EP2AGX65DF25C5G - 60,214 Logic Elements FPGA | Altera
MPN: EP2AGX65DF25C5G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $221.6096 | $221.61 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2AGX65DF25C5G Overview
An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic blocks, routing resources, memory, and input/output structures. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing for different digital architectures. In the hierarchy of programmable logic, EP2AGX65DF25C5G belongs to the Arria II GX family, positioned as a high-density FPGA for embedded, communications, signal-processing, and data-processing applications.
The headline resources of 60,214 logic elements, 5,371,904 embedded-memory bits, and 252 DSP blocks provide the capacity for parallel datapaths, protocol handling, filtering, buffering, and control functions. The 40 nm process technology supports the integration of these resources, while the 0.9 V supply is a key part of the device's power architecture. The 572-ball FCBGA package provides a high-density interconnect solution for complex board designs.
For system architects, the combination of logic density and embedded memory is important when a design requires simultaneous processing and buffering. DSP blocks can accelerate repetitive arithmetic operations, while the programmable fabric supports interfaces and state machines that may not fit efficiently in a fixed processor architecture. The package and pin count must be considered during PCB footprint planning, power distribution, signal-integrity review, and thermal analysis.
Typical applications include communications infrastructure, industrial automation, video and imaging systems, test and measurement equipment, and embedded data-processing platforms. The device is particularly relevant where parallel processing, high logic capacity, and configurable I/O are needed within one programmable platform. Designers should also verify configuration, clocking, power, and interface requirements against the complete manufacturer documentation before release to production.
A critical design consideration is the high-density 572-ball FCBGA package: board layout, via-in-pad or via structures, controlled-impedance routing, decoupling, and thermal management materially affect reliability. The component should not be selected solely by the visible logic-element count; available package construction, operating temperature, speed grade, I/O capability, power details, and qualification information should be confirmed from the manufacturer datasheet and ordering documentation.
This product page combines verified distributor and manufacturer search data, quantity pricing, package-aware comparison guidance, and practical FPGA design considerations. The supplied web data does not establish a verified five-part drop-in cross-reference set, so substitution guidance should be treated as a validation requirement rather than an assumption of direct interchangeability.
Drop-in alternatives for EP2AGX65DF25C5G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX65DF25C5G (same form factor and footprint) β differing in Speed Grade, Package, Operating Temperature, RoHS Status, Embedded Memory (bits).
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX65DF25C4G
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View Datasheet βEP2AGX45DF25C5G
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View Datasheet βEP2AGX125DF25C5G
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View Datasheet βEP2AGX190EF29C5G
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View Datasheet βEP2AGX260FF35C5G
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View Datasheet βEP2AGX65DF25C5G Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Arria II GX |
| Logic Elements | 60,214 |
| Embedded Memory | 5,371,904 bits |
| DSP Blocks | 252 |
| Technology | 40 nm |
| Core Supply Voltage | 0.9 V |
| Maximum Frequency | 500 MHz |
| Package | 572-ball FCBGA |
| Terminal Count | 572 |
| Mounting Type | Surface Mount |
| Package Form | BGA |
| Operating Temperature | 85 Β°C maximum |
EP2AGX65DF25C5G bga Pin Configuration Guide
Pin configuration for EP2AGX65DF25C5G (bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX65DF25C5G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX65DF25C5G is suitable for 6 applications: Communications Infrastructure, Industrial Automation, Video and Imaging Processing, Test and Measurement Equipment, Embedded Data Processing, Aerospace and Defense Control Systems.
Communications Infrastructure
EP2AGX65DF25C5G fits communications infrastructure designs that need programmable packet handling, parallel datapaths, and local buffering. Its verified 60,214 logic elements support large state machines and protocol logic, while 5,371,904 embedded-memory bits can hold packet descriptors, FIFOs, lookup data, and timing information. The 252 DSP blocks are useful for filtering, conditioning, and arithmetic stages commonly found in communications signal chains. The device is used as a configurable processing element between high-speed interfaces and system memory, allowing algorithm or protocol changes without a new silicon design. The 572-ball FCBGA package provides a high-density interconnect platform, but the supplied data does not confirm transceiver count, protocol certification, or electrical compliance. Engineers must therefore verify I/O standards, reference clocks, channel rates, power integrity, signal integrity, and qualification requirements from the manufacturer datasheet before selecting this FPGA for a communications platform.
