EP4SGX360KF40I4N - 353600-Cell Stratix IV GX FPGA | Intel
MPN: EP4SGX360KF40I4N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4025 | $40,250.00 |
| 100 | $3780 | $378,000.00 |
| 500 | $3450 | $1,725,000.00 |
| 1,000 | $3100 | $3,100,000.00 |
EP4SGX360KF40I4N Overview
A field-programmable gate array (FPGA) is a semiconductor integrated circuit whose digital logic, interconnects, and I/O behavior are defined by user-supplied configuration data after manufacture. FPGAs occupy the position between fixed-function ASICs and software-programmable processors in the computing hierarchy, offering hardware-timed parallelism, configurable I/O standards, and on-chip memory blocks. The Stratix IV GX family specifically extends the architecture with dedicated multi-gigabit transceivers and physical coding sublayers (PCSs) for protocols such as PCIe, Serial RapidIO, Gigabit Ethernet, and CPRI, mapping into the broader taxonomy of programmable logic devices (PLD) within the Intel PSG product tree.
Key features of the EP4SGX360KF40I4N include 14144 LABs/CLBs with 744 maximum user I/Os, 23105536 bits of embedded RAM, embedded transceivers supporting multi-gigabit serial interfaces, on-chip DSP blocks for fixed- and floating-point math, and 8-input fracturable look-up tables (LUTs) per ALM for fine-grained logic packing. The 1517-ball FC-FBGA package provides ample signal pins for parallel DDR3 memory interfaces alongside serial links, while the 40 nm low-power process node enables lower static current versus earlier 65 nm Stratix III devices.
Typical applications include high-end wireline telecom line cards, test and measurement instrumentation with deep trace memory, broadcast video format conversion, ASIC prototyping and emulation, military/aerospace signal processing, and high-performance computing accelerators. The combination of logic density, transceiver bandwidth, and on-chip memory makes the device well-suited to applications that would otherwise require multiple smaller FPGAs or a custom ASIC.
When designing with this part, verify that the PCB footprint matches the 1517-ball FC-FBGA land pattern with proper microvia stack-up and that the transceiver reference clock architecture satisfies jitter requirements for the target protocol. Industrial-grade temperature range (-40C to +100C ambient, indicated by the I4 speed/temperature suffix) is appropriate for outdoor telecom and industrial deployments, but designers should review the power budgeting tool output to confirm thermal headroom under worst-case toggle rates.
This page synthesizes distributor pricing, parametric alternatives, and practical engineering notes that complement the official Intel Stratix IV device handbook.
Drop-in alternatives for EP4SGX360KF40I4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360KF40I4N (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Transceivers, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX360KF40I4
β Drop-Inβ In Stock
$8100 / Unit
View Datasheet βEP4SGX360KF40I3N
β Drop-Inβ In Stock
$5120 / Unit
View Datasheet βEP4SGX360KF40C4N
β Drop-Inβ In Stock
$3360 / Unit
View Datasheet βEP4SGX360KF40C3N
β Drop-Inβ In Stock
$1320 / Unit
View Datasheet βEP4SGX360HF35I4N
β Drop-Inβ In Stock
$8.5 / Unit
View Datasheet βEP4SGX360FF35I4N
β Drop-Inβ In Stock
$1245 / Unit
View Datasheet βEP4SGX290NF45I4N
β Drop-Inβ In Stock
$2095 / Unit
View Datasheet βEP4SGX360KF40I4N Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements | 353600 |
| Adaptive Logic Modules (ALMs) | 141440 |
| LABs/CLBs | 14144 |
| Number of I/O | 744 |
| Embedded Memory Bits | 23105536 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Package | 1517-BBGA, FCBGA (Flip-Chip BGA) |
| Package Pin/Ball Count | 1517 |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial (I4 suffix) |
| Lead Free | Yes |
| RoHS Status | Compliant |
EP4SGX360KF40I4N 1517 Pin Configuration Guide
Pin configuration for EP4SGX360KF40I4N (1517 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360KF40I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360KF40I4N is suitable for 6 applications: Wireline Telecom Line Cards, Broadcast Video Processing & Format Conversion, Test & Measurement Instrumentation, ASIC Prototyping & Emulation, Military & Aerospace Signal Processing, High-Performance Computing Accelerators.
Wireline Telecom Line Cards
The EP4SGX360KF40I4N fits wireline telecom line cards because its 353600 logic elements and embedded multi-gigabit transceivers deliver deterministic throughput for packet classification, queuing, and traffic management. Placed on a line-card PCB alongside PHY and framer/mapper ASICs, the device buffers 23 Mbit of embedded memory absorbs micro-bursts and jitter, while industrial -40C to +100C operation supports central-office and outdoor deployments. Designers must respect the Stratix IV GX transceiver reference-clock jitter budget and use the dedicated PCIe Gen2 hard IP block for backplane interconnect.
Recommended
Broadcast Video Processing & Format Conversion
The EP4SGX360KF40I4N is well suited to broadcast video format conversion and processing due to its 14144 LABs and abundant DSP blocks for scaling, de-interlacing, and color-space conversion. With 744 user I/Os the device can ingest multi-channel 3G-SDI streams while its 0.9 V 40 nm core keeps thermal dissipation manageable in 1U rack chassis. Industrial temperature grade (I4) covers outdoor broadcast trucks and headend equipment, and the 1517-ball FC-BGA provides enough pins for parallel video buses and DDR3 frame buffers.
