Intel

EP2AGX45DF25C5N - Arria II GX FPGA, 42K LE, 572-FBGA | Intel / Altera

MPN: EP2AGX45DF25C5N ✗ End of Life
In Stock Ships in 1-3 business days
0.9 V Vdss 572-ball FC-FBGA (Flip-Chip BGA), 25 × 25 mm Package 500 MHz Speed
From $258.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $396.72 $396.72
10 $357.05 $3,570.50
100 $319 $31,900.00
500 $287.1 $143,550.00
1,000 $258.2 $258,200.00
ℹ️ All prices are in USD

EP2AGX45DF25C5N Overview

The Intel (formerly Altera) EP2AGX45DF25C5N is a member of the Arria II GX family of mid-range, transceiver-equipped FPGAs fabricated on a 40 nm CMOS process, integrating 42,959 logic elements (LEs), 1,805 LABs/CLBs, 3,517,440 bits of embedded RAM, and 252 user I/Os in a 25 mm × 25 mm 572-ball Flip-Chip BGA (FC-FBGA / FCBGA-572) package with built-in 3.125 Gbps transceivers and a hardened PCI Express Gen1 block. The part is specified at the C5 speed grade (commercial, -20 °C to +85 °C ambient) at a 0.9 V core supply, with maximum toggle rates near 500 MHz on internal logic. The Arria II GX family targets cost-sensitive, transceiver-rich applications that bridge ASIC-class bandwidth with FPGA flexibility.

A Field Programmable Gate Array (FPGA) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that the user configures after manufacture to implement arbitrary digital functions, ranging from glue logic and state machines to full processor subsystems and high-speed serial protocol bridges. Within the broader taxonomy, the EP2AGX45DF25C5N sits at the intersection of programmable logic devices (PLD), the FPGA sub-class, the Arria II GX family, and the mid-density 45K-LE segment. Each LE contains a 4-input LUT, dedicated adder/subtractor carry logic, and a programmable register, while LABs (Logic Array Blocks) group 16 LEs with shared control signals and local interconnect, enabling efficient pipelined datapath implementation.

Key features that distinguish the EP2AGX45DF25C5N include integrated multi-gigabit transceivers (MGTs) supporting data rates up to 3.125 Gbps, dedicated hard IP for PCI Express Gen1 (x1/x4), an embedded memory subsystem with up to 4.65 Mbits of block RAM plus MLAB distributed RAM, fractional PLL and general-purpose PLL blocks for clock synthesis, and a DDR/DDR2/DDR3 SDRAM memory controller hard IP block. The transceiver channels support protocols such as Serial RapidIO, Gigabit Ethernet, XAUI, and PCIe Gen1, offloading serialization, deserialization, clock-data recovery, and 8b/10b encoding from programmable fabric to hardened silicon. DSP blocks implement 18×18 multipliers with adders for FIR filters, FFTs, and baseband processing.

In the broader system hierarchy, Arria II GX FPGAs like this part are typically paired with external DDR3 SDRAM, flash configuration memory (EPCS or EPCQ), clock generators, and PHY interfaces. They sit between low-cost Cyclone families and high-end Stratix families, offering the optimal balance when designers need integrated transceivers and DSP blocks at lower cost than Stratix IV/V. Configuration is typically via JTAG, Active Serial (AS), Passive Serial (PS), or Fast Passive Parallel (FPP) modes using Altera/Intel Quartus II design software.

Typical applications include telecom baseband processing, broadcast video bridges, military secure communications, industrial imaging, and PCIe endpoint cards. The EP2AGX45DF25C5N is well suited to designs requiring 4–8 transceiver channels, low DSP density, and a mid-range logic budget at a lower price than Stratix-class parts.

When designing with this part, ensure the PCB uses matched-length routing on all high-speed serial lanes, with continuous reference planes for the 100 Ω differential impedance. Provide decoupling of at least 100 µF bulk + 0.1 µF + 0.01 µF per supply pin group. The 572-BGA requires a multilayer PCB with via-in-pad or microvia technology to escape the 1 mm pitch ball array; verify thermal dissipation against the 27 °C/W θJA typical value with adequate copper area or forced airflow.

This page synthesizes distributor pricing, package-specific drop-in alternatives within the Arria II GX family, and practical PCB/thermal design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for EP2AGX45DF25C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2AGX45DF25C5N (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Transceivers, Mounting Type.

