EP2A25F672I9N - APEX II 900K Gates FPGA, 672-FBGA | Intel
MPN: EP2A25F672I9N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 250 | $228.75 | $57,187.50 |
| 500 | $215 | $107,500.00 |
EP2A25F672I9N Overview
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, allowing the hardware logic to be redefined after manufacture. Within the broader taxonomy, APEX II devices sit between classic CPLDs (Complex Programmable Logic Devices) and high-end SoC FPGAs: a true gate-array-class programmable logic fabric with embedded memory, multipliers, and I/O, rather than a simple PLA/CPLD glue-logic device. APEX II is the predecessor to the Stratix and Cyclone families, sharing many architectural concepts (Look-Up Tables, embedded memory, fast interconnect) but in an older 0.15 µm process node.
Key features of the EP2A25F672I9N include 24,320 logic cells, embedded system blocks totaling hundreds of kbits of RAM, 4 PLLs for clock synthesis and deskew, multi-voltage I/O support with hot-socketing capability, and in-system programmability via JTAG. The device is well-suited to high-throughput parallel data-path designs, including DSP filtering, video processing, and communications protocol bridging.
Typical applications include telecommunications line-card glue logic, video and image processing pipelines, custom DSP accelerators, ASIC prototyping, and high-speed serial protocol bridges. The 672-pin FC-FBGA package provides ample I/O for wide parallel buses and multiple high-speed interfaces.
Designers should note that APEX II is a legacy family no longer in active production; design support is via the legacy Quartus II design tool. Power estimation must include both static and dynamic components, and the 1.5 V core requires tight decoupling close to each supply pin pair.
This page synthesizes distributor availability, drop-in alternatives, and practical design notes not found in a single source elsewhere.
Drop-in alternatives for EP2A25F672I9N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A25F672I9N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Operating Temperature, System Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A25F672I9
✅ Drop-In✓ In Stock
$135 / Unit
View Datasheet →EP2A25F672I8N
✅ Drop-In✓ In Stock
$198.5 / Unit
View Datasheet →EP2A25F672I7N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2A25F672C9N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A25F672I-9
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A25F672I-7
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2A25F672I9N Maximum Ratings & Electrical Characteristics
| Series | APEX II (EP2A25) |
| Family | APEX II |
| Device Type | FPGA (Field-Programmable Gate Array) |
| Logic Elements / Cells | 24,320 |
| System Gates | 900,000 (typical) |
| Process Technology | 0.15 µm CMOS |
| Maximum Internal Frequency | 236 MHz |
| Propagation Delay (tpd) | 2.23 ns |
| Core Supply Voltage (VCCINT) | 1.5 V nominal (1.425 V to 1.525 V) |
| Package | 672-pin FC-FBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +85 °C (Industrial, 'I' suffix) |
| Speed Grade | 9 (fastest commercial APEX II) |
| Embedded System Blocks (ESB) | Yes (on-chip RAM/ROM) |
| PLLs | 4 |
| Configuration | JTAG / in-system programmable |
| AEC-Q100 | not_applicable |
EP2A25F672I9N Pin Configuration
| Pin A1 | I/O — User I/O (bank-dependent VCCIO) |
| Pin A2 | I/O — User I/O |
| Pin A3 | I/O — User I/O |
| Pin A4 | VCCINT — Core supply 1.5 V |
| Pin A5 | GND — Ground |
| Pin B1 | I/O — User I/O |
| Pin B2 | I/O — User I/O |
| Pin B3 | VCCIO — I/O supply (bank-dependent) |
| Pin B4 | I/O — User I/O |
| Pin B5 | GND — Ground |
| Pin C1 | I/O — User I/O |
| Pin C2 | I/O — User I/O |
| Pin C3 | I/O — User I/O |
| Pin C4 | VCCINT — Core supply 1.5 V |
| Pin C5 | I/O — User I/O |
| Pin D1 | GND — Ground |
| Pin D2 | I/O — User I/O |
| Pin D3 | I/O — User I/O |
| Pin D4 | I/O — User I/O |
| Pin D5 | VCCINT — Core supply 1.5 V |
Typical Applications
EP2A25F672I9N is suitable for 6 applications: Telecommunications Line-Card Glue Logic, Video and Image Processing Pipelines, Custom DSP Accelerators, ASIC Prototyping and Emulation, High-Speed Serial Protocol Bridges, Legacy Industrial Control Systems.
