Intel

EP20K600EBI652-2X - 600K Gate APEX 20KE FPGA 488 I/O BGA-652 | Intel

MPN: EP20K600EBI652-2X ✗ End of Life
In Stock Ships in 1-3 business days
1.8 V Vdss 652-ball BGA (45 x 45 mm, 1.27 mm pitch, thermally enhanced) Package 200 MHz Speed
From $198.59 USD / Unit
MOQ: 1 |
Price updated: 2026-09-07
Volume Pricing
Qty Unit Price Extended
1 $330.98 $330.98
10 $297.88 $2,978.80
100 $264.78 $26,478.00
500 $231.68 $115,840.00
1,000 $198.59 $198,590.00
ℹ️ All prices are in USD

EP20K600EBI652-2X Overview

The Intel (formerly Altera) EP20K600EBI652-2X is a high-density APEX 20KE family FPGA delivering 600,000 gates, 24,320 logic elements (cells), and 488 user I/Os in a thermally-enhanced 652-ball BGA package. Manufactured on a 0.18 µm all-layer copper CMOS process, it operates with a 1.8 V core supply and supports system clock rates up to 200 MHz. The device integrates MultiCore architecture combining LUT-based logic for data-path and DSP operations with product-term logic for glue and control functions, plus embedded system blocks (ESBs) that provide up to 311 Kbits of RAM with dual-port and FIFO support.

What is an APEX 20KE FPGA? APEX (Advanced Programmable Logic Element eXtended) is Altera's multi-core programmable logic architecture family launched in the late 1990s. The 20KE generation extends the original APEX 20K with enhanced memory, faster I/O, and improved interconnect for high-volume telecommunications, networking, and DSP designs. FPGAs (Field-Programmable Gate Arrays) sit hierarchically between ASICs and CPLDs: a configurable logic block array plus programmable interconnect and I/O cells, all SRAM- or fuse-based for re-programmability. APEX 20KE targets mid-to-high-density designs where LUT logic, product-term logic, and embedded memory must coexist on one die.

Key features of the EP20K600EBI652-2X include 24,320 logic elements, 488 maximum user I/Os, 311 Kbits of embedded RAM, four dedicated input pins and four PLL-based clock management blocks. The -2X speed grade places this part in the mid-speed tier for APEX 20KE, with propagation delays of 1.48 ns and a 200 MHz internal performance figure. The thermally enhanced 45 x 45 mm BGA package provides a low θJA for high-performance operation without external heatsinks.

On the architectural side, the device uses four-input LUTs for combinatorial logic, dedicated carry chains for arithmetic, distributed RAM within ESBs, and a hierarchical FastTrack interconnect that minimizes delay between adjacent logic blocks. The four PLLs (one per I/O bank) provide zero-delay buffering, frequency synthesis, and clock-skew management for high-speed synchronous designs. MultiVolt I/O supports interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V devices without external level shifters.

Typical applications include telecommunications line cards, ATM switch fabrics, DSLAMs, base-station signal processing, high-speed serial protocol bridging, and PCI/PCI-X bus controllers. The large gate count and embedded RAM also make this FPGA suitable for prototyping ASIC designs and for soft-processor SoC integration.

When designing with this device, observe that the -2X speed grade represents a mid-tier speed bin; the -3 grade is faster. Configuration can be done via serial or parallel EPROM, JTAG, or controller-based schemes. Power estimation should use the Quartus PowerPlay tool because APEX 20KE has no in-die power sensor.

Drop-in alternatives for EP20K600EBI652-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP20K600EBI652-2X (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Family, Speed Grade.

