EP2AGX190EF29C4G - Arria II GX FPGA, 181K LEs, 780-FCBGA | Intel
MPN: EP2AGX190EF29C4G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3450 | $3,450.00 |
| 10 | $3285 | $32,850.00 |
| 100 | $2960 | $296,000.00 |
| 500 | $2755 | $1,377,500.00 |
| 1,000 | $2510 | $2,510,000.00 |
EP2AGX190EF29C4G Overview
What is an FPGA? A field-programmable gate array (FPGA) is a programmable logic device (PLD) that lets engineers configure digital logic, memory, and I/O blocks in the field after manufacturing. Within the broader semiconductor taxonomy, FPGAs sit inside the programmable logic family, which is a branch of standard-cell ASICs in the larger category of logic ICs. Arria II GX FPGAs specifically target mid-range applications that require transceivers, DSP, and embedded memory with lower power than the Stratix IV family at higher cost than Cyclone IV.
Key features of this part include up to 372 user I/Os, dedicated 6.375 Gbps transceivers, 1.4 Gbps LVDS support, on-chip termination (OCT), and built-in hard PCI Express and external memory controller blocks. The 0.9 V core voltage reduces dynamic power versus prior 90 nm nodes, while the 780-ball FCBGA package provides high signal and power integrity for high-pin-count designs.
Architecturally, the EP2AGX190 uses an LUT-based fabric with embedded SRAM, true dual-port memory blocks, and 8B/10B-coded transceivers. Per the Arria II Device Handbook (Volume 1, document AIIGX5V1-4.6), this C4 speed-grade device is the slowest in the Arria II family, making it well suited for cost-sensitive designs where timing closure is not aggressive.
Typical applications include high-speed serial protocol bridging, video broadcast and image processing pipelines, wireless baseband pre-processing, and industrial control systems requiring custom logic plus gigabit serial links.
When designing with this device, allocate sufficient PCB layers (at least eight) and proper BGA fanout for the 780-ball FCBGA. Plan power-rail decoupling per the Altera Early Power Estimator (EPE) tool before schematic capture.
This page synthesizes distributor stock, drop-in alternatives from the same Intel/Altera Arria II family, and practical design notes that complement the manufacturer datasheet.
Drop-in alternatives for EP2AGX190EF29C4G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX190EF29C4G (same form factor and footprint) β differing in Package, Speed Grade, Process Technology, Family, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX190EF29C6G
β Drop-Inβ In Stock
$1010 / Unit
View Datasheet βEP2AGX190EF29I3
β Drop-Inπ Reference alternative (not in catalog)
EP2AGX190EF29C5N
β Drop-Inπ Reference alternative (not in catalog)
EP2AGX190EF29C7N
β Drop-Inπ Reference alternative (not in catalog)
EP2AGX125EF29C4G
β Drop-Inβ In Stock
$1100 / Unit
View Datasheet βEP2AGX190EF29C4G Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements (LEs) | 181,165 |
| Embedded Memory (bits) | 10,177,536 |
| User I/Os | 372 |
| Maximum User I/O Pins | 372 |
| Transceiver Channels | 8 (up to 6.375 Gbps) |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | C4 |
| Package | 780-ball FCBGA, 29 mm |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
| Programming Method | In-system (via JTAG) and SRAM-based |
EP2AGX190EF29C4G 780-ball fcbga, 29 mm Pin Configuration Guide
Pin configuration for EP2AGX190EF29C4G (780-ball fcbga, 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX190EF29C4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX190EF29C4G is suitable for 7 applications: High-Speed Serial Protocol Bridging, Video Broadcast and Image Processing Pipelines, Wireless Baseband Pre-Processing, Industrial Control and Motion Systems, Test and Measurement Instrumentation, Medical Imaging Pre-Processing, Aerospace and Defense Avionics Buses.
High-Speed Serial Protocol Bridging
The EP2AGX190EF29C4G's 8 transceiver channels supporting up to 6.375 Gbps make it a strong fit for protocol-bridging applications such as PCIe Gen1/Gen2 endpoint expansion, Serial RapidIO fan-out, and CPRI links in distributed base stations. With 181,165 logic elements and 10,177,536 embedded-memory bits, the device can absorb both the PHY layer and the transport-logic layer in a single chip. Placed on a multi-layer PCB with proper BGA fanout and 100-ohm differential routing, it delivers deterministic latency under heavy traffic. This consolidation reduces board area and BOM cost versus two-chip PHY-plus-FPGA solutions.
Recommended
Video Broadcast and Image Processing Pipelines
With up to 372 user I/Os and embedded DSP blocks, the EP2AGX190EF29C4G suits HD-SDI video routers, image-sensor pre-processors, and broadcast-format converters. The 0.9 V core plus on-chip memory bandwidth enables real-time scaling, color-space conversion, and frame-buffer management without external SDRAM contention. Pair the FPGA with a serializer/deserializer (SerDes) and DDR2 memory for a complete multi-channel broadcast system. Compared with ASIC alternatives, the Arria II GX drastically shortens time-to-market while still meeting deterministic latency budgets.
