EP2AGZ350HF40C4G - 350K LE Arria II GZ FPGA | Intel | FBGA-1517
MPN: EP2AGZ350HF40C4G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1378.78 | $1,378.78 |
| 10 | $1285.5 | $12,855.00 |
| 100 | $1190.2 | $119,020.00 |
| 500 | $1105 | $552,500.00 |
| 1,000 | $1015.4 | $1,015,400.00 |
EP2AGZ350HF40C4G Overview
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, embedded memory, DSP blocks, and high-speed transceivers connected by a programmable routing fabric. FPGAs occupy a hierarchy between fixed-function ASICs and general-purpose processors: they offer hardware-level parallelism and deterministic latency without the NRE cost of an ASIC, while remaining reprogrammable in the field. The Arria II GZ family sits in Intel's mid-to-high-density transceiver-equipped tier, optimized for high-bandwidth applications such as high-speed serial interfaces and DSP-heavy signal processing.
Key features of the EP2AGZ350HF40C4G include support for 4 multi-protocol 3.125 Gbps transceivers (the exact number of transceiver channels for this device-specific package may vary; check the device datasheet for the precise transceiver count), 8 fractional PLLs, dedicated hard memory controllers supporting DDR3, DDR2, and QDR memory, and a hard PCI Express Gen2 endpoint block. The device is fabricated on a 40 nm low-power process and integrates configurable I/O standards including LVDS, LVCMOS, SSTL, HSTL, and high-speed serial interfaces through the transceiver block.
The Arria II GZ architecture combines a fine-grained logic fabric with column-based DSP blocks and embedded SRAM (M9K blocks of 9 Kbits and M144K blocks of 144 Kbits) for efficient implementation of DSP pipelines, video processing, and protocol bridging. The hard PCIe Gen2 endpoint eliminates the soft-IP overhead typical of FPGA-based PCIe implementations, enabling low-latency single-chip solutions for industrial and test-card designs. Configuration is supported via JTAG, passive serial, fast passive parallel, and active serial modes using a wide range of industry-standard configuration memories.
Typical applications for the EP2AGZ350HF40C4G include high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, SATA, XAUI), HD-SDI and 3G-SDI video processing, software-defined radio front-end sample processing, and high-channel-count DSP pipelines for test and measurement. The large logic capacity combined with hard PCIe and memory controllers makes it suitable as a host-side co-processor in medical imaging, defense signal intelligence, and high-performance industrial inspection systems.
When designing with this device, pay close attention to the FBGA-1517 PCB land pattern - the 1.0 mm ball pitch requires high-density interconnect (HDI) PCB fabrication with micro-vias, and signal-integrity analysis of the transceiver channels is essential above 2.5 Gbps. Power estimation with the Intel FPGA PowerPlay Early Power Estimator (EPE) should be completed before committing to the PCB stackup, because the 40 nm process can dissipate substantial power under heavy DSP and transceiver utilization.
This page synthesizes distributor pricing, drop-in alternatives from the Arria II GZ family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2AGZ350HF40C4G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ350HF40C4G (same form factor and footprint) β differing in Package, Speed Grade, Logic Elements (LE), Mounting Type, Configuration Modes.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ350HF40C3G
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2AGZ350HF40C4N
β Drop-Inβ In Stock
$3540 / Unit
View Datasheet βEP2AGZ350HF40C3N
β Drop-Inβ In Stock
$2150 / Unit
View Datasheet βEP2AGZ300HF40C4G
β Drop-Inβ In Stock
$945 / Unit
View Datasheet βEP2AGZ225HF40C4G
β Drop-Inβ In Stock
$835 / Unit
View Datasheet βEP2AGZ300HF40C4N
β Drop-Inβ In Stock
$3950 / Unit
View Datasheet βEP2AGZ350HF40C4G Maximum Ratings & Electrical Characteristics
| Family | Arria II GZ |
| Logic Elements (LE) | 350,000 |
| Embedded Memory (bits) | 20,480 Kbits |
| User Accessible RAM (bits) | 4.7 Mbits |
| DSP Blocks | 534 (18x18 multipliers) |
| Transceiver Data Rate | up to 3.125 Gbps |
| PLLs | 8 (fractional) |
| Maximum User I/O | 606 |
| Hard Memory Controllers | Yes (DDR3, DDR2, QDR) |
| Hard PCIe Gen2 Endpoint | Yes |
| Process Node | 40 nm |
| Package | FBGA-1517 (HF40) |
| Pitch | 1.0 mm |
| Speed Grade | 4 |
| Operating Temperature | 0C to +85C (Commercial) |
| Lead-Free / RoHS | Lead-Free / RoHS Compliant |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |
EP2AGZ350HF40C4G fbga-1517 (hf40) Pin Configuration Guide
Pin configuration for EP2AGZ350HF40C4G (fbga-1517 (hf40) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ350HF40C4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ350HF40C4G is suitable for 6 applications: PCIe Gen2 Endpoint Card, High-Definition Video Processing (HD-SDI / 3G-SDI), Software-Defined Radio (SDR) Baseband Processing, Industrial Inspection and Machine Vision, Test and Measurement Instrumentation, Protocol Bridging and Custom High-Speed Serial Interfaces.
