EP2AGX45DF25C5G - Arria II GX FPGA 42K LEs 572-FCBGA | Intel
MPN: EP2AGX45DF25C5G ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $162 | $162.00 |
| 10 | $152 | $1,520.00 |
| 100 | $140 | $14,000.00 |
| 500 | $128 | $64,000.00 |
| 1,000 | $118 | $118,000.00 |
EP2AGX45DF25C5G Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can reconfigure post-manufacturing to implement arbitrary digital logic, signal processing, or interface protocols. FPGAs sit hierarchically under programmable logic -> logic IC -> integrated circuit -> semiconductor, providing higher performance-per-watt and lower latency than microcontrollers for parallel workloads while offering more flexibility than ASICs.
Key features of the EP2AGX45DF25C5G include a maximum operating frequency of 500 MHz, embedded transceiver channels supporting PCI Express Gen1/Gen2 and Gigabit Ethernet, dedicated 18x18 multipliers for DSP, and support for external memory interfaces including DDR3, DDR2, and QDRII+. The device family uses a logic-element fabric with adaptive logic modules (ALMs), eight-input fracturable look-up tables, and embedded SRAM blocks distributed throughout the fabric.
Architecturally, the Arria II GX combines a hard PCIe Gen2 IP core with up to 8 full-duplex 3.75 Gbps transceivers and a rich DSP block inventory (up to 232 18x18 multipliers). The 40 nm process delivers a strong performance-per-watt envelope for mid-range designs that need transceivers but cannot justify the cost of a Stratix-class device, making it popular for protocol bridging, video processing, and wireless baseband pre-processing.
Typical applications include telecommunications infrastructure (PCIe-over-cable backplanes, multi-gigabit serial links), broadcast video processing, industrial imaging and machine vision, wireless base stations, and radar signal pre-processing. Designers select the EP2AGX45DF25C5G when they need integrated transceivers plus a moderate logic budget in a single chip.
When designing with this FPGA, pay close attention to transceiver reference-clock jitter and PCB stack-up, because 3.75 Gbps SERDES performance is highly sensitive to channel loss. Use the Quartus II design software (13.0 or later with Arria II device support) for synthesis, place-and-route, and timing closure, and follow Intel's pin connection guidelines for the 25x25 mm 572-FCBGA package to ensure reliable solder-joint formation.
Drop-in alternatives for EP2AGX45DF25C5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX45DF25C5G (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Logic Elements, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX45DF25C6G
✅ Drop-In✓ In Stock
$128 / Unit
View Datasheet →EP2AGX45DF25C4G
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →EP2AGX45DF25C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$258.2 / Unit
View Datasheet →EP2AGX45DF25C4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$460 / Unit
View Datasheet →EP2AGX45DF25C5G Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Family | Arria II GX FPGA |
| Logic Elements (LEs) | 42,959 |
| Embedded Memory Bits | 3,517,440 |
| User I/Os | 252 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Maximum Operating Frequency | 500 MHz |
| Transceivers | Up to 8 (3.75 Gbps) |
| Package | 572-FCBGA (25x25 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Speed Grade | 5 (mid-tier) |
EP2AGX45DF25C5G 572-fcbga (25x25 mm) Pin Configuration Guide
Pin configuration for EP2AGX45DF25C5G (572-fcbga (25x25 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX45DF25C5G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX45DF25C5G is suitable for 7 applications: Telecommunications Infrastructure, Broadcast Video Processing, Industrial Machine Vision, Wireless Base Station, Radar Signal Pre-Processing, Medical Imaging Equipment, Test and Measurement Instrumentation.
Telecommunications Infrastructure
The EP2AGX45DF25C5G's eight integrated 3.75 Gbps transceivers make it well-suited for telecom infrastructure such as PCIe-over-cable backplanes, multi-gigabit serial link aggregation, and CPRI baseband pre-processing. The 42,959 LEs and 3.5 Mbits of embedded memory absorb packet buffers and protocol adaptation logic, while the dedicated hard PCIe Gen2 IP core reduces soft-logic area by ~30K LEs versus a SERDES-only implementation. Compared to a discrete SERDES plus FPGA approach, the integrated transceivers shorten PCB trace length and improve signal-integrity margin, which is critical at 3.75 Gbps where channel loss dominates link budget.
Recommended
Broadcast Video Processing
The EP2AGX45DF25C5G handles SD/HD/3G-SDI video processing pipelines including up/down/cross-conversion, frame-rate conversion, and color-space transformation. The 232 18x18 DSP multipliers provide the parallel multiply-accumulate throughput needed for chroma upsampling and noise reduction, while 3.5 Mbits of embedded RAM buffers multiple video lines at full HD resolutions. The transceiver channels support SDI-over-IP (SMPTE 2022) and HDMI 1.4 bridging, which makes this FPGA common in broadcast studio gear and video-wall controllers.
Recommended
Industrial Machine Vision
Industrial camera systems use the EP2AGX45DF25C5G to receive high-speed image data from CoaXPress or Camera Link interfaces, perform real-time preprocessing (defect detection, barcode reading, optical alignment), and forward results over Gigabit Ethernet. The 8 transceivers natively support CoaXPress up to 3.125 Gbps per lane, while the 500 MHz fabric processes 5-megapixel frames at 60 fps within the embedded memory budget. The industrial 0C to +85C operating range and Pb-free 572-FCBGA package suit factory-floor deployment where vibration and thermal cycling are concerns.
