EP2S130F1020C4RB - Stratix II 130K LE FPGA, 742 I/O, FBGA-1020
MPN: EP2S130F1020C4RB β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1620 | $16,200.00 |
| 50 | $1480 | $74,000.00 |
| 100 | $1395 | $139,500.00 |
| 250 | $1310 | $327,500.00 |
EP2S130F1020C4RB Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device that integrates configurable logic blocks (LABs), embedded memory arrays, DSP blocks, high-speed transceivers, and programmable I/O cells on a single die. FPGAs sit between fixed-function ASICs and general-purpose processors in the compute hierarchy: ASIC -> programmable logic / FPGA -> microprocessor / MCU -> software-defined system. Stratix II parts belong to the high-performance, logic-, DSP-, and memory-rich tier of the FPGA taxonomy, often used for ASIC prototyping, parallel DSP, and high-throughput data-pipeline design.
Key features include 12 dedicated transceiver channels supporting up to 6.375 Gbps (per device family data), up to 152 18x18 multipliers, 1.2 V core operation, multiple phase-locked loops (PLLs), and DDR/DDR2/QDR II external memory interfaces with dedicated DQS logic. The device also supports the Altera (now Intel) Quartus II design flow with incremental compilation, LogicLock regions, and SOPC Builder for embedded-processor integration.
Stratix II uses a 90 nm process technology with a logic-structure overhaul versus Stratix I: the adaptive logic module (ALM) replaces the legacy 4-input LUT architecture, doubling effective logic density per area. This allows the EP2S130 to fit larger designs in the same footprint as earlier Stratix devices, while embedded memory blocks (M512/M4K/M-RAM) provide flexible on-chip storage for buffering, FIFOs, and packet queues.
Typical applications include high-speed serial-protocol bridges (PCI Express, Serial RapidIO, Gigabit Ethernet), ASIC prototyping, digital video broadcast equipment, software-defined radio baseband, and high-performance DSP pipelines for radar and medical imaging. The wide I/O count makes it well suited to memory-rich interfaces and bus aggregation designs.
When designing with this BGA-1020 part, ensure a 1.2 V core supply with sequencing as defined in the Stratix II handbook, and provide adequate PCB thermal relief - the package dissipates significant power under heavy logic utilization. The C4 speed grade is the slowest in the family; choose a higher speed grade (C3, C5, I3, I4, I5) only if timing closure demands it.
Drop-in alternatives for EP2S130F1020C4RB β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S130F1020C4RB (same form factor and footprint) β differing in Speed Grade, Package, Operating Temperature, RoHS Status, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S130F1020C5
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$4100 / Unit
View Datasheet βEP2S130F1020C4N
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View Datasheet βEP2S130F1020I4
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$1395 / Unit
View Datasheet βEP2S130F1020C3NRB
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$1245 / Unit
View Datasheet βEP2S130F1020C3N
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$1095 / Unit
View Datasheet βEP2S130F1020C4RB Maximum Ratings & Electrical Characteristics
| Device Family | Stratix II (EP2S130) |
| Logic Elements | 132,540 |
| Adaptive Logic Modules (ALMs) | 53,016 |
| User I/O Pins | 742 |
| Package | 1020-ball FBGA |
| Total RAM Bits | 6,747,000 |
| 18x18 Multipliers | 152 (per device family) |
| Transceiver Channels | 12 (up to 6.375 Gbps per family) |
| Speed Grade | C4 |
| Core Voltage | 1.2 V (typical) |
| Process Technology | 90 nm |
| Operating Temperature | Commercial (0C to +85C) |
| Mounting Type | Surface Mount (BGA) |
EP2S130F1020C4RB 1020-ball fbga Pin Configuration Guide
Pin configuration for EP2S130F1020C4RB (1020-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S130F1020C4RB.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S130F1020C4RB is suitable for 6 applications: ASIC Prototyping and Emulation, High-Speed Serial Protocol Bridges, Digital Video Broadcast Equipment, Software-Defined Radio Baseband, High-Performance DSP Pipelines (Radar/Medical Imaging), Defense and Industrial Long-Lifecycle Programs.
ASIC Prototyping and Emulation
The EP2S130F1020C4RB fits ASIC prototyping because its 132,540 logic elements and 6.747 Mbit of embedded RAM can absorb large multi-million-gate ASIC netlists while preserving pin-out flexibility. Engineers partition the target ASIC into LogicLock regions, compile incrementally, and iterate on RTL without re-spinning the silicon, reducing time-to-prototype by months versus traditional emulation farms. Compared with ASIC tape-out, the FBGA-1020 device supports hot-insertion into prototype boards, and the 90 nm Stratix II fabric provides predictable timing closure at GHz internal clock rates.
Recommended
High-Speed Serial Protocol Bridges
The EP2S130F1020C4RB integrates up to 12 transceiver channels operating up to 6.375 Gbps per Stratix II family specification, enabling PCIe Gen1/Gen2, Serial RapidIO, and Gigabit Ethernet bridge designs on a single chip. The 742 user I/O pins aggregate multiple low-speed interfaces such as GMII, SPI, and parallel DDR memory buses into the same device, eliminating an external bridge ASIC. Hardware designers benefit from dedicated hard IP for PCIe and RapidIO, plus on-chip PLLs that reduce external clocking components versus soft implementations on smaller FPGAs.
