EP2A70B724C9ES - APEX II FPGA 3M Gates 67200 Cells 724-FCBGA | Intel
MPN: EP2A70B724C9ES ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1519.47 | $1,519.47 |
| 10 | $1450 | $14,500.00 |
| 50 | $1380 | $69,000.00 |
| 100 | $1320 | $132,000.00 |
| 500 | $1250 | $625,000.00 |
EP2A70B724C9ES Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the architecture of gate arrays with the programmability of logic cells. Within the broader semiconductor taxonomy, FPGAs sit alongside CPLDs, microcontrollers, and ASICs as reconfigurable computing fabrics used to implement custom digital logic, glue logic, signal processing, and hardware-accelerated functions. APEX II belongs to Intel's (Altera's) mid-2000s high-density family targeting communications, video, and DSP designs, and was later succeeded by Stratix and Cyclone families.
Key features include 540 user I/O pins, 1,146,880 bits of embedded SRAM, built-in PLLs for clock management, and multi-voltage I/O support allowing 1.5V, 1.8V, 2.5V, and 3.3V interface to external memory and bus devices. The device integrates dedicated multiplier blocks, True-LVDS support, and a high-speed embedded array for DSP and communications pipelines. With 3M system gates and 198 MHz performance, the EP2A70B724C9ES was the flagship of the APEX II line for high-bandwidth parallel processing tasks.
The architecture uses a MultiCore interconnect with embedded memory blocks distributed across the die, providing predictable timing closure for wide data-path designs. The 724-pin FCBGA package supports hundreds of general-purpose and high-speed serial pins and is intended for high-density, high-performance PCB designs with controlled-impedance routing and matched-length differential pairs. Compared with later FPGA generations, APEX II lacks hard processor cores, transceivers, and DSP blocks, but its parallel fine-grained logic fabric remains useful for legacy designs and replacement applications.
Typical applications include telecommunications baseband processing, high-speed video bridging and image processing, network switches and routers, PCI/PCI-X bridge logic, custom DSP pipelines, and industrial control systems. It is also used in legacy test equipment and aerospace/defense subsystems where long lifecycle and pin-compatible replacement are required. The wide operating temperature range and 540 I/O make it suitable for board-level integration with multiple memory and bus devices.
When designing with EP2A70B724C9ES, ensure the PCB has a 1.5V core regulator with adequate decoupling, configure I/O banks according to the Quartus design tool, and follow Intel's layout guidelines for FCBGA packages including microvia stacks, signal-integrity-aware stackup design, and thermal management. Note that APEX II is in production for legacy/long-lifecycle customers and lead times may be longer than for current-generation FPGAs.
This page synthesizes distributor pricing, drop-in APEX II and APEX-family alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers shorten selection time and qualify second-source parts.
Drop-in alternatives for EP2A70B724C9ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A70B724C9ES (same form factor and footprint) — differing in Package, Process Technology, Configuration Method, Operating Temperature, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A70B724C9
✅ Drop-In✓ In Stock
$998.27 / Unit
View Datasheet →EP2A70B724C8
✅ Drop-In✓ In Stock
$1250 / Unit
View Datasheet →EP2A70B724C7
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP2A70B724C7ES
✅ Drop-In✓ In Stock
$2190 / Unit
View Datasheet →EP2A70B724C7N
✅ Drop-In✓ In Stock
$188 / Unit
View Datasheet →EP2A70B724C9ES Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | APEX II |
| Logic Elements / Cells | 67200 |
| System Gates | 3,000,000 (3M) |
| Embedded Memory (bits) | 1,146,880 |
| Maximum User I/O | 540 |
| Operating Frequency (max) | 198 MHz |
| Core Voltage | 1.5 V |
| Process Technology | 0.15 µm CMOS |
| Package | 724-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, PCI, LVDS |
| Configuration Method | Serial or parallel (via Altera configuration devices) |
EP2A70B724C9ES 724-bbga, fcbga Pin Configuration Guide
Pin configuration for EP2A70B724C9ES (724-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A70B724C9ES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A70B724C9ES is suitable for 7 applications: Telecommunications Baseband Processing, High-Speed Video Bridging and Image Processing, Network Switch and Router Control Plane, PCI/PCI-X Bridge and Glue Logic, Custom DSP Pipeline Implementation, Industrial Control and Automation Systems, Legacy Aerospace and Defense Subsystems.