Intel
Speed Grade: -C5 (mid-grade)
Package: 572-BGA, FCBGA
Mounting Type: Surface Mount (FCBGA)
Compare with EP2AGX45DF25C5N →
Intel
Speed Grade: C4 (-4 speed grade)
Package: 572-BGA, FCBGA
Mounting Type: Surface Mount
Compare with EP2AGX45DF25C5N →
Intel
Speed Grade: C4
Package: 572-ball FC-FBGA (DF25)
Operating Temperature: 0C to +85C (commercial, 'C' grade)
Compare with EP2AGX45DF25C5N →
Intel
Speed Grade: 5 (mid-tier)
Package: 572-FCBGA (25x25 mm)
Operating Temperature: 0C to +85C (Commercial)
Compare with EP2AGX45DF25C5N →
Altera
Speed Grade: C6
Package: 572-ball FC-FBGA
Operating Temperature: 0 C to +85 C (Commercial)
Compare with EP2AGX45DF25C5N →
Intel
Speed Grade: C6 (commercial)
Package: 572-FCBGA (UBGA-358 pin variant per datasheet summary)
Operating Temperature: 0C to +85C (commercial)
Compare with EP2AGX45DF25C5N →
Intel
Package: 572-ball FCBGA (25x25 mm)
Mounting Type: Surface Mount
Compare with EP2AGX45DF25C5N →
Intel
Speed Grade: I5 (industrial, mid-speed)
Package: 572-ball FCBGA, 25 mm x 25 mm
Operating Temperature: -40C to +100C (Industrial)
Compare with EP2AGX45DF25C5N →
Intel
Speed Grade: 5
Operating Temperature: 0C to +85C (commercial, C5 speed grade)
Compare with EP2AGX45DF25C5N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2AGX45DF25C4N

✅ Drop-In
Intel
📦 572-ball FC-FBGA (DF25)
Arria II GX · EP2AGX45 · 42,959 · 1,805 · 3,517,440 · 273 · 56 · 252

✓ In Stock

$460 / Unit

View Datasheet →

EP2AGX45DF25C5G

✅ Drop-In
Intel
📦 572-ball FC-FBGA (DF25)
Arria II GX · Arria II GX FPGA · 42,959 · 3,517,440 · 252 · 40 nm · 0.9 V · 500 MHz

✓ In Stock

$118 / Unit

View Datasheet →

EP2AGX45DF25C4G

✅ Drop-In
Intel
📦 572-ball FC-FBGA (DF25)
Arria II GX · EP2AGX (Arria II GX) · 45000 · 3517440 · 42959 · 252 · 572-BGA, FCBGA · DF25 (1.0 mm pitch)

✓ In Stock

$205 / Unit

View Datasheet →

EP2AGX45DF25C6ES

✅ Drop-In
📦 572-ball FC-FBGA (DF25)
same 572-FBGA DF25 footprint; C6 (-6% Fmax vs C5) speed grade, ES marking

📋 Reference alternative (not in catalog)

EP2AGX125DF25C5G

✅ Drop-In
Intel
📦 572-ball FC-FBGA (DF25)
Arria II GX · Arria II GX FPGA · 118,143 · 8,315,904 · 260 · 572-BGA, FCBGA · -C5 (mid-grade) · 40 nm

✓ In Stock

$399.5 / Unit

View Datasheet →

EP2AGX45DF25C5N Maximum Ratings & Electrical Characteristics

Family Arria II GX
Series Arria II GX
Number of Logic Elements (LEs) 42,959
Number of LABs/CLBs 1,805
Total RAM Bits 3,517,440
Number of User I/O 252
Number of Transceivers 4 or 8 (device-dependent)
Transceiver Data Rate Up to 3.125 Gbps
Process Technology 40 nm CMOS
Core Supply Voltage 0.9 V
Maximum Internal Frequency 500 MHz
Speed Grade C5 (commercial, -20 °C to +85 °C)
Package 572-ball FC-FBGA (Flip-Chip BGA), 25 × 25 mm
Mounting Type Surface Mount (BGA)
Lead-Free / RoHS Lead Free (MSL per JEDEC J-STD-020)
PCI Express Hard IP Yes, PCIe Gen1 ×1/×4
Configuration Modes JTAG, AS, PS, FPP

EP2AGX45DF25C5N 572-ball fc-fbga (flip-chip bga), 25 × 25 mm Pin Configuration Guide

Pin configuration for EP2AGX45DF25C5N (572-ball fc-fbga (flip-chip bga), 25 × 25 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

572-ball fc-fbga (flip-chip bga), 25 × 25 mm package pinout diagram for EP2AGX45DF25C5N

No detailed pinout data available for EP2AGX45DF25C5N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2AGX45DF25C5N is suitable for 6 applications: Telecom Baseband Processing, PCIe Endpoint Add-In Cards, Broadcast Video Bridges, Industrial Imaging and Machine Vision, Military Secure Communications, Wireless Baseband / Test Equipment.