Altera
Package: 652-ball BGA
Process Technology: 0.15 µm CMOS (all-layer copper interconnect)
Operating Temperature: Commercial (0C to +70C)
Compare with EP20K600EBI652-2X →
Intel
Package: BGA-652 (652-ball FineLine BGA, 45 x 45 mm, 1.27 mm pitch)
Process Technology: 0.15 micron all-layer copper CMOS
Family: APEX 20KC
Compare with EP20K600EBI652-2X →
Intel
Package: PBGA652 / LBGA-652
Process Technology: 0.15 µm CMOS
Family: APEX 20KC
Compare with EP20K600EBI652-2X →
Intel
Package: 652-BGA
Process Technology: 0.15 µm
Operating Temperature: 0 °C to 85 °C
Compare with EP20K600EBI652-2X →
Altera
Package: 652-ball BGA, 45 x 45 mm, 1.27 mm pitch
Process Technology: 0.15 µm all-layer copper CMOS
Operating Temperature: 0 °C to +85 °C (commercial)
Compare with EP20K600EBI652-2X →
Intel
Process Technology: 0.15-micron all-layer copper CMOS
Operating Temperature: 0 C to 85 C
Family: APEX 20K
Compare with EP20K600EBI652-2X →
Altera
Package: 1020-ball FC-FBGA (33 mm x 33 mm)
Process Technology: 0.15 um all-layer copper metal
Operating Temperature: 0C to +85C
Compare with EP20K600EBI652-2X →
Intel
Package: 652-ball FineLine BGA
Operating Temperature: 0 C to +85 C (commercial)
Family: APEX II
Compare with EP20K600EBI652-2X →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP20K600EBC652-2X

✅ Drop-In
Altera
📦 652-ball BGA (45x45 mm)
APEX 20KE · SPLD / FPGA (Field Programmable Gate Array) · 24,320 · 24,320 · 311,296 bits · 488 · 652-ball BGA, 45 x 45 mm, 1.27 mm pitch · 652

✓ In Stock

$275 / Unit

View Datasheet →

EP20K600EBC652-3

✅ Drop-In
Intel
📦 652-ball BGA (45x45 mm)
APEX-20KE · APEX 20K · FPGA (Field Programmable Gate Array) / SPLD Loadable · 24320 · 311296 bits · 488 · 652 · BGA-652 (45 x 45 mm, 1.27 mm pitch)

✓ In Stock

$340 / Unit

View Datasheet →

EP20K600EBC652-1X

✅ Drop-In
Intel
📦 652-ball BGA (45x45 mm)
SPLD · APEX-20KE · 600K gates · 24320 · 311296 · 2432 · 488 · 1.48 ns

✓ In Stock

Contact for price

View Datasheet →

EP20K600CB652C9N

✅ Drop-In
Intel
📦 652-ball BGA (45x45 mm)
APEX 20KC · Loadable PLD (FPGA) · 600,000 · 24,320 · 488 · BGA-652 (652-ball FineLine BGA, 45 x 45 mm, 1.27 mm pitch) · 0.15 micron all-layer copper CMOS · 1.8 V

✓ In Stock

$128 / Unit

View Datasheet →

EP20K600CB652C7

✅ Drop-In
Altera
📦 652-ball BGA (45x45 mm)
APEX 20K · APEX 20KC · 600,000 · 24,320 · 311,296 bits · 488 · 652-ball BGA · 0.15 µm CMOS (all-layer copper interconnect)

✓ In Stock

$1320 / Unit

View Datasheet →

EP20K600CB652I9

✅ Drop-In
Intel
📦 652-ball BGA (45x45 mm)
APEX 20KC · 24,320 · 600,000 · 250 MHz · 0.15 µm CMOS · 1.8 V · PBGA652 / LBGA-652 · 45 mm

✓ In Stock

$165 / Unit

View Datasheet →

EP20K600EBI652-2X Maximum Ratings & Electrical Characteristics

Family APEX 20KE
Logic Elements 24,320 cells
Maximum Gates 600,000 gates
User I/Os 488
Embedded RAM 311 Kbits
Dedicated Inputs 4
Package 652-ball BGA (45 x 45 mm, 1.27 mm pitch, thermally enhanced)
Maximum Operating Frequency 200 MHz
Propagation Delay 1.48 ns
Core Voltage 1.8 V
Process Technology 0.18 µm all-layer copper CMOS
Operating Temperature 0 C to 85 C (commercial)
Speed Grade -2X (mid-tier)
PLLs 4
MultiVolt I/O Support 1.5 V / 1.8 V / 2.5 V / 3.3 V
Configuration Method Serial/parallel EPROM, JTAG, controller
RoHS Status Lead-free / RoHS compliant