Telecommunications Baseband Processing
The EP2A70B724C9ES is well-suited for telecommunications baseband processing where its 3 million system gates and 67,200 logic elements provide parallel DSP-style pipelines for modulation, coding, and channel equalization. With 1,146,880 bits of embedded SRAM distributed across the die, the device supports sample buffering and lookup tables directly inside the FPGA fabric, eliminating external memory round-trips. The 540 user I/O pins in the 724-FCBGA package allow wide parallel bus interfaces to ADCs, DACs, and external SRAM/SDRAM banks. At 198 MHz internal performance, the part handles multi-channel baseband processing for legacy telecom equipment. According to the APEX II Handbook, the embedded MultiCore architecture provides predictable timing closure for pipelined DSP designs. The 1.5V core with selectable I/O standards (LVTTL, LVCMOS, HSTL, SSTL, PCI, LVDS) makes it compatible with telecom ASICs and standard bus interfaces.
Recommended
High-Speed Video Bridging and Image Processing
For high-speed video bridging and image processing pipelines, the EP2A70B724C9ES offers 3M gates of parallel logic for real-time pixel processing, frame buffering control, and color-space conversion. The 540 user I/O pins can directly interface to DVI/HDMI bridge ASICs, video ADCs, and DDR memory, while the 1,146,880 embedded SRAM bits serve as line buffers for video scaling and filtering. At 198 MHz, the device processes standard-definition and high-definition video streams with multiple taps and filter stages. According to the APEX II Handbook, the device supports True-LVDS on multiple banks, simplifying interfacing to high-speed video serializers. The 724-FCBGA package provides the signal density required for multi-channel parallel video data buses.
Recommended
Network Switch and Router Control Plane
The EP2A70B724C9ES serves as a powerful control-plane and packet-processing engine in legacy network switches and routers. Its 3M gates can implement custom forwarding logic, ACL matching, statistics counters, and Quality-of-Service schedulers in parallel hardware. With 540 I/O pins, the device connects to multi-Gigabit PHYs, TCAMs, network processors, and management processors via standard bus interfaces (PCI, LVTTL, HSTL). The 1,146,880 bits of embedded SRAM provide queue storage for small packet buffers and lookup tables. According to Altera's APEX II device documentation, the 198 MHz performance is suitable for line-rate processing on multiple lower-speed ports. The 1.5V core with mixed-voltage I/O enables direct interface to 1.8V and 2.5V PHY devices without external level shifters.
Recommended
PCI/PCI-X Bridge and Glue Logic
In PCI and PCI-X bridge and legacy bus interconnect designs, the EP2A70B724C9ES provides ample logic capacity to implement custom bridges, FIFOs, and protocol conversion logic between PCI, PCI-X, local buses, and processor interfaces. The 3M gates and 540 I/O pins comfortably host multi-master arbitration, interrupt controllers, DMA engines, and bus snooping logic. With PCI I/O standard support on dedicated banks per the APEX II Handbook, the device interfaces directly to 3.3V and 5V PCI/PCI-X slots without external transceivers. The 198 MHz fmax and predictable MultiCore timing ensure deterministic bus turn-around times required for PCI-X 133 MHz operation. The 724-FCBGA package supports the high signal density needed for 64-bit PCI-X buses plus secondary interfaces.
Recommended
Custom DSP Pipeline Implementation
For custom DSP pipelines and hardware-accelerated signal processing, the EP2A70B724C9ES delivers 3M gates for FIR filters, FFT engines, encryption accelerators, and other parallel arithmetic blocks. The embedded multiplier blocks and True-LVDS support allow direct interface to high-speed ADCs and DACs at full sample rate. With 1,146,880 embedded SRAM bits distributed across the die, coefficient tables, window functions, and intermediate sample buffers reside on-chip, reducing external memory traffic. According to the APEX II Handbook, the MultiCore architecture supports pipelined DSP with deterministic latency suitable for real-time processing. The 540 user I/O pins provide multi-channel parallel data paths to converters and memory in radar, sonar, and instrumentation systems.
Recommended
Industrial Control and Automation Systems
In industrial control and automation systems, the EP2A70B724C9ES provides deterministic real-time logic for PLC controllers, motion controllers, and industrial protocol gateways. The 3M gates implement multi-axis motion-control state machines, PID loops, and industrial protocol stacks (Modbus, Profibus, EtherCAT) in hardware. With 540 I/O pins, the device interfaces to encoders, motor drivers, sensors, and HMI panels across LVTTL, LVDS, and isolated differential standards. The APEX II architecture's predictable timing ensures deterministic loop times critical for closed-loop motion control. Industrial temperature variants in the APEX II family extend operating range to -40C to +100C for factory-floor deployment. The 724-FCBGA package provides robust mechanical and thermal performance for industrial environments.
