EP2A40F1020C8 - APEX II 1.5M Gates FPGA, 1020-FBGA | Intel / Altera
MPN: EP2A40F1020C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $335 | $167,500.00 |
| 1,000 | $310 | $310,000.00 |
EP2A40F1020C8 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, routing interconnects, and programmable I/O cells. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit alongside ASICs (Application-Specific Integrated Circuits) in the digital logic hierarchy. APEX II devices combine Look-Up Table (LUT)-based logic with embedded system blocks (ESBs) that provide dual-port RAM, ROM, and CAM functions, enabling high-density datapath and memory-intensive designs.
Key features of the EP2A40F1020C8 include 735 user I/O pins, 2,560 macro cells, a propagation delay of approximately 1.55 ns, MultiVolt I/O support for interfacing with 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V buses, and embedded LVDS-capable channels for high-speed differential signalling. The 1020-ball FC-FBGA package provides excellent signal and power integrity for designs requiring hundreds of I/Os and high pin-count board integration.
The APEX II architecture combines four types of structured ASIC-like blocks (megaLAB, LAB, ESB, and FastTrack interconnect) to deliver predictable timing and high utilisation. The 1.5 V VCCINT core plus separate VCCIO banks allow mixed-voltage system design without external level shifters. The device supports in-system programmability via JTAG and Altera serial configuration schemes.
Typical applications include high-speed telecommunications line cards, multi-channel data acquisition systems, RAID controllers, high-density glue-logic replacement, and protocol bridging ASICs. The 735 available user I/Os make it suitable for parallel bus interfaces and SDRAM controller implementations in embedded and industrial systems.
When designing with the EP2A40F1020C8, allocate at least six PCB layers for power/ground planes and signal routing to maintain signal integrity for the 1.5 V core. Use the Altera Quartus II design suite (legacy 32-bit versions 4.x and earlier remain the recommended toolchain because APEX II predates Cyclone/Stratix support) for synthesis, place-and-route, and timing closure. Note that the APEX II family is now in mature lifecycle status - verify long-term availability before new design starts.
This page synthesises distributor pricing, drop-in alternative ordering options, and practical board-level design considerations that are not consolidated on a single manufacturer page.
Drop-in alternatives for EP2A40F1020C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40F1020C8 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, System Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40F1020C7
✅ Drop-In✓ In Stock
$138 / Unit
View Datasheet →EP2A40F1020C9
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →EP2A40F1020C7N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP2A40F1020C6
✅ Drop-In✓ In Stock
$149 / Unit
View Datasheet →EP2A40F1020C7ES
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP2A40F1020C6N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP2A40F1020C8 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Family | CMOS |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers |
| System Gates | 1,500,000 |
| Logic Cells | 38,400 |
| Macros / Macro Cells | 2,560 |
| Maximum Internal Frequency | 376 MHz |
| Propagation Delay | 1.55 ns |
| User I/O Pins | 735 |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | MultiVolt 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Package Type | FC-FBGA (FineLine BGA) |
| Package Pin Count | 1020 |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature | 0 C to +85 C (commercial, 'C' suffix) |
| Configuration Interface | JTAG / Altera serial |
| Design Toolchain | Quartus II (legacy version 4.x or earlier recommended) |
EP2A40F1020C8 33 x 33 mm Pin Configuration Guide
Pin configuration for EP2A40F1020C8 (33 x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40F1020C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40F1020C8 is suitable for 6 applications: Telecommunications Line Cards, Multi-Channel Data Acquisition, RAID / Storage Controllers, Protocol Bridging ASIC Replacement, Industrial Glue Logic / Machine Control, Legacy Avionics / Defence Upgrades.
Telecommunications Line Cards
The EP2A40F1020C8's 1.5 million system gates, 735 user I/Os, and embedded RAM via ESB blocks make it a strong fit for telecommunications line cards that need to terminate multiple high-speed serial or parallel links simultaneously. Placed on a six-layer controlled-impedance PCB, the FPGA can implement channelised framing, ATM / MPLS segmentation, and per-channel statistics gathering while exposing LVDS pairs to backplane connectors. Compared to a fixed ASIC, the APEX II allows late-stage feature updates via JTAG, reducing respin cost. Power budget is approximately 4 to 6 W at full toggle, so a 1 oz copper pour plus airflow at 200 LFM is recommended.
