EP2AGZ350HF40C4N - Arria II GZ FPGA, 350K LE, 1517-BGA | Intel
MPN: EP2AGZ350HF40C4N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4180 | $41,800.00 |
| 100 | $3950 | $395,000.00 |
| 500 | $3720 | $1,860,000.00 |
| 1,000 | $3540 | $3,540,000.00 |
EP2AGZ350HF40C4N Overview
An FPGA is a reprogrammable semiconductor that engineers can configure post-manufacturing to implement custom digital logic, DSP pipelines, memory controllers, transceiver interfaces, and high-speed serial protocols. Within the broader programmable-logic hierarchy, the Arria II GZ family sits between Cyclone (low-cost) and Stratix (high-end) families. Its 40 nm process technology, embedded transceivers (per family datasheet) and 0.9 V core supply make it well-suited for systems where performance per watt is more important than absolute capacity.
Key features include 8-input adaptive logic modules (ALMs), fractional synthesis PLLs, up to 16 global clock networks, and dedicated DSP blocks that deliver up to ~550 MHz multiply-accumulate performance. Memory is organized as M9K and M144K blocks, with 24 transceiver channels supporting rates up to 6.375 Gbps (per family datasheet). The HF40 package exposes 734 general-purpose I/O plus dedicated clock, configuration, and JTAG pins for boundary-scan and in-system programming via JTAG or passive/active serial.
The architecture is built around a core fabric of columns and rows of LABs interconnected by multi-track routing, with dedicated hardware for 18 x 18 multipliers, memory blocks, and high-speed I/O serializer/deserializer (SERDES) elements. The 40 nm process balances static and dynamic power, and Arria II GZ devices support Quartus II programmable power technology that automatically reduces power on unused blocks. Configuration is loaded from a serial flash or via JTAG using the active serial (AS) or JTAG modes, supporting fast field updates and remote reprogramming.
Typical applications include high-performance digital signal processing (radar, baseband, software defined radio), video processing and broadcast infrastructure, 40G/100G line-card bridging, test and measurement equipment, and high-end industrial imaging. The combination of 21 Mbits of block RAM and 734 user I/O also suits large datapath buffering for high-resolution video walls or medical imaging front-ends.
When designing with this device, plan the PCB layout around the 40 x 40 mm FC-BGA land pattern, using microvia stack-ups for breakout, and provide multiple decoupling values (0.1 uF, 1 uF, 10 uF) close to each power rail. Always sequence the 0.9 V core before the 1.1 V/2.5 V/3.3 V auxiliary supplies to avoid latch-up at power-up.
This page synthesizes distributor pricing, same-family drop-in alternatives from the Arria II GZ portfolio, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2AGZ350HF40C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ350HF40C4N (same form factor and footprint) β differing in Package, Speed Grade, RoHS Status, Logic Elements, DSP Blocks.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ350HF40C4G
β Drop-Inβ In Stock
$1015.4 / Unit
View Datasheet βEP2AGZ350HF40C3N
β Drop-Inβ In Stock
$2150 / Unit
View Datasheet βEP2AGZ350HF40C3G
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2AGZ350HF40C2N
β Drop-Inβ In Stock
$2645 / Unit
View Datasheet βEP2AGZ300HF40C4N
β Drop-Inβ In Stock
$3950 / Unit
View Datasheet βEP2AGZ225HF40C4N
β Drop-Inβ In Stock
$2410 / Unit
View Datasheet βEP2AGZ350HF40C4N Maximum Ratings & Electrical Characteristics
| Family | Arria II GZ |
| Logic Elements | 348,500 |
| Logic Array Blocks (LABs) | 13,940 |
| Embedded Memory Bits | 21,270,528 (~21.27 Mbit) |
| User I/O Pins | 734 |
| Process Technology | 40 nm |
| Core Supply Voltage | 0.9 V |
| Speed Grade | C4 |
| Temperature Grade | Commercial (0C to +85C) |
| Package | 1517-ball FC-FBGA (HF40, 40 x 40 mm) |
| Mounting Type | Surface Mount |
| Transceivers | Up to 24 channels, up to 6.375 Gbps (per family datasheet) |
| DSP Blocks | Yes (18 x 18 multipliers, per family datasheet) |
| PLLs | Fractional and integer PLLs (per family datasheet) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| RoHS Status | Compliant (per Altera/Intel product page) |
EP2AGZ350HF40C4N 1517-ball fc-fbga (hf40, 40 x 40 mm) Pin Configuration Guide
Pin configuration for EP2AGZ350HF40C4N (1517-ball fc-fbga (hf40, 40 x 40 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ350HF40C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ350HF40C4N is suitable for 6 applications: High-Performance DSP / Software Defined Radio, Video Processing and Broadcast Infrastructure, Telecom Line Cards and Backplane Bridging, Test and Measurement Equipment, Medical Imaging Front-End, Industrial Imaging and Machine Vision.
