EP20K600EBI652-2X - 600K Gate APEX 20KE FPGA 488 I/O BGA-652 | Intel
MPN: EP20K600EBI652-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $330.98 | $330.98 |
| 10 | $297.88 | $2,978.80 |
| 100 | $264.78 | $26,478.00 |
| 500 | $231.68 | $115,840.00 |
| 1,000 | $198.59 | $198,590.00 |
EP20K600EBI652-2X Overview
What is an APEX 20KE FPGA? APEX (Advanced Programmable Logic Element eXtended) is Altera's multi-core programmable logic architecture family launched in the late 1990s. The 20KE generation extends the original APEX 20K with enhanced memory, faster I/O, and improved interconnect for high-volume telecommunications, networking, and DSP designs. FPGAs (Field-Programmable Gate Arrays) sit hierarchically between ASICs and CPLDs: a configurable logic block array plus programmable interconnect and I/O cells, all SRAM- or fuse-based for re-programmability. APEX 20KE targets mid-to-high-density designs where LUT logic, product-term logic, and embedded memory must coexist on one die.
Key features of the EP20K600EBI652-2X include 24,320 logic elements, 488 maximum user I/Os, 311 Kbits of embedded RAM, four dedicated input pins and four PLL-based clock management blocks. The -2X speed grade places this part in the mid-speed tier for APEX 20KE, with propagation delays of 1.48 ns and a 200 MHz internal performance figure. The thermally enhanced 45 x 45 mm BGA package provides a low θJA for high-performance operation without external heatsinks.
On the architectural side, the device uses four-input LUTs for combinatorial logic, dedicated carry chains for arithmetic, distributed RAM within ESBs, and a hierarchical FastTrack interconnect that minimizes delay between adjacent logic blocks. The four PLLs (one per I/O bank) provide zero-delay buffering, frequency synthesis, and clock-skew management for high-speed synchronous designs. MultiVolt I/O supports interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V devices without external level shifters.
Typical applications include telecommunications line cards, ATM switch fabrics, DSLAMs, base-station signal processing, high-speed serial protocol bridging, and PCI/PCI-X bus controllers. The large gate count and embedded RAM also make this FPGA suitable for prototyping ASIC designs and for soft-processor SoC integration.
When designing with this device, observe that the -2X speed grade represents a mid-tier speed bin; the -3 grade is faster. Configuration can be done via serial or parallel EPROM, JTAG, or controller-based schemes. Power estimation should use the Quartus PowerPlay tool because APEX 20KE has no in-die power sensor.
Drop-in alternatives for EP20K600EBI652-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600EBI652-2X (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Family, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600EBC652-2X
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View Datasheet →EP20K600EBI652-2X Maximum Ratings & Electrical Characteristics
| Family | APEX 20KE |
| Logic Elements | 24,320 cells |
| Maximum Gates | 600,000 gates |
| User I/Os | 488 |
| Embedded RAM | 311 Kbits |
| Dedicated Inputs | 4 |
| Package | 652-ball BGA (45 x 45 mm, 1.27 mm pitch, thermally enhanced) |
| Maximum Operating Frequency | 200 MHz |
| Propagation Delay | 1.48 ns |
| Core Voltage | 1.8 V |
| Process Technology | 0.18 µm all-layer copper CMOS |
| Operating Temperature | 0 C to 85 C (commercial) |
| Speed Grade | -2X (mid-tier) |
| PLLs | 4 |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Method | Serial/parallel EPROM, JTAG, controller |
| RoHS Status | Lead-free / RoHS compliant |
EP20K600EBI652-2X 652-ball bga (45 x 45 mm, 1.27 mm pitch, thermally enhanced) Pin Configuration Guide
Pin configuration for EP20K600EBI652-2X (652-ball bga (45 x 45 mm, 1.27 mm pitch, thermally enhanced) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600EBI652-2X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600EBI652-2X is suitable for 6 applications: Telecommunications Line Cards, ATM Switch Fabric and DSLAM Aggregation, Base-Station DSP Front-End Processing, PCI / PCI-X Bus Controllers, ASIC Prototyping and Emulation, Industrial Control and Factory Automation.
Telecommunications Line Cards
The EP20K600EBI652-2X fits telecommunications line card designs because its 600K gates and 488 user I/Os can absorb the entire TDM bus framer, ATM SAR, and HDLC controller in a single device. The four PLLs provide jitter-cleaned clocks for T1/E1/OC-3 line-side interfaces, and the 311 Kbits of embedded dual-port RAM simplify cell buffer implementation. At 200 MHz internal performance, the device handles STS-1/STM-0 payloads without throughput bottlenecks.
Recommended
ATM Switch Fabric and DSLAM Aggregation
In ATM switch fabric and DSLAM aggregation designs, the EP20K600EBI652-2X's combination of LUT-based data-path logic and product-term glue logic maps efficiently to cell header parsing, UPC policing, and AAL2/AAL5 segmentation. The 488 I/Os are sufficient for UTOPIA-2 / UTOPIA-3 PHY interfaces across multiple ports, while 311 Kbits of embedded RAM implement per-VC queue descriptors. Industrial temperature rating suits outdoor DSLAM cabinet deployments.
