EP4CE75F23I7N - Cyclone IV E FPGA, 75K LEs, 484-FBGA | Intel
MPN: EP4CE75F23I7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $175 | $175.00 |
| 10 | $158 | $1,580.00 |
| 100 | $142 | $14,200.00 |
| 500 | $128.5 | $64,250.00 |
| 1,000 | $118 | $118,000.00 |
EP4CE75F23I7N Overview
An FPGA (field-programmable gate array) is a programmable logic device whose architecture consists of an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks, multiplier/DSP blocks, and phase-locked loops. FPGAs sit above microcontrollers and fixed-function ASICs in the programmable-logic hierarchy, enabling hardware-level parallelism and per-design logic customization. The Cyclone IV E family targets cost-optimized applications such as industrial control, video bridging, automotive driver assistance, and low-cost ASIC prototyping.
Key features of the EP4CE75F23I7N include 75,408 logic elements, 4 PLLs for clock synthesis, 15 embedded 18x18 multipliers delivering up to ~300 MHz DSP performance, 2,810,880 bits of embedded M9K memory (312 blocks), 200 Kbits of distributed RAM, 292 user I/Os, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 484-ball FBGA package (23 mm body, 1.0 mm pitch) supports high-density board designs while maintaining the Cyclone IV family's signature low power budget of roughly 150 mW per 100K LEs typical.
The device uses a 60 nm low-power CMOS process, runs Quartus II / Quartus Prime design-software support, and supports JTAG, Active Serial (AS), and Passive Serial (PS) configuration modes. Configuration memory is volatile; an external configuration device (typically EPCS16/EPCS64) is required to load the bitstream at power-up. The Cyclone IV E family is the lowest-cost member of the Cyclone IV line versus Cyclone IV GX which adds transceivers.
Typical applications include industrial machine vision and video bridging (HDMI/DVI/VGA interface conversion), factory-automation controllers with EtherCAT/Modbus interfaces, automotive infotainment and rear-view camera bridges, low-cost ASIC prototyping and emulation, motor-control loops with high-speed encoder feedback, and consumer-display controllers for LCD or LED panels.
When designing with this device, ensure the 484-ball FBGA land pattern is matched to manufacturer-recommended pad dimensions (typically 0.5 mm to 0.6 mm diameter with NSMD pads) and that the FPGA's decoupling network follows the Quartus Prime power-supply design guidelines - typically 100 nF and 10 uF capacitors per VCCINT/VCCIO rail plus a ferrite bead on supply entry.
This page synthesizes distributor pricing, drop-in alternatives from the Cyclone IV E family, comparison data, and practical design notes not found in a single place in the manufacturer datasheet.
Drop-in alternatives for EP4CE75F23I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE75F23I7N (same form factor and footprint) β differing in Package, Configuration Modes, Family, Embedded 18x18 Multipliers, Logic Elements (LE).
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE75F23I7
β Drop-Inβ In Stock
$220.4 / Unit
View Datasheet βEP4CE75F23I8LN
β Drop-Inβ In Stock
$199.5 / Unit
View Datasheet βEP4CE75F23C8N
β Drop-Inβ In Stock
$42.3 / Unit
View Datasheet βEP4CE115F23I7N
β Drop-Inβ In Stock
$87.95 / Unit
View Datasheet βEP4CE55F23I7N
β Drop-Inβ In Stock
$119.6 / Unit
View Datasheet βEP4CE40F23I7N
β Drop-Inβ In Stock
$52.75 / Unit
View Datasheet βEP4CE75F23I7N Maximum Ratings & Electrical Characteristics
| Product Line | Cyclone IV E |
| Family | Cyclone IV E (EP4CE) |
| Logic Elements (LEs) | 75,408 |
| Logic Array Blocks (LABs) | 4,713 |
| Embedded Memory Bits | 2,810,880 bits (312 M9K blocks) |
| Distributed RAM Bits | 200 Kbits |
| Embedded 18x18 Multipliers | 15 |
| PLLs | 4 |
| Maximum User I/Os | 292 |
| Core Voltage (VCCINT) | 1.2 V nominal |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Process Technology | 60 nm low-power CMOS |
| Package | 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) |
| Operating Temperature Grade | Industrial (I7: -40C to +100C Tj) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| External Memory Interfaces | DDR / DDR2 SDRAM, QDRII SRAM |
| Design Software | Quartus II / Quartus Prime |
| RoHS Status | Compliant |
EP4CE75F23I7N 484-ball fbga (f23, 23 mm body, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP4CE75F23I7N (484-ball fbga (f23, 23 mm body, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE75F23I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE75F23I7N is suitable for 6 applications: Industrial Machine Vision and Video Bridging, Factory Automation Controllers (EtherCAT/Modbus), Automotive Infotainment and Rear-View Camera Bridges, Low-Cost ASIC Prototyping and Emulation, Motor-Control Loops with Encoder Feedback, Consumer Display Controllers (LCD / LED Panels).