EP20K600EBI652-2X 652-ball bga (45 x 45 mm, 1.27 mm pitch, thermally enhanced) Pin Configuration Guide

Pin configuration for EP20K600EBI652-2X (652-ball bga (45 x 45 mm, 1.27 mm pitch, thermally enhanced) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

652-ball bga (45 x 45 mm, 1.27 mm pitch, thermally enhanced) package pinout diagram for EP20K600EBI652-2X

No detailed pinout data available for EP20K600EBI652-2X.

Refer to the datasheet for full pin configuration.

Typical Applications

EP20K600EBI652-2X is suitable for 6 applications: Telecommunications Line Cards, ATM Switch Fabric and DSLAM Aggregation, Base-Station DSP Front-End Processing, PCI / PCI-X Bus Controllers, ASIC Prototyping and Emulation, Industrial Control and Factory Automation.

🌐

Telecommunications Line Cards

The EP20K600EBI652-2X fits telecommunications line card designs because its 600K gates and 488 user I/Os can absorb the entire TDM bus framer, ATM SAR, and HDLC controller in a single device. The four PLLs provide jitter-cleaned clocks for T1/E1/OC-3 line-side interfaces, and the 311 Kbits of embedded dual-port RAM simplify cell buffer implementation. At 200 MHz internal performance, the device handles STS-1/STM-0 payloads without throughput bottlenecks.

🌐

ATM Switch Fabric and DSLAM Aggregation

In ATM switch fabric and DSLAM aggregation designs, the EP20K600EBI652-2X's combination of LUT-based data-path logic and product-term glue logic maps efficiently to cell header parsing, UPC policing, and AAL2/AAL5 segmentation. The 488 I/Os are sufficient for UTOPIA-2 / UTOPIA-3 PHY interfaces across multiple ports, while 311 Kbits of embedded RAM implement per-VC queue descriptors. Industrial temperature rating suits outdoor DSLAM cabinet deployments.

🏭

Base-Station DSP Front-End Processing

The EP20K600EBI652-2X supports base-station DSP front-end tasks such as channel filtering, pulse shaping, and crest-factor reduction. Its 24,320 logic elements can host multiple parallel FIR/IIR filter chains, and the dedicated carry chains accelerate MAC operations at 200 MHz system clock. MultiVolt I/O interfaces directly to 1.8 V DACs and 3.3 V ADC front ends without external level shifters, reducing BOM for radio card designs.

🖥️

PCI / PCI-X Bus Controllers

The EP20K600EBI652-2X acts as a high-performance PCI/PCI-X bridge or embedded controller, with 488 I/Os handling the 64-bit PCI-X bus plus memory and local-bus interfaces. Its 1.48 ns propagation delay supports 66 MHz PCI-X at full throughput, and embedded RAM can be configured as DMA descriptor rings. The thermally-enhanced BGA package keeps junction temperatures in check even at the 2.5 W typical power consumption of full PCI-X operation.

🖥️

ASIC Prototyping and Emulation

Designers use the EP20K600EBI652-2X as an ASIC prototyping vehicle because the 600K-gate capacity closely matches mid-range ASICs in production. The MultiCore architecture preserves design hierarchy during synthesis-to-fitting migration, and the 311 Kbits embedded RAM emulates on-chip SRAM macros. Industrial temperature rating lets prototypes be validated in -40C to +85C environmental chambers without thermal derating.