Recommended
Base-Station DSP Front-End Processing
The EP20K600EBI652-2X supports base-station DSP front-end tasks such as channel filtering, pulse shaping, and crest-factor reduction. Its 24,320 logic elements can host multiple parallel FIR/IIR filter chains, and the dedicated carry chains accelerate MAC operations at 200 MHz system clock. MultiVolt I/O interfaces directly to 1.8 V DACs and 3.3 V ADC front ends without external level shifters, reducing BOM for radio card designs.
Recommended
PCI / PCI-X Bus Controllers
The EP20K600EBI652-2X acts as a high-performance PCI/PCI-X bridge or embedded controller, with 488 I/Os handling the 64-bit PCI-X bus plus memory and local-bus interfaces. Its 1.48 ns propagation delay supports 66 MHz PCI-X at full throughput, and embedded RAM can be configured as DMA descriptor rings. The thermally-enhanced BGA package keeps junction temperatures in check even at the 2.5 W typical power consumption of full PCI-X operation.
Recommended
ASIC Prototyping and Emulation
Designers use the EP20K600EBI652-2X as an ASIC prototyping vehicle because the 600K-gate capacity closely matches mid-range ASICs in production. The MultiCore architecture preserves design hierarchy during synthesis-to-fitting migration, and the 311 Kbits embedded RAM emulates on-chip SRAM macros. Industrial temperature rating lets prototypes be validated in -40C to +85C environmental chambers without thermal derating.
Recommended
Industrial Control and Factory Automation
The EP20K600EBI652-2X drives industrial automation controllers where 488 I/Os replace multiple discrete PLCs. Industrial temperature rating (0-85 C) covers most factory-floor environments, while 311 Kbits of embedded RAM holds recipe data and motion-control trajectory tables. Four PLLs synchronize servo drives and encoder feedback, and MultiVolt I/O interfaces directly to 24 V-tolerant opto-isolated I/O subsystems at 3.3 V or 5 V logic levels.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600EBI652-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600EBC652-2X | EP20K600EBC652-3 | EP20K600EBC652-1X | EP20K600CB652C9N | EP20K600CB652C7 | EP20K600CB652I9 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 652-ball BGA (45x45 mm) | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same |
| Logic Elements | 24,320 cells | 24,320 cells | 24,320 cells | 24,320 cells | 24,320 cells | 24,320 cells | 24,320 cells |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | -2X (mid-tier) | -2X | -3 (faster) | -1X (slower) | -C9 | -C7 | -I9 |
| Temperature Grade | Industrial (0-85 C) | Commercial (0-70 C) | Commercial (0-70 C) | Commercial (0-70 C) | Commercial (0-70 C) | Commercial (0-70 C) | Industrial (0-85 C) |
| Embedded RAM | 311 Kbits | 311 Kbits | 311 Kbits | 311 Kbits | 311 Kbits | 311 Kbits | 311 Kbits |
| Lifecycle Status | Obsolete (aftermarket only) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature rating on -2X speed grade (vs EP20K600EBC652-2X)
- Mid-tier speed grade balances cost and performance (vs EP20K600EBC652-3)
- Enhanced 'E' silicon variant (vs EP20K600CB652C9N)
Design Notes
Estimated: APEX 20KE power consumption scales with clock frequency, toggle rate, and utilization. At 200 MHz with 50% toggle rate and 80% utilization, the EP20K600EBI652-2X typically dissipates 1.5-2.5 W from a 1.8 V core supply. Decoupling requires at least 12 low-ESR 0.1 µF ceramic capacitors placed adjacent to the BGA balls, plus four 10 µF bulk capacitors near the four VCCINT power balls.
The thermally-enhanced 652-ball BGA package provides a lower θJA than the standard BGA, but at 2 W dissipation the junction temperature still rises approximately 15-20 C above ambient. For industrial 85 C operation, ambient air temperature must remain below 65 C without airflow or 70 C with 200 LFM forced air. A thermal pad or heatsink is recommended for fully enclosed chassis.
Use a 12-layer PCB stackup with 1 oz copper outer layers and 0.5 oz inner layers for the BGA-652 breakout. Route signal traces on the top layer using 4-mil lines/spaces with 8-mil vias, fan out via dog-bone pattern from inner-row balls to inner signal layers, and dedicate at least one solid ground plane and one solid 1.8 V plane directly under the BGA footprint for power integrity.
Do not confuse the EP20K600EBI652-2X (industrial temp, -2X speed) with the EP20K600EBC652-3 (commercial, -3 speed) or the EP20K600CB652C9N (non-enhanced, -C9). Bitstreams generated for one speed grade do not work on another. Always confirm the orderable part number matches your BOM and temperature requirements before fabrication. Configuration modes must also match the EPROM/JTAG programming cable selected.
Compliance Information
Lead-free and RoHS compliant per IC Components distributor listing (2026-09-08). Not AEC-Q100 qualified - APEX 20KE is a commercial/industrial FPGA, not an automotive-grade part. AEC-Q100 only applies to automotive-qualified semiconductors.