Industrial Machine Vision and Video Bridging
The EP4CE75F23I7N fits machine-vision and video-bridging designs because its 75,408 logic elements and 15 embedded 18x18 multipliers handle real-time pixel processing at common camera resolutions (VGA, 720p, 1080p) while four PLLs synthesize the multiple clock domains needed for HDMI/DVI/VGA/LVDS interfaces. With 292 user I/Os and external memory support for DDR/DDR2 SDRAM, the part captures video from a sensor, scales and color-converts it, and drives an HDMI transmitter IC such as the ADV7513 without external frame-buffer logic. The industrial -40C to +100C operating range allows deployment in factory-floor enclosures without thermal screening.
Recommended
Factory Automation Controllers (EtherCAT/Modbus)
Industrial EtherCAT and Modbus fieldbus controllers benefit from the EP4CE75F23I7N's combination of high logic count and deterministic low-latency parallel processing. The 4 PLLs synthesize the 100 Mbps PHY clocks for EtherCAT slave controllers with sub-microsecond jitter, and the 15 embedded multipliers accelerate field-oriented control (FOC) math for direct motor-drive feedback loops. With 292 user I/Os the part can manage multi-axis servo drive control plus industrial I/O expansion. Industrial-grade -40C to +100C operation is required for cabinet installations near motor drives.
Recommended
Automotive Infotainment and Rear-View Camera Bridges
The EP4CE75F23I7N is well-suited for automotive infotainment back-end processing because it bridges BT.656 / LVDS / MIPI-CSI camera inputs to LVDS / OpenLDI / i.LINK display outputs at low BOM cost versus ASSPs. The 75,408 LEs implement on-the-fly image scaling, color-space conversion, and overlay blending while four PLLs generate the precise display timing clocks. Its -40C to +100C operating junction range supports center-console and rear-camera electronics, although AEC-Q100 qualification should be confirmed with the manufacturer for safety-critical applications. Designers typically pair this part with an external DDR2 SDRAM for line buffers.
Recommended
Low-Cost ASIC Prototyping and Emulation
With 75,408 logic elements, 2.8 Mbits of M9K memory, and 292 user I/Os, the EP4CE75F23I7N serves as a mid-density ASIC prototyping platform. Designers targeting ASICs in the 30K-60K gate-equivalent range can map their RTL into the FPGA, validate functional and timing behaviour at near-ASIC speeds, then transition the design to a foundry with low risk. The four PLLs and DDR/DDR2 memory controllers help replicate real-world interface timing. Industrial-grade temperature rating supports in-vehicle and edge-device validation campaigns.
Recommended
Motor-Control Loops with Encoder Feedback
The EP4CE75F23I7N implements multi-axis field-oriented control (FOC) loops where high-resolution encoder feedback (typically 1 MHz line frequency or higher) requires deterministic sub-microsecond interrupt latency. Its 15 embedded 18x18 multipliers execute Clarke/Park transforms, space-vector modulators, and PI loops at 50-100 kHz PWM rates, while the four PLLs derive the PWM switching frequencies and the encoder sampling clocks. The 292 user I/Os handle multi-axis PWM outputs, encoder inputs, and isolation-driver interfaces. Industrial-temperature operation is required for servo-amplifier cabinet deployments.
