EP2AGZ350HF40I3N - Arria II GZ 350K LE FPGA | Intel | Industrial
MPN: EP2AGZ350HF40I3N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2420 | $242,000.00 |
| 500 | $2190 | $1,095,000.00 |
| 1,000 | $1985 | $1,985,000.00 |
EP2AGZ350HF40I3N Overview
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and dedicated I/O cells that engineers can reconfigure after manufacturing. FPGAs occupy a specific position in the semiconductor hierarchy: integrated circuit -> programmable logic -> FPGA -> SRAM-based FPGA -> transceiver FPGA. They are commonly used as flexible alternatives to ASICs for prototyping, low-volume production, and applications requiring parallel processing, custom I/O timing, or hardware-accelerated DSP.
The EP2AGZ350HF40I3N integrates up to 24 high-speed transceivers operating up to 6.375 Gbps, dedicated DSP blocks supporting variable-precision arithmetic, and embedded memory blocks totaling over 20 Mbits. The HF40 package denotes a flip-chip fine-pitch BGA with a 1.0 mm ball pitch, optimized for high signal integrity on multi-gigabit serial links.
Architecturally, the Arria II GZ family uses an SRAM-based configuration memory backed by 40 nm low-power process technology, providing a balance of performance-per-watt for applications such as wireless baseband processing, broadcast video bridging, and high-speed serial protocol bridging. The 'I3' speed grade and 'N' lead-free suffix designate industrial temperature range operation (-40C to +100C) and lead-free / RoHS compliance.
Typical applications include 40G/10G Ethernet bridge and aggregation, HD-SDI video routers, PCIe Gen1/Gen2 endpoint and root complex designs, software-defined radio (SDR) baseband, and high-speed test and measurement instrumentation. The HF40 package's flip-chip construction supports the high pin count required for wide parallel and serial interfaces simultaneously.
When designing with this part, ensure the PCB stack-up supports 1.0 mm BGA breakout and that thermal management accounts for industrial temperature operation under full transceiver utilization. Engineers should use the Quartus II design software with Arria II device support to generate configuration bitstreams and verify pin assignments before tape-out.
This page synthesizes distributor pricing, drop-in compatible Arria II GZ siblings, and practical PCB/design notes that are not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP2AGZ350HF40I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ350HF40I3N (same form factor and footprint) — differing in Package, Speed Grade, RoHS Status, Logic Elements, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGZ350HF40I3G
✅ Drop-In✓ In Stock
$3565 / Unit
View Datasheet →EP2AGZ350HF40I2N
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2AGZ350HF40C4N
✅ Drop-In✓ In Stock
$3540 / Unit
View Datasheet →EP2AGZ350HF40C3G
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2AGZ300HF40I3N
✅ Drop-In✓ In Stock
$3820 / Unit
View Datasheet →EP2AGZ350HF40I3N Maximum Ratings & Electrical Characteristics
| Family | Arria II GZ |
| Series | Arria II |
| Logic Elements (LE) | 348500 |
| Logic Array Blocks (LABs) | 13940 |
| User I/O Count | 734 |
| Total Embedded Memory Bits | 21270528 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I3 |
| Package | 1517-ball FC-FBGA (HF40) |
| Package Code | BGA (Ball Grid Array) |
| Terminal Form | Ball |
| Number of Terminals | 1517 |
| Package Shape | Square |
| RoHS Status | Compliant (lead-free N suffix) |
| Lead-Free | Yes |
EP2AGZ350HF40I3N square Pin Configuration Guide
Pin configuration for EP2AGZ350HF40I3N (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ350HF40I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ350HF40I3N is suitable for 6 applications: 10G/40G Ethernet Bridge and Aggregation, HD-SDI / Broadcast Video Router, PCIe Gen2 Endpoint / Root Complex, Software-Defined Radio (SDR) Baseband, Test & Measurement Instrumentation, Wireless Baseband Processing.
10G/40G Ethernet Bridge and Aggregation
The EP2AGZ350HF40I3N fits 10G/40G Ethernet bridging because its 348,500 LEs and up to 24 transceivers (per Arria II GZ family documentation) support multiple SFP+ / QSFP ports simultaneously. Placed as a line-card aggregator, the device's 21 Mbit embedded memory buffers packet bursts, and the 734 user I/Os route parallel fabric to backplane connectors without external bridging ASICs. Industrial temperature grade (-40C to +100C) suits telecom central-office deployments where rack temperatures vary widely.
Recommended
HD-SDI / Broadcast Video Router
The EP2AGZ350HF40I3N suits broadcast video routing because its high I/O count (734 pins) and SERDES channels handle multiple HD-SDI / 3G-SDI streams in parallel without external crosspoint switches. Per the Arria II GZ datasheet, the integrated CDR and variable-precision DSP blocks support SDI scrambling, de-interlacing, and format conversion at frame rate. Industrial temperature operation enables OB-truck and outdoor venue installations where commercial-grade parts would derate.
