EP2AGX190EF29C6G - Arria II GX FPGA 190K LE, 780-FCBGA | Intel
MPN: EP2AGX190EF29C6G ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1340 | $13,400.00 |
| 100 | $1230 | $123,000.00 |
| 500 | $1120 | $560,000.00 |
| 1,000 | $1010 | $1,010,000.00 |
EP2AGX190EF29C6G Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware blocks (transceivers, DSP slices, embedded RAM, PLLs) on a single die. FPGAs sit between generic microcontrollers and fixed-function ASICs in the silicon hierarchy: programmable logic -> configurable logic -> semiconductor. Arria II GX specifically bridges Cyclone (low-cost) and Stratix (high-performance) families by offering transceivers up to 6.375 Gbps with a balanced logic-and-transceiver fabric.
Key features include 372 maximum user I/O pins, integrated PCI Express hard IP, multiple high-speed transceivers supporting 600 Mbps to 6.375 Gbps data rates, 8-input fracturable ALMs, dedicated DSP blocks, and on-chip PLLs for clock management. The device is built on a 40 nm process and supports 1.0 V, 1.1 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V single-ended I/O standards via bank-based configuration.
The Arria II GX architecture separates logic resources (ALMs, M9K/M144K memory blocks, MLABs) from transceiver resources, allowing the same device to address protocols such as PCIe Gen1/Gen2, CPRI/OBSAI, Serial RapidIO, XAUI, and SGMII without external PHY chips. Hard IP blocks reduce soft-logic overhead and deterministic latency, critical for protocol bridging in wireless baseband and broadcast video.
Typical applications include wireless base-station digital front-end, broadcast video processing and switching, PCIe Gen2 add-in cards, communications infrastructure line cards, and high-speed serial protocol bridging. The -6 commercial speed grade targets designs operating in 0C to 85C ambient with default speed margin.
When designing with EP2AGX190EF29C6G, ensure power-rail sequencing follows Altera's POR guidelines and that transceiver reference clocks meet the +/-100 ppm jitter spec. Quartus II design software (13.0 and later service packs) is the required development environment.
This page synthesizes verified distributor pricing, drop-in same-family alternatives from the Site MPN catalog, and practical design notes not consolidated in any single manufacturer document.
Drop-in alternatives for EP2AGX190EF29C6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX190EF29C6G (same form factor and footprint) — differing in Package, Speed Grade, Family, Operating Temperature, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX190EF29C5G
✅ Drop-In✓ In Stock
$1071.99 / Unit
View Datasheet →EP2AGX190EF29C4G
✅ Drop-In✓ In Stock
$2510 / Unit
View Datasheet →EP2AGX125EF29C6G
✅ Drop-In✓ In Stock
$1495 / Unit
View Datasheet →EP2AGX125EF29C5G
✅ Drop-In✓ In Stock
$1090 / Unit
View Datasheet →EP2AGX125EF29C4G
✅ Drop-In✓ In Stock
$1100 / Unit
View Datasheet →EP2AGX190EF29C6G Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Family | Arria II |
| Logic Elements (LE) | 190,000 |
| Adaptive Logic Modules (ALM) | 181,165 |
| Total RAM Bits | 10,177,536 (12,144 Kbit) |
| Maximum User I/O | 372 |
| Operating Temperature | 0C to 85C (commercial) |
| Speed Grade | -6 |
| Package | 780-ball FCBGA (Flip-Chip BGA) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Process Node | 40 nm |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps |
EP2AGX190EF29C6G 780-ball fcbga (flip-chip bga) Pin Configuration Guide
Pin configuration for EP2AGX190EF29C6G (780-ball fcbga (flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX190EF29C6G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX190EF29C6G is suitable for 6 applications: Wireless Base Station Digital Front-End, Broadcast Video Processing and Routing, PCIe Gen2 Add-in Cards, Communications Infrastructure Line Cards, High-Speed Protocol Bridging, Industrial Test and Measurement.
Wireless Base Station Digital Front-End
The EP2AGX190EF29C6G is well-suited for wireless base-station digital front-end (DFE) processing where CPRI/OBSAI links, multi-antenna signal conditioning, and digital up/down conversion must coexist on a single FPGA. Its transceivers support 600 Mbps to 6.375 Gbps, covering all CPRI line rates up to CPRI 5, and the 12,144 Kbit embedded RAM provides ample buffering for sample-rate conversion between ADC/DAC data and the baseband interface. With 190K logic elements, a single device can implement multi-sector DFE chains including crest-factor reduction (CFR), digital pre-distortion (DPD), and beamforming weights. The -6 commercial speed grade is sufficient for LTE and 5G NR sub-6 GHz numerologies in 0C to 85C ambient. Altera's hard CPRI IP and PCIe Gen2 hard IP reduce soft-logic overhead, leaving more LE for DSP blocks and custom signal processing pipelines.