Recommended
Consumer Display Controllers (LCD / LED Panels)
The EP4CE75F23I7N drives mid-resolution LCD and LED display panels by accepting HDMI/DVI/VGA inputs, scaling the image to the panel's native resolution, and timing the LVDS or eDP output with sub-pixel precision. With 75,408 LEs the part implements scalers, color-management engines, and on-screen-display (OSD) overlays; 292 user I/Os accommodate multi-channel LVDS pairs and backlight control. Industrial-temperature operation is suitable for kiosk and digital-signage installations; commercial-temperature C8N grade is sufficient for indoor consumer displays.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE75F23I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE75F23I7 | EP4CE75F23I8LN | EP4CE75F23C8N | EP4CE115F23I7N | EP4CE55F23I7N | EP4CE40F23I7N |
|---|---|---|---|---|---|---|---|
| Package | FBGA-484 (F23, 23 mm, 1.0 mm pitch) | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 75,408 | 75,408 (same die) | 75,408 (same die) | 75,408 (same die) | 114,480 (+52%) | 55,896 (-26%) | 39,600 (-48%) |
| Embedded Memory Bits | 2,810,880 (312 M9K blocks) | 2,810,880 (same) | 2,810,880 (same) | 2,810,880 (same) | 3,981,312 (+42%) | 2,340,000 (-17%) | 1,161,216 (-59%) |
| Embedded 18x18 Multipliers | 15 | 15 (same) | 15 (same) | 15 (same) | 28 (+87%) | 13 (-13%) | 8 (-47%) |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Maximum User I/Os | 292 | 292 | 292 | 292 | 292 | 324 (+11%) | 328 (+12%) |
| Operating Temperature | Industrial (I7: -40C to +100C) | Industrial (I7) - same | Industrial (I8: -40C to +105C) - wider | Commercial (C8: 0C to +85C) | Industrial (I7) - same | Industrial (I7) - same | Industrial (I7) - same |
| RoHS Compliance | Yes (lead-free, 'N' suffix) | No (Pb-containing) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- RoHS-compliant industrial-temperature grade in 484-FBGA (vs EP4CE75F23I7)
- Highest logic-element count in same F23 footprint family (vs EP4CE115F23I7N)
- 15 embedded multipliers with industrial temperature grade (vs EP4CE75F23C8N)
Design Notes
The 484-ball FBGA package uses a 1.0 mm ball pitch on a 23 mm body. Use NSMD (non-solder-mask-defined) pads of approximately 0.5-0.55 mm diameter with 0.10 mm solder-mask clearance to maximize pad-to-pad spacing and improve manufacturability. Microvia (0.1 mm/0.2 mm) technology with via-in-pad is recommended for inner balls; outer rows can use conventional 0.2 mm through-vias. Follow IPC-7351 and IPC-SM-782 guidelines for FBGA land pattern. Maintain at least 8 layers with continuous VCCINT and GND planes directly beneath the BGA for power delivery and thermal dissipation.
Estimated: at full logic utilization (75% toggle rate, 75C ambient), the EP4CE75F23I7N consumes approximately 1.2-1.8 W from VCCINT (1.2 V) and additional dynamic current from VCCIO banks (1.2 V to 3.3 V). Apply the Quartus Prime PowerPlay Early Power Estimator (EPE) spreadsheet during design to obtain an accurate figure for your specific utilization. Decoupling: place one 100 nF X7R 0402 ceramic capacitor within 1 mm of every VCCINT/VCCIO ball pair, plus 10 uF X5R 0805 bulk capacitors per voltage rail (one per ~10-20 decoupling balls). Add a ferrite bead at each supply entry to filter board-level noise. All 1.2 V VCCINT balls MUST be connected for proper operation; floating VCCINT pins cause logic errors.
Differential-pair routing (LVDS, DDR memory clocks) must be 100 ohm differential impedance with intra-pair length matching of 50 mil or better. DDR/DDR2 memory interfaces should follow the Cyclone IV E external memory interface guidelines in the Intel/Altera EMIF documentation - DQ-DQS skew typically must be held under 50 ps within a byte lane. Place configuration-memory device (EPCS16 / EPCS64) within 2 inches of the FPGA's Active Serial (AS) interface pins (DATA0, DCLK, nCSO, ASDO) and route on inner layers with a continuous ground reference. Keep JTAG chain signals away from high-speed differential pairs to avoid coupling noise into boundary-scan mode.
Configuration failure modes: (1) MSEL[3:0] pins select Active Serial (AS), Passive Serial (PS), JTAG, or Fast Passive Parallel modes - incorrect MSEL strapping causes the FPGA to silently fail to configure. (2) The Cyclone IV E configuration memory is volatile - power-cycling without an external configuration device (EPCS16 / EPCS64 / EPCQ16) leaves the device unconfigured. (3) nCONFIG, nSTATUS, and CONF_DONE pins must be properly pulled up to VCCIO or driven by the host during multi-FPGAs configurations; floating pins cause intermittent startup. (4) I/O bank voltages must not be applied before VCCINT to prevent I/O latch-up.
Compliance Information
EP4CE75F23I7N carries the 'N' suffix indicating Pb-free / RoHS-compliant assembly per Intel/Altera ordering-code conventions. REACH and conflict-minerals compliance statements are published on the Intel product-compliance page. AEC-Q100 qualification status is not explicitly stated for this Cyclone IV E variant; consult Intel for safety-critical automotive applications.