Telecommunications Line-Card Glue Logic
The EP2A25F672I9N fits telecom line-card glue-logic roles where high I/O count and multi-protocol bridging are required. Its 24,320 logic elements and embedded system blocks can implement UTOPIA / POS-PHY interfaces, serial-to-parallel converters, and protocol state machines in parallel, while the 672-FBGA ball map exposes enough pins to drive wide parallel buses alongside serial links. The 236 MHz internal frequency and 2.23 ns propagation delay are adequate for backplane timing at telecom-grade clock rates, and the four PLLs allow multiple frequency domains to coexist on a single die. Compared with discrete logic, this part reduces board area while giving designers the flexibility to update protocol logic after deployment via JTAG reconfiguration.
Recommended
Video and Image Processing Pipelines
The EP2A25F672I9N suits video and image processing pipelines where real-time pixel-rate logic must operate on wide parallel buses. With 24,320 logic elements, embedded RAM blocks, and a 672-pin BGA exposing well over 300 user I/Os, the device can absorb color-space conversion, scaling, filtering, and overlay compositing directly at video pixel rates. The four on-chip PLLs synthesize the multiple pixel-clock and memory-clock domains typical of LCD panel timing, and the LVTTL/LVCMOS I/O standards directly drive most video DAC and encoder interfaces. Designers favor APEX II for these pipelines because the high logic density eliminates external FIFO and glue-logic devices that would otherwise complicate PCB layout.
Recommended
Custom DSP Accelerators
The EP2A25F672I9N is widely used as a custom DSP accelerator in systems where fixed-function DSPs lack throughput or flexibility. Its 24,320 logic cells can implement parallel FIR/IIR filters, FFT butterflies, and adaptive algorithms that would consume several DSP cycles on a sequential processor. Embedded system blocks provide dual-port RAM for coefficient and sample storage, and the four PLLs generate the multiple clocks needed for input sample-rate, processing core, and output data-rate domains. Industrial temperature grade and the 2.23 ns propagation delay make the part suitable for radar, sonar, and instrumentation pre-processing where deterministic logic latency matters more than absolute clock speed.
Recommended
ASIC Prototyping and Emulation
The EP2A25F672I9N is well-suited to ASIC prototyping and logic emulation because its high logic density can host substantial blocks of an ASIC RTL at near-real-time operating speeds. Engineers map ASIC gates into APEX II logic elements and ESB RAM, then iterate on RTL while running the design against real system stimuli - a workflow that catches integration bugs earlier than software simulation. The 672-FBGA exposes enough I/O to bring out wide ASIC buses, and JTAG-based in-system programmability allows rapid bitstream swaps during debug sessions. Although APEX II is older than modern emulation platforms, its price on the secondary market makes it attractive for low-cost multi-FPGA prototyping boards.
Recommended
High-Speed Serial Protocol Bridges
The EP2A25F672I9N functions as a high-speed serial-protocol bridge between incompatible PHYs or between serial links and parallel ASIC interfaces. Its 24,320 logic elements can implement serializer, deserializer, and protocol-state logic for LVDS, PCI, and custom differential interfaces, while the four PLLs synthesize the bit-rate and word-rate clocks required for clock-data recovery and parallel framing. The 672-BGA footprint supports the many dedicated clock and high-speed I/O pins that serializer/deserializer designs need, and JTAG-based in-system programmability allows field upgrades when protocol revisions appear. Industrial temperature rating ensures reliable operation in outdoor and industrial deployments.
