EP20K600EBC652-2X - APEX 20KE FPGA, 24,320 LEs, 652-BGA | Altera
MPN: EP20K600EBC652-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $355 | $35,500.00 |
| 500 | $310 | $155,000.00 |
| 1,000 | $275 | $275,000.00 |
EP20K600EBC652-2X Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be electrically reconfigured after manufacturing to implement custom digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which also include SPLDs, CPLDs, and PALs, and they are the most flexible members of that family. APEX 20KE devices combine FPGA fabric with embedded system-on-a-chip features including embedded memory blocks and a MultiCore architecture, enabling high-density data-path and control designs.
Key features of the EP20K600EBC652-2X include a 1.48 ns propagation delay at the speed-grade-2 corner, 488 user I/Os distributed across 8 I/O banks, 4 PLL-style clock management circuits (Lock and FastCLK), and embedded array blocks (EABs) for on-chip memory. The device supports JTAG (IEEE 1149.1) boundary-scan testing and is built on a 2.5 V core supply with multi-voltage I/O standards including LVTTL, LVCMOS, PCI, SSTL, and GTL+ for high-speed memory and backplane interfaces. Configuration is supported via passive serial, passive parallel, and JTAG modes.
The EP20K600EBC652-2X uses CMOS technology with a 0.15 µm process geometry and operates over the commercial temperature range of 0 °C to 85 °C. The PLD designation in the part number reflects the APEX 20KE family signature, and the speed grade '2' indicates the device is the second-fastest bin in the family, suitable for designs requiring both high logic capacity and timing margin.
Typical applications include high-speed telecommunications switching, ASIC prototyping, multi-channel data buffering, glue-logic integration in DSP and processor boards, and high-throughput parallel processing pipelines. Designers often choose this device for legacy industrial and telecom systems where APEX 20KE reference flows are still maintained.
When designing with this device, verify availability and lifecycle status before committing to new production: the APEX 20KE family has been superseded by Cyclone and Arria device families, so long-term supply planning and last-time-buy evaluation are essential. Use Altera (Intel) Quartus II or the legacy MAX+PLUS II toolchain for design entry.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that are not consolidated in the original manufacturer datasheet, giving engineers a faster path to a verified design decision.
Drop-in alternatives for EP20K600EBC652-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K600EBC652-2X (same form factor and footprint) — differing in Process Technology, Operating Temperature, Package, RoHS Status, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K600EBC652-1X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP20K600EBC652-1X
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP20K600EBC652-3X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K600EBI652-2X
✅ Drop-In✓ In Stock
$198.59 / Unit
View Datasheet →EP20K600EBC652-2X Maximum Ratings & Electrical Characteristics
| Device Family | APEX 20KE |
| Device Type | SPLD / FPGA (Field Programmable Gate Array) |
| Logic Elements (LEs) | 24,320 |
| Macros | 24,320 |
| Embedded Memory Bits | 311,296 bits |
| User I/Os | 488 |
| Package | 652-ball BGA, 45 x 45 mm, 1.27 mm pitch |
| Total Pins / Balls | 652 |
| Propagation Delay | 1.48 ns |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Core Supply Voltage | 2.5 V |
| I/O Standard Support | LVTTL, LVCMOS, PCI, SSTL, GTL+ |
| Configuration Modes | Passive serial, passive parallel, JTAG (IEEE 1149.1) |
| Mounting Type | Surface Mount |
EP20K600EBC652-2X 652-ball bga, 45 x 45 mm, 1.27 mm pitch Pin Configuration Guide
Pin configuration for EP20K600EBC652-2X (652-ball bga, 45 x 45 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K600EBC652-2X.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K600EBC652-2X is suitable for 6 applications: Telecommunications Switching, ASIC Prototyping, DSP Co-Processing and Glue Logic, Industrial Control and Factory Automation, Military and Aerospace Legacy Systems, Test and Measurement Instrumentation.
Telecommunications Switching
The EP20K600EBC652-2X fits telecom switching line cards because it provides 24,320 logic elements, 311 Kbits of embedded memory, and 488 user I/Os - sufficient to implement multi-channel serial-link aggregation, packet classification, and forwarding-table lookups in a single device. The 1.48 ns propagation delay at speed grade 2 supports 66 MHz-100 MHz backplane operation, while the LVTTL/SSTL/GTL+ I/O standards directly interface to legacy telecom backplanes. Compared with a multi-device CPLD implementation, a single APEX 20KE part reduces board area and BOM cost on legacy line cards still maintained in service provider networks.
Recommended
ASIC Prototyping
With 24,320 LEs and rich embedded memory, the EP20K600EBC652-2X is widely used as an ASIC prototyping vehicle for designs that target gate-arrays in the 200K-300K usable-gate range. Designers map ASIC RTL into APEX 20KE fabric using Quartus II synthesis, then validate at-speed before committing to mask tooling. The 488 user I/Os break out enough signals to expose a complete ASIC I/O ring on bench validation hardware, and the 1.48 ns propagation delay enables realistic timing-closure studies.