Recommended
Test & Measurement Instrumentation
The EP4SGX360KF40I4N supports high-end test and measurement instruments such as logic analyzers, protocol exercisers, and oscilloscope digitizer boards because the 23 Mbit embedded RAM functions as deep trace memory and the 353600 logic elements implement parallel correlation engines. Industrial temperature grade enables portable field-test gear, and the dedicated transceiver hard IP drives PCIe Gen2 host connectivity for streaming captured waveforms at multi-gigabit rates. Power integrity is critical given the 0.9 V core at high toggle rates - designers should use the Intel PowerPlay early power estimator before layout.
Recommended
ASIC Prototyping & Emulation
The EP4SGX360KF40I4N serves as a building block in ASIC prototyping and emulation farms where designers partition large ASIC RTL across multiple high-density FPGAs. Its 353600 logic elements and 744 I/Os map cleanly to mid-complexity ASIC blocks, while the 23 Mbit embedded memory emulates SRAMs and register files without off-chip access latency. Industrial temperature grade suits lab and bench environments; designers stack multiple boards using high-density board-to-board connectors to scale capacity. Quartus II software provides time-domain multiplexing to bridge multiple FPGAs.
Recommended
Military & Aerospace Signal Processing
The EP4SGX360KF40I4N, in its industrial temperature grade, supports military and aerospace signal-processing applications such as radar front-end preprocessing, electronic-warfare channelization, and satellite modem designs. The 40 nm 0.9 V core reduces inrush and thermal load compared with older 90 nm FPGAs, while the embedded transceivers handle high-bandwidth ADC/DAC data links. Designers must perform component-level reliability screening per the target MIL-PRF or DO-254 program and apply conformal coating on the 1517-ball FC-BGA assembly to survive vibration and humidity.
Recommended
High-Performance Computing Accelerators
The EP4SGX360KF40I4N accelerates financial analytics, genomics, and scientific computing workloads because its 14144 LABs and embedded DSP blocks deliver high parallel throughput, while the 23 Mbit embedded RAM supports large on-chip lookup tables and scratch buffers. With PCIe Gen2 hard IP, the device plugs into commodity server hosts over x8 lanes, and industrial temperature grade tolerates data-center and edge deployments. Compared with GPU accelerators, the FPGA offers deterministic latency and lower bit-exactness drift between runs, which is critical for reproducibility.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360KF40I4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360KF40I4 | EP4SGX360KF40I3N | EP4SGX360KF40C4N | EP4SGX360HF35I4N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA FCBGA (KF40) | 1517-BBGA FCBGA (KF40) - same | 1517-BBGA FCBGA (KF40) - same | 1517-BBGA FCBGA (KF40) - same | 1517-BBGA FCBGA (HF35) - different ball-out |
| Logic Elements | 353600 | 353600 | 353600 | 353600 | 353600 |
| LABs / CLBs | 14144 | 14144 | 14144 | 14144 | 14144 |
| Number of I/O | 744 | 744 | 744 | 744 | 744 |
| Embedded Memory | 23105536 bits | 23105536 bits | 23105536 bits | 23105536 bits | 23105536 bits |
| Speed Grade | I4 (industrial, fastest) | I4 (industrial, fastest) | I3 (industrial, one step slower) | C4 (commercial, fastest) | I4 (industrial, fastest) |
| Operating Temperature | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Key Differentiators
- Fastest industrial speed grade in the 360KLE Stratix IV GX family (vs EP4SGX360KF40I3N)
- Highest-density Stratix IV GX with the KF40 ball-out (vs EP4SGX360HF35I4N)
- Industrial temperature grade for outdoor and ruggedized deployments (vs EP4SGX360KF40C4N)
Design Notes
At typical Stratix IV GX toggle rates, the EP4SGX360KF40I4N can dissipate 10-15 W under worst-case vectors. The 1517-ball FC-BGA package requires substantial copper pour on the top and inner PCB layers, plus thermal vias to inner pads, to keep junction temperature within the industrial 100C limit. Designers should run the Intel PowerPlay Early Power Estimator with realistic toggle and utilization rates BEFORE layout, and reserve space for an optional heatsink for fan-less industrial enclosures.
The 1517-ball flip-chip BGA mandates a high-density PCB stack-up with laser-drilled microvias (typically 0.1 mm pad, 0.4 mm pitch). Signal integrity demands controlled-impedance routing for transceiver channels (typically 85 ohm differential) and matched-length tuning within the PCIe Gen2 specification. Power decoupling must use a combination of bulk, mid-frequency, and high-frequency MLCCs placed directly beneath the BGA via array with short loop inductance to the package balls.
Transceiver channels on the EP4SGX360KF40I4N must be routed with reference planes on adjacent layers and routed AC-coupled (per the Stratix IV GX handbook). Reference-clock routing must be kept short, isolated from data lanes, and guarded by ground vias to minimize jitter. The configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE) require careful routing away from high-speed signals and an external flash or EPCS/EPCQ configuration memory for fast parallel or serial configuration.
Common pitfalls include mixing industrial and commercial speed grades on the same PCB (which violates Intel's binning rules), exceeding transceiver reference-clock jitter budgets, leaving JTAG chain un-terminated, and using non-Intel-supported configuration schemes. The Quartus II software will flag many of these during compilation, but designers should always validate the generated pinout against the device handbook pin tables for the KF40 package specifically.
Compliance Information
Lead-free per FindIC and Alldatasheet listings. RoHS compliant per distributor listings. AEC-Q100 is not applicable to FPGAs (automotive qualification standard for ICs is not typically pursued for high-density programmable logic).