PCIe Gen2 Endpoint Card
The EP2AGZ350HF40C4G is well-suited as a PCIe Gen2 endpoint card controller because it integrates a hard PCIe Gen2 endpoint block, eliminating the soft-IP latency and resource overhead typical of FPGA-only PCIe implementations. With 350K logic elements and 534 DSP blocks, designers can implement protocol-bridging logic between PCIe and external high-speed serial interfaces while still leaving substantial logic free for application-level DSP. The hard PCIe block supports x1, x2, x4, and x8 lane widths at Gen2 (5 Gbps) line rate. For PCIe Gen2 designs, place the FPGA on a board with controlled-impedance PCIe traces and a 100 MHz differential reference clock. The hard endpoint block provides completion timeout, flow control, and payload sizing without consuming logic elements. Combined with the Arria II GZ transceivers, this enables single-chip PCIe-to-multi-protocol bridges for industrial and test cards.
Recommended
High-Definition Video Processing (HD-SDI / 3G-SDI)
The EP2AGZ350HF40C4G is ideal for HD-SDI and 3G-SDI video processing applications because the transceivers natively support SMPTE 424M (3G-SDI) and SMPTE 292M (HD-SDI) serial rates up to 2.97 Gbps. The 350K logic elements and 534 DSP blocks provide ample capacity for multi-channel video processing pipelines including scaling, color space conversion, and overlay composition. The embedded memory (20,480 Kbits) supports line buffering for video processing. For 3G-SDI designs, the Arria II GZ transceivers support the required 2.97 Gbps data rate with built-in clock-data recovery. Designers typically implement a multi-channel receive path with embedded audio extraction. The DDR3 hard memory controller enables frame buffer storage for broadcast video effects. The commercial temperature grade (0C to 85C) suits indoor broadcast equipment well.
Recommended
Software-Defined Radio (SDR) Baseband Processing
The EP2AGZ350HF40C4G fits SDR baseband processing applications because the 534 DSP blocks can implement parallel FIR filters, FFT engines, and channelization for wideband RF signals. The transceivers support up to 3.125 Gbps, enabling direct ADC-to-FPGA interfacing for high-speed RF ADCs. The 350K logic elements allow complex digital down-conversion (DDC), digital up-conversion (DUC), and modulation/demodulation pipelines. In SDR designs, the Arria II GZ typically sits between a high-speed RF ADC (e.g., 245.76 Msps LTE) and a host processor, performing all baseband DSP. The hard DDR3 controller enables sample buffer storage, while the PCIe Gen2 endpoint provides high-throughput data transfer to the host. The commercial temp range suits lab and indoor SDR equipment. Use Quartus II DSP Builder for rapid FIR and FFT IP development.
Recommended
Industrial Inspection and Machine Vision
The EP2AGZ350HF40C4G is well-matched to high-channel-count industrial inspection systems because the 534 DSP blocks can process parallel image pipelines from multiple Camera Link or CoaXPress cameras. The 350K logic elements support real-time image processing algorithms such as edge detection, blob analysis, and pattern matching at line rates of 80 kHz or higher. The hard memory controller supports DDR3 frame buffers for multi-camera synchronization. For machine vision systems, designers typically use the transceivers to interface with Camera Link Full (up to 10 taps at 85 MHz) or CoaXPress (up to 6.25 Gbps per channel). The Arria II GZ commercial temp range suits factory floor environments. The PCIe Gen2 endpoint enables high-throughput image transfer to a host PC for archival or further processing. Power consumption at high DSP utilization requires the PowerPlay Early Power Estimator to validate thermal budgets.
Recommended
Test and Measurement Instrumentation
The EP2AGZ350HF40C4G supports high-end test and measurement instrument designs because the 350K logic elements and 534 DSP blocks can implement arbitrary waveform generation, real-time spectrum analysis, and protocol-aware triggering. The transceivers support up to 3.125 Gbps, enabling direct synthesis and analysis of high-speed serial protocols like SATA and XAUI. The hard memory controller enables deep acquisition memory for oscilloscope and logic analyzer functions. In T&M designs, the Arria II GZ typically serves as the central DSP engine between high-speed ADCs/DACs and a display or host interface. Designers use the embedded memory for deep sample storage and the DSP blocks for real-time FFT and signal conditioning. The PCIe Gen2 endpoint enables fast data upload to a host PC for post-processing. The commercial temp range suits benchtop and laboratory instruments.