Recommended
Legacy Industrial Control Systems
The EP2A25F672I9N remains a good fit for legacy industrial control systems already designed around the APEX II family, especially where long-term availability of a pin-compatible replacement is required. Industrial temperature rating (-40 °C to +85 °C), 4 PLLs for motor and feedback clock generation, and 24K logic elements for state-machine, PWM, and encoder logic make the device a workhorse for retrofitting old controller boards. The 672-BGA package gives designers ample I/O for parallel sensor buses and isolated high-side drivers. Because APEX II is obsolete, designers should plan a forward-migration path to a modern Intel Cyclone or Lattice ECP5 family while maintaining EP2A25F672I9N stock for service-repair continuity.
Recommended
Recommended Products Summary
Engineering reference data for EP2A25F672I9N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A25F672I9 | EP2A25F672I8N | EP2A25F672I7N | EP2A25F672C9N | EP2A25F672I-9 |
|---|---|---|---|---|---|---|
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | 9 (fastest) | 9 | 8 | 7 | 9 | 9 |
| Temperature Range | -40 to +85 C (Industrial) | -40 to +85 C | -40 to +85 C | -40 to +85 C | 0 to +85 C (Commercial) | -40 to +85 C |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Core Voltage | 1.5 V (1.425-1.525 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Pin/Ball Count | 672 | 672 | 672 | 672 | 672 | 672 |
| Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest APEX II speed grade in 672-FBGA (vs EP2A25F672I8N)
- Industrial temperature range (-40 to +85 C) (vs EP2A25F672C9N)
- Largest BGA ball count in APEX II family (vs EP2A25B652C7)
Design Notes
Estimated: at full logic utilization (24,320 LEs at the 236 MHz core clock) the EP2A25F672I9N draws roughly 1-2 W from VCCINT (1.5 V). Designers should budget 2.5-3 A on the 1.5 V rail and place at least six 0.1 µF + four 10 µF ceramic decoupling capacitors within 1 cm of the VCCINT balls; one bulk 100 µF tantalum or polymer cap near the supply pin reduces transient response to logic-block switching. VCCIO banks can draw hundreds of mA each depending on switching frequency; treat each bank as an independent rail.
Estimated: typical FC-FBGA package theta-JA of 15-20 C/W means a 2 W dissipation produces a 30-40 C junction rise. For industrial operation (-40 to +85 C ambient) the maximum allowable dissipation is approximately 1.6 W at 85 C ambient. Use at least four thermal vias under the BGA's central thermal pad array to a 2 oz inner-plane copper spreader; consider forced airflow above 1.5 W total dissipation.
Use a 1.0 mm or 0.8 mm pitch BGA breakout with via-in-pad plated over with copper (via tenting on top/bottom). Route the 1.5 V core and per-bank VCCIO as wide traces or inner-plane shapes, and place one decoupling cap per VCCINT ball and one per VCCIO ball cluster. The JTAG chain (TCK/TMS/TDO/TDI) must be brought out to a 0.1 inch header for programming; keep the JTAG trace length below 6 inches to avoid signal-integrity issues at the configuration clock rate.
Common pitfalls when designing with the EP2A25F672I9N include: (1) assuming VCCIO is universal - the device has bank-specific VCCIO voltages that must be respected per-bank, (2) ignoring the configuration sequence - APEX II requires a proper POR (power-on-reset) and configuration clock before I/O become active, (3) overlooking the speed-grade suffix in timing closure - speed grade 9 vs 7 changes Fmax by ~15-25%, and (4) using new Quartus Prime versions that have removed APEX II support - only legacy Quartus II (≤ v13.0) still compiles APEX II designs.
Compliance Information
Compliance information for EP2A25F672I9N was not provided in the verified web data; recommend referring to the official Intel/Altera APEX II material declaration or requesting a compliance letter from your broker source.