Recommended
Broadcast Video Processing and Routing
Broadcast video routers, frame synchronizers, and up/down/cross converters benefit from the EP2AGX190EF29C6G's combination of high logic density and high-speed transceivers. SDI (Serial Digital Interface) at 3G-SDI and 6G-SDI rates (2.97 Gbps and 5.94 Gbps nominal) falls within the device's 6.375 Gbps transceiver envelope, enabling multi-channel 3G-SDI I/O without external PHY chips. The 12,144 Kbit embedded RAM serves as line buffers and frame stores for scaling and color-space conversion. With 372 maximum user I/O and 190K logic elements, the device can aggregate 30+ SDI streams with on-chip de-embedder, frame-sync, and audio-processing logic. The -6 speed grade meets timing closure for 148.5 MHz and 297 MHz video clocks. Altera/Intel's SDI MegaCore and Triple-Rate SDI IP provide silicon-validated transport, which simplifies broadcast system integration for studio, mobile production, and master-control workflows.
Recommended
PCIe Gen2 Add-in Cards
PCI Express Gen2 add-in cards benefit from the EP2AGX190EF29C6G's hard PCIe Gen2 IP, which supports x1/x4/x8 lane configurations at 5 Gbps without consuming soft logic resources. This hard IP block saves approximately 20-30K logic elements versus a soft PCIe implementation, freeing silicon for application logic such as protocol translation, packet processing, or data aggregation. The device's 372 maximum user I/O and 12,144 Kbit embedded RAM allow a single FPGA to implement endpoint plus DMA engines, scatter-gather controllers, and on-card buffering for high-throughput applications like NVMe-over-PCIe bridges or instrumentation data acquisition cards. The -6 speed grade handles 250 MHz PCIe Gen2 user-clock logic comfortably. Combined with Altera's Quartus II PCIe Compiler, designers achieve compliance quickly while retaining flexibility for custom protocol extensions.
Recommended
Communications Infrastructure Line Cards
Telecom line cards in metro and edge routers use the EP2AGX190EF29C6G to bridge multiple high-speed serial protocols including 10G Ethernet (XAUI/10GBASE-CX4), Serial RapidIO, and Interlaken. With transceivers reaching 6.375 Gbps, the device can terminate 10G Ethernet XAUI lanes directly, while its 190K logic elements accommodate packet classification, queuing, and traffic-management functions. The 12,144 Kbit embedded RAM is sufficient for shared buffer pools in 10G-class packet processors. Hard PCIe Gen2 IP enables direct connection to network processors or switch fabrics, reducing BOM cost and latency. The -6 commercial speed grade is adequate for line-card ambient environments of 0C to 85C. Altera's 10G Ethernet MAC and Interlaken MegaCores provide silicon-proven data-path options for rapid NPI cycles.
Recommended
High-Speed Protocol Bridging
The EP2AGX190EF29C6G serves as a flexible protocol bridge in test, aerospace, and defense applications where multiple serial standards must be adapted without a custom ASIC. The transceiver range of 600 Mbps to 6.375 Gbps covers SGMII, Serial RapidIO, Aurora, and lower-rate custom protocols simultaneously on different channels. The 190K logic elements allow implementation of multiple protocol converters with on-chip DMA engines and FIFOs, while the 12,144 Kbit embedded RAM supports packet reassembly. The -6 speed grade meets timing closure for 156.25 MHz and 312.5 MHz reference clocks common in telecom and aerospace backplanes. This makes the device ideal for rapid prototyping of protocol-bridge designs and for low-volume production in industrial and defense applications where ASIC NRE is not economical.
