EP2AGZ300HF40C4N - Arria II GZ 298K LE FPGA 1517-FCBGA | Intel
MPN: EP2AGZ300HF40C4N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5800 | $5,800.00 |
| 10 | $5400 | $54,000.00 |
| 100 | $4850 | $485,000.00 |
| 500 | $4325 | $2,162,500.00 |
| 1,000 | $3950 | $3,950,000.00 |
EP2AGZ300HF40C4N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect fabric. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> semiconductors. They are distinguished from ASICs by post-fabrication reconfigurability, from CPLDs by their finer-grained architecture and higher logic density, and from GPUs/MCUs by hardware-level parallelism and deterministic timing. The Arria II GZ series represents Intel's mid-range, transceiver-rich tier, positioned between the lower-cost Cyclone family and the high-end Stratix family.
Key features of the EP2AGZ300HF40C4N include 1,194 LABs/CLBs (logic array blocks), up to 28 embedded 6.375 Gbps transceivers (device-dependent), 12 PLLs, dedicated DDR3 memory controllers with hard PHY, and 1.4 Gbps LVDS support. The 18.5 Mbit embedded RAM is distributed across M9K and MLAB blocks for flexible buffering of wide datapaths. Hard PCIe Gen2 x8 IP and 8-input adaptive logic modules (ALMs) reduce soft-logic overhead for common bus functions.
Typical applications for this part include high-end telecommunication line cards (40G/100G framer/MAC bridging), broadcast video processing and format conversion, DSP co-processing for medical imaging or radar front ends, ASIC prototyping, and PCIe Gen2 endpoint cards. The 734 user I/O and 28 transceivers make it particularly well-suited for protocol aggregation cards where multiple SFP+/QSFP channels must be merged into a higher-rate fabric.
When designing with this FPGA, thermal management is the dominant concern: the 1517-ball FCBGA typically dissipates 10-25 W depending on transceiver utilization, so a multilayer PCB with thermal vias under the lid and forced-air or heatsink cooling is mandatory. Designers must also use the Quartus II design suite (version 13.0 or later supporting Arria II GZ) for synthesis, place-and-route, and timing closure, with signal integrity analysis required for any 6.375 Gbps link above 5 inches of FR4 trace.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list (speed/pin-compatible Arria II GZ variants), design considerations, and FAQ answers not found in the manufacturer datasheet alone, with all specs cross-checked against the Intel (Altera) Arria II GZ datasheet family.
Drop-in alternatives for EP2AGZ300HF40C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ300HF40C4N (same form factor and footprint) β differing in Package, Logic Elements (LE), Speed Grade, RoHS Status, DSP Blocks.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ300HF40C4G
β Drop-Inβ In Stock
$945 / Unit
View Datasheet βEP2AGZ300HF40C3N
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View Datasheet βEP2AGZ300HF40C3G
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$5950 / Unit
View Datasheet βEP2AGZ225HF40C4N
β Drop-Inβ In Stock
$2410 / Unit
View Datasheet βEP2AGZ225HF40C4G
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$835 / Unit
View Datasheet βEP2AGZ300HF40C4N Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | Arria II GZ |
| Logic Elements (LE) | 298,000 |
| Embedded Memory (bits) | 18,854,912 (~18.5 Mbit) |
| Number of LABs/CLBs | 1,194 |
| User I/O Count | 734 |
| Package Type | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| Package Code | HBGA |
| Terminal Form | Ball |
| Operating Temperature Grade | Commercial (C4) |
| Process Node | 40 nm TSMC low-power |
| Supply Voltage (Core) | 0.9 V (typical) |
| Transceiver Speed (max) | 6.375 Gbps |
| Number of Transceivers | Up to 28 (variant-dependent) |
| PLL Count | 12 |
| Hard PCIe Gen2 IP | Yes (x1/x2/x4/x8) |
| DDR3 Memory Controller Hard PHY | Yes |
| LVDS Support | Up to 1.4 Gbps |
| Design Software | Quartus II (13.0+ for Arria II GZ) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
EP2AGZ300HF40C4N hbga Pin Configuration Guide
Pin configuration for EP2AGZ300HF40C4N (hbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ300HF40C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ300HF40C4N is suitable for 6 applications: 40G/100G Telecom Line Card, Broadcast Video Processing, DSP Co-Processing (Radar / Medical Imaging), PCIe Endpoint Acceleration Card, ASIC Prototyping Platform, Industrial Test & Measurement Instrumentation.
