-5/6 XOR engines, DMA controllers, and SCSI/Fibre Channel state machines. The 1020-ball FCBGA exposes enough I/O to drive 4-8 parallel Ultra160 SCSI buses plus a PCI/X host interface. Industrial temperature grade supports use in enterprise storage enclosures with controlled airflow.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600CF33C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600CF1020C7 | EP20K600CF1020C8 | EP20K600CF1020C9 | EP20K600CF1020I7 | EP20K600CF1020I8 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-BBGA FCBGA (33x33 mm) | 1020-BBGA FCBGA (33x33 mm) - same | 1020-BBGA FCBGA (33x33 mm) - same | 1020-BBGA FCBGA (33x33 mm) - same | 1020-BBGA FCBGA (33x33 mm) - same | 1020-BBGA FCBGA (33x33 mm) - same |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded RAM Bits | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 |
| Typical Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Speed Grade | C7 (7 ns) | C7 (identical) | C8 (slower, +14%) | C9 (slower, +29%) | I7 (identical, industrial temp) | I8 (slower, +14%, industrial temp) |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Configuration Memory | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade in 1020-ball FCBGA (vs EP20K600CF1020C7)
- C7 speed grade is the fastest available in APEX-20K 1020-ball FCBGA (vs EP20K600CF1020C9)
- Highest-density APEX-20K with 1020-ball FCBGA exposes maximum user I/O (vs EP20K600CB652C7)
Design Notes
The 1020-ball FCBGA at 33x33 mm requires a multilayer PCB (8 layers minimum recommended) with via-in-pad or microvia technology. Per APEX-20K layout guidelines, place 16-20 0.1 uF X7R ceramic capacitors directly beneath the BGA footprint plus 4-8 bulk 10 uF-47 uF tantalum or polymer capacitors on each VCCINT/VCCIO plane. Use 4-6 ground vias per decoupling cap and stitch the entire BGA perimeter with a ground ring to control SSO noise. Matched-length clock traces should be length-matched within 25 mil across the top microstrip layer; high-speed I/O differential pairs require 100 ohm differential impedance.
Estimated: At typical 1.8 V core with 600 mA active current (from APEX-20K family datasheet), core power dissipation is approximately 1.08 W. Adding high-utilization I/O (50 mA at 3.3 V across multiple banks), total board dissipation rises to ~2-3 W. The FCBGA has theta_JA around 15-20 C/W with recommended thermal via array and 4-layer PCB copper pour, so junction temperature stays under 100C at ambient 70C. For high-utilization designs, recommend thermal vias under the center die flag plus a small clip-on heatsink if enclosure ambient exceeds 60C.
The APEX-20K uses volatile SRAM configuration memory and will not retain the bitstream on power-down; an external EPC configuration PROM (such as EPC16QC100) is mandatory for unattended boot. Designers often mis-wire the JTAG chain when sharing TMS/TCK/TDO/TDI with other devices - always include a JTAG header with proper buffer isolation and confirm chain integrity with Quartus II programmer before board bring-up. The 1.71-1.89 V core rail must ramp monotonically; out-of-spec ramp profiles cause partial configuration and unrecoverable logic errors at power-on.
Place the EPC configuration PROM within 2 inches of the EP20K600CF33C7 DATA0/DATA1/DCLK/nCONFIG/nSTATUS chain. Route DCLK as a 50 ohm controlled-impedance trace with no stubs and keep the trace length under 50 mm. Group all configuration-related pins on a single I/O bank to simplify pin-planner assignments. The JTAG TCK trace must be guarded by ground traces on both sides to prevent double-clocking during in-system programming. Avoid routing any high-speed switching signals (FIFO clocks, SDRAM clocks) under the BGA to minimize coupling into the core supply.
Compliance Information
RoHS/REACH status not explicitly stated in the verified web data; Altera APEX-20K family predates widespread RoHS adoption and many date codes are non-compliant. Verify date code and compliance status with the supplier before ordering for RoHS-restricted markets.