🌐

Telecom Baseband Processing

The EP2AGX45DF25C5N is well suited to telecom baseband boards where 42,959 LEs handle channel-card DSP, scrambling, framing, and backhaul serialization at up to 3.125 Gbps per lane. Up to 8 hard multi-gigabit transceivers eliminate external SERDES ICs, reducing BOM and PCB area for CPRI / OBSAI fronthaul links. Hard PCIe Gen1 IP simplifies host-side backplane connectivity to a baseband SoC or DSP cluster. Quartus II transceiver toolkit provides eye-diagram margin analysis on every lane for production test.

🖥️

PCIe Endpoint Add-In Cards

Built-in hard IP for PCI Express Gen1 ×1 and ×4 makes the EP2AGX45DF25C5N ideal for endpoint add-in cards that acquire high-speed data and push it to a host CPU over PCIe. The 252 user I/Os are sufficient for parallel ADC/DAC interfaces, FMC HPC connectors, or LVDS breakout. Transceivers above the PCIe lane budget are repurposed for Aurora or Serial RapidIO to external FPGAs/ASICs. Hard PCIe eliminates soft IP timing closure work and frees roughly 5K LEs versus a soft IP implementation.

📺

Broadcast Video Bridges

For broadcast routers and SDI/HDMI bridge cards, the EP2AGX45DF25C5N provides transceivers running SDI at 2.97 Gbps (3G-SDI) plus DSP blocks for color-space conversion, scaling, and audio embedding. The 3.5 Mbit block RAM plus distributed MLAB RAM (about 0.6 Mbit) buffers line-rate video frames; DDR2/DDR3 hard controller hooks directly to external SDRAM for frame-store. Quartus II Video and Image Processing (VIP) suite provides drop-in IP for common bridging functions, accelerating development.

🏭

Industrial Imaging and Machine Vision

The 42,959 LEs plus dedicated DSP blocks (18×18 multipliers) implement real-time Bayer demosaicing, gamma correction, and defect pixel correction on multi-megapixel sensor streams. Up to 8 transceivers drive CoaXPress or Camera Link HS uplinks at 3.125 Gbps with deterministic latency. The 252 user I/Os accept multiple LVDS / sub-LVDS image sensor channels in parallel, with internal PLLs generating the precise pixel clocks. Industrial temperature variants (-40 °C to +100 °C) are available in the same package for outdoor use.

✈️

Military Secure Communications

Although the EP2AGX45DF25C5N is commercial temperature, the same Arria II GX family supports military / industrial temperature grades in identical 572-FBGA packages, making migration straightforward. The hardened AES engine plus 252 user I/Os and transceivers support secure voice, data, and link encryption across multiple channels at 3.125 Gbps. Hard PCIe simplifies secure router backplane designs. Quartus II supports design obfuscation and bitstream authentication for tamper resistance.

📱

Wireless Baseband / Test Equipment

For wireless test platforms, the EP2AGX45DF25C5N implements arbitrary waveform generation, real-time FFT analysis, and multi-channel modulation / demodulation in the FPGA fabric, with transceivers digitizing or synthesizing IF signals up to 3.125 Gbps. About 16 to 24 DSP blocks provide the 18×18 multipliers and adders needed for vector modulation, with the 3.5 Mbit block RAM capturing sample bursts. The PCIe hard block streams processed IQ data to the host analyzer GUI in real time without CPU bottlenecks.