Recommended
PCIe Gen2 Endpoint / Root Complex
The EP2AGZ350HF40I3N is appropriate for PCIe Gen1/Gen2 designs because Arria II GZ transceivers natively support PCIe hard IP up to Gen2 x4/x8 lanes. The 734 user I/Os route endpoint application logic to host boards, while 21 Mbit embedded memory accommodates DMA descriptor rings and TLP buffers. Industrial temperature operation enables PCIe cards in factory automation, medical imaging, and military/aerospace subsystems.
Recommended
Software-Defined Radio (SDR) Baseband
The EP2AGZ350HF40I3N excels in SDR baseband because its DSP blocks support variable-precision arithmetic (9x9, 18x18, 27x27 multipliers) for FFTs, channelizers, and digital down-conversion. The 348,500 LEs implement protocol stacks in parallel, and 734 I/Os interface to RF front-end ADCs/DACs. Industrial temperature operation is critical for outdoor wireless base stations where ambient temperature fluctuates widely.
Recommended
Test & Measurement Instrumentation
The EP2AGZ350HF40I3N is well suited to T&M equipment because its high logic density and transceiver count implement multiple protocol analyzers (PCIe, Ethernet, SATA, USB) on one chip. The 21 Mbit embedded memory captures trace buffers without external DRAM pressure, and 734 I/Os route to probe connectors, front-panel displays, and backplane interfaces. Industrial temperature operation supports bench and field-portable instrumentation.
Recommended
Wireless Baseband Processing
The EP2AGZ350HF40I3N serves wireless baseband processing because its transceiver and DSP combination implements LTE, WiMAX, and proprietary PHY/MAC layers with low latency. The 13,940 LABs implement parallel Turbo/Viterbi decoders, while the 734 I/Os interface to RFICs and antenna switch fabrics. Industrial temperature operation is mandatory for outdoor base-station hardware subject to seasonal extremes.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ350HF40I3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ350HF40I3G | EP2AGZ350HF40I2N | EP2AGZ350HF40C4N | EP2AGZ350HF40C3G | EP2AGZ300HF40I3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FC-FBGA (HF40) | 1517-ball FC-FBGA (HF40) - same | 1517-ball FC-FBGA (HF40) - same | 1517-ball FC-FBGA (HF40) - same | 1517-ball FC-FBGA (HF40) - same | 1517-ball FC-FBGA (HF40) - same |
| Logic Elements | 348500 | 348500 | 348500 | 348500 | 348500 | 300000 |
| LABs | 13940 | 13940 | 13940 | 13940 | 13940 | 11920 |
| User I/O | 734 | 734 | 734 | 734 | 734 | 612 |
| Embedded Memory (bits) | 21270528 | 21270528 | 21270528 | 21270528 | 21270528 | 18095616 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | I3 | I3 | I2 (slower) | C4 (faster) | C3 | I3 |
| Lead-Free / RoHS | Yes (N suffix) | Yes (G suffix) | Yes (N suffix) | Yes (N suffix) | Yes (G suffix) | Yes (N suffix) |
| Estimated Unit Price (USD, qty 1) | 2850 | 2820 | 2620 | 2990 | 2950 | 2350 |
Key Differentiators
- Highest logic density in the Arria II GZ family within HF40 package (vs EP2AGZ300HF40I3N)
- Maximum I/O count in the HF40 package family (vs EP2AGZ350FH29I3N)
- Industrial temperature with lead-free RoHS compliance (vs EP2AGZ350HF40C4N)
- Drop-in compatible across multiple temperature/speed variants (vs EP2AGZ350FF35I3N)
Design Notes
The HF40 package uses a 1.0 mm ball pitch with a 1517-ball flip-chip FC-FBGA footprint. PCB stack-up must support microvia-in-pad construction and 4-6 routing layers between BGA breakouts; high-speed transceiver lanes require matched 100-ohm differential impedance with length matching within 5 mils. Plan escape routing for power and ground balls before committing layout to fabrication - the BGA breakouts dictate the entire PCB layer budget.
Industrial temperature operation (-40C to +100C) at full transceiver utilization requires substantial thermal management. Estimate: with 24 transceivers at 6.375 Gbps, core power can exceed 15 W. Use a minimum 4-layer board with continuous ground plane, thermal vias under the central ground balls, and a heatsink or forced-air cooling to keep junction temperature below 100C. Verify with the Arria II GZ PowerPlay Early Power Estimator before tape-out.
Do not confuse EP2AGZ350HF40I3N (1517-ball, industrial, I3 speed, lead-free) with EP2AGZ350FF35I3N (different package, FF35 1152-ball) or EP2AGZ350HF40I3 (older non-lead-free). The HF40 suffix is the package identifier; mismatched package variants are NOT pin-compatible. Always verify the full ordering code against the Intel Arria II GZ device handbook before PCB layout.
Place transceiver reference clocks and the FPGA clock input pins on dedicated clock-input balls; route clocks first with length-matched differential pairs. Decouple every power rail (VCC, VCC_PLL, VCCPT, VCCAUX) with bulk + ceramic + high-frequency caps as specified in the Arria II GZ pin connection guidelines. Use Intel's Quartus II Pin Planner to validate I/O standard and bank voltage assignments before generating configuration bitstreams.
Compliance Information
RoHS compliant per N suffix in ordering code. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC. Halogen-free status not verified in provided data.
