EP2A40F1020I7 - APEX II 1.5M Gates FPGA | Altera | FC-FBGA-1020
MPN: EP2A40F1020I7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 500 | $125 | $62,500.00 |
| 1,000 | $110 | $110,000.00 |
EP2A40F1020I7 Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which can be reconfigured by the designer after manufacture. FPGAs sit in the hierarchy of programmable logic devices -> CPLD -> FPGA -> programmable SoC, occupying the high-density end of the programmable logic spectrum. APEX II FPGAs in particular combine look-up-table based logic with embedded memory blocks (ESBs) and high-speed I/O, making them suitable for DSP, telecom, and parallel datapath implementations.
Key features of the EP2A40F1020I7 include 38,400 logic cells, 1.5M system gates, embedded system blocks (ESBs) for memory and arithmetic, and 4 phase-locked loops (PLLs) for clock management. The device supports LVTTL, LVCMOS, PCI, and LVDS I/O standards, and provides multi-voltage I/O support for mixed-voltage system interfacing. Four high-speed clock networks and dedicated routing minimize skew across the die.
The APEX II architecture combines coarse-grained look-up tables with dedicated carry chains, embedded RAM, and multipliers, allowing efficient implementation of both control logic and datapath-intensive DSP functions. The 1.5 V core voltage and 0.15 µm process balance performance against power dissipation, while the 1020-ball FC-FBGA package exposes the full I/O count needed for high-bandwidth memory and bus interfaces.
Typical applications for the EP2A40F1020I7 include telecommunications infrastructure (SONET/SDH framers, base-station DSP), high-speed data acquisition systems, broadcast video processing, custom accelerator cards, and ASIC prototyping platforms. Industrial temperature grading extends usability into factory automation and outdoor equipment.
When designing with this part, plan power sequencing for the 1.5 V core and the I/O supply rails, and provide adequate decoupling across the 1020 balls. Use Altera Quartus II (legacy) for synthesis, place-and-route, and timing closure; the device is now considered mature and may be best sourced through the secondary market.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the original datasheet, giving engineers an integrated view of the EP2A40F1020I7 for legacy designs and second-source planning.
Drop-in alternatives for EP2A40F1020I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40F1020I7 (same form factor and footprint) — differing in Process Technology, Package, System Gates, Operating Temperature, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40F1020C7
✅ Drop-In✓ In Stock
$138 / Unit
View Datasheet →EP2A40F1020C7N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP2A40F1020C7ES
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP2A40F1020I8
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP2A40F1020I9
✅ Drop-In✓ In Stock
$2105 / Unit
View Datasheet →EP2A40F1020C8N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2A40F1020I7 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements | 38,400 |
| System Gates | 1.5M |
| Process Technology | 0.15 µm CMOS |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 562 MHz |
| Package | 1020-ball FC-FBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Temperature Grade | Industrial (I) |
| Speed Grade | 7 |
| Embedded System Blocks (ESBs) | Yes (RAM/ROM/arithmetic) |
| PLLs | 4 |
| I/O Standards | LVTTL, LVCMOS, PCI, LVDS |
| Multi-Voltage I/O Support | Yes |
EP2A40F1020I7 1020-ball fc-fbga Pin Configuration Guide
Pin configuration for EP2A40F1020I7 (1020-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40F1020I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40F1020I7 is suitable for 6 applications: Telecommunications Infrastructure (SONET/SDH Framers), High-Speed Data Acquisition Systems, Broadcast Video Processing, ASIC Prototyping Platforms, Custom Accelerator Cards, Industrial Factory Automation Controllers.
Telecommunications Infrastructure (SONET/SDH Framers)
The EP2A40F1020I7 is well matched to SONET/SDH framer and mapper designs because its 1.5M system gates and 38,400 logic elements can absorb multi-channel framers, payload mappers, and pointer-processing state machines in a single device. The four PLLs provide the multiple low-jitter clock domains required for STS/STM tributaries, while the multi-voltage I/O supports direct interfacing to 3.3 V framers and 2.5 V backplane transceivers. Industrial temperature grading allows deployment in outdoor telecom cabinets. Designers typically instantiate LVDS pairs for high-speed serial backplane links and dedicate ESBs for pointer and overhead buffering.
Recommended
High-Speed Data Acquisition Systems
The EP2A40F1020I7 fits high-channel-count data acquisition front-ends where multiple ADC lanes, FIFOs, and digital down-conversion stages must be implemented in parallel. Its 38,400 logic elements and embedded system blocks enable per-channel FIR filtering and decimation, while the four PLLs synchronize ADC sample clocks across the die. The 1020-ball FC-FBGA exposes enough I/O to fan out to multiple parallel ADCs and to a host bus such as PCI or a custom backplane. The 562 MHz internal frequency supports demanding DSP datapaths in test and measurement instrumentation.