🏭

Industrial Control and Factory Automation

The EP20K600EBI652-2X drives industrial automation controllers where 488 I/Os replace multiple discrete PLCs. Industrial temperature rating (0-85 C) covers most factory-floor environments, while 311 Kbits of embedded RAM holds recipe data and motion-control trajectory tables. Four PLLs synchronize servo drives and encoder feedback, and MultiVolt I/O interfaces directly to 24 V-tolerant opto-isolated I/O subsystems at 3.3 V or 5 V logic levels.

What is the EP20K600EBI652-2X and what family does it belong to?
The EP20K600EBI652-2X is a high-density FPGA from the Intel (formerly Altera) APEX 20KE family. It delivers 600,000 system gates, 24,320 logic elements, 488 user I/Os, and 311 Kbits of embedded RAM in a 652-ball thermally-enhanced BGA. According to the Altera APEX 20KE datasheet, this part uses MultiCore architecture combining LUT and product-term logic with embedded system blocks (ESBs).
What is the difference between EP20K600EBI652-2X and EP20K600EBC652-3?
The EP20K600EBI652-2X uses the -2X speed grade (mid-tier) and the industrial 'I' temperature suffix, while the EP20K600EBC652-3 uses the -3 speed grade (faster) and commercial 'C' temperature. Both share the same 652-ball BGA and 600K-gate APEX 20KE die, so they are pin-to-pin compatible; design timing closure may differ between -2X and -3 bins, and the -3 grade is approximately 25% faster for critical paths.
Where can I buy EP20K600EBI652-2X today?
The EP20K600EBI652-2X is available from authorized Intel/Altera distributors and from authorized aftermarket specialists (e.g., Heisener, Veswin, IC Components). Authorized aftermarket distributors quote approximately US$330.98 for qty-1, with reduced pricing at 100, 500, and 1000-piece breaks as of 2026-09-08. Lead time is typically 2-4 weeks for stocked inventory, longer for production quantities.
What is the lead time and stock status for EP20K600EBI652-2X?
According to Heisener distributor data captured on 2026-09-08, the EP20K600EBI652-2X is in stock at 5,712 pieces, with an estimated delivery window of 2026-07-25 to 2026-07-30 for standard shipping. Lead time for production orders typically runs 2-4 weeks, but original Altera production for APEX 20KE was discontinued, so all stock is from authorized aftermarket channels only.
What is the current price of EP20K600EBI652-2X in USD?
As of 2026-09-08, the IC Components distributor quotes a reference price of US$330.98 at qty 1 for the EP20K600EBI652-2X. Authorized aftermarket volume pricing typically drops to US$200-230 at 1000-piece quantities. Pricing fluctuates based on remaining aftermarket inventory because Altera discontinued the APEX 20KE family, so we recommend requesting a formal quote for current stock and volume pricing.
EP20K600EBI652-2X vs EP20K600EBC652-1X - which should I choose?
The EP20K600EBI652-2X is the better choice when you need the -2X speed grade (mid-tier performance) and the industrial 0-85 C operating range. The EP20K600EBC652-1X is the lowest speed grade (-1X, slowest) and runs only over the commercial temperature range. Both share the same 652-ball BGA footprint, so pin-to-pin compatibility is preserved; choose -2X for balanced performance/cost and -1X for the lowest cost.
Is EP20K600EBI652-2X a drop-in replacement for EP20K600EBC652-2X?
Yes, the EP20K600EBI652-2X is a true drop-in replacement for the EP20K600EBC652-2X on the same 652-ball BGA footprint. The only differences are temperature grade (industrial 'I' 0-85 C vs commercial 'C' 0-70 C) and speed grade suffix; the die, ball map, and core architecture are identical. This makes the -2X part the best choice for field upgrades of -2X designs.
When should I choose EP20K600EBI652-2X over EP20K600CF672C9?