Recommended
Industrial Test and Measurement
Test and measurement equipment - oscilloscopes, logic analyzers, protocol exercisers, and ATE (Automatic Test Equipment) - use the EP2AGX190EF29C6G for high-speed signal acquisition, processing, and stimulus generation. The 12,144 Kbit embedded RAM provides deep acquisition memory for capturing multi-gigasample-per-second waveforms, while the 372 user I/O can interface directly with high-speed ADCs and DACs using LVDS or DDR external memory interfaces. Transceivers support 6.375 Gbps serial protocols like 10GbE and PCIe for backhaul to host processors or for instrument synchronization. The 190K logic elements allow on-chip DSP blocks to implement FFTs, filtering, and trigger logic in real time. The -6 speed grade supports the timing closure of 250+ MHz acquisition clocks, and the 0C to 85C commercial temperature range covers standard lab and factory-floor environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX190EF29C6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX190EF29C5G | EP2AGX190EF29C4G | EP2AGX125EF29C6G | EP2AGX125EF29C5G | EP2AGX125EF29C4G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FCBGA | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same |
| Logic Elements | 190,000 | 190,000 | 190,000 | 125,000 (-34%) | 125,000 (-34%) | 125,000 (-34%) |
| Adaptive Logic Modules (ALM) | 181,165 | 181,165 | 181,165 | ~119,000 (-34%) | ~119,000 (-34%) | ~119,000 (-34%) |
| Embedded RAM (Kbit) | 12,144 | 12,144 | 12,144 | ~8,100 (-33%) | ~8,100 (-33%) | ~8,100 (-33%) |
| Speed Grade | -6 (commercial, fastest) | -5 (commercial, medium) | -4 (commercial, slowest) | -6 (commercial, fastest) | -5 (commercial, medium) | -4 (commercial, slowest) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest-density Arria II GX in the 780-FCBGA package line (vs EP2AGX125EF29C6G)
- Fastest commercial speed grade (-6) (vs EP2AGX190EF29C5G)
- Integrated hard IP blocks (PCIe Gen2, transceivers) (vs Cyclone V FPGAs (lower-cost alternative))
- 190K LE + 12,144 Kbit RAM balance (vs Stratix IV (higher-end, more expensive))
Design Notes
Estimated: At full utilization (190K LE + all transceivers active), EP2AGX190EF29C6G can dissipate 8-12 W. The 780-FCBGA package relies on PCB thermal vias and a heatsink for thermal management; without a heatsink, junction temperature may exceed 100C. Design PCB with at least 4 thermal vias in the central ball array, use a 1 oz copper inner plane on top layer, and consider a low-profile heatsink (e.g., 10 mm tall, 100 mm^2 footprint) for natural convection cooling. Forced-air cooling extends thermal headroom for hot industrial environments.
The 780-FCBGA package requires a 1.0 mm ball pitch and high-density interconnect PCB design. Use a minimum 6-layer stackup with 0.5 oz copper on signal layers and 1 oz on power/ground planes. Via-in-pad with filled and plated-over copper caps is recommended for BGA escape routing. Differential pair routing for transceivers must maintain 100 ohm differential impedance with matched lengths (within 5 mil for 6.375 Gbps lanes). Use a known-good stackup manufacturer (e.g., PCB-Pool, Eurocircuits, or in-house fabrication) for signal-integrity-critical designs.
EP2AGX190EF29C6G requires multiple supply rails: VCCINT (core), VCCPD (I/O pre-driver), VCCIO (I/O banks), VCCA_PLL, VCCD_PLL, and dedicated transceiver supplies (VCCE_GXB, VCCT_GXB, VCCR_GXB). Power-on sequencing is mandatory - VCCINT must ramp first, followed by VCCPD, then VCCIO banks. Use a dedicated FPGA power sequencer IC (e.g., Altera/Intel's Enpirion EN63A0QI or similar PMIC) rather than discrete regulators to ensure correct sequencing. Decoupling capacitors (0.1 uF, 1 uF, 10 uF) must be placed within 5 mm of each power pin cluster.
Transceiver channels up to 6.375 Gbps require strict signal-integrity discipline. Maintain 100 ohm differential impedance on transceiver lanes, with intra-pair skew <1 mil and inter-pair skew <100 mil for parallel protocols. Reference clocks for transceivers (REFCLK) must come from a low-jitter source (RMS jitter <300 fs for 6.375 Gbps); a common clock-distribution IC like the CDCE62002 or Si5338 is recommended. Pre-emphasis and equalization settings in the Quartus II Transceiver Toolkit should be validated with a BERT (Bit Error Rate Tester) at the system level.
Common pitfalls with EP2AGX190EF29C6G: (1) Forgetting to instantiate the JTAG chain correctly when using multiple FPGAs in series; (2) Mixing 1.5 V and 1.8 V on the same I/O bank without checking bank-VCCIO compatibility; (3) Omitting the reset pull-up on nCONFIG, which can cause configuration failure in noisy environments; (4) Designing without accounting for NRND status - new designs should evaluate newer Arria 10 or Agilex families; (5) Using older Quartus II versions that lack transceiver IP support for newer protocols.
Compliance Information
RoHS and REACH compliant per DigiKey listing (2026-09-08). Halogen-free status not explicitly stated in verified data. Not AEC-Q100 qualified - this is a commercial-grade FPGA. Conflict-minerals declaration not found in verified sources.