Recommended
Digital Video Broadcast Equipment
Broadcast video encoders, MPEG-4/H.264 transcoders, and HD-SDI routers rely on FPGAs like the EP2S130F1020C4RB to handle multi-channel parallel processing at wire speed. The 152 18x18 multipliers and ample embedded RAM (M512/M4K/M-RAM) provide the DSP and line-buffer resources needed for HD-to-SD down-conversion, motion estimation, and real-time de-interlacing. The 742 I/O count supports multiple SDI inputs, audio embedding, and front-panel control buses simultaneously, while the FBGA-1020 package provides the signal integrity needed for 1.485 Gbps SDI serialization.
Recommended
Software-Defined Radio Baseband
Software-defined radio baseband designs use FPGAs such as the EP2S130F1020C4RB to implement multi-channel digital down-conversion, channelization, and demodulation in parallel. The combination of high logic density (132,540 LE), 152 DSP multipliers, and 6.747 Mbit of RAM enables simultaneous processing of multiple LTE/WiMAX carriers within a single device. The 12 transceiver channels interface directly to RF front-end ADCs and DACs, eliminating external serializer/deserializer chips and reducing board area, while embedded Nios II soft-core integration enables on-chip protocol-stack processing.
Recommended
High-Performance DSP Pipelines (Radar/Medical Imaging)
Radar signal processing and medical imaging (CT, MRI, ultrasound) front-ends rely on dense FPGA DSP capability. The EP2S130F1020C4RB's 152 18x18 multipliers and parallel ALM fabric support beam-forming, FFT pipelines, and image-reconstruction kernels at line rate. The large embedded RAM (M-RAM blocks up to 500 kbit each) holds FFT window coefficients and intermediate sample arrays, while the 1.2 V core voltage keeps per-channel power dissipation manageable in dense multi-channel systems. The 742 I/O accommodates parallel LVDS data acquisition from high-speed ADCs.
Recommended
Defense and Industrial Long-Lifecycle Programs
Defense avionics, naval communications, and industrial process-control systems with 15 to 25-year support windows often retain Stratix II designs because re-qualifying a new FPGA family is cost-prohibitive. The EP2S130F1020C4RB's 1020-ball FBGA package, 742 I/O count, and proven 90 nm silicon provide a stable platform for these programs. Engineers maintain existing Quartus II design databases and LogicLock-based incremental compilation flows without retraining, while the device's hot-socketing capability simplifies field-service replacement on live systems.
Recommended
Recommended Products Summary
Engineering reference data for EP2S130F1020C4RB β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F1020C5 | EP2S130F1020C4N | EP2S130F1020I4 | EP2S130F1020C3NRB | EP2S130F1020C3N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FBGA | 1020-ball FBGA (same) | 1020-ball FBGA (same) | 1020-ball FBGA (same) | 1020-ball FBGA (same) | 1020-ball FBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Speed Grade | C4 | C5 (faster) | C4 (same) | I4 (industrial) | C3 (faster, RB suffix) | C3 (faster) |
| Operating Temperature | Commercial 0C to +85C | Commercial | Commercial | Industrial -40C to +100C | Commercial | Commercial |
| User I/O Pins | 742 | 742 | 742 | 742 | 742 | 742 |
| Total RAM Bits | 6,747,000 | 6,747,000 | 6,747,000 | 6,747,000 | 6,747,000 | 6,747,000 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Slowest but most timing-conservative speed grade in Stratix II family (vs EP2S130F1020C5)
- Same silicon die as commercial C4N variant (vs EP2S130F1020C4N)
- Drop-in compatible with industrial temperature I4 variant (vs EP2S130F1020I4)
Design Notes
The EP2S130F1020C4RB requires a 1.2 V core supply plus separate VCCPD (3.3 V or 2.5 V) and VCCAUX rails, all of which must sequence according to the Stratix II handbook to avoid latch-up. Use a multi-rail controller such as the LTC3567 or ISL6549 with power-good feedback to each rail. Decoupling requires dozens of 0.1 uF and 10 uF ceramic capacitors placed adjacent to BGA power balls, plus bulk capacitance of 100 uF per rail.
Estimated: at 100 percent logic utilization and 1.2 V core, the EP2S130 can dissipate 8 to 12 W depending on toggle rate. The FBGA-1020 package theta_JA is approximately 15 C/W with a 4-layer JEDEC board, yielding a 75 C/W rise that may exceed commercial temperature limits without airflow. Recommended: provide at least 200 LFM airflow, use thermal vias under the BGA, and consider a heatsink for >70 percent utilization designs.
The FBGA-1020 ball pitch is 1.0 mm, requiring via-in-pad micro-vias or sub-100 um laser-drilled vias on a high-layer-count PCB (8+ layers). Maintain 50 ohm controlled impedance on transceiver channels and 100 ohm differential for LVDS pairs per Stratix II handbook recommendations. Keep the JTAG chain length below 6 inches and add a 4.7 kohm pull-up on nCONFIG plus 1 kohm pull-up on nCE per the configuration chapter.
Do not mix C3, C4, and C5 speed grades in the same JTAG chain without verifying IDCODE ordering, because Quartus II programming files are speed-grade-specific. Do not enable hot-socketing features without verifying that all transceivers are powered down during insertion, otherwise back-drive current can damage the device. The MSEL[2:0] configuration mode pins must be tied to fixed values via 4.7 kohm resistors - floating MSEL pins can cause intermittent configuration failure.
Compliance Information
RoHS/REACH/lead-free status for EP2S130F1020C4RB not explicitly stated in the Verified Web Data. Stratix II family parts were typically available in both lead-free (RB suffix) and leaded versions; confirm ordering code suffix with the supplier. AEC-Q100 is not applicable for this high-end commercial/industrial FPGA.