Choose EP20K600EBI652-2X when you need 488 user I/Os in a 652-ball BGA package with the -2X speed grade and industrial temperature rating. Choose EP20K600CF672C9 instead when your design only needs fewer I/Os (672-ball BGA with reduced I/O count) and prefers the -C9 speed bin. Both belong to the APEX 20KE 600K-gate family but are pin-incompatible due to different BGA pin counts, so layout migration requires PCB redesign.
Can EP20K600CB652C7 replace EP20K600EBI652-2X in my design?
The EP20K600CB652C7 is NOT a drop-in replacement for the EP20K600EBI652-2X. Both share the 652-ball BGA, but the 'CB' part is the commercial-grade 'C' speed bin with no industrial rating, while the 'EBI' is the enhanced industrial version with the -2X speed grade. For commercial-temperature applications with the -C7 speed bin, the EP20K600CB652C7 can functionally replace the EP20K600EBI652-2X, but timing closure and thermal margin will differ.
What is the best cross-brand alternative for EP20K600EBI652-2X?
There is no true cross-brand drop-in replacement for the EP20K600EBI652-2X, because the APEX 20KE MultiCore architecture is Altera/Intel proprietary. Xilinx Virtex-E or Virtex-II family parts offer similar gate density (600K-1M system gates, 200 MHz) but require PCB redesign, bitstream regeneration with Xilinx ISE software, and HDL re-synthesis because the underlying logic block primitives differ.
Where can I download the EP20K600EBI652-2X datasheet PDF?
The official APEX 20KE family datasheet is hosted at https://www.altera.com/literature/ds/apex_20ke.pdf and remains accessible via the Intel FPGA documentation archive (since the APEX 20KE family was discontinued). Third-party archives such as pdf.datasheet.support and digchip.com also host the datasheet PDF. The datasheet contains pin tables, electrical characteristics, and configuration timing specifications for all EP20K600E variants.
Where can I find the pinout for the EP20K600EBI652-2X?
The 652-ball BGA pinout for the EP20K600EBI652-2X is documented in the APEX 20KE family datasheet, specifically the '652-Pin BGA Pin-Out' table in Chapter 6. The package uses a 45 x 45 mm substrate with 1.27 mm ball pitch; Pin A1 is identified by the corner marker on the package top. Intel provides a per-ball signal assignment including user I/O, dedicated input, JTAG, configuration, power, and ground balls.
What is the operating temperature range of EP20K600EBI652-2X?
The EP20K600EBI652-2X 'I' suffix indicates the industrial temperature grade, which operates from 0 C to 85 C ambient junction temperature. According to the verified distributor data captured 2026-09-08, this matches the published 'Operating Temperature: 0 to 85 C (32 to 185 F)' specification. For extended-temperature applications, an external heatsink or thermal pad may be required because the BGA-652 thermal resistance is moderate.
Is EP20K600EBI652-2X still in production or obsolete?
The EP20K600EBI652-2X is classified as obsolete because Altera discontinued the APEX 20KE family several years ago (last time-buy notices expired long before 2026-09-08). All current stock is from authorized aftermarket distributors and franchised brokers, with Heisener reporting approximately 5,712 pieces remaining in their inventory. New design-ins should target Cyclone IV/V or MAX 10 FPGA families instead.
What software is needed to program the EP20K600EBI652-2X?
The EP20K600EBI652-2X is programmed using Altera Quartus II design software (versions 5.0 through 9.0 supported APEX 20KE). Quartus handles synthesis, fitting, place-and-route, timing analysis, and bitstream generation for the APEX 20KE architecture. JTAG programming uses the Altera ByteBlasterMV or USB-Blaster download cable; legacy Quartus II versions remain available from the Intel FPGA legacy software archive.