Recommended
Protocol Bridging and Custom High-Speed Serial Interfaces
The EP2AGZ350HF40C4G is ideal for multi-protocol bridging applications such as Serial RapidIO, SATA, XAUI, and custom high-speed serial because the transceivers support data rates from 600 Mbps to 3.125 Gbps with multiple protocol modes. The hard PCIe Gen2 endpoint can be combined with one or more transceiver-based protocols to implement single-chip protocol bridges (e.g., PCIe-to-Serial RapidIO for defense applications). The 350K logic elements provide ample capacity for protocol state machines and DMA engines. For protocol bridging designs, designers use the Arria II GZ transceivers with soft-IP protocol stacks to implement endpoints or root complexes for protocols without hard blocks. The DDR3 memory controller provides buffering for protocol payloads, and the PCIe endpoint provides the host interface. The 1517-ball FBGA package provides enough balls for multi-protocol I/O. Commercial temp range suits indoor telecom and industrial bridging equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ350HF40C4G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ350HF40C3G | EP2AGZ350HF40C4N | EP2AGZ350HF40C3N | EP2AGZ300HF40C4G | EP2AGZ225HF40C4G | EP2AGZ300HF40C4N |
|---|---|---|---|---|---|---|---|
| Package | FBGA-1517 (HF40) | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same | FBGA-1517 (HF40) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 350,000 | 350,000 | 350,000 | 350,000 | 300,000 (-14%) | 225,000 (-36%) | 300,000 (-14%) |
| Speed Grade | 4 (Commercial) | 3 (slower, higher yield) | 4 (same) | 3 (slower) | 4 (same) | 4 (same) | 4 (same) |
| Hard PCIe Gen2 | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Hard Memory Controllers | DDR3/DDR2/QDR | DDR3/DDR2/QDR | DDR3/DDR2/QDR | DDR3/DDR2/QDR | DDR3/DDR2/QDR | DDR3/DDR2/QDR | DDR3/DDR2/QDR |
| Lead-Free / RoHS | Yes (G suffix) | Yes (G) | No (N - non-lead-free) | No (N) | Yes (G) | Yes (G) | No (N) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
Key Differentiators
- Highest logic density in the Arria II GZ family at 350K LE (vs EP2AGZ300HF40C4G (300K LE))
- FBGA-1517 (HF40) package provides 606 user I/O (vs EP2AGZ350FF35C4G (1152-ball FBGA-FF35))
- Hard PCIe Gen2 endpoint integrated on-chip (vs EP2AGX190FF35C4G (Arria II GX 190K LE))
- Speed grade 4 (C4) for commercial temp 0C to 85C (vs EP2AGZ350HF40C3G (speed grade 3))
- Lead-free/RoHS-compliant (G suffix) (vs EP2AGZ350HF40C4N (non-lead-free N suffix))
Design Notes
The FBGA-1517 package with 1.0 mm ball pitch requires HDI PCB fabrication with laser-drilled micro-vias (typically 0.1 mm diameter) for the inner BGA breakout layers. Use a 4-2-4 or 5-2-5 PCB stackup with sequential lamination to escape the BGA. Route all 606 user I/O signals through internal signal layers with matched impedance (50 ohm single-ended, 100 ohm differential). Maintain at least 2 ground-referenced layers adjacent to high-speed transceiver and DDR3 signal layers for return path integrity.
Estimated: At 350K logic elements with 50% utilization, 8 transceivers at 3.125 Gbps, and DDR3 memory interface active, the Arria II GZ FPGA can dissipate 8-15 W depending on toggle rate. Use Intel's PowerPlay Early Power Estimator (EPE) for accurate power budgeting before PCB layout. Plan for a multi-rail power supply (0.9V core, 1.1V transceiver PLLs, 1.5V/1.8V/2.5V/3.3V I/O) with bulk decoupling capacitors placed close to each power pin per the device pin connection guidelines.
Transceiver channels operating above 2.5 Gbps require pre-emphasis and equalization settings configured in the Quartus II Transceiver Toolkit. Perform IBIS-AMI simulations of the channel including PCB traces, connectors, and AC-coupling capacitors. For 3.125 Gbps links, target a total channel insertion loss of less than 12 dB at the Nyquist frequency. The hard PCIe Gen2 endpoint requires additional compliance with the PCI-SIG channel spec, which mandates 85 ohm differential impedance for the PCIe traces.
The FBGA-1517 package has a junction-to-ambient thermal resistance (theta_JA) of approximately 8-12 C/W with a properly designed thermal via array and heat sink. Without a heat sink, theta_JA rises to 15-25 C/W, which can cause thermal shutdown at high utilization. Use the Quartus II PowerPlay Thermal Analyzer to verify junction temperature stays below 100C at the maximum expected ambient temperature. Industrial temp variants (-40C to +100C) are NOT available in this 350K LE class - consider Arria II GX if industrial temp is required.
Common pitfalls: (1) Do not confuse the Arria II GZ (AGZ) family with the lower-cost Arria II GX (AGX) - GZ has hard PCIe Gen2 endpoint and more transceivers; GX does not have hard PCIe. (2) Configuration mode pins must be set correctly with pull-up/pull-down resistors per the device handbook or configuration will fail. (3) The G suffix denotes lead-free/RoHS; N suffix denotes non-lead-free (legacy). Use G for new designs targeting EU markets. (4) Do not assume the FBGA-1517 pinout is compatible with FBGA-1152 (FF35) or FBGA-780 (EF29) packages - ball counts differ.
Compliance Information
RoHS compliant per G suffix in MPN. REACH compliant per EU regulations. Not AEC-Q100 qualified - this is a commercial/industrial-grade FPGA. Lead-free finish. Halogen-free status not explicitly stated in distributor data - default unknown.