Recommended
Multi-Channel Data Acquisition
In multi-channel data-acquisition front-ends, the EP2A40F1020C8 can host parallel FIR filters, FFT engines, and per-channel calibration state machines alongside high-speed DMA into external SDRAM. The 735 user I/Os comfortably absorb 16-bit parallel LVDS buses from multiple ADC channels at 125 MSPS, and the 1.55 ns propagation delay supports 376 MHz internal operation for time-interleaved capture. Compared to a bank of DSPs, the FPGA consolidates glue logic, reduces board area, and provides deterministic latency. Designers should budget 2 W per 100 MHz of fabric toggle and place 0.1 µF + 10 µF decoupling on every VCCINT ball.
Recommended
RAID / Storage Controllers
The APEX II fabric of the EP2A40F1020C8 supports RAID 5/6 XOR engines, stripe-cache management, and command-queue FIFOs in a single device, removing the need for a companion controller ASIC. The 735 user I/Os expose multiple SATA / SAS PHYs in parallel, and the embedded system blocks provide the dual-port RAM used for stripe buffers. Compared to discrete XOR chips, the FPGA approach gives designers freedom to add features (encryption, de-duplication hints) at zero BOM cost. Sustained fabric power is around 5 W; a small clip-on heatsink or 4 cm x 4 cm copper pour is recommended in 1U chassis.
Recommended
Protocol Bridging ASIC Replacement
Designers often reach for the EP2A40F1020C8 when retiring an obsolete bridging ASIC: PCIe-to-local bus, I²C/SPI-to-parallel, or UART multiplexing glue. The 2,560 macros and 735 I/Os support multiple bridge cores concurrently, while the Quartus II IP library contains mature reference designs. Compared to designing a new ASIC, an APEX II solution ships in weeks and is field-upgradable via JTAG. Care must be taken to translate 5 V legacy signals through level-shifters before reaching VCCIO banks, because absolute maximum ratings on APEX II inputs are 4.1 V even on 3.3 V banks.
Recommended
Industrial Glue Logic / Machine Control
In factory automation, the EP2A40F1020C8 can replace dozens of discrete 74-series logic ICs, integrating encoder counters, PWM generators, Modbus / EtherCAT slave cores, and safety interlocks into a single device. The 1020-FBGA's exposed die allows direct thermal attachment to a metal chassis for harsh environments. Compared to discrete logic, the FPGA consolidates PCB area by 70% and adds field-reprogrammable flexibility for line-changeovers. Use the industrial-temperature (-40 C to +100 C) EP2A40F1020I8 variant in non-conditioned cabinets, or accept the commercial-grade C8 in climate-controlled panels.
Recommended
Legacy Avionics / Defence Upgrades
Military and avionics programs with long life-cycles (often 20+ years) still rely on APEX II for systems fielded in the 2000s. The EP2A40F1020C8's deterministic LUT architecture and MIL-STD-883 screening options suit mission-critical video processing, fire-control, and secure-communication cores. Compared to newer FPGAs, the APEX II has a stable, well-understood supply chain via authorised defence distributors. Procurement teams should verify lot-level radiation and burn-in certificates; new design starts should weigh the APEX II against Rad-Hard-by-Design parts such as Microsemi RTAX or Xilinx Virtex-5QV.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40F1020C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40F1020C7 | EP2A40F1020C9 | EP2A40F1020C7N | EP2A40F1020C6 | EP2A40F1020C7ES | EP2A40F1020C6N |
|---|---|---|---|---|---|---|---|
| Package | 1020-FBGA (33 x 33 mm, 1.0 mm pitch) | 1020-FBGA (33 x 33 mm, 1.0 mm pitch) - same | 1020-FBGA (33 x 33 mm, 1.0 mm pitch) - same | 1020-FBGA (33 x 33 mm, 1.0 mm pitch) - same | 1020-FBGA (33 x 33 mm, 1.0 mm pitch) - same | 1020-FBGA (33 x 33 mm, 1.0 mm pitch) - same | 1020-FBGA (33 x 33 mm, 1.0 mm pitch) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | APEX II | APEX II - same | APEX II - same | APEX II - same | APEX II - same | APEX II - same | APEX II - same |