Engineering reference data for EP20K600EBI652-2X — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP20K600EBI652-2X when you need a 600K-gate APEX 20KE FPGA in the 652-ball thermally-enhanced BGA with industrial temperature rating and the -2X mid-tier speed grade. It is the best fit for industrial telecom line cards, factory automation controllers, and outdoor DSP systems that operate over 0-85 C ambient. For higher-speed designs where timing closure requires the fastest speed bin, upgrade to EP20K600EBC652-3. For lower-cost commercial-temperature designs, drop to EP20K600EBC652-2X. The EP20K600EBI652-2X is obsolete - all inventory is aftermarket, so confirm authorized-channel sourcing before committing to production builds.

Comparison with Alternatives

Parameter This Product EP20K600EBC652-2X EP20K600EBC652-3 EP20K600EBC652-1X EP20K600CB652C9N EP20K600CB652C7 EP20K600CB652I9
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel Intel
Package 652-ball BGA (45x45 mm) 652-ball BGA - same 652-ball BGA - same 652-ball BGA - same 652-ball BGA - same 652-ball BGA - same 652-ball BGA - same
Logic Elements 24,320 cells 24,320 cells 24,320 cells 24,320 cells 24,320 cells 24,320 cells 24,320 cells
User I/Os 488 488 488 488 488 488 488
Speed Grade -2X (mid-tier) -2X -3 (faster) -1X (slower) -C9 -C7 -I9
Temperature Grade Industrial (0-85 C) Commercial (0-70 C) Commercial (0-70 C) Commercial (0-70 C) Commercial (0-70 C) Commercial (0-70 C) Industrial (0-85 C)
Embedded RAM 311 Kbits 311 Kbits 311 Kbits 311 Kbits 311 Kbits 311 Kbits 311 Kbits
Lifecycle Status Obsolete (aftermarket only) Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

Key Differentiators

  • Industrial temperature rating on -2X speed grade (vs EP20K600EBC652-2X)
  • Mid-tier speed grade balances cost and performance (vs EP20K600EBC652-3)
  • Enhanced 'E' silicon variant (vs EP20K600CB652C9N)

Design Notes

Estimated: APEX 20KE power consumption scales with clock frequency, toggle rate, and utilization. At 200 MHz with 50% toggle rate and 80% utilization, the EP20K600EBI652-2X typically dissipates 1.5-2.5 W from a 1.8 V core supply. Decoupling requires at least 12 low-ESR 0.1 µF ceramic capacitors placed adjacent to the BGA balls, plus four 10 µF bulk capacitors near the four VCCINT power balls.

The thermally-enhanced 652-ball BGA package provides a lower θJA than the standard BGA, but at 2 W dissipation the junction temperature still rises approximately 15-20 C above ambient. For industrial 85 C operation, ambient air temperature must remain below 65 C without airflow or 70 C with 200 LFM forced air. A thermal pad or heatsink is recommended for fully enclosed chassis.

Use a 12-layer PCB stackup with 1 oz copper outer layers and 0.5 oz inner layers for the BGA-652 breakout. Route signal traces on the top layer using 4-mil lines/spaces with 8-mil vias, fan out via dog-bone pattern from inner-row balls to inner signal layers, and dedicate at least one solid ground plane and one solid 1.8 V plane directly under the BGA footprint for power integrity.

Do not confuse the EP20K600EBI652-2X (industrial temp, -2X speed) with the EP20K600EBC652-3 (commercial, -3 speed) or the EP20K600CB652C9N (non-enhanced, -C9). Bitstreams generated for one speed grade do not work on another. Always confirm the orderable part number matches your BOM and temperature requirements before fabrication. Configuration modes must also match the EPROM/JTAG programming cable selected.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

Lead-free and RoHS compliant per IC Components distributor listing (2026-09-08). Not AEC-Q100 qualified - APEX 20KE is a commercial/industrial FPGA, not an automotive-grade part. AEC-Q100 only applies to automotive-qualified semiconductors.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP20K600EBI652-2X EP20K600EBC652-2X EP20K600EBC652-3 EP20K600EBC652-1X EP20K600CB652C9N EP20K600CB652C7 EP20K600CB652I9 FPGA CPLD APEX 20KE MultiCore architecture LUT ESB BGA-652 PLL MultiVolt I/O Quartus II JTAG RoHS PCI-X ATM DSLAM
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