Recommended Products Summary

EP4SGX230KF40C2N Higher-density Stratix IV GX for aggregation layers Used in: Telecom Baseband Processing EP2C70F672C8N Intel Used in: Telecom Baseband Processing EPCQ256SI16N Configuration flash for Arria II GX AS-mode boot Used in: Telecom Baseband Processing EP2AGX125EF29C5G Intel Used in: PCIe Endpoint Add-In Cards EPCQ64SI16N QSPI configuration memory for PCIe cards Used in: PCIe Endpoint Add-In Cards, Military Secure Communications 10CL025YU256I7G Intel Used in: PCIe Endpoint Add-In Cards EP2AGX125FF35I5N Higher-density 125K LE member of same family for full matrix routing Used in: Broadcast Video Bridges MT47H64M16HR-25:H DDR2 SDRAM frame buffer companion Used in: Broadcast Video Bridges, Wireless Baseband / Test Equipment EPCQ128SI16N Configuration flash for broadcast modules Used in: Broadcast Video Bridges EP4SGX110DF29C2XN Stratix IV GX for higher-bandwidth imaging pipelines Used in: Industrial Imaging and Machine Vision MT41J128M16HA-15E DDR3 SDRAM line buffer Used in: Industrial Imaging and Machine Vision EPCQ32SI16N Configuration flash for vision modules Used in: Industrial Imaging and Machine Vision EP2AGX260FF35C6N Intel Used in: Military Secure Communications EP2AGX45CU17I5N Non-transceiver variant for DSP-heavy sections Used in: Wireless Baseband / Test Equipment
What is the EP2AGX45DF25C5N?
The EP2AGX45DF25C5N is an Arria II GX family field-programmable gate array (FPGA) from Intel (formerly Altera). According to the Arria II GX Device Handbook, it contains 42,959 logic elements, 3,517,440 bits of embedded RAM, 252 user I/Os, and 4–8 multi-gigabit transceivers capable of 3.125 Gbps, all housed in a 572-ball FC-FBGA package with a 0.9 V core supply at the C5 commercial speed grade.
How many transceivers does the EP2AGX45DF25C5N have?
The EP2AGX45DF25C5N integrates up to 8 multi-gigabit transceivers (MGTs) operating up to 3.125 Gbps each. The exact number of enabled channels depends on the device-specific pinout for the 572-FBGA package; engineering teams should consult the Arria II GX pin-out file for the EP2AGX45DF25 row to confirm per-channel availability.
What is the difference between EP2AGX45DF25C5N and EP2AGX45DF25C4N?
The EP2AGX45DF25C5N is the C5 speed-grade variant, while the EP2AGX45DF25C4N is the slower C4 speed-grade variant. Both share the same 572-FBGA package, identical 42,959-LE fabric, same RAM (3,517,440 bits) and the same 252 I/Os, so they are drop-in pin-compatible. The C5 grade offers faster Fmax timing; the C4 is typically used as a cost-down alternative when timing margins permit.
Where can I buy the EP2AGX45DF25C5N?
Authorized stock includes DigiKey, Mouser, and Octopart-listed distributors such as Heisener, Sierra IC, and Veswin. As of 2026-09-08, Heisener lists approximately 19,260 pieces in stock with immediate shipping, and the indicative unit price is around $396.72 at quantity 1, dropping to roughly $258 at 1,000 pieces; lead time for direct factory orders should be confirmed with Intel/Altera authorized channels.
What is the price of EP2AGX45DF25C5N as of September 2026?
The EP2AGX45DF25C5N unit price is approximately $396.72 at quantity 1 as of 2026-09-08, falling to $357 at 10 pieces, $319 at 100 pieces, $287 at 500 pieces, and $258 at 1,000 pieces per distributor listings. Pricing reflects an NRND (Not Recommended for New Designs) lifecycle status, so volume discounts apply but the price trend may be upward as inventory tightens.
Is the EP2AGX45DF25C5N in stock and what is its lead time?
Yes, the EP2AGX45DF25C5N is reported in stock with approximately 19,260 units available at major distributors as of 2026-09-08, with immediate shipping on most listings. Lead time is typically 3–5 business days for in-stock inventory; for volume orders above distributor stock, a 12-week factory lead time should be expected from Intel/Altera authorized channels.
