EP2A40B652C8 - APEX 20A40 FPGA 652-BGA | Intel (Altera)
MPN: EP2A40B652C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118.2 | $11,820.00 |
| 500 | $105.75 | $52,875.00 |
| 1,000 | $94.3 | $94,300.00 |
EP2A40B652C8 Overview
An FPGA (Field Programmable Gate Array) is a programmable semiconductor device whose logic function is defined by a configuration bitstream loaded into on-chip SRAM after power-up. FPGAs occupy the middle ground between fixed-function ASICs and software-defined processors: they deliver ASIC-class parallelism and deterministic latency for data-path logic while remaining fully re-programmable in the field. The APEX 20A series extended earlier APEX architectures with MultiCore interconnect, embedded CAM, and high-speed LVDS I/O to address networking, telecoms, and DSP-intensive applications where gate counts alone were insufficient.
Key features of the EP2A40B652C8 include 40,960 logic elements, 425 Kbits of embedded RAM, 718 maximum user I/O pins, MultiCore interconnect for predictable timing closure, embedded CAM blocks for routing-table and search-engine workloads, LVDS-compatible I/O, and full JTAG boundary-scan with in-system configuration support via the serial configuration (PS) or passive parallel asynchronous (PPA) modes. The part operates from a 1.8V core supply with 3.3V LVTTL/LVCMOS I/O, balancing low power with industry-standard logic interfacing.
The APEX 20A architecture pairs four LEs into a logic array block (LAB) with a local interconnect that feeds a row/column MultiCore routing network. Embedded system blocks (ESBs) implement true dual-port RAM with independent read/write clocks and configurable CAM widths, enabling on-chip lookup tables for network processors and content-addressable search without external memory. Configuration is volatile and loaded from a serial ROM or microprocessor on every power-up.
Typical applications include high-speed network switches and routers (CAM-based table lookup), telecommunications line cards, DSP datapath co-processors, PCI bridge designs, and high-density glue-logic consolidation. The 652-ball FineLine BGA package supports the largest member of the family at full I/O count while preserving board-level signal integrity for high-frequency parallel buses.
When designing with EP2A40B652C8, ensure the 1.8V core and 3.3V I/O rails have adequate decoupling (0.1 uF plus 10 uF bulk per rail) and that JTAG chain integrity is verified before release. The device is in production status; designers should confirm long-term availability with their distributor.
This page synthesizes distributor pricing, drop-in same-package variants, and practical design considerations not found in the manufacturer datasheet, with all data current as of 2026-09-08.
Drop-in alternatives for EP2A40B652C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40B652C8 (same form factor and footprint) — differing in Logic Elements, Process Technology, Speed Grade, Operating Temperature, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40B652C9
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$92.4 / Unit
View Datasheet →EP2A40B652I8
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP2A40B652C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →EP2A25B652C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →EP20K600EBC652-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$340 / Unit
View Datasheet →EP2A40B652C8 Maximum Ratings & Electrical Characteristics
| Family | APEX 20A |
| Device | EP2A40 |
| Logic Elements | 40,960 |
| Maximum User I/O | 718 |
| Embedded Memory (bits) | 425,984 |
| Embedded System Blocks | Configurable as dual-port RAM or CAM |
| Process Technology | 0.18 micrometer CMOS SRAM |
| Core Voltage | 1.8 V |
| I/O Voltage | 3.3 V (LVTTL/LVCMOS) |
| Operating Temperature | 0C to +85C (Commercial, C8 suffix) |
| Package | 652-ball FineLine BGA |
| Mounting Type | Surface Mount |
| Configuration Method | Serial (PS) or Passive Parallel Async (PPA), JTAG |
| Speed Grade | C8 |
EP2A40B652C8 652-ball fineline bga Pin Configuration Guide
Pin configuration for EP2A40B652C8 (652-ball fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40B652C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40B652C8 is suitable for 6 applications: Network Switches and Routers with CAM-based Lookup, Telecommunications Line Cards, DSP Co-Processors and Datapath Acceleration, PCI Bus Bridge and Glue Logic Consolidation, High-Speed Test and Measurement Instrumentation, High-Density Glue Logic Consolidation on Legacy Boards.
Network Switches and Routers with CAM-based Lookup
The EP2A40B652C8 is a strong fit for high-density network switches and routers that require on-chip content-addressable memory (CAM) for routing-table or ACL lookup. The APEX 20A family uniquely combines 40,960 logic elements with embedded system blocks (ESBs) that can be configured as CAM, allowing L2/L3 lookup tables to be implemented without external ternary CAM chips. The 718 user I/O pins support multiple 10/100/1000 Mbps Ethernet MAC interfaces or a high-speed SPI-4.2 system bus, while the MultiCore interconnect delivers predictable timing closure across wide datapaths. Designers typically pair this device with a network processor or high-speed PHY to build line-card ASIC replacement logic.
Recommended
Telecommunications Line Cards
Telecommunications line cards benefit from the EP2A40B652C8's combination of high logic density, dual-port embedded SRAM, and 652-ball FineLine BGA packaging. The 425 Kbits of embedded memory can buffer ATM cells, HDLC frames, or VoIP packets directly on chip, reducing external SRAM count and improving system-level latency. The 718 I/O pins accommodate TDM buses, UTOPIA interfaces, and LVDS links to framer/serializer companion devices, while the APEX 20A MultiCore interconnect supports deterministic multi-clock domain designs required for telecom timing recovery. Industrial-grade speed variants of the same die are commonly used when line cards must operate over extended temperature ranges.
