EP2A40F672I-7 - 1.5M Gates APEX II FPGA, 672-BGA | Intel / Altera
MPN: EP2A40F672I-7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $320 | $160,000.00 |
| 1,000 | $285 | $285,000.00 |
EP2A40F672I-7 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, I/O elements, and routing interconnects that the customer programs after manufacture using an HDL (Hardware Description Language) such as Verilog or VHDL. FPGAs sit at the top of the programmable logic hierarchy, alongside CPLDs, and provide higher logic density, parallel processing, and faster time-to-market than ASICs for low-to-mid volume designs.
Key features of the EP2A40F672I-7 include 38,400 logic elements, embedded system blocks (ESBs) implementing dual-port RAM, ROM, and CAM functions, four Phase-Locked Loops (PLLs) for clock management, multi-level interconnect with DirectDrive and FastTrack routing, and a high-bandwidth I/O structure supporting LVTTL, LVCMOS, SSTL, HSTL, GTL+, and LVDS signalling. It supports PCI, PCI-X, and RapidIO interconnect standards for embedded applications.
The APEX II architecture combines logic elements (LEs), ESBs, and dedicated I/O cells on a single die with continuous high-performance routing. MultiCore interconnect with DirectDrive technology ensures predictable, deterministic timing for high-speed design paths. Four PLLs provide on-chip clock multiplication, division, phase shifting, and skew control.
Typical applications include high-speed digital signal processing (DSP), telecommunications backplanes, network switching fabrics, PCI/PCI-X bridge designs, and industrial automation controllers. The combination of large logic capacity and high-speed I/O also suits the part for use as a high-volume prototyping vehicle for ASIC designs.
When designing with the EP2A40F672I-7, attention must be paid to power sequencing, signal integrity at high toggle rates, and thermal dissipation. The 672-pin FC-FBGA package requires a 1.27 mm ball pitch PCB and Xilinx/Altera-compatible footprint.
This page synthesizes distributor availability, drop-in alternatives sourced from the same APEX II family, and engineering guidance not found in the standalone datasheet.
Drop-in alternatives for EP2A40F672I-7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40F672I-7 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Operating Temperature, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40F672I9N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP2A40F672I9
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP2A40F672I8N
✅ Drop-In✓ In Stock
$1145 / Unit
View Datasheet →EP2A40F672I8
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP2A40F672I7N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP2A40F672C7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A40F672I-7 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 38,400 |
| System Gates | 1,500,000 |
| Maximum Internal Frequency | 562 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Voltage | 1.5 V |
| Phase-Locked Loops (PLLs) | 4 |
| Package | 672-pin FC-FBGA |
| Mounting Type | Surface Mount (BGA) |
| Speed Grade | -7 |
| Operating Temperature | -40°C to +85°C (Industrial) |
| Moisture Sensitivity Level (MSL) | 3 |
| Peak Reflow Temperature | 220°C |
| Lifecycle Status | Obsolete (EOL by Altera/Intel) |
| Programming Interface | JTAG (IEEE 1149.1) |
EP2A40F672I-7 672-pin fc-fbga Pin Configuration Guide
Pin configuration for EP2A40F672I-7 (672-pin fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40F672I-7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40F672I-7 is suitable for 6 applications: High-Speed Telecommunications Backplanes, Digital Signal Processing (DSP) Front-End, PCI / PCI-X Bridge and Embedded Controller, Network Switching and Routing Fabric, ASIC Prototyping and Emulation, Industrial Automation and Motor Control.
High-Speed Telecommunications Backplanes
The EP2A40F672I-7's 562 MHz internal frequency and 38,400 logic elements make it well-suited for telecommunications backplane interfaces and protocol bridging. Its 672-pin FC-FBGA exposes sufficient I/O to support multi-channel LVDS links, RapidIO interconnect, and parallel backplane buses. The APEX II architecture's DirectDrive routing provides deterministic timing critical for serializer/deserializer (SerDes) companion logic. Industrial temperature rating (-40°C to +85°C) supports outside-plant telecom equipment.
Recommended
Digital Signal Processing (DSP) Front-End
The EP2A40F672I-7's 38,400 logic elements and embedded system blocks (ESBs) implementing dual-port RAM support high-throughput DSP functions such as FIR filtering, FFT/iFFT engines, and forward error correction (FEC). The four on-chip PLLs enable precise clock management for multi-rate sampling. Industrial temperature rating makes the part suitable for instrumentation and SDR front-ends in laboratory or outdoor environments.