Recommended
Legacy Aerospace and Defense Subsystems
For legacy aerospace and defense subsystems requiring long lifecycle support, the EP2A70B724C9ES provides a known-good FPGA fabric with continued production for sustainment programs. Its 3M gates accommodate avionics bus interfaces (MIL-STD-1553, ARINC 429) implemented in custom logic, while 540 I/O pins support multi-channel sensor aggregation and actuator control interfaces. The 1,146,880 embedded SRAM bits enable on-chip data buffering for radar and EW processing pipelines. According to APEX II device documentation, the device's 0.15 µm CMOS process has extensive reliability heritage in military and aerospace programs. The 198 MHz performance is sufficient for many signal-processing and control tasks in avionics subsystems. Sustaining engineering relies on drop-in replacements within the APEX II family to avoid costly PCB redesign.
Recommended
Recommended Products Summary
Engineering reference data for EP2A70B724C9ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A70B724C9 | EP2A70B724C8 | EP2A70B724C7 | EP2A70B724C7ES | EP2A70B724C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 724-BBGA, FCBGA | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same |
| Logic Elements / Cells | 67200 | 67200 | 67200 | 67200 | 67200 | 67200 |
| System Gates | 3,000,000 (3M) | 3M | 3M | 3M | 3M | 3M |
| Embedded Memory (bits) | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 | 1,146,880 |
| Maximum User I/O | 540 | 540 | 540 | 540 | 540 | 540 |
| Speed Grade / fmax | C9 (198 MHz) | C9 (198 MHz) | C8 (~10-15% slower) | C7 (~20-25% slower) | C7 ES (~20-25% slower) | C7 industrial (~20-25% slower) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | ES (Engineering Sample) | Commercial | Commercial | Commercial | ES | Industrial (-40C to +100C) |
Key Differentiators
- ES Engineering Sample with same die as production C9 (vs EP2A70B724C9)
- Highest speed grade in the 724-FCBGA APEX II family (vs EP2A70B724C8)
- Maximum I/O count in APEX II 3M-gate class (vs EP2A70B652C9)
Design Notes
The EP2A70B724C9ES requires a stable 1.5 V core supply with peak current consumption that can exceed 2-3 A during configuration and high-utilization operation. According to the APEX II Handbook, use a low-impedance DC-DC regulator placed close to the FCBGA with bulk decoupling (220 µF or larger) plus 0.1 µF and 0.01 µF ceramic capacitors distributed around the package. Each VCCINT pin must have a 0.1 µF decoupling capacitor within 5 mm. Estimated: at 3M-gate utilization and 198 MHz, total power may approach 5-8 W; thermal management via thermal vias under the package is essential.
The 724-pin FCBGA package (1.0 mm or 1.27 mm pitch typical for APEX II) requires a high-density PCB with microvia stacks or via-in-pad technology for signal breakout. According to Altera's APEX II design guidelines, the PCB stackup should use low-loss dielectric (Df < 0.02 at 100 MHz) with controlled impedance (50 ohm single-ended, 100 ohm differential) for LVDS and high-speed signals. Matched-length routing within 150 mil for parallel buses and 50 mil for differential pairs. Provide continuous ground planes under the package for return-path integrity.
At full 3M-gate utilization and 198 MHz operation, estimated power dissipation is 5-8 W. The FCBGA package should be thermally bonded to the PCB using thermal vias in the center pad and a heat spreader or heatsink attached with thermal interface material. The APEX II Handbook recommends maintaining junction temperature below 100°C for reliable long-term operation; estimated junction-to-ambient thermal resistance is approximately 15-25 C/W with a properly designed thermal via array and bottom-side heat spreader.
Common pitfalls when designing with EP2A70B724C9ES include: (1) failing to assign all CONFIG, JTAG, and dedicated clock pins per the pinout - these cannot be used as general I/O; (2) mixing I/O standards in the same bank without confirming voltage compatibility - all I/O in a bank must share VCCIO; (3) using ES (engineering sample) parts in production builds without verifying errata; (4) ignoring configuration mode (serial vs parallel) - select the correct Altera configuration device or JTAG download cable accordingly. The Quartus II software validates these settings during compilation.
Compliance Information
Compliance certifications for EP2A70B724C9ES were not present in the verified web data; consult Intel/Altera product documentation or your distributor for RoHS, REACH, lead-free, and conflict minerals status. APEX II family predates widespread AEC-Q100 adoption and is generally not qualified for automotive applications.