Recommended
Wireless Base Station
The EP2AGX45DF25C5G serves wireless base-station applications including LTE small-cell digital front-end, CPRI fronthaul aggregation, and baseband pre-processing. Its 8 transceivers carry multiple CPRI links at 2.4576 or 3.072 Gbps, while the DSP blocks implement FFT/iFFT and channel-filter functions needed for physical-layer processing. Power consumption stays within typical small-cell thermal envelopes because the 40 nm process and 0.9 V core are tuned for low static current. Designers migrating from older Stratix II designs often pick the Arria II GX for cost reasons while keeping the same Quartus II toolchain.
Recommended
Radar Signal Pre-Processing
The EP2AGX45DF25C5G supports phased-array radar pre-processing tasks including digital down-conversion, pulse compression, and beamforming. The transceiver channels accept raw IF data from A/D converters at up to 3.75 Gbps, while the DSP multiplier array performs FIR filtering and FFT-based Doppler analysis. Embedded memory stores range-bin buffers for moving-target indication, and the fabric's deterministic timing makes it suitable for time-sensitive radar gating. Military and weather-radar systems frequently use this FPGA family because of its NRND-stable supply and predictable availability for sustainment programs.
Recommended
Medical Imaging Equipment
Medical imaging modalities including ultrasound and endoscopy leverage the EP2AGX45DF25C5G for beamforming, image reconstruction, and DICOM-over-Ethernet streaming. The transceiver channels accept raw transducer data at multi-gigabit rates while the DSP blocks perform real-time apodization and beam-steering calculations. The 252 user I/Os interface to image sensors, motor controllers, and high-resolution displays, and the 500 MHz fabric maintains deterministic latency required for diagnostic-quality imaging. Designers must follow IEC 60601 isolation practices when integrating this FPGA into patient-connected medical devices.
Recommended
Test and Measurement Instrumentation
Test-and-measurement instruments such as protocol analyzers, logic analyzers, and high-speed data recorders use the EP2AGX45DF25C5G for real-time pattern matching, state-machine-based sequencing, and protocol-aware triggering. The 8 transceivers ingest multi-gigabit serial streams from DUTs (USB 3.0, PCIe Gen2, SATA), while the 3.5 Mbits of embedded RAM buffers captured events before offload to host PC over Gigabit Ethernet. Designers favor this FPGA because the hard PCIe Gen2 endpoint allows direct streaming into a host workstation's PCIe slot for sustained capture bandwidth.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX45DF25C5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX45DF25C6G | EP2AGX45DF25C4G | EP2AGX45DF25C5N |
|---|---|---|---|---|
| Package | 572-FCBGA (25x25 mm) | 572-FCBGA (25x25 mm) - same | 572-FCBGA (25x25 mm) - same | 572-FCBGA (25x25 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Speed Grade | C5 (mid-tier) | C6 (faster) | C4 (slower) | C5 (same) |
| Logic Elements | 42,959 LEs | 42,959 LEs | 42,959 LEs | 42,959 LEs |
| Transceivers | 8 x 3.75 Gbps | 8 x 3.75 Gbps | 8 x 3.75 Gbps | 8 x 3.75 Gbps |
| Embedded Memory | 3,517,440 bits | 3,517,440 bits | 3,517,440 bits | 3,517,440 bits |
| User I/Os | 252 | 252 | 252 | 252 |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- Faster speed grade within the same 572-FCBGA footprint (vs EP2AGX45DF25C4G)
- Cost-optimized alternative shares exact pinout (vs EP2AGX45DF25C4G)
- Same package and pinout as C5 with N-suffix plating (vs EP2AGX45DF25C5N)
Design Notes
The 572-FCBGA package has a typical junction-to-ambient thermal resistance (theta_JA) of approximately 8-12 C/W with sufficient PCB copper. Estimated: at 1.0W total power dissipation, junction temperature rises ~10C above ambient; at 5W (typical for transceiver-active Arria II GX designs), expect ~50C rise. Use 4-layer PCB with continuous inner-plane copper and thermal vias under the exposed die region to maintain TJ below 100C. Designers should validate with PowerPlay power analysis in Quartus II for their specific utilization profile.
For the 25x25 mm 572-FCBGA package, follow Intel's pin connection guidelines for via-in-pad design and 1.0 mm ball pitch. Use 0.5 mm drilled microvias with 0.25 mm capture pads for signal escape, and full ground/power planes on adjacent layers. Differential pair length matching should be within 150 mils for transceiver lanes, and AC-coupling capacitors (0.01 uF) must be placed within 250 mils of the transmitter pins to meet PCIe Gen2 and 3.75 Gbps SERDES compliance.
Three pitfalls to avoid: (1) Do not use the EP2AGX45CU17 variant as a drop-in replacement - it uses a different 358-uBGA package. (2) Do not assume C4/C5/C6 speed grades are interchangeable without re-running timing analysis - each grade has distinct timing models in Quartus II. (3) Confirm the part's NRND status before committing to new designs; Intel is steering customers to Cyclone V or Arria 10, and long-term production availability beyond 2027 is not guaranteed.
Compliance Information
RoHS compliant per Besenchips and LCSC distributor listings. Not AEC-Q100 qualified - this is a commercial-grade FPGA. Halogen-free status not specified in available web data; marked unknown. Conflict minerals compliance follows Intel's standard CMRT reporting.