Recommended
PCI / PCI-X Bridge and Embedded Controller
The EP2A40F672I-7 supports PCI (33/66 MHz) and PCI-X (66/100/133 MHz) protocols natively per the Altera APEX II datasheet. The 38,400 logic elements comfortably implement 64-bit/66 MHz PCI-X bridges, custom bus arbiters, and protocol state machines. Industrial temperature rating allows deployment in factory automation and ruggedized embedded systems where commercial-temperature parts would be marginal.
Recommended
Network Switching and Routing Fabric
The EP2A40F672I-7's 1.5M system gates and high-I/O 672-BGA package suit it for layer-2/layer-3 switching fabric implementations including TCAM lookups, packet classification engines, and queue managers. APEX II ESBs can be configured as Content Addressable Memory (CAM) for rapid MAC/IP table lookup. Industrial temperature operation supports outdoor aggregation switches and metro Ethernet nodes.
Recommended
ASIC Prototyping and Emulation
With 38,400 logic elements and 1.5M system gates, the EP2A40F672I-7 supports ASIC prototyping for chips up to roughly 500K gates (after factoring typical FPGA overhead). Multiple EP2A40F672I-7 parts can be paralleled on a multi-FPGA prototyping board using high-speed LVDS links. The industrial temperature rating also suits the part for harsh-environment emulators. Quartus II software supports the full APEX II family for HDL-based prototyping.
Recommended
Industrial Automation and Motor Control
The EP2A40F672I-7's industrial temperature range and large logic capacity support multi-axis motor control, PLC-style sequential logic, and industrial Ethernet protocols. Four PLLs synchronize to encoder feedback and PWM carrier frequencies, while the 562 MHz internal frequency enables sub-microsecond control loops. The 672-BGA package exposes sufficient I/O for multi-axis servo drives with parallel encoder and resolver interfaces.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40F672I-7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40F672I9N | EP2A40F672I8 | EP2A40F672C7 |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Speed Grade | -7 | -9 (slower) | -8 (slower) | -7 (same speed) |
| Operating Temperature | -40°C to +85°C (Industrial) | -40°C to +85°C (Industrial) | -40°C to +85°C (Industrial) | 0°C to +85°C (Commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade available in the APEX II EP2A40 family (vs EP2A40F672I8)
- Industrial temperature range for harsh environments (vs EP2A40F672C7)
- Pin-compatible upgrade path within the EP2A40 672-BGA family (vs EP2A40F1020I7)
Design Notes
The 672-pin FC-FBGA package requires a 4-layer PCB minimum with 1.27 mm ball pitch. Use microvia or via-in-pad technology to fan out signals from inner balls; standard through-hole vias will not fit between pads. Match trace impedance (50 Ω single-ended, 100 Ω differential) to the I/O standard selected. A continuous ground plane under the BGA improves thermal dissipation and signal return paths for high-speed LVDS/PECL interfaces.
Estimated: at 50% logic utilization toggling at 100 MHz, the EP2A40F672I-7 dissipates approximately 1.8 W typical per the Altera APEX II power calculator methodology. The FC-FBGA package has thermal resistance theta_JA of approximately 13°C/W with a properly designed 4-layer PCB. For continuous operation above ambient 60°C, ensure airflow of at least 200 LFM across the package. Use the Quartus II PowerPlay tool for design-specific thermal estimates.
Do not confuse EP2A40F672I-7 (APEX II, 1.5V, -7 speed grade, industrial) with EP20K600EBC652 (APEX 20K, different die) or EP2A40F1020I7 (same die, larger 1020-pin BGA package). All three share the 'EP2A40' family prefix but have different ball maps and routing. Always verify the full part number including package suffix (672 vs 1020 vs 33). The -7 suffix denotes speed grade in the APEX II family, NOT a 700-MHz rating.
Route all four global clock networks (CLK0-CLK3) as matched-length, 50 Ω controlled-impedance traces from dedicated clock input pins. Place decoupling capacitors (0.1 µF + 1 µF) within 5 mm of every VCC/GND ball pair. Use star-ground topology at the FPGA's main ground balls to avoid ground bounce during simultaneous switching outputs (SSO).
Compliance Information
Altera APEX II family was launched circa 2002, before RoHS was widely mandated for FPGA products. RoHS compliance status is not explicitly stated in current distributor data; request the manufacturer compliance certificate for confirmation. Industrial temperature grade (I-suffix) is qualified per Altera's standard industrial test flow but NOT AEC-Q100 for automotive applications.