| Logic Cells | 38,400 | 38,400 - same die | 38,400 - same die | 38,400 - same die | 38,400 - same die | 38,400 - same die | 38,400 - same die |
| System Gates | 1,500,000 | 1,500,000 - same | 1,500,000 - same | 1,500,000 - same | 1,500,000 - same | 1,500,000 - same | 1,500,000 - same |
| Speed Grade | C8 (376 MHz) | C7 (~10% slower) | C9 (~3% faster) | C7, Pb-free finish | C6 (~15% slower) | C7, engineering sample | C6, Pb-free finish |
| User I/Os | 735 | 735 - same | 735 - same | 735 - same | 735 - same | 735 - same | 735 - same |
| Core Voltage | 1.5 V | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| Operating Temperature | 0 to +85 C (commercial) | 0 to +85 C | 0 to +85 C | 0 to +85 C | 0 to +85 C | 0 to +85 C | 0 to +85 C |
| Lifecycle Status | NRND (Not Recommended for New Designs) | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- C8 speed grade sits between the cheaper C6/C7 and the faster C9 in the same package (vs EP2A40F1020C7)
- Open-drain available I/O count of 735 supports wider parallel buses than most FPGAs (vs EP2A25F672C8)
- Mature 0.15 µm APEX II architecture with extensive Quartus II legacy support (vs EP2A40B724C8)
Design Notes
The 1020-FBGA has a relatively small die-to-PCB thermal path. Estimated: at 376 MHz internal toggle with typical 25% switching activity, junction-to-ambient (theta_JA) for a JEDEC 4-layer test board is approximately 12 C/W, so a 5 W dissipation yields a 60 C temperature rise above ambient. For commercial-grade parts (0 to +85 C) keep ambient below 50 C, or attach a small clip-on heatsink for industrial deployments. Use thermal vias in a 4 x 4 array directly under the BGA thermal ball group to spread heat into inner ground planes.
The 1020-ball 1.0 mm-pitch FC-FBGA requires a minimum six-layer PCB stack-up with two dedicated ground planes, one power plane, and three signal layers. Use 0.5 oz copper on outer layers and 1 oz on inner power/ground for current handling. Fan-out should use dog-bone or via-in-pad (VIPPO) micro-vias (0.1 mm hole, 0.25 mm pad). Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS pairs. Reference manufacturer pinout files before laying out BGA escape, because APEX II has multiple GND and VCCINT balls distributed under the array.
Do not apply 5 V signals directly to APEX II I/O banks. Although the MultiVolt feature supports 1.5/1.8/2.5/3.3/5.0 V supplies, absolute maximum input voltage on any I/O pin is 4.1 V; exceeding this latches up the device. For legacy 5 V peripherals, add a 74LVC245 or similar level-shifter in front of the FPGA. Also, hold VCCINT stable before VCCIO rises during power-up to avoid I/O buffer contention; an ordered power-supply sequencer (e.g. TPS3808 or APEX II reference circuit) is recommended.
LVDS pairs on APEX II I/O banks require 100 ohm differential termination at the receiver. Place the termination resistor within 7 mm of the FPGA ball to limit reflections. For SDRAM interfaces, route address/command traces length-matched within ±25 ps and place series 33 ohm damping resistors near the driver. Use HyperLynx or Siwave simulations before fabrication when more than 8 LVDS channels toggle simultaneously.
Configuration: route JTAG TMS, TDI, TDO, TCK as a four-wire bus with TCK having a 33 ohm series damping resistor near the FPGA. For multi-device JTAG chains, add 10 kohm pull-ups on TMS and TDI. The MSEL[2:0] pins select the configuration mode (AS, AP, PS, JTAG) - tie them to the appropriate boot-mode values via 4.7 kohm resistors to VCCIO or GND. Refer to the APEX II configuration handbook for the exact MSEL pin settings.
Compliance Information
APEX II family preceded the EU RoHS recast of 2011. RoHS / lead-free status varies by manufacturing date code and distributor supply chain - confirm via the manufacturer Certificate of Conformance for each lot. AEC-Q100 is not applicable (FPGA is not an automotive-qualified IC).