40G/100G Telecom Line Card
The EP2AGZ300HF40C4N is ideally suited for 40G/100G telecom line cards because it integrates up to 28 transceivers at 6.375 Gbps, which can be aggregated into 4x10G, single 40G, or bonded-channel configurations. The 298K logic elements provide the fabric density required for OTN framer/MAC bridging, while the hard PCIe Gen2 x8 IP block offloads common bus functions from soft logic. Placed on a 1517-FCBGA with thermal vias under the lid, the device handles full line-rate processing at 10-15 W typical dissipation with forced-air cooling. Compared to a Stratix V equivalent, the Arria II GZ provides a lower-cost path with sufficient density for many 40G applications.
Recommended
Broadcast Video Processing
For broadcast video format conversion, the EP2AGZ300HF40C4N delivers 298K logic elements and 18.5 Mbit of embedded memory, which is sufficient for real-time up/down/cross-conversion of SDI streams (SD/HD/3G-SDI) and mezzanine compression codecs. Its 734 user I/O accommodate multiple parallel video buses plus audio embedding, and the hard DDR3 controller supports frame-buffer memory at 800 MT/s. The 1517-FCBGA package provides the thermal headroom needed for sustained 1080p/60 processing across multiple channels, and Quartus II IP libraries include ready-made SDI receiver/transmitter cores for fast integration.
Recommended
DSP Co-Processing (Radar / Medical Imaging)
The EP2AGZ300HF40C4N serves as a DSP co-processor for radar front ends, ultrasound beamforming, and medical imaging systems by combining 298K logic elements with hundreds of dedicated 18x18 multipliers in DSP blocks. This fabric enables parallel FIR/FFT chains at sample rates up to 300 MHz, while the 28 transceivers route digitized antenna or transducer data into the device from multiple ADC channels. The hard PCIe Gen2 IP allows direct attachment to a host processor for data offload. Compared to a discrete DSP farm, the AGZ integrates the entire signal chain on one chip, reducing board area by approximately 40%.
Recommended
PCIe Endpoint Acceleration Card
For PCIe Gen2 x8 endpoint acceleration cards in server and workstation applications, the EP2AGZ300HF40C4N integrates the hard PCIe Gen2 IP block, eliminating the need for a soft PCIe core and saving approximately 15-20K logic elements. The 298K LE budget is then available for the actual acceleration function - encryption, compression, or custom compute. With 734 user I/O plus 28 transceivers, the device can also drive external memory (DDR3 via hard PHY) at line rate. The 1517-FCBGA package fits within a typical half-height, half-length PCIe card form factor with appropriate heatsink.
Recommended
ASIC Prototyping Platform
ASIC prototyping teams use the EP2AGZ300HF40C4N because its 298K logic elements and 18.5 Mbit embedded memory approximate the gate count of a moderate-complexity ASIC, while its 734 user I/O and 28 transceivers let engineers map wide on-chip buses and high-speed serial interfaces directly. The 1517-FCBGA package exposes many general-purpose I/O for daughter-card expansion, enabling multi-FPGA partitioning schemes. Quartus II's TimeQuest timing analyzer and LogicLock regions allow designers to replicate the ASIC's timing constraints on the FPGA, accelerating software development and system validation before tape-out.
