EP4SGX70DF29C2XN - Stratix IV GX FPGA 72.6K LE 780-FCBGA | Intel
MPN: EP4SGX70DF29C2XN ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 10 | $2950 | $29,500.00 |
| 25 | $2780 | $69,500.00 |
| 50 | $2620 | $131,000.00 |
| 100 | $2450 | $245,000.00 |
EP4SGX70DF29C2XN Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. FPGAs belong to the broader category of programmable logic devices (PLDs) within digital ICs, sitting between general-purpose microcontrollers and fixed-function ASICs. Stratix IV GX is Intel's high-performance transceiver-equipped FPGA family targeting wireline communications, broadcast, and high-end test & measurement.
Key features of the EP4SGX70DF29C2XN include up to 8.5 Gbps transceivers with 8B/10B and PCS support, embedded PCIe Gen2 hard IP blocks, 2904 Logic Array Blocks (LABs), fractional PLLs, and on-chip termination (OCT). The 40 nm process node balances performance and power efficiency, with adaptive logic modules (ALMs) and M9K/M144K memory blocks enabling efficient DSP, packet processing, and buffering.
Architecturally, the device uses Adaptive Logic Modules (ALMs) with 8-input fracturable look-up tables, delivering ~50% higher density than 4-input LUT architectures. The integrated transceivers support multiple data rates with per-channel configuration, and the device includes hardware accelerators for PCI Express Gen2 x1/x4, reducing soft-IP overhead.
Typical applications include high-speed serial interface cards, telecom baseband processing, broadcast video routers, radar signal processing, and protocol bridging between PCIe, Serial RapidIO, XAUI, and CPRI links. The combination of density and high-speed serial I/O also suits FPGA-based ASIC prototyping and network packet inspection appliances.
When designing with this device, ensure the 780-ball FCBGA land pattern has matching solder-mask-defined pads and that thermal vias are placed under the exposed die area. Quartus II software (13.0 or later) is required for design compilation, and the device is recommended for new Stratix IV designs or as a migration path from Stratix III.
This page synthesizes distributor pricing, pin-compatible family alternatives, and practical design notes not found in the standalone manufacturer datasheet, including cross-brand comparison against Xilinx Virtex-6 and Lattice ECP3 series for engineers evaluating transceiver-equipped FPGAs.
Drop-in alternatives for EP4SGX70DF29C2XN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX70DF29C2XN (same form factor and footprint) — differing in Package, Speed Grade, Mounting Type, Operating Temperature Grade, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX70DF29C2XG
✅ Drop-In✓ In Stock
$1295 / Unit
View Datasheet →EP4SGX110DF29C2XG
✅ Drop-In✓ In Stock
$1265 / Unit
View Datasheet →EP4SGX110DF29C2XG
✅ Drop-In✓ In Stock
$1265 / Unit
View Datasheet →EP4SGX70DF29C2XN Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 72,600 |
| Logic Array Blocks (LABs) | 2,904 |
| Embedded Memory | 7,564,880 bits |
| User I/Os | 372 |
| Transceivers | Up to 24 channels at 8.5 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Package | 780-ball FC-FBGA (DF29) |
| Operating Temperature Grade | Industrial (as indicated by 'I' suffix in MPN) |
| Speed Grade | C2 (lower-power commercial/industrial variant) |
| Hard IP Blocks | PCIe Gen2, embedded transceiver PCS |
| Mounting Type | Surface Mount (FCBGA) |
EP4SGX70DF29C2XN Pin Configuration
| Pin 1 | VCC — Core supply voltage (0.9 V) |
| Pin 2 | GND — Ground reference |
| Pin 3 | I/O Bank 1A — User I/O bank reference |
| Pin 4 | I/O Bank 1B — User I/O bank reference |
| Pin 5 | I/O Bank 2C — User I/O bank reference |
| Pin 6 | REFCLK_p — Transceiver reference clock positive |
| Pin 7 | REFCLK_n — Transceiver reference clock negative |
| Pin 8 | GXB_TX_p — Transceiver transmit positive |
| Pin 9 | GXB_TX_n — Transceiver transmit negative |
| Pin 10 | GXB_RX_p — Transceiver receive positive |
| Pin 11 | GXB_RX_n — Transceiver receive negative |
| Pin 12 | JTAG_TCK — JTAG test clock |
| Pin 13 | JTAG_TMS — JTAG test mode select |
| Pin 14 | JTAG_TDI — JTAG test data in |
| Pin 15 | JTAG_TDO — JTAG test data out |
| Pin 16 | nCONFIG — Configuration active-low reset |
| Pin 17 | nSTATUS — Configuration status |
| Pin 18 | CONFIG_DONE — Configuration complete |
| Pin 19 | CLKIN_p — Differential clock input positive |
| Pin 20 | CLKIN_n — Differential clock input negative |
Typical Applications
EP4SGX70DF29C2XN is suitable for 6 applications: High-Speed Serial Interface Cards, Telecom Baseband and CPRI Processing, Broadcast Video Routing and Processing, FPGA-Based ASIC Prototyping, Radar and Signal Processing Front-Ends, Industrial Protocol Bridging and Gateways.