Where can I download the EP2AGX45DF25C5N datasheet PDF?
The official EP2AGX45DF25C5N datasheet is published inside the Arria II GX Device Handbook Volume 3 (Device Datasheet and Addendum) available from Intel at the Altera literature archive. The handbook contains the complete DC/AC characteristics, pinout, package thermal data, and configuration specifications for the 572-FBGA DF25 package row.
Where can I find the EP2AGX45DF25C5N pinout?
The full pinout for the EP2AGX45DF25C5N is provided in the Arria II GX pin-out files for the 572-ball DF25 package, available as a downloadable CSV/Excel sheet from the Intel FPGA product page for the Arria II GX family. The pinout file lists every ball coordinate and its dedicated function including user I/O banks, transceiver channels, clock inputs, configuration pins, and power/ground pins.
What is the best drop-in replacement for EP2AGX45DF25C5N?
The best same-package drop-in replacements are EP2AGX45DF25C4N (slower C4 speed grade, same 572-FBGA DF25 package, identical 42,959-LE fabric, same 3,517,440-bit RAM, same 252 I/Os) and EP2AGX45DF25C5G (C5 commercial grade with lead-free finish, otherwise identical). Both are drop-in compatible and require no PCB change.
EP2AGX45DF25C5N vs EP2AGX125DF25C5G - which is better for high-density designs?
The EP2AGX125DF25C5G is the higher-density 125K-LE member of the same Arria II GX family with the same 572-FBGA DF25 package footprint, while the EP2AGX45DF25C5N has 42,959 LEs. For designs that exceed 50K LEs or require more block-RAM/DSP, the EP2AGX125 is the better choice; for designs under 40K LEs, the EP2AGX45 offers significant cost savings at the same package.
When should I choose EP2AGX45DF25C5N over EP2AGX45CU17C5N?
Choose the EP2AGX45DF25C5N when you need integrated multi-gigabit transceivers (the DF25 package) for protocols like PCIe Gen1, XAUI, or Serial RapidIO. Choose the EP2AGX45CU17C5N when your design does not require transceivers and you can use a different package with more user I/Os; the CU17 package excludes transceiver channels to provide additional general-purpose I/Os.
Can I use EP2AGX45DF25C5G as a drop-in replacement for EP2AGX45DF25C5N?
Yes, the EP2AGX45DF25C5G is a drop-in alternative for the EP2AGX45DF25C5N. Both share the same 572-ball DF25 FC-FBGA package, the same 42,959 logic elements, 3,517,440-bit RAM, 252 I/Os, and the same C5 commercial speed grade; the G suffix denotes lead-free / RoHS-compliant finish per Intel packaging nomenclature.
Is the EP2AGX45DF25C5N suitable for new designs in 2026?
The EP2AGX45DF25C5N is in NRND (Not Recommended for New Designs) lifecycle status. According to Intel's product discontinuance policy, NRND parts continue to be available but Intel recommends migrating new designs to the Cyclone V GX or Arria V GX families, which use the same Quartus II toolchain and provide a lower-power, more modern alternative at similar transceiver densities.
What design tools support the EP2AGX45DF25C5N?
The EP2AGX45DF25C5N is fully supported by Intel Quartus II design software (subscription edition required for full transceiver / PCIe hard IP support). The Quartus II toolchain includes the IP catalog, Platform Designer (formerly Qsys), TimeQuest timing analyzer, and SignalTap logic analyzer. Programming is via the USB-Blaster, Ethernet-Blaster, or JTAG server interface.
What is the package thermal resistance of EP2AGX45DF25C5N?
The 572-ball FC-FBGA package has a typical junction-to-ambient thermal resistance (θJA) of approximately 27 °C/W with adequate PCB copper area (per JEDEC EIA/JESD51 standards). At a typical 5 W internal dissipation, the junction temperature rise above ambient is roughly 135 °C, making forced airflow or substantial copper heatsinking recommended for closed enclosures.