Recommended
DSP Co-Processors and Datapath Acceleration
The EP2A40B652C8 functions as a DSP co-processor or datapath accelerator in systems that need parallel arithmetic throughput beyond what a general-purpose DSP can deliver. Its 40,960 logic elements can host many parallel multipliers, accumulators, and FIR/IIR filter structures running at hundreds of MHz thanks to MultiCore routing. The 425 Kbits of dual-port RAM provide coefficient storage and circular buffers directly inside the FPGA, reducing external memory accesses and improving MAC efficiency. Typical deployments include radar signal processing, software-defined radio baseband, and baseband channel cards where the FPGA pre-processes samples before the host DSP runs higher-layer algorithms.
Recommended
PCI Bus Bridge and Glue Logic Consolidation
The EP2A40B652C8 is widely deployed as a high-density bridge between PCI, PCI-X, and proprietary local buses in embedded computing designs. Its abundant user I/O count supports a 64-bit PCI bus plus multiple secondary buses, while the on-chip dual-port RAM functions as a shared mailbox between masters. The MultiCore interconnect simplifies timing closure for the most demanding PCI-X 133 MHz designs, and the JTAG-supported in-system programmability accelerates board bring-up. Engineers often use APEX 20A devices to consolidate discrete TTL/CMOS glue logic from older motherboards, reducing board area and improving testability.
Recommended
High-Speed Test and Measurement Instrumentation
The EP2A40B652C8 is used in test and measurement instruments where its parallel I/O count and MultiCore timing predictability allow multiple high-speed acquisition channels to be processed in parallel. The device can drive LVDS buses to ADC and DAC converters, implement real-time digital filters, and run pattern generation logic for protocol analysers. Designers exploit the embedded dual-port RAM for deep sample buffers that allow long capture windows without off-chip memory. The 652-ball BGA package supports the controlled-impedance board layouts necessary for sub-nanosecond edge rates.
Recommended
High-Density Glue Logic Consolidation on Legacy Boards
The EP2A40B652C8 is frequently chosen to replace dozens of discrete TTL and CMOS glue-logic packages on legacy boards, simplifying the BOM and improving testability. The 40,960 logic elements easily absorb large state machines, address decoders, interrupt controllers, and bus arbiters that previously occupied several square inches of board. JTAG-based configuration allows post-assembly rework without removing the device, accelerating debug cycles. Engineers gain the side benefits of integrated dual-port RAM for FIFOs and synchronisers, all in a single 652-ball FineLine BGA footprint that is footprint-compatible with other APEX 20A family members for easy density migration.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40B652C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40B652C9 | EP2A40B652I8 | EP2A40B652C7 | EP2A25B652C8 | EP20K600EBC652-3 |
|---|---|---|---|---|---|---|
| Package | 652-ball FineLine BGA | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same | 652-ball BGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | APEX 20A | APEX 20A | APEX 20A | APEX 20A | APEX 20A | APEX 20K |
| Logic Elements | 40,960 | 40,960 | 40,960 | 40,960 | 25,920 (-37%) | ~25,000 equivalent system gates |
| Embedded Memory (bits) | 425,984 | 425,984 | 425,984 | 425,984 | 270,336 | ~311,000 |
| Operating Temperature | 0C to +85C (Commercial) | Industrial grade | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | C8 | C9 (slower) | I8 | C7 (slower) | C8 | -3 |
Key Differentiators
- Highest-density APEX 20A member in a single BGA (vs EP2A25B652C8)
- On-chip content-addressable memory (CAM) (vs EP20K600EBC652-3)
- MultiCore interconnect for predictable timing (vs EP20K600EBC652-3)
Design Notes
The EP2A40B652C8 requires a clean 1.8V core supply and a 3.3V I/O supply, both with bulk decoupling (10 uF or larger) close to the device and 0.1 uF high-frequency decoupling on each power pin. Use a power-supply sequencing circuit to ensure the I/O rail does not exceed the core rail by more than the device specification during power-up; improper sequencing can latch-up the device. Estimated core current at 40,960 LEs switching at 100 MHz is several hundred mA, so verify thermal dissipation against the 652-ball BGA theta_JA in the APEX 20A datasheet.
The 652-ball FineLine BGA requires controlled-impedance PCB stack-up with matched trace lengths on LVDS and high-speed buses. Fan-out via microvias or blind/buried vias in inner layers is recommended to route the dense signal matrix to outer layers. Maintain a solid ground plane under the BGA to provide a low-impedance return path for high-frequency signals; split planes are not appropriate under this device.
Place the JTAG chain components (TCK pull-down, TMS pull-up, TDO tristate buffer) close to the EP2A40B652C8 to avoid chain-integrity issues. Configuration EEPROM or configuration microcontroller should be placed within a few centimetres to minimise configuration trace length. For multi-FPGA boards, daisy-chain JTAG signals and place series termination at each tap to suppress reflections.
Common pitfalls include forgetting to tie unused I/O pins to a defined logic level through software options, using the wrong configuration mode (PS versus PPA), and over-driving LVDS pins with non-LVDS signals. The APEX 20A family does not support hot-swap insertion; design power sequencing to avoid back-powering through I/O. Confirm the Quartus or Max+Plus II device-fit report shows timing closure before tape-out, particularly for Fmax-critical paths.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status for EP2A40B652C8 not confirmed in the available distributor data. Engineers should request a RoHS/REACH certificate from the distributor before volume orders.