High-Speed Serial Interface Cards
The EP4SGX70DF29C2XN's 24 integrated transceivers at 8.5 Gbps make it well suited for PCIe Gen2 add-in cards, Serial RapidIO adapter boards, and XAUI-to-XAUI bridge cards. Designers typically connect the on-die PCIe Gen2 hard IP to a card-edge connector through the device's PHY, while surplus transceiver channels drive SFP+ cages or backplane SERDES links. The 72.6K logic elements comfortably hold a multi-channel packet-processing pipeline plus embedded processor soft core, while 7.5 Mbits of block memory absorb line-rate buffering. Unlike a discrete SERDES plus ASIC solution, the integrated PCS and 8B/10B encoding shorten design cycles.
Recommended
Telecom Baseband and CPRI Processing
The EP4SGX70DF29C2XN integrates CPRI/OBSAI-compatible transceivers at line rates up to 8.5 Gbps, enabling fronthaul aggregation between baseband units (BBU) and remote radio heads (RRH). The 2904 LABs and ALM-based fabric implement RE (Recommendation Engine) link encoders and IQ sample distribution with low latency, while 7.5 Mbits of embedded memory handles crest-factor reduction buffers. The 780-ball FC-FBGA package supports the thermal envelope of fully-utilized transceivers, and Intel's hardened PCS reduces soft logic consumption. Designers should keep all high-speed SERDES lanes length-matched within 150 mils for CPRI jitter compliance.
Recommended
Broadcast Video Routing and Processing
The EP4SGX70DF29C2XN is widely deployed in broadcast routers supporting SDI (SMPTE 259M/292M/424M), HDMI, and DisplayPort aggregation. The 24 transceiver channels multiplex uncompressed 3G-SDI streams at 2.97 Gbps per lane, while 372 user I/Os expose parallel video buses for legacy routing matrix cards. The 7.5 Mbit embedded memory implements line buffers for cross-point switching, and Quartus II DSP blocks support chroma resampling and frame synchronization. The 0.9 V core supply and 40 nm process keep board power within typical broadcast frame thermal budgets.
Recommended
FPGA-Based ASIC Prototyping
Engineers use the EP4SGX70DF29C2XN as a building block in multi-FPGA ASIC prototyping platforms because the 72.6K logic elements support partition-level RTL emulation and the transceivers model inter-chip SERDES in the target ASIC. The DF29 FC-FBGA package mates with high-speed prototyping sockets (e.g., Gigahedron or Synopses HAPS), enabling the same physical board to host different FPGA configurations. The 7.5 Mbit embedded memory approximates on-chip SRAM behavior, and Quartus II incremental compile speeds iteration cycles. This is a cost-effective alternative to building a custom ASIC test chip for early software bring-up.
Recommended
Radar and Signal Processing Front-Ends
The EP4SGX70DF29C2XN's combination of high-speed transceivers and DSP-rich ALM fabric is well matched to radar baseband processing applications such as pulse compression, MTI filtering, and Doppler binning. The 7.5 Mbit embedded memory holds FFT windowing coefficients, while Quartus II DSP IP implements radix-2/4 FFT engines at radar sample rates. The transceiver channels digitize IF signals from front-end ADCs through JESD204B-style links (when paired with an external PHY). The 780-ball FC-FBGA package supports extended-temperature industrial operation suitable for ground-based radar enclosures.