High-Performance DSP / Software Defined Radio
The EP2AGZ350HF40C4N's 348,500 logic elements, dedicated 18 x 18 multipliers, and 21,270,528 bits of embedded memory make it well-suited for high-throughput DSP pipelines such as software defined radio baseband and radar front-end processing. The C4 speed grade delivers tight DSP block fMAX margins at commercial temperature, allowing engineers to close timing on multi-tap FIR, FFT, and channelization kernels without dropping to a slower -3 speed grade. Up to 24 embedded transceiver channels at 6.375 Gbps handle raw ADC/DAC data and Aurora or Serial RapidIO backhaul. This part is preferred when design teams need Stratix-class DSP density at lower cost and power than a Stratix IV.
Recommended
Video Processing and Broadcast Infrastructure
Broadcast routers, video walls, and multi-channel image processing benefit from the EP2AGZ350HF40C4N's 21 Mbits of block RAM for line buffering and frame-store plus 734 user I/O for parallel video data paths. The HF40 package exposes enough I/O to drive multiple SDI, HDMI, or DisplayPort bridges simultaneously, while the C4 speed grade meets the timing requirements of 1080p60 and 4K processing pipelines. Designers commonly use the M9K and M144K memory blocks as cost-effective frame buffers and the dedicated DSP blocks for chroma resampling and scaling. Power consumption stays moderate compared to Stratix-class parts, which is attractive for 1U broadcast chassis.
Recommended
Telecom Line Cards and Backplane Bridging
The EP2AGZ350HF40C4N is widely used on 40G/100G telecom line cards where it implements custom packet processing, bridging between CPRI/OBSAI and Ethernet backplanes, and protocol offload engines. Up to 24 transceiver channels at 6.375 Gbps aggregate to more than 150 Gbps of raw serial bandwidth, enough for multiple CPRI links or 10G Ethernet aggregation. The 734 user I/O provide ample side-band and management plane connectivity, while the 21 Mbit embedded memory supports deep packet buffers. The C4 speed grade and commercial temperature range suit controlled-environment central-office and data-center deployments.
Recommended
Test and Measurement Equipment
Test instruments such as protocol analyzers, logic analyzers with pattern generation, and high-speed digitizers benefit from the EP2AGZ350HF40C4N's large fabric and abundant memory. The 348,500 logic elements can implement deep pattern-matching state machines, while 21 Mbits of block RAM hold captured waveforms and protocol traces. Transceiver channels at 6.375 Gbps support 10G Ethernet, USB 3.0, and PCIe Gen2 sniffing/generation in a single device. The C4 commercial speed grade is well suited to bench-top and lab chassis where ambient stays within 0C to +85C.
Recommended
Medical Imaging Front-End
Ultrasound, CT, and MRI front-end processing benefit from the EP2AGZ350HF40C4N's combination of DSP blocks, parallel multipliers, and 21 Mbits of on-chip memory for image reconstruction kernels. The device supports multi-channel beamforming and back-end image processing in a single chip, replacing multiple DSPs and FPGAs in older designs. The 734 user I/O can interface directly to high-channel-count ADC arrays without external muxing, and the C4 commercial temperature range suits the controlled environment of a medical imaging cart or rack. Low FPGA power consumption at 0.9 V core simplifies thermal design in sealed enclosures.