Engineering reference data for EP2AGX45DF25C5N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2AGX45DF25C5N when your design needs 30K–45K logic elements, 3.5 Mbits of block RAM, and up to 8 multi-gigabit transceivers running at 3.125 Gbps or PCIe Gen1, all within a 572-ball FC-FBGA footprint. Choose EP2AGX45DF25C4N for the same design at a slower C4 speed grade when timing margins permit; this is the standard cost-down swap. Choose EP2AGX45DF25C5G when the production variant requires the G lead-free finish suffix for RoHS traceability. Choose EP2AGX125DF25C5G when your design exceeds 50K LEs and needs additional DSP and RAM, but still fits the same DF25 footprint. Migrate to Cyclone V GX or Arria V GX for new designs, as the EP2AGX45 is NRND; both newer families reuse the same Quartus II toolchain and IP library, simplifying migration.

Comparison with Alternatives

Parameter This Product EP2AGX45DF25C4N EP2AGX45DF25C5G EP2AGX45DF25C4G EP2AGX45DF25C6ES EP2AGX125DF25C5G
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Package 572-ball FC-FBGA (DF25) 572-ball FC-FBGA (DF25) 572-ball FC-FBGA (DF25) 572-ball FC-FBGA (DF25) 572-ball FC-FBGA (DF25) 572-ball FC-FBGA (DF25)
Logic Elements 42,959 42,959 42,959 42,959 42,959 125,000
Speed Grade C5 (commercial) C4 (commercial, slower) C5 (commercial) C4 (commercial, slower) C6 (ES marking) C5 (commercial)
Number of I/O 252 252 252 252 252 252
Transceiver Rate Up to 3.125 Gbps Up to 3.125 Gbps Up to 3.125 Gbps Up to 3.125 Gbps Up to 3.125 Gbps Up to 3.125 Gbps
Lifecycle Status NRND NRND NRND NRND Production (ES) NRND

Key Differentiators

  • Same-package drop-in alternatives preserve PCB design (vs EP2AGX45DF25C4N)
  • Hard PCIe Gen1 IP block eliminates soft IP overhead (vs Cyclone IV GX equivalents)
  • Highest LE density in this footprint (vs Cyclone V GX 5CGXFC7C7F23C8N)

Design Notes

The 572-ball FC-FBGA at 1.0 mm ball pitch requires a multilayer PCB with via-in-pad or microvia escape technology. Use a 1-6-1 or 1-8-1 stack-up with continuous ground reference planes under the device. Route high-speed transceiver differential pairs with 100 Ω differential impedance and length-matched to within 5 mils; route reference clock to within 50 mils of receiver pairs. Provide 100 µF bulk + 0.1 µF + 0.01 µF decoupling per supply pin group, with the smallest caps placed closest to the BGA balls.

Estimated: at 5 W typical internal dissipation and a 27 °C/W θJA (with 4-layer PCB and adequate copper area per JEDEC JESD51), the junction-to-ambient temperature rise is roughly 135 °C. In a closed enclosure without airflow, the internal die temperature may exceed 85 °C ambient; deploy forced airflow (≥ 200 LFM) or attach a heatsink via thermal pad. Confirm thermal margin against the C5 grade maximum junction temperature of 100 °C using the Arria II GX PowerPlay early power estimator.

Do not configure Arria II GX transceivers at data rates above 3.125 Gbps; doing so violates IEEE specifications and may cause eye-margin failures. Always enable the 8b/10b encoding hard IP for PCIe, XAUI, and Serial RapidIO; never implement 8b/10b in soft logic, because the CDR circuits inside the MGT are designed for 8b/10b line code. Ensure configuration mode pins MSEL[2:0] are set correctly for the chosen AS/PS/FPP/JTAG boot mode before power-up; an incorrect setting prevents configuration.

For the PCI Express Gen1 hard IP block, route the PCIe transmit pair with DC-blocking capacitors per the PCIe CEM specification; reference clock must be a 100 MHz HCSL with ±300 ppm accuracy. For multi-gigabit transceiver (MGT) channels, provide AC-coupling capacitors of 0.1 µF on each serial lane, place at the receiver side as close to the BGA as possible. Match P and N lengths to within 0.13 mm (5 mils) and route over a continuous ground reference plane; do not cross plane splits.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliance per Altera / Intel product page. JEDEC J-STD-020 MSL rating applies; halogen-free status not explicitly listed in retrieved web data.

Data verified on: 2026-09-08 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP2AGX45DF25C5N EP2AGX45DF25C4N EP2AGX45DF25C5G EP2AGX45DF25C4G EP2AGX125DF25C5G Arria II GX Field Programmable Gate Array FPGA logic element Logic Array Block LAB CLB block RAM embedded RAM multi-gigabit transceiver MGT PCI Express Gen1 PCIe hard IP 572-ball FC-FBGA FCBGA Flip-Chip BGA DF25 package Quartus II 0.9 V core supply 40 nm CMOS RoHS lead-free JEDEC J-STD-020 MSL rating JTAG Active Serial configuration Stratix IV GX Cyclone II Cyclone V GX Arria V GX DSP block 18x18 multiplier DDR3 SDRAM controller PLL XAUI Serial RapidIO 8b/10b encoding CPR OBSAI
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