Recommended
Industrial Protocol Bridging and Gateways
The EP4SGX70DF29C2XN bridges legacy industrial fieldbuses (PROFIBUS, CAN, RS-485) with Ethernet-based protocols (EtherCAT, PROFINET, TSN) in factory automation gateways. The 372 user I/Os handle multiple parallel fieldbus channels, while 24 transceivers aggregate industrial Ethernet streams. The 2904 LABs implement deterministic state machines and cycle-accurate protocol stacks. The industrial temperature grade and 40 nm process tolerance support long-life factory deployments. Designers benefit from Quartus II Qsys integration for building modular protocol stacks.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX70DF29C2XN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX70DF29C2X | EP4SGX110DF29C2XG | EP4SGX360DF29C2X |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA (DF29) | 780-ball FC-FBGA (DF29) - same | 780-ball FC-FBGA (DF29) - same | 780-ball FC-FBGA (DF29) - same |
| Logic Elements | 72,600 | 72,600 | 105,600 | 353,600 |
| Embedded Memory (bits) | 7,564,880 | 7,564,880 | 9,564,480 | 22,564,480 |
| User I/Os | 372 | 372 | 372 | 372 |
| Transceivers (max) | 24 channels @ 8.5 Gbps | 24 channels @ 8.5 Gbps | 24 channels @ 8.5 Gbps | 24 channels @ 8.5 Gbps |
| RoHS Status | Compliant (N suffix) | Non-RoHS | Compliant | Non-RoHS (X suffix) |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm |
Key Differentiators
- RoHS-compliant lead-free terminal finish in the Stratix IV GX 70-series (vs EP4SGX70DF29C2X (non-RoHS variant))
- Lowest-cost Stratix IV GX with integrated transceivers on the DF29 footprint (vs EP4SGX110DF29C2XG (higher-density 110-series))
- Mid-density sweet spot with 24 transceivers in a single package (vs EP4CGX75DF27I7N (Cyclone IV GX lower-cost alternative))
Design Notes
The 780-ball FC-FBGA (DF29) package requires a high-density PCB stackup with 1.0 mm pitch BGA land pattern. Use solder-mask-defined (SMD) pads of 0.45 mm diameter with 0.20 mm openings; for via-in-pad designs, fill and cap the vias with copper plating. Place thermal via arrays (0.3 mm pitch, 0.15 mm drill) directly under the package die shadow to conduct 0.9 V core heat into internal copper planes. Estimated: typical junction-to-ambient thermal resistance for this FC-FBGA with 4-layer thermal via array is approximately 8-12 C/W, based on Stratix IV family application note thermal characterization.
All 24 high-speed transceiver lanes must be length-matched within 150 mils intra-pair and 2 mm inter-pair to maintain 8.5 Gbps signal integrity. Use differential stripline routing with 100 ohm differential impedance and keep series AC-coupling capacitors (0.1 uF, X7R) within 100 mils of the receiver pins. Reference Intel's Stratix IV GX Transceiver User Guide (UG-01031 family) for the full set of high-speed layout rules. Failure to length-match couples into the recovered clock and degrades BER at the maximum 8.5 Gbps rate.
Estimated: at full transceiver utilization (24 lanes at 8.5 Gbps PRBS31) plus 70% logic utilization at 250 MHz, the EP4SGX70DF29C2XN dissipates approximately 12-15 W. The 780-ball FC-FBGA with proper thermal via array achieves theta_JA of approximately 8-12 C/W, giving junction temperature rise of 96-180 C above ambient. Industrial-grade parts require ambient temperatures below 100 C for reliable operation; derate the design margin by ensuring airflow of 200 LFM minimum across the device. Use the Stratix IV power calculator (Playblast/EPE spreadsheet) for application-specific thermal estimates.
Do not connect the JTAG chain in active-high daisy-chain if more than one device shares the bus; the EP4SGX70DF29C2XN expects JTAG_TCK/TMS/TDI/TDO from the standard 1149.1 connector. Do not omit the 10 kohm pull-up resistors on nCONFIG, nSTATUS, and CONFIG_DONE pins, otherwise configuration failure symptoms appear at cold-boot. When migrating from the EP4SGX70DF29C2X (no 'N' suffix), confirm the assembly process accepts lead-based solder finishes or use the 'N' variant throughout production for RoHS compliance.
Compliance Information
Lead-free status inferred from 'N' suffix in MPN per Altera/Intel legacy ordering convention. RoHS compliance flagged as compliant per Intel/Altera legacy product declarations. REACH, AEC-Q100, halogen-free, and conflict-mineral declarations are not present in the verified web data and are marked unknown.
