EP2A15B652C7 - APEX II FPGA, 1.5M Gates | Intel | Legacy PLD
MPN: EP2A15B652C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $128.5 | $1,285.00 |
| 100 | $112 | $11,200.00 |
| 500 | $95.75 | $47,875.00 |
| 1,000 | $82.4 | $82,400.00 |
EP2A15B652C7 Overview
An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose logic function is defined after manufacturing by a configuration bitstream loaded into on-chip SRAM cells. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which also include CPLDs and PALs. APEX II FPGAs specifically target high-density system-on-chip integration, embedding RAM, ROM, and arithmetic logic into the same fabric so that designers can implement entire subsystems - PCI bridges, DSP datapaths, protocol controllers - on a single device.
Key features include 1.5M typical gates (approximately 30K logic elements), dedicated LVDS-capable I/O, MultiCore hot-socketing allowing live insertion into a backplane without disturbing system operation, and embedded array blocks (EABs) for efficient RAM/ROM and product-term logic implementation. The FastTrack continuous routing fabric provides predictable timing across the die. The -7 speed grade corresponds to roughly 200 MHz internal performance, suitable for protocol processing, PCI bus interfaces, and high-throughput DMA controllers.
Architecturally, the APEX II family combines a lookup-table (LUT) based logic array with embedded system blocks. Each ESB can be configured as a 4096-bit memory block or as a logic expansion region, and the LUT-based MegaLAB structure aggregates logic into rows and columns linked by the FastTrack routing. Configuration is volatile SRAM, requiring an external configuration memory (EPC or compatible) at power-up. The device supports multi-voltage I/O standards via dedicated bank supply pins (VCCINT for core, VCCIO for I/O banks).
Typical applications include high-speed telecommunications backplanes, PCI/PCI-X bridge implementations, SDR/DSP baseband processors, networking routers, and high-performance custom computing accelerators. The 652-ball BGA package suits designs that need maximum I/O count for parallel buses or multiple high-speed serial channels. The commercial temperature grade (suffix "C7") targets lab, test, and indoor industrial environments rather than automotive or military ranges.
When designing with EP2A15B652C7, engineers should use the Quartus II design suite (legacy Altera toolchain), which provides synthesis, place-and-route, timing analysis, and bitstream generation. Because APEX II is a mature/legacy family, designers should confirm long-term availability and lifecycle status before committing to new production runs.
Drop-in alternatives for EP2A15B652C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A15B652C7 (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Logic Elements, Configuration Method, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A25B652C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$285 / Unit
View Datasheet →EP2A40B652C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →EP2A15B652C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$99.5 / Unit
View Datasheet →EP2A15B652I7
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K600EBC652-3
✅ Drop-In✓ In Stock
$340 / Unit
View Datasheet →EP2A15B652C7 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements | 30000 (approx) |
| Typical Gates | 1.5 million |
| Process Technology | 0.18 micron CMOS |
| Embedded System Blocks (ESB) | Yes - configurable as RAM/ROM or product-term logic |
| Configuration Method | SRAM-based, requires external configuration memory |
| Speed Grade | -7 |
| Operating Temperature | 0C to +85C (commercial, suffix C7) |
| Package | 652-ball BGA |
| Mounting Type | Surface Mount |
| Hot Socketing Support | Yes (MultiCore hot-socketing) |
| Design Tool | Quartus II (legacy) |
EP2A15B652C7 Pin Configuration
| Pin A1 | I/O — General-purpose user I/O (bank dependent) |
| Pin B1 | I/O — General-purpose user I/O |
| Pin C1 | I/O — General-purpose user I/O |
| Pin D1 | I/O — General-purpose user I/O |
| Pin A26 | GND — Ground |
| Pin B26 | VCCINT — Core supply voltage |
| Pin AA1 | I/O — General-purpose user I/O |
| Pin AB1 | I/O — General-purpose user I/O |
| Pin AE25 | VCCIO — I/O bank supply voltage |
| Pin AE26 | GND — Ground |
| Pin MSEL0 | MSEL0 — Configuration mode select (configuration scheme selection) |
| Pin MSEL1 | MSEL1 — Configuration mode select |
| Pin nCONFIG | nCONFIG — Configuration control (active-low) |
| Pin nSTATUS | nSTATUS — Configuration status (active-low) |
| Pin CONF_DONE | CONF_DONE — Configuration complete (open-drain) |
| Pin DCLK | DCLK — Configuration clock input |
| Pin DATA0 | DATA0 — Configuration data input |
| Pin TDI | TDI — JTAG test data in |
| Pin TDO | TDO — JTAG test data out |
| Pin TCK | TCK — JTAG test clock |
| Pin TMS | TMS — JTAG test mode select |
Typical Applications
EP2A15B652C7 is suitable for 6 applications: Telecommunications Backplane Bridging, PCI/PCI-X Bus Bridge Implementation, DSP Baseband Signal Processing, Industrial Networking Router, Test and Measurement Instrumentation, Legacy Military/Aerospace Avionics Interface.