Recommended
Broadcast Video Processing
Broadcast video pipelines such as SD/HD format converters, color-space processors, and frame synchronizers fit naturally into the EP2A40F1020I7. The 1.5M system gates accommodate wide datapaths and line buffers using the device's embedded RAM blocks, while LVDS I/O pairs connect to serializer/deserializer chips for SDI or DVI links. The 562 MHz fabric supports real-time multi-tap filtering and deinterlacing at HD resolutions. Industrial temperature grade allows use in broadcast equipment racks without additional thermal margin.
Recommended
ASIC Prototyping Platforms
The EP2A40F1020I7 is a popular target for ASIC and ASSP prototyping where designers need 1.5M gates of fast programmable logic with deep memory and abundant I/O. The 1020-ball FC-FBGA exposes a wide pin count that can be brought out to high-speed headers for chip-to-chip emulation. Quartus II supports APEX II synthesis, place-and-route, and timing closure, and boundary-scan (BSDL) is available for bring-up. Industrial temperature grading lets the prototype validate ASIC behaviour in rugged environments before tape-out.
Recommended
Custom Accelerator Cards
The EP2A40F1020I7 is well suited to custom compute or cryptographic accelerator cards that need parallel datapath execution close to memory. Its four PLLs generate the multiple clock domains typical of high-speed accelerator pipelines, and the embedded system blocks hold large look-up tables and crypto constants. The 1020-ball FC-FBGA exposes a high I/O count, supporting PCI, LVDS, or parallel host links. Industrial temperature grade lets the card ride in ruggedized servers and edge-computing chassis.
Recommended
Industrial Factory Automation Controllers
Factory automation PLCs and motion controllers that require high-density logic, multi-axis servo timing, and industrial temperature tolerance can be built around the EP2A40F1020I7. The device's logic capacity absorbs multi-axis trajectory planners, while its PLLs generate the synchronized PWM and quadrature clocks required by servo loops. The 1020-ball FC-FBGA package supports the wide I/O needed to fan out to many encoder inputs and drive outputs. Industrial temperature grading ensures operation in factory-floor enclosures up to +100 °C.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40F1020I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40F1020C7 | EP2A40F1020C7N | EP2A40F1020I8 | EP2A40F1020I9 | EP2A40F1020C8N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| System Gates | 1.5M | 1.5M | 1.5M | 1.5M | 1.5M | 1.5M |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Industrial (-40 to +100 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C), lead-free | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C), lead-free |
| Speed Grade | 7 | 7 | 7 | 8 (faster) | 9 (fastest) | 8 (faster) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Largest density in the APEX II family at 1.5M gates (vs EP2A25F1020)
- Industrial temperature grade with same die and package (vs EP2A40F1020C7)
- Four PLLs for multi-clock-domain designs (vs EP20K60EQC208-3)
- Embedded System Blocks (ESBs) for RAM and arithmetic (vs EP2A15F672C7)
Design Notes
EP2A40F1020I7 requires a clean 1.5 V core supply and a separate I/O supply (3.3 V typical for LVTTL/LVCMOS). Power sequencing is recommended: bring up the core first, then the I/O rails, to avoid I/O driving into unpowered inputs. Decouple close to the package with a network of 0.1 µF, 1 µF, and bulk polymer or tantalum capacitors; the 1020-ball FC-FBGA has many ground balls for low-impedance return paths. Estimated worst-case core current at full toggle activity is several amps; verify with Altera's PowerPlay early-estimate tool.
The 1020-ball FC-FBGA demands a multilayer PCB (typically 8-12 layers) with microvia or via-in-pad technology for reliable assembly. Follow Altera's recommended land pattern, solder mask defined (SMD) or non-solder mask defined (NSMD) pads per the package guidelines, and a matched coefficient of thermal expansion to avoid BGA fatigue. Use the IBIS model for signal-integrity simulation of high-speed LVDS pairs and PCI interfaces. Allocate at least 1 oz copper in inner layers for power planes.
Do not assume active production - APEX II is obsolete and primary distributor stock is gone. Always check date code and avoid parts stored improperly (moisture sensitivity level MSL 3 or higher; bake before assembly). Do not confuse APEX II (EP2A) with APEX 20K (EP20K) - the families share Quartus II support but have different architecture and bitstream formats, so a 20K design will not load on an APEX II device.
Estimated: at full toggle activity and 1.5 V core, the EP2A40F1020I7 can dissipate multiple watts. With a typical FC-FBGA theta_JA around 15-20 C/W on a standard JEDEC test board, junction temperature can exceed 100 C at high ambient. Provide adequate airflow or attach a low-profile heatsink for industrial enclosures up to +85 C ambient; derate further if hot-spot activity is concentrated.
Compliance Information
RoHS, REACH, lead-free and halogen-free status are not stated in the verified distributor data and are marked unknown. APEX II predates many of these compliance requirements; engineers must request a Certificate of Compliance per lot from the secondary-market supplier if RoHS/REACH is required.