Recommended
DSP Co-Processing and Glue Logic
The EP20K600EBC652-2X serves as a co-processor companion to TI or Analog Devices DSPs, implementing glue logic, custom peripheral controllers, and FIR/FFT accelerators that offload the DSP's I/O bandwidth. The 311 Kbits of embedded EAB memory and 488 I/Os make the part well suited to buffering high-speed serial data streams between the DSP and external memory. The 0.15 µm CMOS process keeps dynamic power within tolerable limits for multi-card DSP shelves in industrial and defence systems.
Recommended
Industrial Control and Factory Automation
In factory-automation controllers, the EP20K600EBC652-2X integrates multi-axis motion-control state machines, encoder interfaces, and fieldbus glue logic into a single PLD, replacing racks of 74-series logic. The 488 user I/Os handle dozens of quadrature encoders, limit-switch inputs, and PWM outputs without external multiplexing. Industrial designers should specify the EP20K600EBI652-2X (industrial temperature grade) for factory-floor deployments where ambient temperatures exceed the commercial 0 °C to +85 °C window of the -2X suffix part.
Recommended
Military and Aerospace Legacy Systems
Many defence and aerospace platforms adopted the APEX 20KE family in the early 2000s and continue to require the EP20K600EBC652-2X for sustaining engineering on long-life platforms. The device's 652-ball BGA and Quartus II design flow are validated against extensive field history, lowering the risk of re-spinning flight hardware. Designers should confirm date code and lot origin during procurement, given the part's obsolete lifecycle status.
Recommended
Test and Measurement Instrumentation
The EP20K600EBC652-2X underpins custom protocol analysers, logic-analyzer pattern generators, and ATE load-board controllers where its 488 I/Os and embedded memory enable deep stimulus-and-response capture. The 1.48 ns speed grade supports pattern rates up to ~150 MHz, and the JTAG-based configuration simplifies ATE fixture bring-up. The part is also used in legacy VXI/PXI instruments still deployed in production test cells.
Recommended
Recommended Products Summary
Engineering reference data for EP20K600EBC652-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K600EBC652-1X | EP20K600EBC652 | EP20K600EBC652-3X | EP20K600EBI652-2X |
|---|---|---|---|---|---|
| Package | 652-ball BGA, 45 x 45 mm, 1.27 mm pitch | 652-ball BGA, 45 x 45 mm, 1.27 mm pitch - same | 652-ball BGA, 45 x 45 mm, 1.27 mm pitch - same | 652-ball BGA, 45 x 45 mm, 1.27 mm pitch - same | 652-ball BGA, 45 x 45 mm, 1.27 mm pitch - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Elements | 24,320 | 24,320 - same | 24,320 - same | 24,320 - same | 24,320 - same |
| User I/Os | 488 | 488 - same | 488 - same | 488 - same | 488 - same |
| Embedded Memory | 311,296 bits | 311,296 bits - same | 311,296 bits - same | 311,296 bits - same | 311,296 bits - same |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C - same | 0 °C to +85 °C - same | 0 °C to +85 °C - same | -40 °C to +100 °C (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-package drop-in with identical 1.48 ns propagation delay and industrial temperature grade (vs EP20K600EBI652-2X)
- Highest speed-grade variant in the APEX 20KE 600 KLE 652-BGA family (vs EP20K600EBC652-3X)
- Maximum APEX 20KE logic density in the 652-ball BGA form factor (vs EP20K400EBC652-2X)
Design Notes
The 652-ball BGA at 1.27 mm pitch requires controlled-impedance PCB stack-up design with matched-length routing on critical interfaces. Use a minimum 4-layer PCB with dedicated ground and 2.5 V power planes directly beneath the BGA, plus 0.1 µF + 10 µF decoupling within 5 mm of each power-ball cluster. The BGA thermal pad must be soldered to a thermal via array (0.3 mm vias in a 1.0 mm grid) tied to an internal ground plane for heatsinking.
The 1.48 ns propagation delay supports synchronous operation up to ~150 MHz on internal logic, but I/O timing is constrained by the selected I/O standard. SSTL and GTL+ I/Os require external VTT termination resistors and length-matched routing. LVTTL outputs driving more than 4 cm of trace should be series-terminated with a 33 Ω resistor placed within 7 mm of the BGA ball.
Do not confuse the EP20K600EBC652-2X (652-ball BGA, 1.27 mm pitch) with the EP20K600CB652 series (different ball assignment in some speed grades) or the EP20K600CF672 (672-ball BGA in a 27 × 27 mm package, NOT pin-compatible). Verify the exact ball map from the APEX 20KE datasheet before laying out a replacement footprint. Also confirm configuration mode (passive serial vs passive parallel vs JTAG) matches the existing PCB's PROM and DONE LED circuitry.
Estimated: at 100% resource utilisation toggling at 100 MHz I/O toggling, internal junction temperature rise is approximately 15-20 °C above ambient on the standard 652-ball BGA with a properly soldered thermal via array. At full commercial 85 °C ambient the device remains within spec. For sealed enclosures with limited airflow, specify the industrial-grade EP20K600EBI652-2X instead of the commercial EP20K600EBC652-2X to retain thermal margin.
Compliance Information
RoHS, REACH, lead-free, halogen-free and conflict-mineral status were not stated in the Verified Web Data provided for this obsolete Altera APEX 20KE device. The part is in the obsolete lifecycle phase per Intel's product discontinuation notice; consult Intel's official PCN for the latest compliance attestations.