Recommended
Industrial Imaging and Machine Vision
Multi-camera machine vision systems with GigE Vision, CoaXPress, or Camera Link interfaces leverage the EP2AGZ350HF40C4N's transceiver channels and parallel I/O to aggregate image streams into a single processing pipeline. The 348,500 logic elements can host multiple hardware-accelerated image-processing kernels simultaneously, while 21 Mbits of block RAM acts as line and frame buffers for high-resolution sensors. The C4 commercial temperature range suits factory-floor chassis with active cooling. Designers needing extra thermal margin should evaluate the EP2AGZ350HF40I4N industrial variant instead.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ350HF40C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ350HF40C4G | EP2AGZ350HF40C3N | EP2AGZ300HF40C4N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 1517-ball FC-FBGA (HF40, 40 x 40 mm) | 1517-ball FC-FBGA (HF40) - same | 1517-ball FC-FBGA (HF40) - same | 1517-ball FC-FBGA (HF40) - same |
| Logic Elements | 348,500 | 348,500 | 348,500 | 300,000 |
| Speed Grade | C4 (commercial -4) | C4 (commercial -4) | C3 (commercial -3) | C4 (commercial -4) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial |
| Embedded Memory | 21,270,528 bits | 21,270,528 bits | 21,270,528 bits | ~17,976,000 bits (per family datasheet) |
| User I/O | 734 | 734 | 734 | 734 (HF40 package) |
| Process / Core Voltage | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V |
| Pb-free Suffix | N (standard) | G (Pb-free tray) | N (standard) | N (standard) |
Key Differentiators
- Highest logic density in the Arria II GZ family with the C4 speed grade (vs EP2AGZ300HF40C4N)
- Faster speed grade than -3 alternatives at the same density (vs EP2AGZ350HF40C3N)
- Pin-compatible lead-free tray variant available (vs EP2AGZ350HF40C4G)
Design Notes
The HF40 1517-ball FC-FBGA at 0.8 mm ball pitch requires a high-density PCB stack-up with laser-drilled microvias and via-in-pad. Plan at least 4-6 PCB layers, with dedicated ground and power planes adjacent to the BGA footprint. Use 0.1 uF, 1 uF, and 10 uF decoupling capacitors distributed around the periphery, and follow Intel/Altera's HF40 decoupling and via-array reference design to control simultaneous switching noise on the 0.9 V core rail.
Estimated: a fully-utilized EP2AGZ350HF40C4N with all 24 transceivers active can draw approximately 15-25 W from the 0.9 V core plus several watts from the 1.1 V/2.5 V/3.3 V auxiliary rails. Power sequencing must assert the 0.9 V core before the auxiliary rails to prevent I/O driving into an unpowered core. Use a multi-rail controller with monotonic ramp and PG (power-good) chaining, and budget thermal dissipation on the PCB with a copper pour under the exposed pad and optional forced airflow.
Route the dedicated clock inputs on inner stripline layers with controlled impedance and length matching. Place the configuration flash within 4 inches of the FPGA, and add a JTAG header even on production boards for debug access. Series-terminate all LVDS pairs as recommended in the Arria II GZ device handbook, and avoid routing signals through the BGA pin field when a periphery breakout is possible.
Do not confuse the speed-grade encoding across families: in Arria II GZ, '-4' is faster than '-3' which is faster than '-2', opposite of some older Altera families. Do not migrate bitstreams between C4 and I4 parts - the JTAG ID is the same but temperature-related timing closure must be re-verified. Always re-run TimeQuest timing analysis after a Quartus II version upgrade.
Compliance Information
RoHS and lead-free per Altera/Intel product page; AEC-Q100 not applicable for FPGA logic devices; REACH and halogen-free status not explicitly stated in the verified web data and should be confirmed via the manufacturer declaration.