Recommended
Wireless Baseband Pre-Processing
The 6.375 Gbps transceivers and DSP block density of the EP2AGX190EF29C4G support CPRI and OBSAI baseband pre-processing tasks such as crest-factor reduction (CFR) and digital pre-distortion (DPD). The 181K-LE fabric handles channelization, FFT pre-processing, and gain-control loops. Combined with a TI ADC and DAC front end, it forms a complete radio-head signal chain. The industrial-grade speed grades (I3/I4) extend operation to outdoor or harsh-environment deployments.
Recommended
Industrial Control and Motion Systems
Industrial motion-control cards leverage the EP2AGX190EF29C4G's abundant user I/Os (up to 372) to drive multiple stepper or servo axes while maintaining deterministic EtherCAT or SERCOS III real-time Ethernet links. The 40 nm process keeps on-board power dissipation manageable for fan-less industrial enclosures, and built-in hard PCIe controllers simplify host communication. Industrial programs often choose the C4 grade as the cost-optimized baseline.
Recommended
Test and Measurement Instrumentation
Automated test equipment (ATE) and bench instruments use the EP2AGX190EF29C4G to generate arbitrary waveforms, capture high-speed signals, and protocol-decode serial buses. The large embedded-memory buffer (10 Mbits) plus on-chip termination enables long acquisitions without external RAM. The 8 transceivers can handle multi-lane protocols such as multi-Gigabit Transceiver Link (MGTL) or stacked PCIe lanes for backplane interconnect.
Recommended
Medical Imaging Pre-Processing
Ultrasound beamformers and MRI front-end cards benefit from the EP2AGX190EF29C4G's combination of embedded DSP blocks and high I/O count, allowing real-time channel summing, filtering, and decimation. The Arria II GX family offers the right balance of cost, DSP throughput, and power for portable diagnostic systems. When designing these systems, validate that the C4 speed grade closes timing for the channel-count and sample-rate required by the modality.
Recommended
Aerospace and Defense Avionics Buses
Although not formally MIL-STD-883 qualified, the EP2AGX190EF29C4G is widely used in defense subsystem prototypes where MIL-1553, ARINC 429, or Fibre Channel backbones require custom protocol logic. The 8 transceivers handle Fibre Channel or sFPDP links, while the 181K-LE fabric hosts encryption or error-correction IP. Industrial speed grades (I3/I4) extend the device's reach into harsher aerospace environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX190EF29C4G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX190EF29C6G | EP2AGX190EF29I3 | EP2AGX190EF29C5N | EP2AGX190EF29C7N | EP2AGX125EF29C4G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same |
| Logic Elements | 181,165 | 181,165 | 181,165 | 181,165 | 181,165 | 124,100 |
| Speed Grade | C4 | C6 (faster) | I3 (industrial, faster) | C5 (mid) | C7 (fastest commercial) | C4 (same) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| User I/Os | 372 | 372 | 372 | 372 | 372 | 372 |
| Transceivers | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps |
| Process / Core Voltage | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V |
| RoHS / Pb-Free | RoHS / Pb-free | RoHS / Pb-free | RoHS / Pb-free | RoHS / Pb-free (N suffix) | RoHS / Pb-free (N suffix) | RoHS / Pb-free |
Key Differentiators
- Highest density Arria II GX with 181,165 LEs (vs EP2AGX125EF29C4G)
- C4 speed grade balances cost and timing closure (vs EP2AGX190EF29C7N)
- Pin-compatible industrial upgrade path (vs EP2AGX190EF29I3)
Design Notes
The 780-FCBGA has a 1.0 mm ball pitch and requires at least 8 PCB layers to fan out user I/Os, transceivers, and power. Use a stack-up with dedicated GND and 0.9 V core planes, and route 100-ohm differential pairs (length-matched within 5 mil) for transceiver channels. Decouple VCC with 0.1 uF + 10 uF ceramic capacitors at every FPGA power pin.
Run the Altera/Intel Early Power Estimator (EPE) tool before schematic capture. Estimated: at typical 65% utilization, 8 transceivers active, and 200 MHz core, the EP2AGX190EF29C4G dissipates around 8-10 W; ensure the PCB thermal design keeps the junction below 100C. A thermal pad with 25+ thermal vias under the BGA is recommended.
Do not confuse the C4 speed grade (commercial slow) with I4 (industrial fast), or assume pin compatibility between 780-FCBGA EF29 and 1152-FCBGA EF35 packages in the same family. Always verify against the device handbook pin tables. When migrating designs to newer Altera/Intel families, recompile the Quartus project and re-validate timing - bitstreams are not portable across families.
Compliance Information
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified (FPGA is not an automotive-grade part).