Recommended
Industrial Automation
EP2AGX65DF25C5G is suitable for industrial automation systems requiring deterministic control, parallel processing, and flexible I/O logic. The 60,214 logic elements can coordinate multiple motion, machine-control, safety-interface, or process-control functions, while the 5,371,904 embedded-memory bits support queues, buffers, waveform tables, and diagnostic data. The 252 DSP blocks enable digital filtering and measurement functions in a single programmable device. The FPGA can implement custom timing engines, protocol bridges, sensor aggregation, and real-time control logic while allowing firmware-level changes after deployment. Its 572-ball FCBGA package supports dense board integration, but the verified data does not provide an industrial temperature grade, vibration rating, or qualification certificate. Before production, confirm the exact temperature designation, environmental compliance, I/O voltage support, power sequencing, clocking, and long-term lifecycle status with the manufacturer. The design should also include industrial-grade decoupling, controlled-impedance routing, thermal analysis, and protection for external interfaces.
Recommended
Video and Imaging Processing
EP2AGX65DF25C5G is a strong fit for video and imaging systems that combine high-volume pixel processing with configurable timing and control. The 252 DSP blocks can support filtering, pixel correction, color conversion, edge detection, and other arithmetic operations, while 5,371,904 embedded-memory bits can buffer lines, frames, lookup tables, and intermediate data. The 60,214 logic elements provide capacity for image pipelines, synchronization logic, interface adaptation, and system control. A typical implementation uses the FPGA between camera or display interfaces and external memory, processing multiple data streams in parallel and adapting protocols without a fixed-function ASIC. The 572-ball FCBGA package enables high-density interconnect, but the supplied web data does not establish supported video standards, maximum resolution, transceiver resources, or I/O rates. Designers must validate those details using the complete device documentation. The implementation should also define clock domains, memory bandwidth, reset behavior, color-format handling, frame-buffer architecture, and worst-case thermal conditions before board release.
Recommended
Test and Measurement Equipment
EP2AGX65DF25C5G can serve as the programmable processing and control core in test and measurement equipment. Its 60,214 logic elements support instrument sequencing, trigger logic, data formatting, and custom analysis, while 5,371,904 embedded-memory bits provide space for capture buffers, reference data, and intermediate results. The 252 DSP blocks allow real-time filtering, decimation, spectral processing, and numerical conditioning. The FPGA can coordinate multiple sensors or digitizers, maintain precise timing relationships, and adapt measurement algorithms after hardware development. The 0.9 V core supply and 40 nm technology support a dense programmable architecture, while the 572-ball FCBGA package offers many interconnects for high-channel-count designs. The supplied data does not specify analog input support, converter interfaces, maximum I/O rates, measurement accuracy, or compliance testing, so those functions must be provided by companion devices and verified in the system. Instrument designs should budget timing margin, noise, clock jitter, thermal dissipation, and long-term calibration stability.
Recommended
Embedded Data Processing
EP2AGX65DF25C5G is well suited to embedded data-processing platforms that need flexible computation, buffering, and interface control. The verified 60,214 logic elements can implement data parsers, compression or transformation stages, protocol engines, and parallel control logic. The 5,371,904 embedded-memory bits support FIFOs, lookup tables, scratch buffers, and burst-oriented data movement, while the 252 DSP blocks accelerate arithmetic kernels. The FPGA can operate as a hardware accelerator beside a processor or as a standalone processing element, reducing dependence on fixed-function hardware and allowing post-deployment logic updates. Its high-density 572-ball FCBGA package supports complex interconnects, but the board design must account for controlled-impedance routing, power distribution, decoupling, thermal management, and configuration storage. The supplied search data does not confirm embedded processor availability, memory interfaces, I/O counts, power consumption, or software tool versions. Those capabilities should be validated from the manufacturer's device documentation and timing reports before system architecture is finalized.