Telecommunications Backplane Bridging
The EP2A15B652C7 is well-suited for telecom backplane bridging applications where 1.5M gates and high I/O count are required. The 652-ball BGA exposes hundreds of user I/O pins, enough to implement parallel data buses, clock distribution networks, and protocol bridges simultaneously. APEX II's FastTrack continuous routing fabric delivers predictable timing closure across the die, which is critical for backplane protocols like H.110 CT Bus, TDM switching fabrics, and proprietary telecom interfaces operating above 50 MHz. MultiCore hot-socketing allows live insertion of line cards into an active chassis without disturbing traffic. The -7 speed grade supports internal frequencies around 200 MHz, suitable for serial-to-parallel converters and T1/E1 framers. Quartus II legacy toolchain includes reference designs for telecom bridging IP cores.
Recommended
PCI/PCI-X Bus Bridge Implementation
The EP2A15B652C7 historically served as a PCI/PCI-X bridge controller in embedded computing platforms. The 652-ball BGA provides sufficient I/O for 64-bit PCI-X bus interface at 133 MHz plus sideband signals, while the 1.5M-gate capacity fits the bridge state machine, FIFO buffers, and configuration header registers. APEX II ESBs (Embedded System Blocks) can be configured as dual-port RAM to implement transaction FIFOs without consuming logic resources. The -7 speed grade comfortably meets 133 MHz PCI-X timing, and Quartus II includes the altpcix_megacore IP. For new designs, designers should evaluate this use case against modern Intel Cyclone or Arria FPGAs which integrate hard PCI Express IP.
Recommended
DSP Baseband Signal Processing
The EP2A15B652C7 supports baseband DSP functions such as FIR filtering, FFT computation, and channel coding in software-defined radio platforms. APEX II's combination of LUT-based logic and ESBs enables efficient implementation of multiplier-accumulator arrays using distributed arithmetic, with ESBs configured as coefficient ROMs. The 1.5M-gate density fits mid-complexity OFDM modem datapaths. FastTrack interconnect provides predictable routing delay essential for pipelined DSP at 100+ MHz. Hot-socketing supports field-upgradable radio modules. Note that modern FPGAs with hard DSP blocks deliver much higher MAC rates per watt, so this use case is reserved for legacy or long-lifecycle defense/industrial platforms.
Recommended
Industrial Networking Router
Industrial routers and protocol converters historically used APEX II FPGAs like the EP2A15B652C7 to implement multiple Ethernet MACs, serial protocol stacks (RS-232/422/485, CAN), and packet processing engines on a single device. The 1.5M-gate capacity fits a quad-port managed Ethernet switch fabric with VLAN tag processing and QoS queues. The 652-ball BGA provides enough I/O for multiple MII/RGMII interfaces plus expansion buses. Commercial temperature grade (0C to 85C) suits indoor industrial enclosures. Designers should note that APEX II is obsolete and new industrial designs should evaluate Intel Cyclone IV or Cyclone V with hard MACs for lower power and longer lifecycle support.
Recommended
Test and Measurement Instrumentation
Test equipment such as logic analyzers, protocol testers, and arbitrary waveform generators used APEX II FPGAs for high-speed pattern generation and data acquisition. The EP2A15B652C7's 1.5M gates fit deep pattern buffers, parallel-serial converters, and trigger logic. The 652-ball BGA enables hundreds of high-speed parallel I/O for connecting to ADCs and DACs. FastTrack interconnect ensures matched-path delays for multi-channel synchronization, critical for time-correlated measurements. Commercial temperature range suits laboratory environments. The -7 speed grade supports internal clock rates above 200 MHz, suitable for 100 MHz pattern generation with double-data-rate I/O. Quartus II legacy toolchain includes signal tap logic analyzer features for in-system debug.