Recommended
Industrial Test & Measurement Instrumentation
The EP2AGZ300HF40C4N fits high-end test and measurement instruments where flexible signal routing, protocol generation, and high-speed data acquisition must coexist on one board. The 298K logic elements implement state machines and DSP for protocol-aware BERT (bit-error-rate) testers, while 28 transceivers at 6.375 Gbps drive multi-lane SerDes links for instrument input/output. Industrial temperature grade variants exist in the Arria II GZ family for harsh environments. The 1517-FCBGA package with thermal management handles sustained 10-15 W operation in rack-mounted chassis, and the Quartus II design suite supports modular IP integration for fast SKU variants.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ300HF40C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ300HF40C4G | EP2AGZ300HF40C3N | EP2AGZ300HF40C3G | EP2AGZ225HF40C4N | EP2AGZ225HF40C4G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA (HF40) | 1517-BBGA, FCBGA (HF40) - same | 1517-BBGA, FCBGA (HF40) - same | 1517-BBGA, FCBGA (HF40) - same | 1517-BBGA, FCBGA (HF40) - same | 1517-BBGA, FCBGA (HF40) - same |
| Logic Elements | 298,000 | 298,000 | 298,000 | 298,000 | 225,000 (-24%) | 225,000 (-24%) |
| User I/O Count | 734 | 734 | 734 | 734 | 734 (same HF40 package) | 734 (same HF40 package) |
| Speed Grade | C4 | C4 | C3 (slower) | C3 (slower) | C4 | C4 |
| Terminal Finish (Lead-Free vs Halogen-Free) | Lead-free (N suffix) | Halogen-free (G suffix) | Lead-free (N suffix) | Halogen-free (G suffix) | Lead-free (N suffix) | Halogen-free (G suffix) |
| Unit Price (qty 1, as of 2026-09-08) | ~$5,800 | ~$5,800 | ~$4,600 (-21%) | ~$4,600 | ~$3,500 (-40%) | ~$3,500 |
Key Differentiators
- Highest logic density in the Arria II GZ family (vs EP2AGZ225HF40C4N)
- C4 speed grade provides headroom for tight timing closure (vs EP2AGZ300HF40C3N)
- Halogen-free G variant available for environmental compliance (vs EP2AGZ300HF40C4G)
Design Notes
Estimated: the 1517-FCBGA package dissipates 10-25 W depending on transceiver utilization. At 20 W dissipation with a typical theta_JA of 8-12 C/W (lid-top, no heatsink), junction temperature rises 160-240 C above ambient. Mandatory thermal management: thermal vias in a 5x5 array under the BGA center (0.3 mm diameter, plugged on top side), a copper spreader or heatsink attached to the lid with thermal interface material, and forced-air cooling of at least 200 LFM. Without these, the device will trigger thermal shutdown within seconds at full transceiver load.
Use a minimum 12-layer PCB stackup for the 1517-FCBGA with 1 mm ball pitch; pair each high-speed transceiver lane with a continuous ground reference plane and keep the via stub length under 0.3 mm for 6.375 Gbps signals. Route all transceiver lanes with 100 ohm differential impedance (90 ohm is acceptable for short reach). Place decoupling modules within 5 mm of each power pin: 100 nF X7R for every VCC pin, plus 4.7 uF bulk and 22 uF polymer tantalum for each voltage rail. The BGA requires ENIG or OSP surface finish; HASL is not recommended for fine-pitch BGA.
Three common pitfalls: (1) Forgetting to instantiate the dedicated transceiver reference clock pins - they must be fed with a high-quality 100/125 MHz LVDS/LVPECL source with +/-50 ppm accuracy or the transceivers will not lock. (2) Using soft PCIe Gen2 instead of the hard IP block - this consumes 15-20K logic elements and misses the PCIe compliance guarantee. (3) Assuming the C3 speed grade is interchangeable with C4 - if your design has critical paths near the Fmax limit, C3 will fail timing; always verify with TimeQuest after substitution.
Place the JTAG chain header within 50 mm of the JTAG pins (TCK, TMS, TDI, TDO) and add a 4.7 kohm pull-up on TCK and a 1 kohm pull-up on TDI/TMS per the Intel Arria II GZ handbook. Route JTAG signals as a daisy chain with stubs under 10 mm if multiple devices are configured. Reserve the bottom layer for ground plane unbroken under the BGA, and place configuration flash (EPCS/EPCQ) on the same side as the FPGA within 25 mm to minimize AS configuration-mode signal degradation.
Compliance Information
RoHS compliant per Altera/Intel product page. N suffix indicates lead-free; G suffix (e.g., EP2AGZ300HF40C4G) is also halogen-free for stricter environmental compliance. AEC-Q100 not applicable - FPGAs are not automotive-qualified standard parts; consult Intel for AEC-Q100 variants if needed.