Recommended
Aerospace and Defense Control Systems
EP2AGX65DF25C5G may be considered for aerospace and defense control systems that require programmable processing, deterministic interfaces, and post-deployment logic changes. Its 60,214 logic elements support control, telemetry, navigation-data handling, and custom interface logic, while 5,371,904 embedded-memory bits can hold buffers and mission-specific data. The 252 DSP blocks can support filtering, modulation, signal conditioning, and numerical processing. The FPGA's programmable nature can allow one hardware platform to support multiple configurations, which is useful when system requirements evolve. However, the supplied web data does not establish radiation tolerance, space qualification, military temperature grade, security features, export classification, or reliability certifications. None of those attributes should be inferred from the Arria II GX family name. Aerospace and defense use requires formal manufacturer qualification data, controlled configuration management, environmental testing, reliability analysis, and compliance review. The 572-ball FCBGA package also demands a carefully controlled PCB stack-up, assembly process, inspection method, and thermal path.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX65DF25C5G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX65DF25C4G | EP2AGX45DF25C5G | EP2AGX125DF25C5G | EP2AGX190EF29C5G | EP2AGX260FF35C5G |
|---|---|---|---|---|---|---|
| Package | 572-ball FCBGA | 572-ball FCBGA | 572-ball FCBGA | 572-ball FCBGA | BGA | BGA |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
Key Differentiators
- Verified high logic density (vs EP2AGX45DF25C5G)
- Large embedded-memory resource (vs EP2AGX45DF25C5G)
- High DSP-block count (vs EP2AGX45DF25C5G)
- 40 nm process and 0.9 V core architecture (vs EP2AGX260FF35C5G)
Design Notes
Design the board from the exact 572-ball FCBGA land pattern rather than a generic BGA symbol. Confirm ball pitch, ball numbering, keepout zones, escape fanout, via construction, and the manufacturer's recommended stack-up before routing. High-speed signals require controlled impedance and a defined return path; the supplied data confirms 572 terminals but does not provide a complete ball map. Use the official package drawing and socket or assembly guidelines, and verify that the selected fabricator can manufacture and inspect the required BGA geometry.
Implement the 0.9 V core rail with the manufacturer's sequencing, tolerance, current, and transient requirements. The supplied data confirms the 0.9 V value but does not provide current limits or recommended capacitor values, so no power-network values are fabricated here. Place decoupling close to the relevant power balls, use appropriate bulk capacitance at the regulator, and provide a controlled ramp and reset sequence. Review simultaneous switching noise, regulator stability, ground impedance, and the behavior of auxiliary rails under configuration and normal operation.
Create a thermal budget using final design utilization, clock rates, I/O activity, memory use, DSP activity, voltage, and board airflow. The verified data does not provide a thermal-resistance value or maximum power, so a junction-temperature estimate is not supplied. For the 572-ball FCBGA, follow the package thermal model and use a continuous ground or power structure that matches the manufacturer's reference implementation. Validate worst-case conditions with simulation and measurement, and avoid assuming that a larger BGA automatically provides adequate cooling without a defined thermal path.
Plan clock distribution and I/O timing early. The distributor listing states 500 MHz, but that figure is not a guarantee of system timing; actual frequency depends on design closure, routing, I/O standards, and device timing models. Define clock domains, constraints, input delays, output delays, and reset behavior before place-and-route. Keep high-speed routes short where possible, maintain solid reference planes, avoid unnecessary layer transitions, and verify signal integrity at the receiver rather than relying on nominal FPGA performance.
Do not select EP2AGX45DF25C5G, EP2AGX125DF25C5G, EP2AGX190EF29C5G, or EP2AGX260FF35C5G as a drop-in replacement based only on the EP2AGX family prefix or site MPN listing. The supplied cross-reference data does not verify identical package drawings, ball maps, logic capacity, memory, DSP count, voltage, speed grade, or configuration behavior. A replacement requires a manufacturer cross-reference or a documented redesign review. Also avoid using the listed 500 MHz value as a design guarantee without timing analysis.
Compliance Information
The supplied web data does not provide verified RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 declarations. Confirm compliance and qualification using the manufacturer documentation for the exact ordering code.