Recommended
Legacy Military/Aerospace Avionics Interface
Long-lifecycle avionics platforms continue to maintain APEX II FPGA inventory for interface cards and protocol converters. The EP2A15B652C7's combination of MIL-STD-1553 bus controllers, ARINC 429 transmitters, and discrete I/O management fits within 1.5M gates. Hot-socketing supports line-replaceable unit (LRU) insertion in active racks. The 652-ball BGA suits high-density PCB designs in 6U VME or VXI form factors. Note that the EP2A15B652C7 commercial temperature variant (C7) is specified for 0C to 85C; avionics applications typically require the industrial or military temperature grade, so verify the part's operating range against the platform's environmental specification. Obsolescence planning is critical for these long-field-life programs.
Recommended
Recommended Products Summary
Engineering reference data for EP2A15B652C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A25B652C7 | EP2A40B652C7 | EP2A15B652C8 | EP2A15B652I7 | EP20K600EBC652-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 652-ball BGA | 652-ball BGA (same) | 652-ball BGA (same) | 652-ball BGA (same) | 652-ball BGA (same) | 652-ball BGA (same) |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX 20K (earlier generation) |
| Typical Gates | 1.5 million | 2.5 million | 4.0 million | 1.5 million | 1.5 million | 0.6 million |
| Speed Grade | -7 | -7 | -7 | -8 (slower) | -7 | -3 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Design Tool | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) |
Key Differentiators
- Higher density within same 652-ball BGA footprint (vs EP2A15B652C8)
- APEX II architecture is more advanced than APEX 20K (vs EP20K600EBC652-3)
- Commercial temperature variant suitable for indoor industrial use (vs EP2A15B652I7)
Design Notes
The APEX II core is powered by VCCINT (typically 1.8V) and I/O banks by VCCIO (3.3V or 2.5V depending on bank). Decoupling requires 0.1uF and 0.01uF ceramic capacitors placed within 5mm of every supply pin on the BGA. Power estimation should use the Quartus II PowerPlay tool; APEX II devices with all ESBs active and 100% toggle rate can exceed 3-4W. Bulk capacitors (47uF to 100uF tantalum or polymer) on each supply rail prevent voltage droop during configuration or simultaneous switching events.
Estimated: APEX II BGA packages have a typical theta_JA around 8-12 C/W with adequate PCB thermal vias. For continuous 2W+ dissipation in a non-airflow enclosure, a heatsink is required. BGA-652 packages benefit from a thermal pad array under the package connected to an internal copper plane with stitched vias for heat spreading. Verify junction temperature against the 0C to 85C commercial range using measured ambient and calculated theta_JA.
BGA-652 requires 1.27mm ball pitch PCB design with laser-drilled or micro-via stack-up (typical 6-8 layer board). All signal layers should reference continuous ground planes for controlled impedance (typically 50 ohm single-ended, 100 ohm differential). Length matching on high-speed buses like DDR or LVDS is critical; use serpentine routing within 25-50 mil tolerance. Confirm BGA land pattern against Altera's recommended footprint in the APEX II packaging specification document.
Configuration memory selection: APEX II requires an external EPC series configuration device (EPC2, EPC4, EPC8, or EPC16 depending on bitstream size). A common pitfall is selecting an EPC2 for a design that fills the device - the bitstream exceeds 2 Mbit. Use EPC16 for safety margin. MultiCore hot-socketing requires specific MSEL pin strapping - refer to the configuration handbook section 5. JTAG chain conflicts are common when chaining multiple APEX II devices; verify TDI/TDO ordering in the BSDL file.
DCLK (configuration clock) trace should be length-matched to DATA0 within 100 mil to avoid setup/hold violations during configuration. CONF_DONE pull-up to VCCIO requires a 10K ohm resistor; if not pulled high, the device will not enter user mode. MSEL pins must be tied to VCCIO or GND through 1K resistors, not left floating. For MultiCore designs, each device needs its own configuration memory or shares via daisy-chain configuration scheme documented in AN116.
Compliance Information
APEX II is a legacy Altera family that predates RoHS compliance standards; exact compliance status is not documented in available sources. Part is not AEC-Q100 qualified - not intended for automotive applications. Confirm RoHS/REACH status with broker when sourcing for new production.
